TW368737B - Semiconductor integrated circuit device having high input/output connections - Google Patents
Semiconductor integrated circuit device having high input/output connectionsInfo
- Publication number
- TW368737B TW368737B TW085116112A TW85116112A TW368737B TW 368737 B TW368737 B TW 368737B TW 085116112 A TW085116112 A TW 085116112A TW 85116112 A TW85116112 A TW 85116112A TW 368737 B TW368737 B TW 368737B
- Authority
- TW
- Taiwan
- Prior art keywords
- wiring
- corner
- integrated circuit
- semiconductor integrated
- circuit device
- Prior art date
Links
Classifications
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960021244A KR980006195A (ko) | 1996-06-13 | 1996-06-13 | 와이어 본딩의 안정성을 위한 반도체 칩 패키지의 리드 프레임과 그를 이용한 반도체 칩 패키지 |
KR1019960055751A KR100210712B1 (ko) | 1996-11-20 | 1996-11-20 | 와이어 본딩 안정성을 위한 전극 패드 배열을 갖는 반도체 칩을 이용한 반도체 집적회로 소자 |
Publications (1)
Publication Number | Publication Date |
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TW368737B true TW368737B (en) | 1999-09-01 |
Family
ID=26631909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085116112A TW368737B (en) | 1996-06-13 | 1996-12-26 | Semiconductor integrated circuit device having high input/output connections |
Country Status (6)
Country | Link |
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US (1) | US5923092A (zh) |
JP (1) | JPH1012658A (zh) |
CN (1) | CN1168537A (zh) |
DE (1) | DE19652395A1 (zh) |
FR (1) | FR2749975B1 (zh) |
TW (1) | TW368737B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6692989B2 (en) * | 1999-10-20 | 2004-02-17 | Renesas Technology Corporation | Plastic molded type semiconductor device and fabrication process thereof |
KR100350046B1 (ko) * | 1999-04-14 | 2002-08-24 | 앰코 테크놀로지 코리아 주식회사 | 리드프레임 및 이를 이용한 방열판이 부착된 반도체패키지 |
KR100314773B1 (ko) * | 1999-12-30 | 2001-11-22 | 윤종용 | 반도체 칩 패키지 및 이에 사용되는 리드프레임 |
US6225685B1 (en) * | 2000-04-05 | 2001-05-01 | Advanced Micro Devices, Inc. | Lead frame design for reduced wire sweep having a defined gap between tie bars and lead pins |
JP2003273210A (ja) * | 2002-03-12 | 2003-09-26 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2005005306A (ja) * | 2003-06-09 | 2005-01-06 | Seiko Epson Corp | 半導体装置、半導体モジュール、電子デバイス、電子機器および半導体モジュールの製造方法 |
US6812580B1 (en) * | 2003-06-09 | 2004-11-02 | Freescale Semiconductor, Inc. | Semiconductor package having optimized wire bond positioning |
TWI250622B (en) * | 2003-09-10 | 2006-03-01 | Siliconware Precision Industries Co Ltd | Semiconductor package having high quantity of I/O connections and method for making the same |
DE102004010299B4 (de) | 2004-03-03 | 2008-03-06 | Atmel Germany Gmbh | Infrarot-Empfänger-Chip |
DE102004064118B4 (de) * | 2004-03-03 | 2012-12-20 | Atmel Automotive Gmbh | Infrarot-Empfänger-Chip |
KR100642748B1 (ko) * | 2004-07-24 | 2006-11-10 | 삼성전자주식회사 | 리드 프레임과 패키지 기판 및 이들을 이용한 패키지 |
DE102005035083B4 (de) * | 2004-07-24 | 2007-08-23 | Samsung Electronics Co., Ltd., Suwon | Bondverbindungssystem, Halbleiterbauelementpackung und Drahtbondverfahren |
JP5377366B2 (ja) * | 2010-03-08 | 2013-12-25 | ローム株式会社 | 半導体装置 |
CN102214589B (zh) * | 2011-05-31 | 2013-04-24 | 华亚平 | 垂直芯片电子封装方法 |
JP5959097B2 (ja) | 2012-07-03 | 2016-08-02 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
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JPS6265449A (ja) * | 1985-09-18 | 1987-03-24 | Mitsubishi Electric Corp | 半導体集積回路装置 |
JPH01196138A (ja) * | 1988-01-29 | 1989-08-07 | Nec Corp | マスタスライス集積回路 |
US5270570A (en) * | 1988-10-10 | 1993-12-14 | Lsi Logic Products Gmbh | Lead frame for a multiplicity of terminals |
JPH02210856A (ja) * | 1989-02-10 | 1990-08-22 | Fujitsu Ltd | 半導体装置 |
US4999700A (en) * | 1989-04-20 | 1991-03-12 | Honeywell Inc. | Package to board variable pitch tab |
JPH03230556A (ja) * | 1990-02-06 | 1991-10-14 | Matsushita Electron Corp | 半導体装置用リードフレーム |
JPH04268749A (ja) * | 1991-02-25 | 1992-09-24 | Mitsubishi Electric Corp | 半導体装置 |
JP3046630B2 (ja) * | 1991-02-26 | 2000-05-29 | 株式会社日立製作所 | 半導体集積回路装置 |
US5245214A (en) * | 1991-06-06 | 1993-09-14 | Northern Telecom Limited | Method of designing a leadframe and a leadframe created thereby |
KR100552353B1 (ko) * | 1992-03-27 | 2006-06-20 | 가부시키가이샤 히타치초엘에스아이시스템즈 | 리이드프레임및그것을사용한반도체집적회로장치와그제조방법 |
JPH0653266A (ja) * | 1992-08-03 | 1994-02-25 | Yamaha Corp | 半導体装置 |
US5327008A (en) * | 1993-03-22 | 1994-07-05 | Motorola Inc. | Semiconductor device having universal low-stress die support and method for making the same |
JPH0799213A (ja) * | 1993-06-09 | 1995-04-11 | At & T Corp | 集積回路チップ |
JP2834990B2 (ja) * | 1993-11-02 | 1998-12-14 | ローム株式会社 | クワッド型半導体装置用リードフレームの構造 |
JPH07231007A (ja) * | 1994-02-15 | 1995-08-29 | Toshiba Corp | 半導体装置 |
WO1995028005A2 (en) * | 1994-04-07 | 1995-10-19 | Vlsi Technology, Inc. | Staggered pad array |
-
1996
- 1996-12-17 DE DE19652395A patent/DE19652395A1/de not_active Ceased
- 1996-12-24 US US08/773,679 patent/US5923092A/en not_active Expired - Lifetime
- 1996-12-26 TW TW085116112A patent/TW368737B/zh active
- 1996-12-27 JP JP8351581A patent/JPH1012658A/ja active Pending
- 1996-12-30 CN CN96123430A patent/CN1168537A/zh active Pending
- 1996-12-30 FR FR9616186A patent/FR2749975B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5923092A (en) | 1999-07-13 |
JPH1012658A (ja) | 1998-01-16 |
DE19652395A1 (de) | 1997-12-18 |
CN1168537A (zh) | 1997-12-24 |
FR2749975A1 (fr) | 1997-12-19 |
FR2749975B1 (fr) | 1998-12-04 |
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