TW350931B - Epoxy-containing waterborne photoimageable composition - Google Patents

Epoxy-containing waterborne photoimageable composition

Info

Publication number
TW350931B
TW350931B TW085110420A TW85110420A TW350931B TW 350931 B TW350931 B TW 350931B TW 085110420 A TW085110420 A TW 085110420A TW 85110420 A TW85110420 A TW 85110420A TW 350931 B TW350931 B TW 350931B
Authority
TW
Taiwan
Prior art keywords
epoxy
waterborne
weight
composition
photoimageable composition
Prior art date
Application number
TW085110420A
Other languages
English (en)
Inventor
Maria Elena Hernandez
Shawn Lien
Patrick Sean Mcdevitt
Original Assignee
Morton Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Morton Int Inc filed Critical Morton Int Inc
Application granted granted Critical
Publication of TW350931B publication Critical patent/TW350931B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
TW085110420A 1995-08-01 1996-08-27 Epoxy-containing waterborne photoimageable composition TW350931B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/509,887 US5925499A (en) 1995-08-01 1995-08-01 Epoxy-containing waterborne photoimageable composition

Publications (1)

Publication Number Publication Date
TW350931B true TW350931B (en) 1999-01-21

Family

ID=24028506

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085110420A TW350931B (en) 1995-08-01 1996-08-27 Epoxy-containing waterborne photoimageable composition

Country Status (9)

Country Link
US (1) US5925499A (zh)
EP (1) EP0762209A1 (zh)
JP (1) JP2966350B2 (zh)
KR (1) KR100211200B1 (zh)
CN (1) CN1145480A (zh)
CA (1) CA2182463A1 (zh)
IL (1) IL118896A0 (zh)
SG (1) SG55221A1 (zh)
TW (1) TW350931B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6602651B1 (en) * 1998-07-07 2003-08-05 Kansai Paint Co., Ltd. Water-based solder resist composition
EP0977085B1 (en) 1998-07-31 2003-03-26 Dai Nippon Printing Co., Ltd. Photosensitive resin composition and color filter
JP2001222103A (ja) * 1999-08-05 2001-08-17 Nippon Paint Co Ltd 水性フォトソルダーレジスト組成物
US6784024B2 (en) * 2000-01-18 2004-08-31 Micron Technology, Inc. Die attach curing method for semiconductor device
DE10119127A1 (de) * 2001-04-19 2002-10-24 Cognis Deutschland Gmbh Wäßrige Beschichtungszusammensetzungen auf Basis von Epoxidharzen
JP4175079B2 (ja) * 2002-10-17 2008-11-05 日立化成工業株式会社 感光性樹脂組成物およびこれを用いた感光性エレメント
PL2078063T3 (pl) * 2006-10-24 2010-09-30 Whitford B V Kompozycja powłoki nieprzywierającej
KR102247821B1 (ko) * 2021-03-18 2021-05-06 (주)와이앤피홀딩스 기능성 석탄첨가제 및 석탄첨가제 제조방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3929743A (en) * 1972-10-10 1975-12-30 Johnson & Son Inc S C Polyampholytes
US4092443A (en) * 1976-02-19 1978-05-30 Ciba-Geigy Corporation Method for making reinforced composites
JPS568146A (en) * 1979-07-03 1981-01-27 Kansai Paint Co Ltd Manufacture of screen plate material
EP0345340B1 (en) * 1987-12-07 1995-03-08 Morton International, Inc. Photoimageable compositions
US5364736A (en) * 1987-12-07 1994-11-15 Morton International, Inc. Photoimageable compositions
US5045435A (en) * 1988-11-25 1991-09-03 Armstrong World Industries, Inc. Water-borne, alkali-developable, photoresist coating compositions and their preparation
US5229252A (en) * 1989-06-09 1993-07-20 Morton International, Inc. Photoimageable compositions
DE3931467A1 (de) * 1989-09-21 1991-04-04 Hoechst Ag Durch strahlung polymerisierbares gemisch und verfahren zur herstellung einer loetstopmaske
DE59108989D1 (de) * 1990-12-18 1998-06-25 Ciba Geigy Ag Strahlungsempfindliche Zusammensetzung auf Basis von Wasser als Lösungs- bzw. Dispersionsmittel
DE4234072A1 (de) * 1992-10-09 1994-04-14 Morton Int Inc Durch Strahlung polymerisierbares Gemisch und Verfahren zur Herstellung einer Lötstoppmaske
US5439779A (en) * 1993-02-22 1995-08-08 International Business Machines Corporation Aqueous soldermask
DE69502741T2 (de) * 1994-01-10 1998-10-01 Du Pont Lichtempfindliche wässrige Emulsion, lichtempfindlicher Film und Verfahren zur Herstellung
US5364737A (en) * 1994-01-25 1994-11-15 Morton International, Inc. Waterbone photoresists having associate thickeners
AU660881B1 (en) * 1994-01-25 1995-07-06 Morton International, Inc. Waterborne photoresists having binders neutralized with amino acrylates
TW353158B (en) * 1994-03-09 1999-02-21 Nat Starch Chem Invest Aqueous photoresist composition, method for preparing the same and circuit board comprising thereof
US5458921A (en) * 1994-10-11 1995-10-17 Morton International, Inc. Solvent system for forming films of photoimageable compositions

Also Published As

Publication number Publication date
CN1145480A (zh) 1997-03-19
KR970010866A (ko) 1997-03-27
IL118896A0 (en) 1996-10-31
US5925499A (en) 1999-07-20
KR100211200B1 (ko) 1999-07-15
JPH09120161A (ja) 1997-05-06
SG55221A1 (en) 1998-12-21
JP2966350B2 (ja) 1999-10-25
CA2182463A1 (en) 1997-02-02
EP0762209A1 (en) 1997-03-12

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