TW344829B - Positive characteristic thermistor device - Google Patents

Positive characteristic thermistor device

Info

Publication number
TW344829B
TW344829B TW085115070A TW85115070A TW344829B TW 344829 B TW344829 B TW 344829B TW 085115070 A TW085115070 A TW 085115070A TW 85115070 A TW85115070 A TW 85115070A TW 344829 B TW344829 B TW 344829B
Authority
TW
Taiwan
Prior art keywords
porosity
characteristic thermistor
positive characteristic
thermistor device
ceramic layer
Prior art date
Application number
TW085115070A
Other languages
English (en)
Inventor
Atushi Hirano
Shigeyuki Kuroda
Kenji Tanaka
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Application granted granted Critical
Publication of TW344829B publication Critical patent/TW344829B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Thermistors And Varistors (AREA)
TW085115070A 1995-12-13 1996-12-06 Positive characteristic thermistor device TW344829B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7347321A JPH09162004A (ja) 1995-12-13 1995-12-13 正特性サーミスタ素子

Publications (1)

Publication Number Publication Date
TW344829B true TW344829B (en) 1998-11-11

Family

ID=18389438

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085115070A TW344829B (en) 1995-12-13 1996-12-06 Positive characteristic thermistor device

Country Status (7)

Country Link
US (1) US5907271A (zh)
EP (1) EP0779630B1 (zh)
JP (1) JPH09162004A (zh)
KR (1) KR100231650B1 (zh)
CN (1) CN1087866C (zh)
DE (1) DE69626615T2 (zh)
TW (1) TW344829B (zh)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10326554A (ja) * 1997-03-27 1998-12-08 Ngk Insulators Ltd Ｐｔｃ素子を備えた限流器及び／又は遮断器
DE19739758C1 (de) * 1997-09-10 1999-06-24 Siemens Matsushita Components Kaltleiter-Widerstandselement und Verfahren zur Herstellung solcher Kaltleiter-Widerstandselemente
JPH11135302A (ja) * 1997-10-27 1999-05-21 Murata Mfg Co Ltd 正特性サーミスタ
US6854176B2 (en) * 1999-09-14 2005-02-15 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
US6640420B1 (en) * 1999-09-14 2003-11-04 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
WO2001058212A1 (de) * 2000-02-01 2001-08-09 E.G.O. Elektro-Gerätebau GmbH Elektrisches heizelement und verfahren zu seiner herstellung
JP3636075B2 (ja) * 2001-01-18 2005-04-06 株式会社村田製作所 積層ｐｔｃサーミスタ
EP1263002A3 (en) * 2001-05-17 2004-01-02 Shipley Company LLC Resistors
TW529846U (en) * 2001-11-12 2003-04-21 Polytronics Technology Corp Over-current protection component and the device
JP2006279045A (ja) 2005-03-28 2006-10-12 Tyco Electronics Corp Ｐｐｔｃ層間に能動素子を備える表面実装多層電気回路保護デバイス
US7342303B1 (en) 2006-02-28 2008-03-11 Amkor Technology, Inc. Semiconductor device having RF shielding and method therefor
KR101149634B1 (ko) * 2007-06-14 2012-05-25 가부시키가이샤 무라타 세이사쿠쇼 반도체 세라믹 재료
US7745910B1 (en) 2007-07-10 2010-06-29 Amkor Technology, Inc. Semiconductor device having RF shielding and method therefor
EP2019395B1 (en) * 2007-07-24 2011-09-14 TDK Corporation Stacked electronic part and method of manufacturing the same
US8008753B1 (en) 2008-04-22 2011-08-30 Amkor Technology, Inc. System and method to reduce shorting of radio frequency (RF) shielding
US7915715B2 (en) * 2008-11-25 2011-03-29 Amkor Technology, Inc. System and method to provide RF shielding for a MEMS microphone package
US7960818B1 (en) 2009-03-04 2011-06-14 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US8093691B1 (en) 2009-07-14 2012-01-10 Amkor Technology, Inc. System and method for RF shielding of a semiconductor package
WO2011011586A2 (en) * 2009-07-24 2011-01-27 Saint-Gobain Ceramics & Plastics, Inc. Dry and wet low friction silicon carbide seal
US8362598B2 (en) * 2009-08-26 2013-01-29 Amkor Technology Inc Semiconductor device with electromagnetic interference shielding
JP2011198947A (ja) * 2010-03-18 2011-10-06 Tdk Corp セラミック電子部品およびセラミック電子部品の製造方法
KR101471829B1 (ko) * 2010-06-24 2014-12-24 티디케이가부시기가이샤 칩 서미스터 및 그 제조 방법
KR101657159B1 (ko) * 2014-12-22 2016-09-20 주식회사 케이이씨 과도 전압 억제 소자 패키지
WO2017097976A1 (de) * 2015-12-09 2017-06-15 Dbk David + Baader Gmbh Entladewiderstand
DE102019100316A1 (de) * 2019-01-08 2020-07-09 Tdk Electronics Ag Thermistor und Verfahren zur Herstellung des Thermistors
TWD208349S (zh) * 2019-09-19 2020-11-21 南韓商斯瑪特電子公司 電路保護元件
USD933025S1 (en) * 2019-09-19 2021-10-12 Smart Electronics Inc. Circuit protection element
TWD208350S (zh) * 2019-09-19 2020-11-21 南韓商斯瑪特電子公司 電路保護元件
US11501942B2 (en) * 2021-03-15 2022-11-15 Littelfuse, Inc. PTC device with integrated fuses for high current operation

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2720573A (en) * 1951-06-27 1955-10-11 Dick O R Lundqvist Thermistor disks
US3878501A (en) * 1974-01-02 1975-04-15 Sprague Electric Co Asymmetrical dual PTCR package for motor start system
NL165020C (nl) * 1974-12-16 1981-02-16 Philips Nv Kleurentelevisie-ontvanger bevattende een ontmagneti- seerschakeling en samengesteld thermistorelement voor toepassing in een dergelijke schakeling.
JPS54149856A (en) * 1978-05-17 1979-11-24 Matsushita Electric Ind Co Ltd Method of producing heat impacttproof selffexothermic positive temperature coefficient thermistor
JPS59116536A (ja) * 1982-12-24 1984-07-05 Matsushita Electric Ind Co Ltd 湿度センサ
US5166658A (en) * 1987-09-30 1992-11-24 Raychem Corporation Electrical device comprising conductive polymers
JPH01216503A (ja) * 1988-02-24 1989-08-30 Meidensha Corp 非直線抵抗体
JPH01293502A (ja) * 1988-05-20 1989-11-27 Murata Mfg Co Ltd 正特性サーミスタ
JP3047466B2 (ja) * 1990-11-30 2000-05-29 株式会社村田製作所 積層サーミスタ
JPH076902A (ja) * 1991-03-13 1995-01-10 Murata Mfg Co Ltd 正特性サーミスタ素子
JPH0529104A (ja) * 1991-07-19 1993-02-05 Murata Mfg Co Ltd Ｐｔｃサーミスタ
US5488348A (en) * 1993-03-09 1996-01-30 Murata Manufacturing Co., Ltd. PTC thermistor
JPH06302403A (ja) * 1993-04-16 1994-10-28 Murata Mfg Co Ltd 積層型半導体セラミック素子
EP0640995B1 (de) * 1993-08-25 1997-06-25 Abb Research Ltd. Elektrisches Widerstandselement und Verwendung dieses Widerstandselementes in einem Strombegrenzer
JP3327444B2 (ja) * 1995-06-29 2002-09-24 株式会社村田製作所 正特性サーミスタ素子

Also Published As

Publication number Publication date
EP0779630B1 (en) 2003-03-12
DE69626615T2 (de) 2004-02-19
DE69626615D1 (de) 2003-04-17
EP0779630A1 (en) 1997-06-18
CN1160274A (zh) 1997-09-24
KR100231650B1 (ko) 1999-11-15
US5907271A (en) 1999-05-25
JPH09162004A (ja) 1997-06-20
CN1087866C (zh) 2002-07-17

Similar Documents

Publication Publication Date Title
TW344829B (en) Positive characteristic thermistor device
MX9804967A (es) Obleas laminadas.
ZA938001B (en) Multi-layer absorbent composite
AU8866998A (en) Three-dimensional open-worked prosthetic fabric
DE60134318D1 (de) Mehrschichtige wundauflage
GB2349115B (en) Thin textured barrier films and methods of forming the same
EP0771029A3 (en) Semiconductor device with improved structure to avoid cracks and manufacturing process
DE69534495D1 (de) Laminat, laminierter film und formartikel
SG67489A1 (en) Laminating propylene/1-butene random copolymer composition and composite film using the same
DE69603627T2 (de) Keramischer Verbundkörper
EP0282917A3 (en) Multilayered metallizable film, its manufacture and its use
EP1447689A3 (en) Optical element comprising a structured retarder
DE69619146D1 (de) Metallischer gesinterter Verbundkörper
GB9402430D0 (en) Multilayer ethylene copolymer film
TW336347B (en) Semiconductor device, method of manufacturing the same
GB9526541D0 (en) Photovoltaic generator with dielectric isolation and bonded, insulated wafer layers
DE69716868D1 (de) Orientierter film mit poren
EP0695732A3 (en) Metallic ceramic substrate with smooth plating and process for its manufacture
SG42380A1 (en) An interlayer film and laminated glass using the same
ATE197427T1 (de) Mehrlagiges material, insbesondere transferband
TW356597B (en) Semiconductor device and its method of fabrication the same
WO1999014078A3 (en) Non-blocking filter
EP0994083A3 (en) Ceramic laminate material
DE69601595D1 (de) Keramischer Körper mit kleinen durchgehenden Löchern
GB9724009D0 (en) Device for measuring the thickness of thin layers

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees