TW336926B - Semiconductor element carrier and processor - Google Patents
Semiconductor element carrier and processorInfo
- Publication number
- TW336926B TW336926B TW086112010A TW86112010A TW336926B TW 336926 B TW336926 B TW 336926B TW 086112010 A TW086112010 A TW 086112010A TW 86112010 A TW86112010 A TW 86112010A TW 336926 B TW336926 B TW 336926B
- Authority
- TW
- Taiwan
- Prior art keywords
- level difference
- level
- basic
- processor
- semiconductor
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
- B23Q15/20—Automatic control or regulation of feed movement, cutting velocity or position of tool or work before or after the tool acts upon the workpiece
- B23Q15/22—Control or regulation of position of tool or workpiece
- B23Q15/24—Control or regulation of position of tool or workpiece of linear position
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8222646A JPH1058367A (ja) | 1996-08-23 | 1996-08-23 | Ic搬送装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW336926B true TW336926B (en) | 1998-07-21 |
Family
ID=16785721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086112010A TW336926B (en) | 1996-08-23 | 1997-08-21 | Semiconductor element carrier and processor |
Country Status (8)
Country | Link |
---|---|
US (1) | US5812409A (zh) |
JP (1) | JPH1058367A (zh) |
KR (1) | KR100226096B1 (zh) |
CN (1) | CN1063266C (zh) |
DE (1) | DE19736622C2 (zh) |
GB (1) | GB2316536B (zh) |
SG (1) | SG66390A1 (zh) |
TW (1) | TW336926B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI660900B (zh) * | 2015-06-01 | 2019-06-01 | 日商大福股份有限公司 | 平面保管設備之入出庫裝置的控制方法 |
TWI793766B (zh) * | 2021-09-15 | 2023-02-21 | 日商新川股份有限公司 | 半導體裝置的製造裝置及製造方法 |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19680913C2 (de) * | 1995-09-04 | 1999-06-17 | Advantest Corp | Halbleiterbauelement-Transport- und -Handhabungseinrichtung |
JP3689215B2 (ja) * | 1997-02-20 | 2005-08-31 | 株式会社ルネサステクノロジ | 半導体デバイスのテスト用搬送装置 |
JPH11287842A (ja) * | 1998-04-02 | 1999-10-19 | Advantest Corp | Ic試験装置 |
US6204679B1 (en) | 1998-11-04 | 2001-03-20 | Teradyne, Inc. | Low cost memory tester with high throughput |
JP2000338195A (ja) * | 1999-05-31 | 2000-12-08 | Ando Electric Co Ltd | 集積回路試験方法及び装置 |
JP3584845B2 (ja) * | 2000-03-16 | 2004-11-04 | 日立ハイテク電子エンジニアリング株式会社 | Icデバイスの試験装置及び試験方法 |
DE20103184U1 (de) | 2001-02-22 | 2001-07-05 | Simotec GmbH, 82041 Oberhaching | Aufnahme- und Übergabevorrichtung |
DE20107220U1 (de) | 2001-04-25 | 2001-08-30 | Geringer, Michael, 93092 Barbing | Vorrichtung zum Entnehmen und/oder Vereinzeln von Halbleiterchips aus einem Halbleiterwafer |
KR100802435B1 (ko) * | 2001-12-17 | 2008-02-13 | 미래산업 주식회사 | 반도체 소자 테스트 핸들러의 소자 이송장치의 작업위치인식방법 |
JP4134289B2 (ja) * | 2002-05-29 | 2008-08-20 | 東京エレクトロン株式会社 | プローブカード搬送装置及びアダプタ |
DE10320381B4 (de) * | 2003-05-06 | 2010-11-04 | Scorpion Technologies Ag | Platinentestvorrichtung mit schrägstehend angetriebenen Kontaktiernadeln |
CN1841038B (zh) * | 2005-04-01 | 2010-12-29 | 深圳富泰宏精密工业有限公司 | 按键自动测试装置及方法 |
KR20100017958A (ko) | 2005-07-21 | 2010-02-16 | 가부시키가이샤 어드밴티스트 | 푸셔 |
DE102006020513B4 (de) * | 2006-05-03 | 2014-07-03 | Martin Prasch | Hochleistungs-Standard-Gerät zum flexiblen Transportieren und Handhaben verschieden großer Halbleiterbauelemente |
CN100454687C (zh) * | 2007-08-29 | 2009-01-21 | 中国电子科技集团公司第二研究所 | 套筒类零件的自动上料机构 |
US7847570B2 (en) | 2007-10-19 | 2010-12-07 | Teradyne, Inc. | Laser targeting mechanism |
US7733081B2 (en) | 2007-10-19 | 2010-06-08 | Teradyne, Inc. | Automated test equipment interface |
US8534302B2 (en) | 2008-12-09 | 2013-09-17 | Microchip Technology Incorporated | Prober cleaning block assembly |
CN101793912B (zh) * | 2009-02-03 | 2011-12-28 | 京元电子股份有限公司 | 料管至料盘转换装置 |
CN102069381B (zh) * | 2011-01-04 | 2012-08-22 | 深圳市泽宇自动化设备有限公司 | 一种锁具用锁芯的制造设备 |
CN103043440A (zh) * | 2011-10-11 | 2013-04-17 | 上海华族实业有限公司 | 陶瓷ptc陶瓷片自动送料***及其送料方法 |
ITBS20120010A1 (it) * | 2012-01-26 | 2013-07-27 | Innse Berardi S P A Societa Unipe Rsonale | Sistema di posizionamento su una tavola portapezzo di una macchina utensile e metodo di posizionamento del pezzo sulla tavola |
KR101990973B1 (ko) | 2012-07-30 | 2019-06-19 | 삼성전자 주식회사 | 테스트 핸들러의 트랜스퍼 유닛 및 그 작동방법 |
JP6190264B2 (ja) * | 2013-12-13 | 2017-08-30 | 東芝メモリ株式会社 | 半導体製造装置 |
CN104752295B (zh) * | 2013-12-30 | 2018-03-06 | 北京北方华创微电子装备有限公司 | 位置监测装置、等离子体加工设备及工件的装卸方法 |
US9842823B2 (en) * | 2014-12-29 | 2017-12-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chip-stacking apparatus having a transport device configured to transport a chip onto a substrate |
KR102304256B1 (ko) * | 2015-06-10 | 2021-09-23 | 세메스 주식회사 | 커스터머 트레이 검사 방법 |
CN105905602B (zh) * | 2016-05-18 | 2018-01-12 | 杭州中亚机械股份有限公司 | 一种吸盘 |
CN111232600A (zh) * | 2020-01-16 | 2020-06-05 | 佛山普瑞威尔科技有限公司 | 一种芯片下料装置 |
JP3227434U (ja) | 2020-03-12 | 2020-08-27 | 株式会社アドバンテスト | 電子部品ハンドリング装置及び電子部品試験装置 |
JP7443141B2 (ja) * | 2020-04-10 | 2024-03-05 | ニデックインスツルメンツ株式会社 | 産業用ロボットおよび産業用ロボットの制御方法 |
US11528854B2 (en) * | 2021-02-17 | 2022-12-20 | Firefly Automatix, Inc. | Adjusting a sod harvester's stacking position to form vertically aligned stacks |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3012853B2 (ja) * | 1990-09-14 | 2000-02-28 | 株式会社富士通宮城エレクトロニクス | 半導体試験装置のハンドラー |
US5216631A (en) * | 1990-11-02 | 1993-06-01 | Sliwa Jr John W | Microvibratory memory device |
US5290134A (en) * | 1991-12-03 | 1994-03-01 | Advantest Corporation | Pick and place for automatic test handler |
US5313156A (en) * | 1991-12-04 | 1994-05-17 | Advantest Corporation | Apparatus for automatic handling |
DE4310149C2 (de) * | 1993-03-29 | 1996-05-02 | Jenoptik Jena Gmbh | Einrichtung zur Handhabung von scheibenförmigen Objekten in einer Handhabungsebene eines lokalen Reinraumes |
US5330043A (en) * | 1993-05-25 | 1994-07-19 | Delta Design, Inc. | Transfer apparatus and method for testing facility |
KR0146216B1 (ko) * | 1995-04-24 | 1998-11-02 | 정문술 | 반도체 소자검사기의 소자로딩,언로딩장치 |
JPH08306765A (ja) * | 1995-04-28 | 1996-11-22 | Advantest Corp | ハンドラ装置用トレイ装着台 |
US6019564A (en) * | 1995-10-27 | 2000-02-01 | Advantest Corporation | Semiconductor device transporting and handling apparatus |
-
1996
- 1996-08-23 JP JP8222646A patent/JPH1058367A/ja active Pending
-
1997
- 1997-08-21 SG SG1997003009A patent/SG66390A1/en unknown
- 1997-08-21 US US08/916,015 patent/US5812409A/en not_active Expired - Fee Related
- 1997-08-21 TW TW086112010A patent/TW336926B/zh active
- 1997-08-22 DE DE19736622A patent/DE19736622C2/de not_active Expired - Fee Related
- 1997-08-22 GB GB9717740A patent/GB2316536B/en not_active Expired - Fee Related
- 1997-08-23 KR KR1019970040340A patent/KR100226096B1/ko not_active IP Right Cessation
- 1997-08-23 CN CN97119340A patent/CN1063266C/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI660900B (zh) * | 2015-06-01 | 2019-06-01 | 日商大福股份有限公司 | 平面保管設備之入出庫裝置的控制方法 |
TWI793766B (zh) * | 2021-09-15 | 2023-02-21 | 日商新川股份有限公司 | 半導體裝置的製造裝置及製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US5812409A (en) | 1998-09-22 |
SG66390A1 (en) | 1999-07-20 |
DE19736622C2 (de) | 1999-11-18 |
GB2316536A (en) | 1998-02-25 |
GB2316536B (en) | 1998-10-28 |
KR100226096B1 (ko) | 1999-10-15 |
DE19736622A1 (de) | 1998-02-26 |
CN1063266C (zh) | 2001-03-14 |
JPH1058367A (ja) | 1998-03-03 |
CN1176214A (zh) | 1998-03-18 |
KR19980018935A (ko) | 1998-06-05 |
GB9717740D0 (en) | 1997-10-29 |
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