TW287300B - - Google Patents

Info

Publication number
TW287300B
TW287300B TW085103866A TW85103866A TW287300B TW 287300 B TW287300 B TW 287300B TW 085103866 A TW085103866 A TW 085103866A TW 85103866 A TW85103866 A TW 85103866A TW 287300 B TW287300 B TW 287300B
Authority
TW
Taiwan
Application number
TW085103866A
Original Assignee
Hyundai Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Ind filed Critical Hyundai Electronics Ind
Application granted granted Critical
Publication of TW287300B publication Critical patent/TW287300B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
TW085103866A 1995-04-04 1996-04-02 TW287300B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950007846A KR100199346B1 (ko) 1995-04-04 1995-04-04 반도체 소자의 전하저장전극 형성방법

Publications (1)

Publication Number Publication Date
TW287300B true TW287300B (zh) 1996-10-01

Family

ID=19411528

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085103866A TW287300B (zh) 1995-04-04 1996-04-02

Country Status (5)

Country Link
US (1) US5637527A (zh)
JP (1) JP2816321B2 (zh)
KR (1) KR100199346B1 (zh)
CN (1) CN1080459C (zh)
TW (1) TW287300B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3426420B2 (ja) * 1995-08-21 2003-07-14 三菱電機株式会社 半導体記憶装置およびその製造方法
KR100200299B1 (ko) * 1995-11-30 1999-06-15 김영환 반도체 소자 캐패시터 형성방법
US5843830A (en) * 1996-06-26 1998-12-01 Micron Technology, Inc. Capacitor, and methods for forming a capacitor
JP3179346B2 (ja) * 1996-08-27 2001-06-25 松下電子工業株式会社 窒化ガリウム結晶の製造方法
KR100400290B1 (ko) * 1996-12-31 2003-12-24 주식회사 하이닉스반도체 반도체 소자의 캐패시터 제조방법
TW396602B (en) * 1997-06-30 2000-07-01 Hyundai Electronics Ind Highly integrated memory cell and method of manufacturing thereof
US6159855A (en) 1998-04-28 2000-12-12 Micron Technology, Inc. Organometallic compound mixtures in chemical vapor deposition
KR20000001945A (ko) * 1998-06-15 2000-01-15 윤종용 디램 셀 캐패시터의 제조 방법
KR100276389B1 (ko) * 1998-07-03 2000-12-15 윤종용 커패시터 및 그 제조방법
KR100301371B1 (ko) * 1998-07-03 2001-10-27 윤종용 반도체메모리장치및그의제조방법
US6197628B1 (en) 1998-08-27 2001-03-06 Micron Technology, Inc. Ruthenium silicide diffusion barrier layers and methods of forming same
US6204172B1 (en) 1998-09-03 2001-03-20 Micron Technology, Inc. Low temperature deposition of barrier layers
US6323081B1 (en) 1998-09-03 2001-11-27 Micron Technology, Inc. Diffusion barrier layers and methods of forming same
US6124164A (en) * 1998-09-17 2000-09-26 Micron Technology, Inc. Method of making integrated capacitor incorporating high K dielectric
US6273951B1 (en) 1999-06-16 2001-08-14 Micron Technology, Inc. Precursor mixtures for use in preparing layers on substrates
US7071557B2 (en) 1999-09-01 2006-07-04 Micron Technology, Inc. Metallization structures for semiconductor device interconnects, methods for making same, and semiconductor devices including same
US6780704B1 (en) 1999-12-03 2004-08-24 Asm International Nv Conformal thin films over textured capacitor electrodes
US8617312B2 (en) * 2002-08-28 2013-12-31 Micron Technology, Inc. Systems and methods for forming layers that contain niobium and/or tantalum
US7115528B2 (en) * 2003-04-29 2006-10-03 Micron Technology, Inc. Systems and method for forming silicon oxide layers
CN101452842B (zh) * 2007-11-30 2010-10-20 中芯国际集成电路制造(上海)有限公司 一种可减小器件漏电流的金属电极制造方法
US8479954B2 (en) * 2008-05-15 2013-07-09 Schroeder Industries, Inc. System for identifying fluid pathways through a fluid carrying device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2859363B2 (ja) * 1990-03-20 1999-02-17 富士通株式会社 半導体装置及びその製造方法
US5137842A (en) * 1991-05-10 1992-08-11 Micron Technology, Inc. Stacked H-cell capacitor and process to fabricate same
US5382817A (en) * 1992-02-20 1995-01-17 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having a ferroelectric capacitor with a planarized lower electrode
US5335138A (en) * 1993-02-12 1994-08-02 Micron Semiconductor, Inc. High dielectric constant capacitor and method of manufacture
JP3117320B2 (ja) * 1993-04-19 2000-12-11 沖電気工業株式会社 キャパシタ及びその製造方法
US5504041A (en) * 1994-08-01 1996-04-02 Texas Instruments Incorporated Conductive exotic-nitride barrier layer for high-dielectric-constant materials
US5573979A (en) * 1995-02-13 1996-11-12 Texas Instruments Incorporated Sloped storage node for a 3-D dram cell structure

Also Published As

Publication number Publication date
KR100199346B1 (ko) 1999-06-15
CN1142681A (zh) 1997-02-12
JP2816321B2 (ja) 1998-10-27
JPH08321592A (ja) 1996-12-03
CN1080459C (zh) 2002-03-06
US5637527A (en) 1997-06-10

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