A7 <57887 B7 五、發明説明（τ ) I: » (n^ ^^^1 m~n^— -- —-1Γ. ml 1 J. * ^ 、1 (請先閱讀背面之注意事項再填寫本頁) 本發明係關於自一熱源轉移熱能至一熱貯槽之熱等界面 材料更特別是，本發明熱係關於一熱導性材料，其係適合 於在於熱導性材料與其所结合之基質間提供更佳與更均勻 之接觸。 發明之背最 本發明係關於一熱導性界面材料，其係介於諸如一電子 元件之熱源與一熱貯槽之間。本發明之最普通實例係應用 於半導聘裝置與一熱貯槽間之熱導材料以使由半導體所產 生之熱可被移除。 典型，充填一種或多種熱導性材料之聚矽氧烷，熱塑性 橡膠丙烯酸或胺基甲酸乙酯鈷合劑被使用作為熱界面。此 類產物之一為市販熟知由Chomerics公司出售CHO-THERM 熱導性材料，且其係以_ 土或硼氮化物填料充填之聚矽氧 烷，或胺基甲酸乙酯黏合劑。 經濟部中央標隼局員工消費合作社印製 在介於熱源與熱貯槽之間置放熱導性材料必須謹慎以確 保介於熱導性材料與鄰接基質間具有良好之偶合性。通常 基質之一會與其偶合之表面具有不相合性，諸如由製造所 引起之高污點及低污點，由攜帶，運送或使用時引起之輕 微杻轉，彎屈或傾斜。此殘留之污點或區域不直接地與熱 導界面材料偶合而因此被暴露於空氣中。空氣係極為不良 之熱導體且其存在減少熱導性材料自其熱源熱傳输熱至其 熱貯槽之能力。此可能引起熱源之過熱。 美國專利4,654,754揭示兩種方法以克眼此問題。第一 -4 - 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） <57887 Α7 .—_ Β7 五、發明説明（2 ) 揷係使用一系列金靨彈簧或熱鏈结•其施賦一反颳於鄰接 之基質姒回應所拖加之壓力。第三種係使用窩型熱墊κ使 由邮接基筲所拖加之壓力關聯於窩型壓縮移除。兩種方式 造成基質之間不規則間距之調整。然而兩者均為特別設計 修正，對製造與使用而言為昂貴且其無法針對能力提供含 蓋全部基質表面不變與均勻之熱傳等性。 所Μ，此處需要提供一熱導性材料以使介於熱材料與鄰 接基質間之不均勻性累積之問題降至最低。 目的與概要 本發明提供一熱導性材料，其包含一方法以調適其所插 入之熱導性材料與基筲間之表面。調適之方法較佳係在兩 熱導性材料之主要表面中装入膨脹性金羼網孔•因此當壓 力被施加於熱導性材料與鄰接熱貯槽或熱源之間時•熱材 料調通介於兩郯接表面之間隙。 經濟部中央標準局員工消f合作社印製A7 < 57887 B7 V. Description of invention (τ) I: »(n ^ ^^^ 1 m ~ n ^ — --- 1Γ. Ml 1 J. * ^, 1 (Please read the precautions on the back first (Fill in this page) The present invention relates to the transfer of heat energy from a heat source to a heat storage tank and other interface materials. More particularly, the present invention relates to a thermally conductive material, which is suitable for the combination of the thermally conductive material and Provides better and more uniform contact between the substrates. Back of the Invention The present invention relates to a thermally conductive interface material, which is between a heat source such as an electronic component and a heat storage tank. The most common example of the present invention is Used as a thermally conductive material between a semiconducting device and a thermal storage tank so that the heat generated by the semiconductor can be removed. Typically, polysiloxane filled with one or more thermally conductive materials, thermoplastic rubber acrylic or amine groups Ethyl formate cobalt mixture is used as the thermal interface. One of such products is the CHO-THERM thermal conductivity material that is well known and sold by Chomerics, and it is a polysiloxane filled with _ soil or boron nitride filler, or Urethane adhesive. Central Standard Falcon of the Ministry of Economic Affairs Employee's consumer cooperatives printing and placing thermally conductive materials between the heat source and the heat storage tank must be careful to ensure good coupling between the thermally conductive material and the adjacent substrate. Usually one of the substrates will have a non-coupling surface Consistency, such as high and low stains caused by manufacturing, slight roll, bend or tilt caused by carrying, transportation or use. This residual stain or area is not directly coupled with the thermal interface material and therefore It is exposed to air. Air is a very poor thermal conductor and its presence reduces the ability of the thermally conductive material to transfer heat from its heat source to its heat storage tank. This may cause overheating of the heat source. US Patent 4,654,754 discloses two methods to To overcome this problem, the first-4-This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) < 57887 Α7. —_ Β7 V. Description of the invention (2) A series of gold luteurs are used in the series Spring or thermal link • It applies an anti-scratch to the adjacent substrate to respond to the dragged pressure. The third type uses a nested thermal pad κ to close the pressure dragged by the postal link. Due to the compression of the dimples. The two methods result in the adjustment of the irregular spacing between the substrates. However, both are special design corrections, which are expensive to manufacture and use and cannot provide the ability to cover all the substrate surfaces unchanged. Equivalence with uniform heat transfer. Therefore, it is necessary to provide a thermally conductive material to minimize the problem of accumulation of unevenness between the thermal material and the adjacent matrix. Purpose and Summary The present invention provides a thermal conductivity Material, which includes a method to adjust the surface between the thermally conductive material and the base shank it is inserted in. The method of adjustment is preferably to install an expandable gold mesh in the main surfaces of the two thermally conductive materials When pressure is applied between the thermally conductive material and the adjacent heat storage tank or heat source • The thermal material regulates the gap between the two tacky surfaces. Printed by the Employees ’Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs
In ^i·— ί 1 ml m^i nn —^ϋ HI n^— 一OJ (請先閱讀背面之注意事項再填寫本育) 另外，本發明提供由一聚合物黏，一熱填料，其包 含及瞭脹性金靨層UL·所形成之一正型熱界面材料。膨脹 ^金團網孔甚至在相當低壓力下會變形，如此Μ使調適其 所施壓表面間之外形。此使材料可令空氣之間隔降至最低 而無需提供不變之壓力介於層之間。此係不同於先前技藝 •在其中為使建立並維持介於基質與熱界面材料間之調適 性，彼等必需保持在高達500磅/平方吋下之不變鼷力。在 無法维持此頮腌加壓力下，先前技藝材料將無法調適，並 引起空氣間隙而造成降低均勻熱轉移並形成熱點與熱源之 -5 - 本紙張尺度適用中國國家櫟準（CNS ) Α4規格（210Χ297公釐） <57887 A7 B7 五 發明説明（ 遇熱。 較佳， 性瞭黏劑 熱導性材 接表面而 。其亦 固定此類 導性窜子 本發明 劑與一熱 熱^性材 ，諸如丙 料使熱界 無需諸如 ------ 使熱界面 材料，由 Sfl件或套 之目的係 導性填料 料具有一聚合物黏合劑熱，其係 感壓 一—'· 1 稀酸或聚矽氧综感壓性膠黏劑。感壓性 面材料與熱貯j $鄰 螺絲，固等等之其它固定裝 材料應用於電子元件上，其在之前無法 於尺寸，結構等等原因。另外，其使熱 件達自動化使用與姐裝。 提供熱導性材料，其包含一聚合物黏合 ** ' __- - 1 >·< 之摻合物•該材料中係具有一膨脹性金 網孔層包Ϊ^·4? 〇 本發明之另一目的係提供一熱導性，形成穩定之薄Η 烯與 丙膠 括橡 包性 自塑 選熱 成膠 製橡 所烷 物氣 合矽 摻聚 之氟 劑， 合Ρ 黏橡 物烷 合氧 聚矽 1 聚 由， 其樹 , 酸 其 孔 網驅。 金内 性之 脹面 膨表 1 要 與主 (xt -ft 料種 填一 性少 導至 熱之 1 料 ’ 材 酯該 乙在 酸藏 甲包 基被 胺少 聚至 壓脹 感膨 1 1 含與 包料。 其填中 , 性之 面導面 界熱表 _Λ CKU ΛΒ 性種稻 導多一 熱或少 i 種至 供 一之 提與面 係劑界 的合於 目黏藏 一 物包 另合層 之聚孔 明性網 發黏臛 本膠金 性性 (請先閲請背面之注意事項再填寫本頁) 訂 經濟部中央標隼局員工消費合作杜印製 剖. 剖 之 之 材 材 性 性 導 導 熱 熱 之 之 例 例 實 實 0 體 具 具 Ί1Μ 較 較 0 ㈱ - 1 第 另 之 之 明 明 發 發 本 本 示 示 顯 顯 10 2 示η鬮圖 圖 面 6 本紙張尺度適用中國國家樣準（CNS ) Α4規格（210X297公釐） 經濟部中央標準局員工消f合作社印製 257887 Α7 Β7 五、發明説明（4 ) 而圖。 圖3顯示***介於一熱源與熱貯槽間之圖2具體實例之 剖面圖。 發明之詳细敘述 本發明之一較佳具體苜例包含一形式穩定，似薄Η熱之 熱導性材料，其係由一聚合物黏合劑，一種或多種熱専性 填料與一膨脹性金驅網孔層，其包藏該材料之至少一種主 要表面之中。此類装置如圖1所顯示。 於此具體實例中，較佳為材料之第一主要表面3毗連於 熱分敗器，諸如一熱貯槽且第二主要表面4係毗連於熱源 〇 圖2顯示熱導性材料之另一具體實例，其中膨脹性金屬 網孔22係完全包藏介於界面材料之兩主要表面24，25之間 〇 如圖2顯示，具體實例基本上形成三層或區，兩個外部 部份，2 1，係單獨由樹脂與填料所形成及另一部份 -------- ----- -- 22，係由樹脂，填料與膨脹性金牖網孔所製成。 ^本發明之另一較佳具體實例係一熱能產生装置組件，諸 如電子元件，熱能分散裝置，諸如一熱貯槽或一熱分散器 ，與一熱能移轉裝置，諸如一熱導性聚合物材料***介於 產生装置與分散装置之間如此Μ使熱能自產生裝置移除至 分散裝置。此一姐件如圖3所顯示。 圖3之姐合顯示熱產生装置· 35，其係典型電子元件， -7 - 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） -J . (請先閱讀背面之注意事項再填寫本頁) 、-» 257887 at B7 經濟部中央標準局員工消費合作社印製 五、發明説明 ( 5 ) 1 ί 諸 如 半 導 體 f 一 熱 能 移 轉 裝 置 « 其 係 由 _ 2 之 具 兩 外 層 1 } 32 34之 具 贈 實 例 所 製 成 ， 係 包 含 樹 脂 與 填 料 與 内 部 或 中 1 1 間 蹰 33 · 其 係 包 含 具 樹脂 / 填 料 基 質 包 藏 於 金 鼷 網 孔 空 隙 *s 請 1 1 之 膨 脹 性 金 鬮 網 孔 0 —_- 熱 能 分 散 裝 置 31 被 裝 置 於 轉 移 裝 置 先 閱 1 I 讀 1 I 外 醑 之 外 表 而 0 背 1 I 如 同 白 圖 3 可 參 考 * 分 散 之 裝 置 9 31 % 於 η 例 此 中 係 熱 之 注 1 1 貯 榷 具 有 不 相 合 性 或 高 污 點 36其 施 加 m 力 至 下 方 之 轉 移 意 事 項 1 I 裝 置 a 因 此 杻 曲 膨 脹 性 金 鼷 網 孔 37 〇 m 脹 性 金 靨 網 孔 容 納 再 Λ 此 類 瑕 疵 共 使 轉 移 裝 置 調 適 熱 貯 槽 之 表 面 » Μ 使 均 勻 且 不 本 ^ 頁 1 變 之 熱 轉 移 含 蓋 基 質 之 全 部 表 面 〇 此 消 除 所 產 生 熱 污 點 之 雷 位 能 或 熱 產 生 裝 置 35熱 能 之 不 完 全 轉 移 至 埶 分 散 裝 置 1 1 31 0 1 熱 導 性 材 料 可 被 選 擇 各 種 熟 知 之 聚 合 物 黏 合 劑 * 諸 如 1 訂 1 丙 烯 酸 樹 脂 聚 矽 氧 院 與 氟 聚 矽 氧 烷 橡 膠 埶 塑 性 橡 膠 1 諸 如 Ο ATON 橡 膠 » 與 充 填 —. 種 或 多 種 埶 導 性 填 料 之 各 種 聚 1 I 胺 基 甲 酸 乙 酷 tfl-j 〇 此 類 材 料 所 製 成 之 聚 矽 氧 院 熱 塑 性 橡 膠 或 1 胺 蓽 甲 醃 乙 酯 於 美 _ 專 利 4, 574, 879 美 國 專 利 1 1 4 . 869 , 954 有 所 指 導 旦 其 在 本 文 中 彼 等 之 全 文 列 入 參 I 考 Ο 1 較 佳 熱 導 性 材 料 熱 被 由 — 感 壓 性 膠 黏 性 材 料 之 聚 合 物 1 黏 合 劑 9 諸 如 聚 矽 氧 掠 或 丙 烯 酸 膠 黏 劑 一 種 或 多 種 熱 導 1 性 填 料 與 膨 脹 性 金 匾 網 孔 層 所 製 成 〇 此 類 聚 合 物 黏 合 劑 被 1 I 熟 知 目. 為 市 售 商 品 0 較 佳 具 體 實 例 係 感 壓 性 丙 烯 酸 膠 黏 劑 1 1 t 其 被 熟 知 且 為 市 售 品 且 在 美 國 8 專 利 5, 213, 868 有 所 指 導 1 1 1 1 1 1 1 1 本紙張尺度適用中國國家櫺準（CNS ) A4規格（2丨0X297公釐〉 257887 at B7 經濟部中央標準局員工消費合作社印製 五、發明説明（ 6 ) 1 [ ) 其 在 本 文 中 其 全 文 列 入 參 考 Ο 合 用 於 本 發 明 之 埶 / *N\ 導 性 1 m 料 {% 粒 狀 固 體 其 能 夠 提 供 該 材 料 適 當 之 熱 傳 導 性 〇 較 1 1 佳 此 m 填 料 係 粒 狀 周 體 其 電 氣 絕 緣 性 及 熱 導 性 0 請 1 此類微粒之實例包含 但 係 不 被 限 制 氧 化 鋁 鋁 氮 化 先 閱 1 I 讀 1 物 m 氮 化 物 氧 化 錳 氧 化 鋅 銀 金 與 飼 或 塗 佈 金 m 背 A 1 | 之 材 料 諸 如 塗 佈 銀 之 飼 或 塗 佈 銀 之 鋁 〇 冬 1 I 意 1 I /JiL· 微 粒 應 為 足 夠 小 之 尺 寸 K 不 至 於 杻 曲 熱 導 性 材 料 之 表 面 事 1 項 〇 ifi 料 較 佳 之 尺 寸 白 約 1 微米至約100 MiL· 微 米 更 佳 於 一 範 再 4. % 阐 白 約 5 微 米 至約2 5微米 〇 填 料 被 含 於 黏 合 劑 中 其 含 量 足 本 .·~ 頁 1 提 供 適 當 之 熱 傳 導 性 〇 較 佳 填 料 包 含 之 量 為 白 約10¾ ^—' 重 最 計至約8 5 % 以 電 量 計 製 成 品 〇 更 佳 填 料 包 含 量 之 I I 範 圃 自 約40¾ 重 量計至約75¾ VX 重 量計且最佳約6 8 以 1 重 最 計 0 更 佳 之 瑣 料 係 硼 氮 化 物 氧 化 錳 而 含 m 氮 化 物 之 1 訂 氧 化 鋁 為 最 較 佳 之 填 料 0 1 額 外 之 成 分 亦 可 被 加 只 要 彼 等 不 妨 礙 產 物 之 調 適 性 或 熱 1 1 傳 導 性 〇 例如 當 混 合 黏 合 劑 或 一 聯 结 劑 至 填 料 中 時 較 佳 1 使 用 一 溶 媒 如 此 以 使 混 合 與 應 用 更 為 容 易 〇 若 需 要 吾 人 1 1 亦 可 加 人 顔 料 抗 燃 劑 及 / 或 抗 氧 化 劑 於 材 料 中 〇 1 作 為 瞭 脹 性 金 驅 網 孔 之 有 用 較 佳 金 m 之 實 例 包 含 但 1 不 被 限 制 ' 鋁 網 銀 锇 鍍 錫 铜 m 電 鍍 铜 錫 電 渡 1 板 銅 被 謁 鋼 與 其 他 電 鍍 或 被 護 金 靨 〇 無 論 材 料 之 使 用 1 其 應 為 盡 可 能 薄 而 同 時 仍 妖 提 供 適 當 之 調 適 性 〇 此 類 材 料 1 I 已 被 熟 知 且 為 市 售 品 〇 此 等 網 孔 之 典 型 係 薄 層 一 般 而 言 1 1 厚 度 約 .005 吋 ( .127毫米 ) .030 时 9 - ( .7 6 πι m )且 具 有 鑕 石 1 1 1 1 1 1 1 1 本紙張尺度適用中國國家標隼（CNS ) A4規格（210X297公釐） 〜57887 Α7 ______ Β7 五、發明説明（） 7 ' 口自約25個開口 /平方时至2600涸開口 /平方吋。此 可自許多市售品，包含Exmet與Delker購得。 性金驅網孔可完全地包藏於熱導性材料中或至少部 Wife包*ί於熱導性材料之一種表面。較佳，熱導性材料被 使具有三種或多種層或區，其係膨脹性金靨網孔/ 性樹脂覉形成中心賺而熱導性材料單獨形成外層。 胃本發明之熱導性材料被製成感壓性材料時，其可被製 臌帶•包含分離部份之膠帶或個別貼墊或片。 #發明之熱導性材枓可Μ各棟方法被製成。 製成材料之—方法係结合樹脂黏合劑與選定之填料或諸 ft完全涓合諸成分同時媛慢加入一溶媒直到液體具有 ¥ ®之構造被達成。材料然後被澆鏞在—剝離板，諸如一 $玻SI *或MYLAR瞋或具塗層之紙，包含膨脹性金賵層且 移除溶媒而製成熱導性材料。 方法係Μ足夠最之溶媒徹底地混合諸成分Μ獲得一 體。然後液賴可被噴覆或塗覆在膨脹性金騙網孔之 J:.並與加熱硬化。另外，相同之液體配方可被使用作 為> 兩者之夾合層.其中金靨網孔被浸入以製成適當材料。 經濟部中央標隼局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 製成本發明之熱導性材料之另一方法係藉模製。此係特 印丨有用’當吾人希望製成一厚熱導性層或當吾人實質上希 Μ製成特別成形之熱熱導性材料。於模製法中熱導性材料 ’諸姐成份被潖合並倒入一預製横中*其包含膨脹性金靨 網孔於適當位置。較佳，吾人在加入諸姐成份之前可塗覆 在具有剌離塗層膜之模子之内部。模子然後被加熱或其方 -10 - 本紙張尺度適用中國國家樣準（CNS ) Α4規格（210Χ297公釐） 257887 A7 B7 五、發明説明（8 ) (請先閲讀背面之注意事項再填寫本頁) 法置於外部能最區域W製成橫製外形。代替使用分離模· 其可被預期使用一模子以使熱導性材料被横製直接尼置於 在其欲接觸之表面。 較佳之方法係，形成三層或多層層合感壓性膠黏性材料 ，其中心蹰由膨脹性金鼷網孔製成·Μ熱導性樹脂基質浸 清a熱導性材料之外層形成於金屬層之每一面上，μ形成 一有黏著力之層合材料。外層可連讓地形成，以使網孔層 之一側被浸透並硬化，然後製程在相反面被重複。較佳， 製稈可同時地被應用於兩面。當材料係膠黏劑時，外表面 被用剝離層*諸如經塗覆之紙，鋁萡或一塑膠膜所掩蔽。 熱導性產物熱如以上所述無論是在模製時或直接配置時 可被製成連_或不連薄之膠帶；或薄Η或貼墊，然後切成 滴當外形；或外部模製成適當外形。若需要，一種或兩種 主要表而可包含額外之空氣移除结構，諸如於美國專利 5,21 3,868中所述之浮彫物或穿洞其全文已被列入本文中 〇 所得熱導性材料應足夠柔軟以使調適表面與其界面。較 佳，材料應具有Sho「e Α硬度小於90，更佳Shore Α硬度 約1 0。 根據本發明製備所典型產物所呈現之性質如下： 經濟部中央標準局員工消费合作社印製 厚度一1至20毫英时，較佳約5— 8毫英吋。 硬度，S h 〇「e - 1 0 至 9 0 (A S T M D - 2 2 4 0 ) 熱阳抗- 0.10。至 1.00t/W (Choraerics 煸號 27 ) 熱傳導性-0 . 5 - 2 W / m - K ( C h 〇 m e r i c s 編號 2 8 ) -11 - 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） "57887 at B7 五、發明説明（9 ) 雖然本發明已依諸參考例描述其較佳具體簧例，其他具 等修 彼類 於此 對部 正全 修蓋 與含 化試 變嘈 之被 明其 發且 本見 。 易 果顯 结明 之將 同者 相链 成技 達面 可方 例此 啻練 體熟 精 實 真 之 明 發 本 於 括 包 Μ 画 範 利 專 請 Φ 之 靨 0 附内 之之 當圍 相範 Μ 毎 TE神 (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部中央標準局員工消費合作杜印製 2 11 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）In ^ i · — ί 1 ml m ^ i nn — ^ ϋ HI n ^ — one OJ (please read the precautions on the back before filling in this education) In addition, the present invention provides a polymer adhesive, a thermal filler, which Contains one of the positive thermal interface materials formed by the expandable gold layer UL. Expansion ^ The gold ball mesh will deform even at a relatively low pressure, so that the shape of the surface to which the pressure is applied is adjusted. This allows the material to minimize air separation without providing constant pressure between layers. This is different from previous techniques. In order to establish and maintain the adaptability between the matrix and the thermal interface material, they must maintain a constant force up to 500 psi. In the absence of this pressure, the prior art materials will not be able to adjust, and cause air gaps to reduce the uniform heat transfer and form hot spots and heat sources -5-This paper size is suitable for China National Oak Standard (CNS) Α4 specifications ( 210Χ297mm) < 57887 A7 B7 Five descriptions of the invention (in case of heat. Preferably, the adhesive thermal conductive material is connected to the surface. It also fixes such conductive channeling agent of the invention and a thermal thermal material , Such as acrylic materials so that the thermal world does not need to make thermal interface materials, such as Sfl pieces or sleeves, the purpose of the conductive filler material has a polymer binder heat, which is pressure sensitive-'· 1 dilute Acid or polysilicone pressure-sensitive adhesive. The pressure-sensitive surface material and other storage materials such as screws, solids, etc. are applied to electronic components, which cannot be used for size, structure, etc. Reason. In addition, it enables the automatic use of hot parts and sister equipment. Provides thermally conductive material, which contains a polymer bond ** '__--1 > · < Expandable gold mesh layer Ϊ ^ · 4? 〇 Another invention The purpose is to provide a thermal conductivity, to form a stable thin H ene and propylene rubber including rubber-containing self-plastic heat-selective rubber rubber compound gas compound silicon fluoride fluorine agent, compound P sticky rubber compound oxygen polymer Silicon 1 gathers its roots, its trees, and its acid mesh drive. The internal expansion of the gold internal expansion table 1 should be filled with the main (xt-ft material and less lead to the heat of the 1st material). A cladding group is less polymerized by amines to swell and swell. 1 1 Contains and encapsulates. In its filling, the thermal surface of the surface guide surface thermal table _Λ CKU ΛΒ sexual rice leads to one more heat or less i to one Mentioned in the surface of the agent, it is a combination of a polyporous bright mesh with a layer of adhesive and a layer of glue. This kind of glue is golden (please read the precautions on the back and then fill out this page). Falcon Bureau ’s consumer cooperation to produce printed profiles. Examples of profile materials for thermal conductivity and thermal conductivity. 0 Examples of physical equipment with Ί1Μ compared to 0. ㈱-1 The other is clearly issued and the text is displayed. 10 2 Show η 阄 图 图 6 This paper scale is applicable to China National Standards (CNS) Α4 specifications (210X297 mm) 257887 Α7 Β7 printed by the Employee Consumers ’Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of the invention (4). Figure 3 shows a cross-sectional view of the specific example of FIG. 2 inserted between a heat source and a heat storage tank. Detailed description of the invention A preferred embodiment of the present invention includes a formally stable, thin-H thermally conductive material composed of a polymer binder, one or more thermal fillers, and an expandable gold flooding mesh layer. It encapsulates at least one major surface of the material. Such devices are shown in Figure 1. In this specific example, it is preferred that the first main surface 3 of the material is adjacent to the thermal divider, such as a thermal reservoir and the second main surface 4 is adjacent to the heat source. FIG. 2 shows another specific example of the thermally conductive material , In which the expanded metal mesh 22 is completely encapsulated between the two main surfaces 24, 25 of the interface material. As shown in FIG. 2, the specific example basically forms three layers or regions, two external parts, 2 1. Separately formed by resin and filler and the other part -------- ------22, made of resin, filler and expandable metal mesh. ^ Another preferred embodiment of the present invention is a thermal energy generating device assembly, such as an electronic component, a thermal energy dispersing device, such as a thermal storage tank or a thermal disperser, and a thermal energy transfer device, such as a thermally conductive polymer material It is inserted between the generating device and the dispersing device so that the thermal energy is removed from the generating device to the dispersing device. This sister piece is shown in Figure 3. Fig. 3 shows the heat generating device · 35, which is a typical electronic component, -7-This paper size is applicable to China National Standard (CNS) Α4 specification (210Χ297 mm) -J. (Please read the precautions on the back first (Fill in this page),-»257887 at B7 Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Invention Instructions (5) 1 ί Such as semiconductor f a thermal energy transfer device« It consists of _ 2 with two outer layers 1} 32 It is made of a special example of 34, which contains resin and filler and the inner or middle 1 1 between 33 · It is composed of a resin / filler matrix encased in the pores of the gold mesh mesh * s 1 1 expandable gold mesh Hole 0 —_- thermal energy dispersing device 31 is installed in the transfer device. 1 I read 1 I. The external surface is 0 and the back 1 I is like white figure 3. Refer to * Dispersing device 9 31% in η. Note 1 1 Questions about inconsistency or high stains 36 its application m Transfer considerations to the bottom 1 I Device a Therefore, the flexed expandable gold mesh mesh 37 〇m The expandable gold mesh mesh accommodates again. Such defects make the transfer apparatus adapt to the surface of the heat storage tank »Μ Make it uniform and cost-effective ^ Page 1 Variable heat transfer covers the entire surface of the substrate. This eliminates the thermal energy generated by the lightning potential energy or the incomplete transfer of the thermal energy of the heat generating device 35 to the dispersing device 1 1 31 0 1 The thermal conductivity material can be selected Various well-known polymer binders * such as 1 order 1 acrylic resin polysiloxane and fluoropolysiloxane rubber plastic rubber 1 such as Ο ATON rubber »and filling-. One or more kinds of conductive fillers of various poly 1 I Ethyl carbamate tfl-j 〇Polysiloxane-based thermoplastic rubber made from such materials or 1 amine methyl ethyl ester in the United States_ Patent 4, 574, 879 US Patent 1 1 4. 869, 954 are instructed once their full texts are included in the reference I. Ο 1 Preferred Thermal Conductivity Materials Thermally Included — Polymers of Pressure Sensitive Adhesive Materials 1 Adhesive 9 Such as polysiloxane or acrylic adhesives, one or more thermal conductivity 1 filler and expandable gold plaque mesh layer made of such polymer adhesives are well-known for 1 I. For commercial products 0 preferably specific The example is a pressure sensitive acrylic adhesive 1 1 t which is well known and commercially available and has guidance in the US 8 Patent 5, 213, 868 1 1 1 1 1 1 1 1 1 This paper size is applicable to the Chinese National Standard ( CNS) A4 specification (2 丨 0X297mm) 257887 at B7 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs V. Description of invention (6) 1 [) The full text of which is incorporated by reference in this text. Ο Applicable to the invention / * N \ Conductivity 1 m material {% granular solid which can provide this The thermal conductivity of the material is better than that of 1 1. The electrical insulation and thermal conductivity of the filler-shaped granular body are 0. Please 1 Examples of such particles include but are not limited. Alumina aluminum nitridation 1 I read 1 m Nitride Manganese Oxide Zinc Oxide Silver Gold and Feed or Coated Gold m Back A 1 | Materials such as silver-coated feed or silver-coated aluminum Winter 1 I Italian 1 I / JiL · The particles should be sufficiently small The size K is not as high as the surface of the thermally conductive material. The preferred size of the material is about 1 micron to about 100 MiL · micron. It is better than a standard and 4.% is about 5 microns to about 25 microns. 〇The filler is contained in the binder and its content is sufficient. · ~ Page 1 Provide appropriate thermal conductivity 〇The preferred filler is included in an amount of about 10 ¾ ^ — 'The maximum weight is about 8 5% of the finished product on the basis of electricity. The better filler content of II Fanpu is from about 40¾ weight to about 75¾ VX weight and the best is about 6 8. The best weight is 1 and the best is 0. The better material is boron nitride manganese oxide The 1st alumina containing m nitride is the most preferred filler. 0 1 additional ingredients can also be added as long as they do not hinder the product's adaptability or heat 1 1 conductivity. For example, when mixing a binder or a coupling agent When it is added to the filler, it is better to use a solvent so as to make mixing and application easier. If necessary, we can also add pigment flame retardants and / or antioxidants to the material. 1 serves as a swellable gold drive net Examples of useful gold m holes include but are not limited to 1) Aluminum mesh silver osmium tin-plated copper m electroplated copper-tin electroplating 1 plate copper is covered with steel and other electroplated or protected gold. Regardless of the material used 1 its application Exhausted It may be thin while still providing proper adaptation. Such materials 1 I are well known and are commercially available. Typical thin layers of these meshes are generally 1 1 thick about .005 inches (.127 mm) .030 o'clock 9-(.7 6 πι m) and with side stones 1 1 1 1 1 1 1 1 1 This paper scale is applicable to the Chinese National Standard Falcon (CNS) A4 specification (210X297 mm) ~ 57887 Α7 ______ Β7 5. Invention Description () 7 'mouth from about 25 openings / square to 2600 yuan openings / square inch. This is available from many commercial products, including Exmet and Delker. The gold drive mesh can be completely encapsulated in the thermally conductive material or at least partially wrapped in a surface of the thermally conductive material. Preferably, the thermally conductive material is made to have three or more layers or regions, which are formed by the expandable gold-mesh mesh / resin resin core and the thermally conductive material alone forms the outer layer. Stomach When the thermally conductive material of the present invention is made into a pressure-sensitive material, it can be made with tape • Tape or separate pads or sheets containing separate parts. #Invented thermally conductive materials can be made by various methods. The method of making the material is to combine the resin binder with the selected filler or the ft to completely blend the ingredients while slowly adding a solvent until the liquid has the structure of ¥ ®. The material is then poured onto a peeling board, such as a $ glass SI * or MYLAR® or coated paper, which contains an intumescent layer of gold and removes the solvent to make a thermally conductive material. The method is such that M is sufficient and the solvent is thoroughly mixed to obtain one. Then the liquid can be sprayed or coated on the expandable gold decoy mesh J: and hardened with heat. In addition, the same liquid formulation can be used as a sandwich layer between the two. The gold-mesh mesh is immersed to make an appropriate material. Printed by the Employee Consumer Cooperative of the Central Standard Falcon Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page). Another method for making the thermally conductive material of the present invention is by molding. This special feature is useful when we want to make a thick thermally conductive layer or when we actually want to make a specially shaped thermally conductive material. In the molding method, the thermally conductive material ’s ingredients are poured and poured into a prefabricated cross * which contains an expanded gold-mesh mesh in place. Preferably, before adding the ingredients of the sisters, we can coat the inside of the mold with the release coating film. The mold is then heated or its side -10-This paper scale is applicable to China National Standards (CNS) Α4 specification (210Χ297mm) 257887 A7 B7 5. Invention description (8) (Please read the precautions on the back before filling this page ) Method is placed in the outermost area W to make a horizontal shape. Instead of using a separate mold, it can be expected to use a mold to allow the thermally conductive material to be placed horizontally directly on the surface to be contacted. The preferred method is to form a three-layer or multi-layer laminated pressure-sensitive adhesive material, the center of which is made of expandable gold mesh. ΜThermally conductive resin matrix is immersed a layer of thermally conductive material is formed in On each side of the metal layer, μ forms an adhesive laminate. The outer layer can be formed continuously so that one side of the mesh layer is saturated and hardened, and then the process is repeated on the opposite side. Preferably, the stalk preparation can be applied to both sides simultaneously. When the material is an adhesive, the outer surface is masked with a release layer * such as coated paper, aluminum foil or a plastic film. The thermally conductive product heat can be made into a thin tape with or without a thin layer when it is molded or directly configured as described above; or a thin Η or a pad, and then cut into drops for shape; or externally molded Into a proper shape. If necessary, one or both of the main tables may contain additional air removal structures, such as reliefs or perforations described in US Patent 5,21 3,868, the full text of which has been incorporated herein. The resulting thermally conductive material It should be soft enough to allow the conditioning surface to interface with it. Preferably, the material should have a Sho "e Α hardness of less than 90, and more preferably Shore Α hardness of about 10. The typical properties of the typical product prepared according to the present invention are as follows: The thickness printed by the employee cooperative of the Central Bureau of Standards, Ministry of Economic Affairs 20 mils, preferably about 5-8 mils. Hardness, Sh 〇 "e-1 0 to 9 0 (ASTMD-2 2 4 0) Thermal resistance-0.10. To 1.00t / W (Choraerics 煸No. 27) Thermal conductivity-0.5-2 W / m-K (C h 〇merics No. 2 8) -11-This paper scale is applicable to China National Standard (CNS) A4 specifications (210X297 mm) " 57887 at B7 V. Description of the invention (9) Although the present invention has described its preferred specific spring examples according to reference examples, other instruments and other amendments are here to be completely revised and the contents of the chemical test become noisy. See. Yi Guoxian made it clear that the same person can be linked to form a skillful noodles. Xiangfan Μ every TE God (please read the notes on the back before filling out this page) Bureau staff consumer cooperatives 2 11 printed paper scale applicable Chinese National Standard (CNS) A4 size (210X297 mm)