2043i6A6 B6 五、發明説明（>) 或好 Η 良 層到 劑達 箸可 黏框 和鉛 ，過 曲經 彎 ， 可法 的方 體之 基等 導片 傳薄 熱劑 含箸 現黏 發助 己自 今導 迄傳 熱 造在 所中 緣劑 絶充 電 填 和之 接荷 鍵負 的高 力及 應包 之層 量脂 熱樹 械經 機可 因導 及傳 果熱 效 〇 器壞 熱破 散的 的成 用 使 來 代 替 可 劑 〇 充少 填減 且此 ，因 行可 進壞 時破 脂之 樹力 量應 微量 含熱 只械 或機 無此 含 包 份 Β- S 1 另 之 明 發 本 為 少 至 量 導 傳 熱 有 含 ο ο 11 至 ο U 為 度 厚 和 體 基 之 的 層 基 該 少 至 於 用 應 偽 其 Η 層 劑 箸 黏 電 介 値 及 度 厚 e ϋ ο 5 至 5 有 具 並 劑 〇 充上 填面 性表 導之 傳量 熱導 含傳 値熱 之 (請先閲讀背面之注意事項再填寫本頁) 布 之 製15 屬約 金及 或量 箔導 , 傳 膜熱 薄之 一 高 為含 的且 合料 適材 可模 體脂 基樹 此成 合 或 金 合 熔 的 溫 高 °c 較 金 面 合 表 之 之 鎳 金 和 合 銅 和 。為 屬緣金 金絶合 。電之 布之其 薄好及 的良鋅 成 一 ， 做到鎳 瓷達 ， 陶以銅 或者為 碩化屬 為氧金 可可之 亦為佳 ，可較 占 fch I Mu 經濟部中央標準局貝工消費合作社印製2043i6A6 B6 V. Description of the invention (>) or good Η Good layer to the agent can be glued to the frame and lead, bent through the bend, can be used in the base of the rectangular block, etc. The heat transfer agent contains a thin layer of heat transfer agent containing the glue. Since the heat transfer has been done so far, the negative force of the charge bond filled by the edge agent and the amount of the layered fat and heat tree machine can be broken by the heat conduction and heat transfer device. The use of the powder can replace the agent. The amount of the filling tree should be reduced and filled, and the strength of the broken tree when it can go bad should contain a small amount of heat, only the machine or the machine. This is as low as the amount of heat conduction. The layer base with ο 11 to ο U is thick and the body base should be as little as the thickness of the viscous dielectric layer and the thickness of the layer should be false. There is a combined agent. The mass transfer thermal conductivity filled with a surface-filled surface guide contains heat transfer (please read the precautions on the back and then fill out this page). The system of fabric 15 is about gold and or foil guide, film transfer One of the hot thin is high, and the suitable material is suitable for phantom fat-based tree. Gold Melting temperature ° c higher than the gold surface of the engagement table of nickel and gold and Copper. It belongs to the fate of gold and gold. The cloth of electricity is as thin as it is good, and the good zinc is one, so that it can achieve nickel porcelain, and the pottery is copper or the master is oxygen. The cocoa is also better, which can account for fch I Mu ’s consumption of shellfish. Printed by cooperatives
化 氧 K 二 的 W 銅20 和為 鋁量 括熱 包導 為的 體體 基載 的的 佳佳 .3’ 最較/W 為 佳 最 圍g J冑 箸f之 黏 m s Μ \ 面 表 之 佳 較 度 厚 其 至 至 ^ 至 ο 5 為 佳 較 0 ο ο 3 至 ο 2 為 度 厚 之 佳 較 Η 層 為 少 至 量 熱 導 之 佳 較 片 層 劑 本紙張尺度逍用中國國家標準(CNS)甲4規格(210X297公釐) 81. 5. 20,000〇1) A 6 Β6 經濟部中央標準局員工消費合作社印製 五、發明説明（> ) 黏著劑在此技藝中之應用是為眾所週知的。其可為糊 漿狀，黏狀或固態狀之黏箸物。其可在進行製程時將外 層的保護膜去除之。在製備過程時，基體亦可採用液狀 或熔融狀之黏著劑。再者，薄膜黏箸劑和熱熔黏著劑亦 可應用之。典型合適的黏著劑包括環氣樹脂，聚P，聚 丙烯酸酯，聚矽氧及熱塑膠例如聚亞胺及聚酯。 較佳的黏箸劑為環氣樹脂，持別是含有硬化潛能及熟 化加速物之二甘油醋或更好為二酚A的二甘油酯。環氣 薄膜己陳述於 L.M.Leung的 Hybrid Circuits,Nol8, pages 22-24(1989)〇 此瑱充劑可為非常細的顆粒物，其通常的顆粒大小較 佳為小於黏箸劑的厚度。較好的条統為一較高填充劑的 用量以達一較高的熱傳導量。此填充劑的細頼粒填充量 典型的為25至90重量％較佳為30至80重量％，其填充量 是基於熱傳導之量而定0此填充量可為片狀，針狀或纖 維狀。此種瑱充劑經常會有很高的熱傳導量，故此可採 較小的填充物量，典型的為5至4 0重量％此填充物之量 是基於黏著劑層片的重量而定。此镇充劑並非電子導電 物，其可為介電物質。 適合且經常在應用之熱傳導和介電質填充物典型的為 自然或合成之礦物和陶瓷材料，包括鑽石，金红石，石 英，·雲母，矽矽藻土，矽灰石，結，鋁之硝酸化合物， 礬土，硼石，氣化鋅，硝酸矽氧和磺化矽以及此種填充 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度逍用中BB家標毕(CNS)甲4規格(210x297公龙） 81. 5. 20/00〇〇 ^04316 A 6 B6 經濟部中央標準局員工消費合作社印製 五、發明説明（斗） 劑的混合物。較佳的實體為本發明之硝酸鋁填充劑。 此镇充黏合劑可經此技藝方面之方法經混合步驟將之 製備或以已知的層包方法。（刷法，摻合層包，簾塗層 包，旋轉層包或模成形）。 此新穎性的層合板可為平面或較佳為其可為凹或凸狀 以能黏在元件（典型為鉛柜）的表面上，且是以鍵接之方 式。 此新穎性的層合板優於與以鉛和鉛柜以鍵接的方式形 成溫熱橋。一驚呀之熱移除量可因此經這電子及電機元 件來達成。其熱阻® J A可較習知的元件且在沒有或有水 冷卻時高出三倍以上。鋁的鍵接亦為有效的熱排除部份 。以層合板的形狀以及材料的選擇將防止機械熱能的應 力，即以熱膨脹係數宋算，可保持一持久的保護層之電 子元件，例如雙同線塑膠層包物。 本發明較佳的實體為，含可用來做為熱橋的熱傳導的 介電自助之黏合薄膜。較佳用於做為黏合劑薄膜和填充 劑是如先前所曾提及的。此黏合劑可為平面的或者各形 狀以便其能以凸狀或凹狀的黏在元件上的面積，較佳為 鋁柜。此新穎層合板的熱移除量之範圍是為驚人的大。 另一方面之優點即為除了金屬基體，其可將機械熱能應 力降低，故此可為優良的黏著之鍵接物，待別是若此樹 脂或其他的合成樹脂形成材料，例如鋁柜層包樹脂，是 以鹼性物質做成的材料例如環氧樹脂。再者，鉛柜和雙 -6 - 本紙張I/fe逍用中困a家標準(CNS)甲4規格(210X297公*) """' 81. 5. 20.000(H) (請先閲讀背面之注意事項再填寫本頁) ^04316 A 6 B6 經濟部中央標準局員工消費合作社印製 五、發明説明（r) 同線的構造是為經濟及間單。 黏合劑薄Μ的熱傳導量至少為1 W/ mK及較佳的厚度為 至 5 0 0 /i m。 在另一方面，本發明偽有關於鉛與鉛柜和電子及電機 的電絶緣接觸面之元件，其傜與鉛柜鍵接至一新穎性之 層合板或一介電和自黏合薄片且其所含之熱傳導填充物 之熱傳導量為至少1W/ ιπΚ。 此鉛柜的另外一面可完全與層合板或黏著層鍵接。此 鉛偽為金颶或合金，典型的是銅，鋁或銅/鎳合金，含 優越之熱傳導，故部份之鍵接即足夠。本發明之較佳的 實體中，只有鉛的尖端之接觸面是和層合板和黏合薄Η 鍵接。 此新穎性之鉛柜可以經已知的方法以將之鍵接與層合 板或黏合薄片並可在有和沒有熱及/或壓力下將之製造 之。·在另一方面，本發明傜有關於採用鉛柜鍵接至層合 板或黏合劑薄片上，以製備電子和電機元件，待別為D I P s 。此元件之製程是為已知。例如其步驟可為將電子及電 機元件，持別是為用一個半導體將之定位於接觸面且在 有或没有黏著劑時，將此元件與電鉛接觸，接者將之以 一合成樹脂模製物層包住。以合成樹脂模製物將電子及 電機元件層包住是為眾所週知的。環氣樹脂經常做為此 方面之應用。 在另一方面，本發明偽有關將熱量由經合成樹脂模物 -7 - (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度遑用中國a家樣準(CNS>甲4規格(210父297公货) 81. 5. 20,000(H) A6B6 經濟部中央標準局貝工消費合作社印製 五、發明説明（b) 層包在鉛柜上之電機和電子元件的電絶緣接觸面而得以 排散出的程序。較佳為雙同線塑_層包紮，其中其製程 為將接觸面的背面和鉛柜之介電鉛鍵接至本發明的層合 板或含熱傳導镇充物且熱傳導量為至少lW/mK之介電及 自助之黏合劑薄膜以做成散熱層。 此新穎性之鉛柜傜特別適合用於製備D I P s因其可在操 作時能達到所要求之效果。在S —方面而言，本發明是 有關含鉛柜之D I P s,其中其背面是電絶緣面以使得半導 體能與鉛鍵接至本發明所製之層合板或至介電及自肋之 黏合劑薄膜，而此薄膜含有導熱填充物並具有至少1 W/ mK的導熱量。較佳而言，只有鉛的尖端和層合板或黏合 劑薄膜鍵接。在本案較佳的實體中的雙同線塑膠層包中 ，此層合板或黏合劑薄膜是貼於鉛柜之凹和凸之部位。 此設計在視覺上會覺得破裂，這乃因其熱機械性質的拉 應力。 本案所指較佳的層Μ亦可做為本發明之其他物件之用 途。 圖1掲示一種新潁性之雙同線塑膠層包（D I P s )及一個 層包片的截面圖。一鉛柜（2 )是置於一基體（1 )上，此給 柜含有金屬鉛（8 )和接觸面（7 )。層包Η樹脂（3 )是經一 熱.接觸阽蓋（4 )鍵接至基體（1 )。層Η ( 5 )是經黏合劑層 (6 )固定於鉛柜（2 )之接觸面上。接觸面（7 )是鍵接至鉛 柜（2 )的金靥鉛（8 )之上，其俗經一含熱傳導填充物介電 一 8 - (請先閲讀背面之注意事項再填寫本頁) 裝- 訂_Oxygen K 2 W copper 20 and aluminum body is thermally conductive as the base of the body is better. 3 'is the best / W is the best g J 胄 箸 f viscosity ms Μ \ surface surface It is better to be thicker than ^ to ο 5 is better than 0 ο ο 3 to ο 2 is better than thick layer is better than Η layer is less than the amount of thermal conductivity is better than the laminating agent CNS) A4 specifications (210X297 mm) 81. 5. 20,000〇1) A 6 Β6 Printed by the Employees ’Consumer Cooperative of the Central Standards Bureau of the Ministry of Economy V. Description of invention (>) The application of adhesives in this technique is well known of. It can be paste-like, sticky or solid sticky objects. It can remove the outer protective film during the process. In the preparation process, the matrix can also use liquid or molten adhesive. Furthermore, film adhesives and hot melt adhesives can also be used. Typical suitable adhesives include epoxy resin, poly P, polyacrylate, polysiloxane, and thermoplastics such as polyimide and polyester. The preferred viscous agent is a ring gas resin, especially a diglycerin vinegar containing a hardening potential and a curing accelerator or more preferably a diglycerin ester of diphenol A. The ring gas film has been described in L.M. Leung's Hybrid Circuits, Nol 8, pages 22-24 (1989). This filler can be very fine particles, and the usual particle size is preferably smaller than the thickness of the binder. A better rule is a higher amount of filler to achieve a higher thermal conductivity. The filling amount of the fine particles of this filler is typically 25 to 90% by weight, preferably 30 to 80% by weight, and the filling amount is determined based on the amount of heat conduction. The filling amount can be in the form of a sheet, needle or fiber . Such fillers often have a high thermal conductivity, so a smaller amount of filler can be used, typically 5 to 40% by weight. The amount of filler is based on the weight of the adhesive layer. This sedative is not an electronically conductive substance, it may be a dielectric substance. Suitable and often used thermally conductive and dielectric fillers are typically natural or synthetic mineral and ceramic materials, including diamond, rutile, quartz, mica, diatomaceous earth, wollastonite, knots, aluminum nitrate compounds , Bauxite, Boron, Vaporized Zinc, Silicon Oxynitrate and Sulfonated Silicone and this kind of filling (please read the precautions on the back before filling this page) The standard of this paper is BB Family Standard (CNS) A 4 Specifications (210x297 male dragon) 81. 5. 20 / 00〇〇 ^ 04316 A 6 B6 The Ministry of Economic Affairs Central Standards Bureau employee consumption cooperative printed five, invention description (bucket) mixture of agents. The preferred entity is the aluminum nitrate filler of the present invention. This filling adhesive can be prepared by a mixing step by this art method or by a known lamination method. (Brush method, blending layer package, curtain coating package, rotating layer package or die forming). This novel laminate can be flat or preferably it can be concave or convex to stick to the surface of a component (typically a lead cabinet) and is bonded. This novel laminate is superior to forming a thermal bridge with lead and lead cabinets in a bonded manner. The amount of heat removal can be achieved through these electronic and motor components. Its thermal resistance ® J A can be more than three times higher than conventional components and without or with water cooling. Aluminum bonding is also an effective part of heat removal. The shape of the laminate and the choice of material will prevent the stress of mechanical thermal energy, that is, the thermal expansion coefficient can be calculated, which can maintain a durable protective layer of electronic components, such as double-line plastic layer wrap. The preferred entity of the present invention is a self-adhesive adhesive film containing a thermally conductive dielectric that can be used as a thermal bridge. The preferred use as adhesive films and fillers is as mentioned previously. The adhesive can be flat or shaped so that it can stick to the area of the component in a convex or concave shape, preferably an aluminum cabinet. The range of heat removal of this novel laminate is surprisingly large. On the other hand, the advantage is that it can reduce the mechanical thermal energy stress in addition to the metal substrate, so it can be an excellent adhesive bond, except if this resin or other synthetic resin forming materials, such as aluminum cabinet-clad resin , Made of alkaline materials such as epoxy resin. Furthermore, lead cabinets and double-6-this paper I / fe is easy to use a home standard (CNS) A 4 specifications (210X297 public *) " " " '81. 5. 20.000 (H) (please (Read the precautions on the back before filling in this page) ^ 04316 A 6 B6 Printed by the Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of Invention (r) The structure of the same line is for economic and inter-order. The thermal conductivity of the thin adhesive M is at least 1 W / mK and the preferred thickness is up to 500 / im. On the other hand, the present invention pseudo-regards the components of the lead-to-lead cabinet and the electrically insulating contact surfaces of electronics and motors, which are bonded to the lead cabinet to a novel laminate or a dielectric and self-adhesive sheet and its The thermal conductivity of the thermally conductive filler contained is at least 1 W / ιπΚ. The other side of the lead cabinet can be completely bonded to the laminate or adhesive layer. This lead is pseudo-gold or alloy, typically copper, aluminum or copper / nickel alloy, with excellent thermal conductivity, so some of the bonding is sufficient. In the preferred embodiment of the present invention, only the contact surface of the tip of the lead is bonded to the laminate and the bonding thin H. This novel lead cabinet can be bonded to laminates or adhesive sheets by known methods and can be manufactured with and without heat and / or pressure. On the other hand, the present invention relates to the use of lead cabinet bonding to laminates or adhesive sheets to prepare electronic and motor components, to be distinguished as D I P s. The manufacturing process of this device is known. For example, the steps may be to place the electronic and motor components, in order to use a semiconductor to position them on the contact surface and contact the component with electrical lead with or without adhesive, and then use a synthetic resin mold Enclosed in the product layer. It is well known to wrap synthetic resin molded products around electronic and motor component layers. Ring gas resins are often used for this purpose. On the other hand, the present invention is pseudo-related to the use of heat from synthetic resin molds-7-(please read the precautions on the back before filling in this page). This paper uses the Chinese standard (CNS> A4 specifications ( 210 father 297 public goods) 81. 5. 20,000 (H) A6B6 Printed by the Beigong Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Invention Description (b) The electrical insulation contact surface of the motor and electronic components wrapped in the lead cabinet The process of dissipation. Preferably double-line plastic-layer bandaging, in which the process is to bond the back surface of the contact surface and the dielectric lead of the lead cabinet to the laminate or thermally conductive ballast of the present invention and the amount of thermal conductivity It is at least 1W / mK of dielectric and self-adhesive adhesive film to make a heat dissipation layer. This novel lead cabinet is particularly suitable for preparing DIP s because it can achieve the required effect during operation. In S — In terms of aspects, the present invention relates to DIP s for leaded cabinets, where the backside is an electrically insulating surface so that the semiconductor can bond with lead to the laminate made by the present invention or to the dielectric and self-ribbon adhesive film, The film contains a thermally conductive filler and has a thermal conductivity of at least 1 W / mK . Preferably, only the tip of lead is bonded to the laminate or adhesive film. In the double-line plastic layer package in the preferred entity of this case, this laminate or adhesive film is attached to the recess of the lead cabinet The convex part. This design will feel visually broken due to the tensile stress of its thermomechanical properties. The better layer M referred to in this case can also be used for other objects of the invention. Figure 1 shows a new A cross-sectional view of a double-coated plastic layer package (DIP s) and a layer package. A lead cabinet (2) is placed on a substrate (1). This cabinet contains metal lead (8) and contact surfaces (7). The layer-coated H resin (3) is bonded to the substrate (1) by a heat. The contact lid (4) is bonded to the lead cabinet (2) through the adhesive layer (6) The contact surface (7) is the gold lead (8) that is bonded to the lead cabinet (2), which is a dielectric material with a thermally conductive filler 8-(please read the notes on the back first Fill in this page again)
C 本紙張尺度逡用中a B家搮準(CNS)甲4規格(210父297公龙) 81. 5· 20,000(ίί) ^〇43i6 經濟部中央標準局員工消費合作社印製 A 6 B6 _ 五、發明説明（ 及自助的黏合劑薄膜而貼上的。 圖2掲示對應之DIP其中層合板（9)>金屬Η是定置於 接觸面（7 )之層包樹脂（3 )之下。 以下之實施例將更清楚的說明本案之内容。 實施例 1 :製備層合板 67. 2重量％的硝酸鋁具有平均粒子直徑為30# m及最 大直徑為1 0 0 A m化合至含1 4 . 9 2重量％的環氣樹脂〔先 前先加入6 6 · 4重量％的雙酚A之二甘油酯，3 0 . 5重量％; 的雙酚A和3 . 1重量％的對第三丁基酚（A r a 1 d i t ® 7 0 9 7 ) I ，且其中7 3 · 7 3 %與19.82重量X之羧基端基之聚丁二烯/ 丙烯睛共聚物（H y c a r » C T B N 1 3 (3 0 X 1 3 )及6 · 4 5重量％的 雙酚A産生反應〕，4 . 4重量％的雙酚A之二甘油，0 . 2 8 重量％的聚醚聚亞胺之嵌段聚合物（P e b a X ® 2 5 3 3， A t o c h e ns)， 3 · 3 3重量％的環氧樹腊之改良彈性體〔3 4 . 7 6 重量 ％ A r a 1 d i t ® 7 0 9 7 , 1 6 · 7 9 重量 ％ 的 H y c a r ® C T B N 1 3 0 0 X 1 3 , 3 4 . 7 6重量％之固態雙酚A之環氧樹脂（A r> a 1 d i t ® B )及0·%重量X之雙酚A,環氣當量為1.1當量/公斤之産 物〕，0.47重量X旳A r a 1 d i t ® 7 0 9 7， 1重量％的檟如堅果 殼油（C N S L油），0 . 2 8重量％的A e r o s i 1 ® ,三甲氣基（甘 油氧基丙基）矽烷（黏合促進劑），G . 4 6重量％的第三羧 酸 Versatic® lQ(Cardura® E 10)的甘油酷，0.92重量 ％ 的二氟二亞胺，0.Q6重量％的氯甲苯和0.22重量％含有 聚-對-乙烯酚，二甲基胺和甲醛（EP 797， Shell)之 -9 - 本紙張尺度逍用中困B家標準(CNS)甲4規格(210X297公釐) 81. 5_ 20,000(H) (請先閲讀背面之注意事項再填寫本頁) A6 B6 經濟部中央標準局員工消費合作社印製 五、發明説明（9) Mannich鹼。一痼柔軟賦黏性組成物之熔融黏合劑薄膜 施壓以一厚度為35/im之銅箔經力塗層於層合板上。層 合板之黏合劑層的導熱量為1 . 5 W/ in K且其厚度為2 4 0 # m 〇 實施例 2 :利用實施例1之層合板製備鉛柜 將實施例1之層合板置定於一個含有1 6 -針銅鉛柜； 如電鉛之尖端，即電絶緣接觸面的背面。其鍵接是經 1 8 0 °C在半小時内完成。然後此層合板就固定的鍵接於 鉛柜上。 實施例 3 :製備D I P 將一値熱元件和一個熱偶极鍵接於如實施例2之鉛柜 的薄Η邊緣。此鉛柜經置於一個模内徑一具導熱量為0 . 2 W/ m Κ，含1 8 5克雙酚A ( A r a 1 d i t ® G Υ 2 6 0 )的環氣樹脂和 2 9 · 5克做為硬化物之三甲基六亞甲二胺將之層包住。此 樹脂經導入模内並在8 (TC之溫度中硬化而此鉛柜將被0 . 2 cm樹脂層完全層包住，其熱阻（gi J Α為2 1 W/ mK。 實施例 4 :製備自肋黏合劑薄膜和層合板。 以下之成份將如例1中之成份混合，4 3 . 7重量％的雙 酚A之二甘油醚，S3 7重量％的環氣-·酚-酚醛清漆，2 6 . 1 重量％的環氣-甲苯酚-酚菘清漆。1 2 . 3重量％的硬化劑 其中其含有5 Q重量部份之雙酚A之二甘油醚及5 Q重量部 份的二気二亞胺，5.2重量％的促進劑，其中含73重量 部份的雙酚A之二甘油醚及2 7重量部份之混合物；而此 _ 1 0 - (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度逍用中a Η家標準(CNS)甲4規格(210x297公釐) 81. 5. 20,000(H) 〇43i〇 A6 B 6 經濟部中央標準局員工消費合作社印製 五、發明説明（9 ) 混合物具52.3重量部份的2,4, 6-參（二甲基甲胺）酚及 4 7 . 7重量部份的聚-4 -乙烯酚，以及3重量％的酚氣樹 脂（聚-雙酚A之二甘油醚）。 一部份之混合物成份與A I N混合（7 4重量％的4 Q a m直 徑之粒子以及2 5重量％的1 # m直徑之粒子）（總成份： 7 5 · 4重量％之A I N和2 4 . 6重量％之樹脂）。另一部份與 石英粉混合（粒子直徑為3 in )(總成份：7 0重量％之镇 充物及3 0重量％之樹脂）。 含2 0 0 a m厚度之自肋黏合劑薄膜係如例1所製備之混 合物。一些黏合劑薄膜經再加工以製成如實施例1之銅 箔（厚度為3 5 # m )及鋁箔（厚度為1 ϋ # in ) 所得之黏合劑薄膜如層合板如以下： 黏合劑薄膜A (填充物 A I Ν ) 黏合劑薄膜B (镇充物為石英粉） 層合板 C (銅箔與黏合劑薄膜A ) 層合板 D (銅箔與黏合劑薄膜B ) 層合板 E (鋁箔與黏合劑薄膜A ) 這些黏合劑薄膜和層合板經鍵接至如實施例2之鉛柜 及至如實施例3之D I P s ,可獲得以下之熱阻值 J A。 黏合劑薄膜A : 25 1/ W 黏合劑薄膜B : 37 K/ W 層合板 C : 20 K/ W 層合板 D : 2 2 K / W 層合板 E : 2 5 K / W -1 1 - (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度遑用中a «家標準(CNS)甲4規格(210x297公釐) 81. 5. 20,000(H)C This paper is used in the standard a B Family Standard (CNS) A 4 specifications (210 father 297 male dragon) 81. 5 · 20,000 (ίί) ^ 〇43i6 Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A 6 B6 _ V. Description of the invention (and self-adhesive adhesive film attached. Figure 2 shows the corresponding DIP in which the laminate (9) > metal Η is placed under the contact surface (7) under the cladding resin (3). The following examples will more clearly illustrate the content of this case. Example 1: Preparation of a laminated board 67.2% by weight of aluminum nitrate has an average particle diameter of 30 # m and a maximum diameter of 1 0 0 A m combined to contain 1 4 . 92% by weight of the ring gas resin [previously added 66.4% by weight of diglyceride of bisphenol A, 30.5% by weight; of bisphenol A and 3.1% by weight of the third butyl Based phenol (A ra 1 dit ® 7 0 9 7) I, and of which 7 3 · 7 3% and 19.82 weight X of carboxyl terminal polybutadiene / acrylonitrile copolymer (H ycar »CTBN 1 3 (3 0 X 1 3) and 6.45% by weight of bisphenol A reaction], 4.4% by weight of diglycerin of bisphenol A, 0.28% by weight of polyether polyimide block polymer (P eba X ® 2 5 3 3, A toche ns), 3 · 3 3% by weight of the modified elastomer of epoxy resin [3 4. 7 6% by weight A ra 1 dit ® 7 0 9 7, 1 6 · 7 9 1% by weight of Hycar ® CTBN 1 3 0 0 X 1 3, 3 4. 7 6% by weight of solid bisphenol A epoxy resin (A r> a 1 dit ® B) and 0% by weight of bisphenol X A, the product with a ring gas equivalent of 1.1 equivalents / kg], 0.47 weight X 旳 A ra 1 dit ® 7 0 9 7, 1% by weight of cassia nut shell oil (CNSL oil), 0.28% by weight of A erosi 1 ®, trimethylamino (glycerooxypropyl) silane (adhesion promoter), G. 4 6% by weight of the third carboxylic acid Versatic® lQ (Cardura® E 10) glycerol cooler, 0.92% by weight of the di Fluorodiimide, 0.Q6% by weight of chlorotoluene and 0.22% by weight containing poly-p-vinylphenol, dimethylamine and formaldehyde (EP 797, Shell)-9 Standard (CNS) A4 specifications (210X297 mm) 81. 5_ 20,000 (H) (please read the notes on the back before filling this page) A6 B6 Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Invention Instructions (9 ) Mannich Alkali. A melt adhesive film of a soft and adhesive composition is pressed with a copper foil with a thickness of 35 / im to force coat the laminate. The thermal conductivity of the adhesive layer of the laminate is 1.5 W / in K and its thickness is 2 4 0 # m 〇 Example 2: Using the laminate of Example 1 to prepare a lead cabinet and setting the laminate of Example 1 In a cabinet containing 16-pin copper-lead; such as the tip of electric lead, ie the back of the electrically insulating contact surface. The bonding is completed within 180 hours at 180 ° C. Then the laminate is fixedly bonded to the lead cabinet. Example 3: Preparation of D I P A thermal element and a thermal dipole were bonded to the thin H edge of the lead cabinet as in Example 2. This lead cabinet was placed in a mold with an inner diameter of 0.2 W / m Κ, containing 185 grams of bisphenol A (A ra 1 dit ® G Υ 2 6 0) ring gas resin and 2 9 · 5 grams of trimethylhexamethylenediamine as a hardened substance to wrap the layer. This resin is introduced into the mold and hardened at a temperature of 8 ° C. The lead cabinet will be completely covered by a 0.2 cm resin layer, and its thermal resistance (gi J Α is 2 1 W / mK. Example 4: Prepared from rib adhesive film and laminate. The following ingredients will be mixed as in Example 1, 43.7% by weight of diglyceryl ether of bisphenol A, S3 7% by weight of ring gas-· phenol-novolak , 26.1% by weight of cyclo-cresol-phenolic varnish. 1 2.3% by weight of hardener which contains 5 Q by weight of diglyceryl ether of bisphenol A and 5 Q by weight of Diimine, 5.2% by weight of accelerator, which contains 73 parts by weight of diglyceryl ether of bisphenol A and 27 parts by weight of the mixture; and this _ 1 0-(please read the notes on the back first (Fill in this page again) This paper standard is used in a Η family standard (CNS) A 4 specifications (210x297 mm) 81. 5. 20,000 (H) 〇43i〇A6 B 6 Printed by the employee consumer cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (9) The mixture has 52.3 parts by weight of 2,4, 6-ginseng (dimethylmethylamine) phenol and 47.7 parts by weight of poly-4-vinylphenol, and 3% by weight Phenol gas Fat (diglyceryl ether of poly-bisphenol A). A part of the mixture ingredients are mixed with AIN (74% by weight 4 Q am diameter particles and 25% by weight 1 # m diameter particles) (total composition : 75.4% by weight of AIN and 24.6% by weight of resin). The other part is mixed with quartz powder (particle diameter is 3 in) (total composition: 70% by weight of ballast and 3 0 % By weight of resin). Self-ribbed adhesive film with a thickness of 200 am is a mixture prepared as in Example 1. Some adhesive films are reprocessed to make copper foil as in Example 1 (thickness 3 5 #) m) and aluminum foil (thickness 1 ϋ # in) The resulting adhesive film such as a laminate is as follows: Adhesive film A (filler AI Ν) Adhesive film B (ballast is quartz powder) Laminate C (copper Foil and Adhesive Film A) Laminated Board D (Copper Foil and Adhesive Film B) Laminated Board E (Aluminum Foil and Adhesive Film A) These adhesive films and laminated board are bonded to the lead cabinet as in Example 2 and to For the DIP s of Example 3, the following thermal resistance value JA can be obtained. Adhesive film A: 25 1 / W Adhesive film B: 37 K / W Laminate C: 20 K / W Laminate D: 2 2 K / W Laminate E: 2 5 K / W -1 1-(Please read the precautions on the back before filling out this page) This paper size is in use a «Household Standards (CNS) A4 specifications (210x297 mm) 81. 5. 20,000 (H)