KR960703723A - Conformal Thermally Conductive Interface Material - Google Patents

Conformal Thermally Conductive Interface Material Download PDF

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Publication number
KR960703723A
KR960703723A KR1019960700166A KR19960700166A KR960703723A KR 960703723 A KR960703723 A KR 960703723A KR 1019960700166 A KR1019960700166 A KR 1019960700166A KR 19960700166 A KR19960700166 A KR 19960700166A KR 960703723 A KR960703723 A KR 960703723A
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KR
South Korea
Prior art keywords
thermally conductive
metal mesh
expanded metal
resin
partially embedded
Prior art date
Application number
KR1019960700166A
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Korean (ko)
Inventor
스티븐 엘. 토른톤
Original Assignee
죠지 에이. 리
초메릭스, 인크.
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Application filed by 죠지 에이. 리, 초메릭스, 인크. filed Critical 죠지 에이. 리
Publication of KR960703723A publication Critical patent/KR960703723A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/04—Inorganic
    • B32B2266/045—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

중합 결합제(2), 하나 이상의 열 전도성 충전제(1) 및 적어도 부분적으로 상기 결합제의 주표면 중 하나에 파묻힌 팽창된 금속 메쉬 층으로 이루어진 열 전도성 계면 물질이 개시되어 있다. 바람직하게는, 상기 계면은 감압 접착 물질이고 더 바람직하게는, 이는 테이프 또는 자동 접착 패드 형태로 되어 있다.A thermally conductive interface material is disclosed which consists of a polymeric binder (2), one or more thermally conductive fillers (1) and an expanded metal mesh layer at least partially embedded in one of the major surfaces of the binder. Preferably, the interface is a pressure sensitive adhesive material and more preferably it is in the form of a tape or self-adhesive pad.

Description

열 전도성 상사 계면 물질(Conformal Thermally Conductive Interface Material)Conformal Thermally Conductive Interface Material

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명의 열 전도성 물질의 바람직한 일 구체예의 단면도이다.1 is a cross-sectional view of one preferred embodiment of the thermally conductive material of the present invention.

제2도는 본 발명의 열 전도성 물질의 바람직한 또 다른 구체예의 단면도이다.2 is a cross-sectional view of another preferred embodiment of the thermally conductive material of the present invention.

제3도는 열원과 방열기 사이에 놓은 제2도의 구체예의 단면도이다.3 is a cross-sectional view of the embodiment of FIG. 2 placed between a heat source and a radiator.

Claims (10)

열 에너지 방출 수단, 열 에너지를 발생시키는 전자 부품, 및 열에너지 방출 수단과 전자 부품 사이에 놓여 전자 부품으로부터 나온 열 에너지를 열 에너지 방출 수단으로 전달하며, 중합 결합제로 된 시트, 상기 결합제에 골고루 분포된 열 전도성 충전체, 및 적어도 부분적으로 상기 시트의 주표면에 파묻힌 팽창된 금속메쉬로 이루어지는 열에너지 전달 수단을 포함하는 전기 조립체.A heat energy releasing means, an electronic component for generating thermal energy, and a sheet of polymeric binder, evenly distributed in the binder, placed between the heat energy releasing means and the electronic component to transfer thermal energy from the electronic component to the thermal energy releasing means, An electrical assembly comprising thermally conductive fillers and thermal energy transfer means consisting of an expanded metal mesh at least partially embedded in the major surface of the sheet. 제1항에 있어서, 열 에너지 방출 수단이 방열기 및 열 유포기로 구성된 군으로부터 선택되는 것이 특징인 전기 조립체.The electrical assembly of claim 1 wherein the thermal energy dissipation means is selected from the group consisting of radiators and heat spreaders. 제1항에 있어서, 전자 부품이 반도체, 변환기(transformer) 직류(DC)대 직류 전환기, 다중칩 모듈 및 전자 서브어셈블리로 이루어진 군으로부터 선택되는 것이 특징인 조립체.The assembly of claim 1, wherein the electronic component is selected from the group consisting of semiconductors, transformer direct current (DC) to direct current converters, multichip modules, and electronic subassemblies. 제1항에 있어서, 열 에너지 전달 수단이 하나 이상의 표면에 형성된 양각 무늬 또는 관통구로 이루어진 군으로부터 선택되는 공기 제거 장치를 갖는 것이 특징인 조립체.2. The assembly of claim 1, wherein the heat energy transfer means has an air removal device selected from the group consisting of embossed patterns or through holes formed in at least one surface. 중합 결합제로 형성된 안정한 성형 시트, 열 전도성 충전제 및 적어도 부분적으로 상기 물질의 주표면에 파묻힌 팽창된 금속 메쉬를 포함하는 열 전도성 물질.A thermally conductive material comprising a stable formed sheet formed of a polymeric binder, a thermally conductive filler and an expanded metal mesh at least partially embedded in the major surface of the material. 아크릴산 수지, 실리콘 고무, 불소실리콘 고무, 열 가소성 고무 및 폴리우레탄으로 구성된 군으로부터 선택된 중합 결합제의 혼합물로 형성된 안정한 성형 시트, 하나 이상의 열 전도성 충전체 및 적어도 부분적으로 상기 물질의 하나의 주표면에 파묻힌 팽창된 금속 메쉬를 포함하는 열 전도성 물질.Stable molded sheet formed of a mixture of polymeric binders selected from the group consisting of acrylic resins, silicone rubbers, fluorosilicone rubbers, thermoplastic rubbers and polyurethanes, at least one thermally conductive filler and at least partially embedded in one major surface of the material A thermally conductive material comprising an expanded metal mesh. 중합 결합제로 형성된 안정한 성형 시트, 열 전도성 충전제 및 시트에 완전히 파묻힌 팽창된 금속 메쉬층을 포함하는 열 전도성 물질.A thermally conductive material comprising a stable formed sheet formed of a polymeric binder, a thermally conductive filler and an expanded metal mesh layer completely embedded in the sheet. 제7항에 있어서, 결합제가 감암 아크릴산 수지이고 하나 이상의 열 전도성 충전체가 산화 알루미늄, 질화붕소, 산화 마그네슘, 산화 아연, 및 그들의 혼합물로 이루어진 군으로부터 선택되는 열 전도성 물질.8. The thermally conductive material of claim 7, wherein the binder is a light sensitive acrylic acid resin and the at least one thermally conductive filler is selected from the group consisting of aluminum oxide, boron nitride, magnesium oxide, zinc oxide, and mixtures thereof. 제7항에 있어서, 팽창된 금속 메쉬가 중합 결합제의 중앙에 위치하는 열 전도성 물질.8. The thermally conductive material of claim 7, wherein the expanded metal mesh is positioned centrally in the polymeric binder. 수지와 상기 수지 전체에 분포된 열 전도성 충전체로 형성된 열 전도성 수지의 제1층, 제1층 위에 놓이고 그 내부에 적어도 부분적으로 파묻힌 팽창된 금속 메쉬층, 수지와 상기 수지 전체에 분포된 열 전도성 충전제로 형성된 열 전도성 수지로 되어 있으며 상기 팽창된 금속 메쉬층 위에 놓이고 그 내부에 부분적으로 파묻힌 제2층을 포함하는 열 전도성 계면.A first layer of a thermally conductive resin formed of a resin and a thermally conductive filler distributed throughout the resin, an expanded metal mesh layer overlying and at least partially embedded in the first layer, thermally distributed throughout the resin and the resin And a second layer of a thermally conductive resin formed from a filler and comprising a second layer overlying and partially embedded in said expanded metal mesh layer. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019960700166A 1993-07-14 1994-07-11 Conformal Thermally Conductive Interface Material KR960703723A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9149793A 1993-07-14 1993-07-14
US08/091,497 1993-07-14
PCT/US1994/007793 WO1995002505A1 (en) 1993-07-14 1994-07-11 Conformal thermally conductive interface material

Publications (1)

Publication Number Publication Date
KR960703723A true KR960703723A (en) 1996-08-31

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KR1019960700166A KR960703723A (en) 1993-07-14 1994-07-11 Conformal Thermally Conductive Interface Material

Country Status (5)

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EP (1) EP0710178A4 (en)
JP (1) JPH09501016A (en)
KR (1) KR960703723A (en)
TW (1) TW257887B (en)
WO (1) WO1995002505A1 (en)

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Also Published As

Publication number Publication date
EP0710178A1 (en) 1996-05-08
JPH09501016A (en) 1997-01-28
EP0710178A4 (en) 1997-06-11
WO1995002505A1 (en) 1995-01-26
TW257887B (en) 1995-09-21

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