TW202403945A - 搬運裝置、研磨裝置、及搬運方法 - Google Patents

搬運裝置、研磨裝置、及搬運方法 Download PDF

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Publication number
TW202403945A
TW202403945A TW112106477A TW112106477A TW202403945A TW 202403945 A TW202403945 A TW 202403945A TW 112106477 A TW112106477 A TW 112106477A TW 112106477 A TW112106477 A TW 112106477A TW 202403945 A TW202403945 A TW 202403945A
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TW
Taiwan
Prior art keywords
carrier
substrate
holding part
holding
thickness direction
Prior art date
Application number
TW112106477A
Other languages
English (en)
Chinese (zh)
Inventor
齋藤貢
古川温光
蛭田孝平
三浦雅史
廣嶋俊洋
森田優
江﨑圭佑
Original Assignee
日商三菱綜合材料技術股份有限公司
日商勝高股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三菱綜合材料技術股份有限公司, 日商勝高股份有限公司 filed Critical 日商三菱綜合材料技術股份有限公司
Publication of TW202403945A publication Critical patent/TW202403945A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW112106477A 2022-02-24 2023-02-22 搬運裝置、研磨裝置、及搬運方法 TW202403945A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022027113A JP2023123191A (ja) 2022-02-24 2022-02-24 搬送装置、研磨装置、及び搬送方法
JP2022-027113 2022-02-24

Publications (1)

Publication Number Publication Date
TW202403945A true TW202403945A (zh) 2024-01-16

Family

ID=87765805

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112106477A TW202403945A (zh) 2022-02-24 2023-02-22 搬運裝置、研磨裝置、及搬運方法

Country Status (3)

Country Link
JP (1) JP2023123191A (ja)
TW (1) TW202403945A (ja)
WO (1) WO2023162922A1 (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0329083Y2 (ja) * 1985-05-21 1991-06-21
JP4235313B2 (ja) * 1999-05-17 2009-03-11 株式会社住友金属ファインテック 両面研摩装置
JP6101175B2 (ja) * 2013-08-28 2017-03-22 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハの研磨方法
JP2017024084A (ja) * 2015-07-15 2017-02-02 浜井産業株式会社 ワーク搬出入装置および平面加工システム

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Publication number Publication date
WO2023162922A1 (ja) 2023-08-31
JP2023123191A (ja) 2023-09-05

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