TW202202311A - Resin material supply device, resin molding device, and method for producing resin molded product capable of precisely controlling the supply amount of a resin material - Google Patents

Resin material supply device, resin molding device, and method for producing resin molded product capable of precisely controlling the supply amount of a resin material Download PDF

Info

Publication number
TW202202311A
TW202202311A TW110118326A TW110118326A TW202202311A TW 202202311 A TW202202311 A TW 202202311A TW 110118326 A TW110118326 A TW 110118326A TW 110118326 A TW110118326 A TW 110118326A TW 202202311 A TW202202311 A TW 202202311A
Authority
TW
Taiwan
Prior art keywords
resin material
resin
supply
tray
supply amount
Prior art date
Application number
TW110118326A
Other languages
Chinese (zh)
Other versions
TWI833082B (en
Inventor
寺岡拓人
Original Assignee
日商Ｔｏｗａ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｔｏｗａ股份有限公司 filed Critical 日商Ｔｏｗａ股份有限公司
Publication of TW202202311A publication Critical patent/TW202202311A/en
Application granted granted Critical
Publication of TWI833082B publication Critical patent/TWI833082B/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/06—Feeding of the material to be moulded, e.g. into a mould cavity in measured doses, e.g. by weighting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/042—Feeding of the material to be moulded, e.g. into a mould cavity using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B29C31/044—Feeding of the material to be moulded, e.g. into a mould cavity using dispensing heads, e.g. extruders, placed over or apart from the moulds with moving heads for distributing liquid or viscous material into the moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/06—Feeding of the material to be moulded, e.g. into a mould cavity in measured doses, e.g. by weighting
    • B29C31/065—Feeding of the material to be moulded, e.g. into a mould cavity in measured doses, e.g. by weighting using volumetric measuring chambers moving between a charging station and a discharge station
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C2037/90—Measuring, controlling or regulating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The present invention provides a resin material supply device capable of controlling a supply amount of a resin material with high accuracy, a resin molding device, and a method for producing a resin molded product. A resin material supply device includes: a resin material supply part for supplying a resin material; a first resin material conveying part for supplying the resin material from the resin material supply part; a second resin material conveying part for conveying the resin material conveyed by the first resin material conveying part to a molding die; and a control part for adjusting the supply amount of the resin material from the resin material supply unit based on a previous supply amount of the resin material from the resin material supply unit when the resin material supplied to the second resin material conveying part is supplied from the resin material supply part to the first resin material conveying part a plurality of times.

Description

樹脂材料供給裝置、樹脂成形裝置及樹脂成形品的製法Resin material supply device, resin molding device, and method for producing resin molded product

本發明是有關於一種樹脂材料供給裝置、樹脂成形裝置及樹脂成形品的製法的技術。The present invention relates to a technology related to a resin material supply device, a resin molding device, and a method for producing a resin molded product.

在專利文獻1中公開了一種樹脂材料供給裝置，其將從樹脂供給機構供給的樹脂材料經由小型樹脂保持托盤而供給至大型樹脂保持托盤。在所述樹脂材料供給裝置中，大型樹脂保持托盤被預先劃分為多個分區。從樹脂供給機構接收到樹脂材料的小型樹脂保持托盤將樹脂材料供給至大型樹脂保持托盤的一個分區。小型樹脂保持托盤按照分區的數量反復進行從樹脂供給機構接收樹脂材料、與樹脂材料向大型樹脂保持托盤的供給。在以所述方式向大型樹脂保持托盤整體供給樹脂材料之後，通過大型樹脂保持托盤將樹脂材料搬送至成形模的模腔。 [現有技術文獻] [專利文獻]Patent Document 1 discloses a resin material supply device that supplies a resin material supplied from a resin supply mechanism to a large resin holding tray via a small resin holding tray. In the resin material supply device, the large resin holding tray is divided into a plurality of divisions in advance. The small resin holding tray that receives the resin material from the resin supply mechanism supplies the resin material to one section of the large resin holding tray. The small resin holding tray repeats the reception of the resin material from the resin supply mechanism and the supply of the resin material to the large resin holding tray according to the number of partitions. After the resin material is supplied to the entire large-sized resin holding tray in this manner, the resin material is conveyed to the cavity of the molding die through the large-sized resin holding tray. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利第6039750號公報[Patent Document 1] Japanese Patent No. 6039750

[發明所要解決的問題] 在專利文獻1所記載的技術中，為了將樹脂材料供給至成形模，將樹脂材料從一個樹脂供給機構多次供給至小型樹脂保持托盤。在此情況下，若樹脂供給機構所供給的樹脂材料的供給量產生誤差，則有誤差根據利用樹脂供給機構進行的樹脂材料的供給次數而累積並增大之虞。[Problems to be Solved by Invention] In the technique described in Patent Document 1, in order to supply the resin material to the molding die, the resin material is supplied to the small resin holding tray a plurality of times from one resin supply mechanism. In this case, if an error occurs in the supply amount of the resin material supplied by the resin supply mechanism, the error may accumulate and increase depending on the number of times of supply of the resin material by the resin supply mechanism.

本發明是鑒於如上所述的狀況而成，其所要解決的問題在於提供一種能夠高精度地控制樹脂材料的供給量的樹脂材料供給裝置、樹脂成形裝置及樹脂成形品的製造方法。 [解決問題的技術手段]The present invention is made in view of the above-mentioned situation, and the problem to be solved is to provide a resin material supply device, a resin molding device, and a method for producing a resin molded product that can precisely control the supply amount of the resin material. [Technical means to solve the problem]

本發明所要解決的問題如上所述，為了解決所述問題，本發明的樹脂材料供給裝置包括：樹脂材料供給部，供給樹脂材料；第一樹脂材料搬送部，從所述樹脂材料供給部供給樹脂材料；第二樹脂材料搬送部，將由所述第一樹脂材料搬送部搬送的樹脂材料搬送至成形模；以及控制部，在將向一個所述第二樹脂材料搬送部供給的樹脂材料分成多次從所述樹脂材料供給部供給至所述第一樹脂材料搬送部的情況下，對於某一次的來自所述樹脂材料供給部的樹脂材料的供給量，基於所述某一次之前的一次的來自所述樹脂材料供給部的樹脂材料的供給量進行調整。Problem to be solved by the present invention As described above, in order to solve the problem, the resin material supply device of the present invention includes: a resin material supply unit for supplying resin material; and a first resin material conveying unit for supplying resin from the resin material supply unit materials; a second resin material conveying unit that conveys the resin material conveyed by the first resin material conveying unit to a molding die; and a control unit that divides the resin material supplied to one of the second resin material conveying units into a plurality of times In the case of supplying from the resin material supply unit to the first resin material conveying unit, the supply amount of the resin material from the resin material supply unit at a certain time is based on the supply amount from the resin material at a time before the certain time. The supply amount of the resin material in the resin material supply unit is adjusted.

另外，本發明的樹脂成形裝置包括所述樹脂材料供給裝置。Moreover, the resin molding apparatus of this invention includes the said resin material supply apparatus.

另外，本發明的樹脂成形品的製造方法使用所述樹脂成形裝置來製造樹脂成形品。 [發明的效果]Moreover, the manufacturing method of the resin molded product of this invention manufactures a resin molded product using the said resin molding apparatus. [Effect of invention]

根據本發明，可高精度地控制樹脂材料的供給量。According to the present invention, the supply amount of the resin material can be controlled with high accuracy.

以下，將圖中的箭頭U、箭頭D、箭頭F、箭頭B、箭頭L及箭頭R所示的方向分別定義為上方向、下方向、前方向、後方向、左方向及右方向來進行說明。Hereinafter, the directions indicated by the arrows U, D, F, B, L, and R in the drawings will be described as upward, downward, front, rear, left, and right, respectively. .

首先，使用圖1對本實施方式的樹脂成形裝置1的結構進行說明。樹脂成形裝置1對半導體晶片等電子零件進行樹脂密封，來製造樹脂成形品。尤其在本實施方式中，例示了採用將模腔內的樹脂材料壓縮並成形的壓縮成形方式（壓縮方式）的樹脂成形裝置1。再者，在本實施方式中假定使用顆粒狀的樹脂材料，但作為樹脂材料，不僅能夠使用顆粒狀的材料，而且能夠使用粉末狀或液狀等任意形態的材料。First, the structure of the resin molding apparatus 1 of this embodiment is demonstrated using FIG. 1. FIG. The resin molding apparatus 1 resin-seales electronic components such as semiconductor wafers, and manufactures resin-molded products. In particular, in the present embodiment, the resin molding apparatus 1 using the compression molding method (compression method) for compressing and molding the resin material in the cavity is exemplified. In addition, in the present embodiment, it is assumed that a particulate resin material is used, but as the resin material, not only a particulate material but also a material in any form such as powder or liquid can be used.

樹脂成形裝置1包括基板搬入搬出模塊10、基板交接模塊20、成形模塊30、樹脂供給模塊40及控制部50作為構成元件。各構成元件能夠相對於其他構成元件裝卸且能夠更換。另外，例如也可使成形模塊30為一個或三個以上等，來增減各構成元件。The resin molding apparatus 1 includes a board carrying and unloading module 10 , a board delivery module 20 , a molding module 30 , a resin supply module 40 , and a control unit 50 as constituent elements. Each constituent element is detachable and replaceable with respect to other constituent elements. In addition, for example, the number of forming modules 30 may be one or three or more, and each constituent element may be increased or decreased.

基板搬入搬出模塊10搬入裝設有電子零件的基板P，並且搬出電子零件經樹脂密封的基板P。在本實施方式中，假定使用相對較大型的基板P。例如，基板P形成為一邊為450 mm以上、500 mm以上、或600 mm以上的矩形板狀。基板搬入搬出模塊10主要包括：搬入部11、搬出部12、檢查部13及臂機構14。The board carry-in and carry-out module 10 carries in the board P on which the electronic components are mounted, and carries out the board P in which the electronic parts are sealed with resin. In the present embodiment, it is assumed that a relatively large-sized substrate P is used. For example, the board|substrate P is formed in the rectangular plate shape whose one side is 450 mm or more, 500 mm or more, or 600 mm or more. The board loading and unloading module 10 mainly includes a loading unit 11 , a loading unit 12 , an inspection unit 13 , and an arm mechanism 14 .

搬入部11為配置未經樹脂密封的基板P的部分。搬出部12為配置經樹脂密封的基板P的部分。搬入部11及搬出部12可分別收納多個基板P。The carrying-in part 11 is a part where the board|substrate P which is not resin-sealed is arrange|positioned. The carry-out portion 12 is a portion where the resin-sealed substrate P is arranged. The carrying-in portion 11 and the carrying-out portion 12 can accommodate a plurality of substrates P, respectively.

檢查部13為進行經樹脂密封的基板P的檢查的部分。檢查部13包括：載置經樹脂密封的基板P的載置部、對基板P進行檢查的檢查機構（未圖示）等。The inspection unit 13 is a portion that inspects the resin-sealed substrate P. As shown in FIG. The inspection unit 13 includes a placement unit on which the resin-sealed substrate P is placed, an inspection mechanism (not shown) that inspects the substrate P, and the like.

臂機構14使基板P移動。臂機構14包括：吸附基板P的吸附手部14a、用來安裝吸附手部14a的臂部14b、使臂部14b適當旋轉或移動的驅動部14c等。The arm mechanism 14 moves the substrate P. The arm mechanism 14 includes a suction hand 14a for sucking the substrate P, an arm 14b for attaching the suction hand 14a, a drive section 14c for appropriately rotating or moving the arm 14b, and the like.

基板交接模塊20為在基板搬入搬出模塊10與後述的成形模塊30之間進行基板P的交接的部分。基板交接模塊20主要包括裝載器21及卸載器22。The board|substrate delivery module 20 is a part which performs delivery of the board|substrate P between the board|substrate carry-in/out module 10 and the shaping|molding module 30 mentioned later. The substrate handover module 20 mainly includes a loader 21 and an unloader 22 .

裝載器21從臂機構14接收未經樹脂密封的基板P，並搬送至後述的成形模塊30的成形模31。卸載器22從後述的成形模31接收經樹脂密封的基板P，並搬送至基板搬入搬出模塊10。裝載器21及卸載器22可沿著在左右方向上延伸的導軌Lr移動。在本實施方式中，裝載器21與卸載器22以一體地移動的方式相互連結。The loader 21 receives the substrate P that is not sealed with resin from the arm mechanism 14 and conveys it to the molding die 31 of the molding module 30 to be described later. The unloader 22 receives the resin-sealed substrate P from the molding die 31 described later, and conveys it to the substrate carrying-in/out module 10 . The loader 21 and the unloader 22 are movable along guide rails Lr extending in the left-right direction. In the present embodiment, the loader 21 and the unloader 22 are connected to each other so as to move integrally.

成形模塊30使用從後述的樹脂供給模塊40供給的樹脂材料，來對裝設在基板P的電子零件進行樹脂密封。在本實施方式中，成形模塊30排列兩個而配置。通過利用兩個成形模塊30並行地進行基板P的樹脂密封，可提高樹脂成形品的製造效率。成形模塊30主要包括成形模31、合模機構（未圖示）等。The molding module 30 uses a resin material supplied from a resin supply module 40 to be described later to resin-encapsulate the electronic components mounted on the substrate P. In the present embodiment, two forming modules 30 are arranged in a row. By performing resin sealing of the board|substrate P in parallel by the two molding modules 30, the manufacturing efficiency of a resin molded product can be improved. The forming module 30 mainly includes a forming die 31 , a die clamping mechanism (not shown), and the like.

成形模31使用熔融的樹脂材料對基板P進行壓縮成形。成形模31包括上下一對模（上模及下模）。在下模形成用來收納樹脂材料的凹狀的模腔（未圖示）。另外，在成形模31設置用於使樹脂材料熔融的加熱器（未圖示）。The molding die 31 performs compression molding on the substrate P using a molten resin material. The forming mold 31 includes a pair of upper and lower molds (an upper mold and a lower mold). A concave cavity (not shown) for accommodating the resin material is formed in the lower mold. In addition, a heater (not shown) for melting the resin material is provided in the molding die 31 .

樹脂供給模塊40向成形模塊30的成形模31供給樹脂材料。樹脂供給模塊40主要包括：樹脂材料收納裝置100、小托盤41、小托盤搬送機構42、大托盤43及大托盤搬送機構44。The resin supply module 40 supplies the resin material to the molding die 31 of the molding module 30 . The resin supply module 40 mainly includes a resin material storage device 100 , a small tray 41 , a small tray conveying mechanism 42 , a large tray 43 , and a large tray conveying mechanism 44 .

樹脂材料收納裝置100收納樹脂材料，並且向後述的小托盤41供給樹脂材料。樹脂材料收納裝置100以左右排列的方式設置兩個。兩個樹脂材料收納裝置100可並行地向兩個小托盤41供給樹脂材料。再者，關於樹脂材料收納裝置100的詳細結構將在後面敘述。The resin material storage device 100 stores the resin material and supplies the resin material to the small tray 41 described later. Two resin material storage apparatuses 100 are provided so that they may be arranged side by side. The two resin material storage devices 100 can supply the resin material to the two small trays 41 in parallel. In addition, the detailed structure of the resin material storage apparatus 100 is mentioned later.

小托盤41將從樹脂材料收納裝置100接收到的樹脂材料供給至後述的大托盤43。小托盤41可在上表面保持樹脂材料。小托盤41以俯視時的大小成為後述大托盤43的大小的四分之一左右的方式形成。The small tray 41 supplies the resin material received from the resin material storage device 100 to the large tray 43 described later. The small tray 41 can hold the resin material on the upper surface. The small tray 41 is formed so that the size in plan view is about a quarter of the size of the large tray 43 to be described later.

小托盤搬送機構42將小托盤41搬送至適當的位置。小托盤搬送機構42可在樹脂材料收納裝置100與大托盤43之間以使小托盤41往返的方式搬送小托盤41。The small tray conveyance mechanism 42 conveys the small tray 41 to an appropriate position. The small tray conveyance mechanism 42 can convey the small tray 41 between the resin material storage device 100 and the large tray 43 so as to reciprocate the small tray 41 .

大托盤43將從小托盤41接收到的樹脂材料供給至成形模塊30的成形模31。大托盤43可在上表面保持樹脂材料。大托盤43以成為與成形模31的模腔的平面形狀對應的平面形狀（例如，矩形形狀）的方式形成。The large tray 43 supplies the resin material received from the small tray 41 to the forming die 31 of the forming module 30 . The large tray 43 can hold the resin material on the upper surface. The large tray 43 is formed so as to have a planar shape (for example, a rectangular shape) corresponding to the planar shape of the cavity of the molding die 31 .

大托盤搬送機構44將大托盤43搬送至適當的位置。大托盤搬送機構44可沿著在左右方向上延伸的導軌Lr移動。The large tray conveyance mechanism 44 conveys the large tray 43 to an appropriate position. The large-tray conveyance mechanism 44 is movable along the guide rail Lr extending in the left-right direction.

再者，樹脂供給模塊40是本發明的樹脂材料供給裝置的一實施形態。另外，小托盤41及大托盤43分別是本發明的第一樹脂材料搬送部及第二樹脂材料搬送部的一實施形態。小托盤41及大托盤43的詳細結構將在後面敘述。In addition, the resin supply module 40 is one Embodiment of the resin material supply apparatus of this invention. In addition, the small tray 41 and the large tray 43 are respectively one Embodiment of the 1st resin material conveyance part and the 2nd resin material conveyance part of this invention. The detailed structures of the small tray 41 and the large tray 43 will be described later.

控制部50對樹脂成形裝置1的各模塊的動作進行控制。利用控制部50對基板搬入搬出模塊10、基板交接模塊20、成形模塊30及樹脂供給模塊40的動作進行控制。另外，可使用控制部50任意地變更（調整）各模塊的動作。The control unit 50 controls the operation of each module of the resin molding apparatus 1 . The control unit 50 controls the operations of the board carrying and unloading module 10 , the board delivery module 20 , the molding module 30 , and the resin supply module 40 . In addition, the operation of each module can be arbitrarily changed (adjusted) using the control unit 50 .

接著，對如上所述那樣構成的樹脂成形裝置1的動作（樹脂成形品的成形方法、樹脂成形品的製造方法）的概要進行說明。Next, the outline of the operation of the resin molding apparatus 1 configured as described above (the molding method of the resin molded product, and the manufacturing method of the resin molded product) will be described.

首先，將配置在搬入部11的未經樹脂密封的基板P通過臂機構14搬送至裝載器21。First, the board|substrate P arrange|positioned in the carrying-in part 11 without resin sealing is carried to the loader 21 by the arm mechanism 14. As shown in FIG.

接著，裝載器21沿著導軌Lr移動，將基板P搬送至其中一個成形模塊30。搬送至成形模塊30的基板P吸附並保持在成形模31的上模。Next, the loader 21 moves along the guide rail Lr, and conveys the substrate P to one of the molding modules 30 . The board|substrate P conveyed to the shaping|molding module 30 is attracted|sucked to the upper die of the shaping|molding die 31, and is hold|maintained.

接著，以覆蓋成形模31的下模的方式配置離型膜。Next, a release film is arranged so as to cover the lower mold of the molding die 31 .

接著，從樹脂供給模塊40向成形模塊30的成形模31供給樹脂材料。此處，在樹脂供給模塊40中，預先從樹脂材料收納裝置100供給的樹脂材料經由小托盤41而供給至大托盤43。由於小托盤41以成為大托盤43的四分之一左右的大小的方式形成，因此利用總計四個小托盤41向大托盤43整體大致均勻地供給樹脂材料。Next, the resin material is supplied from the resin supply module 40 to the molding die 31 of the molding module 30 . Here, in the resin supply module 40 , the resin material previously supplied from the resin material storage device 100 is supplied to the large tray 43 via the small tray 41 . Since the small tray 41 is formed so as to be about a quarter of the size of the large tray 43 , the resin material is substantially uniformly supplied to the entire large tray 43 by four small trays 41 in total.

通過大托盤搬送機構44沿著導軌Lr移動，將保持有樹脂材料的大托盤43搬送至成形模塊30的成形模31。其後，將大托盤43的樹脂材料供給至成形模31（下模）的模腔。大托盤搬送機構44向成形模31供給樹脂材料之後，返回至樹脂供給模塊40。The large tray 43 holding the resin material is conveyed to the forming die 31 of the forming module 30 by the large tray conveying mechanism 44 moving along the guide rail Lr. After that, the resin material of the large tray 43 is supplied to the cavity of the molding die 31 (lower die). The large-tray conveyance mechanism 44 returns to the resin supply module 40 after supplying the resin material to the molding die 31 .

接著，利用成形模31的加熱器將樹脂材料熔融。其後，通過所述合模機構而下模與上模相對地靠近（合模），基板P的電子零件浸漬於樹脂材料。在此狀態下，對樹脂材料適當施加壓力。通過在所述狀態下樹脂材料硬化，可獲得電子零件經樹脂密封的基板P。Next, the resin material is melted by the heater of the molding die 31 . Then, the lower mold and the upper mold are relatively close to each other by the mold clamping mechanism (mold clamping), and the electronic components of the substrate P are impregnated with the resin material. In this state, appropriate pressure is applied to the resin material. By hardening the resin material in this state, the substrate P in which the electronic parts are sealed with resin can be obtained.

接著，通過所述合模機構而下模與上模相對地分離（開模）。另外，卸載器22沿著導軌Lr移動，從成形模31接收電子零件經樹脂密封的基板P。此時，可利用與卸載器22一起移動來的裝載器21將新的基板P配置在成形模31。其後，卸載器22沿著導軌Lr移動，並返回至基板交接模塊20。Next, the lower mold and the upper mold are relatively separated from each other by the mold clamping mechanism (mold opening). In addition, the unloader 22 moves along the guide rail Lr, and receives the electronic component resin-sealed substrate P from the molding die 31 . At this time, the new board|substrate P can be arrange|positioned in the shaping|molding die 31 by the loader 21 which moved together with the unloader 22. After that, the unloader 22 moves along the guide rail Lr and returns to the substrate delivery module 20 .

接著，由卸載器22保持的基板P通過臂機構14搬送至檢查部13。在檢查部13中，進行電子零件經樹脂密封的基板P的檢查。Next, the board|substrate P hold|maintained by the unloader 22 is conveyed to the inspection part 13 by the arm mechanism 14. In the inspection part 13, the inspection of the board|substrate P by which the electronic component was sealed by resin is performed.

接著，檢查結束後的基板P通過臂機構14搬送至搬出部12。配置在搬出部12的基板P被適當搬出至外部。Next, the board|substrate P after completion|finish of inspection is conveyed to the unloading part 12 by the arm mechanism 14. As shown in FIG. The board|substrate P arrange|positioned in the carrying-out part 12 is carried out to the outside suitably.

如上所述，通過對裝設在基板P的電子零件進行樹脂密封，可製造樹脂成形品。再者，在所述的動作說明中省略了說明，但在本實施方式的樹脂成形裝置1中，可利用設置有兩個的成形模塊30，並行地進行基板P的樹脂密封。具體而言，在利用其中一個成形模塊30進行樹脂密封（樹脂材料的熔融、或對基板P的按壓等）時，可向另一個成形模塊30供給樹脂材料，或進行基板P的樹脂密封。如此，可效率良好地製造樹脂成形品（電子零件經樹脂密封的基板P）。As described above, by resin-sealing the electronic components mounted on the substrate P, a resin molded product can be produced. In addition, although description is abbreviate|omitted in the said operation description, in the resin molding apparatus 1 of this embodiment, the resin sealing of the board|substrate P can be performed in parallel using the molding module 30 provided with two. Specifically, when resin sealing (melting of the resin material, pressing of the substrate P, etc.) is performed by one of the molding modules 30 , the resin material can be supplied to the other molding module 30 or the substrate P can be resin-sealed. In this way, a resin molded product (electronic component resin-sealed substrate P) can be efficiently produced.

以下，使用圖2至圖8對樹脂供給模塊40的樹脂材料收納裝置100進行具體說明。Hereinafter, the resin material storage device 100 of the resin supply module 40 will be specifically described with reference to FIGS. 2 to 8 .

如圖2所示，樹脂材料收納裝置100在樹脂供給模塊40的框體40a內以左右排列兩個的方式設置。兩個樹脂材料收納裝置100除了左右大致對稱地配置這一點以外，包括相互大致相同的結構。因此，以下，對其中一個（右側）的樹脂材料收納裝置100的結構進行具體說明，省略另一個（左側）的樹脂材料收納裝置100的結構的說明。As shown in FIG. 2 , the resin material storage devices 100 are installed in two left and right arrays in the housing 40 a of the resin supply module 40 . The two resin material storage apparatuses 100 have substantially the same structure as each other except that they are arranged substantially symmetrically on the left and right. Therefore, below, the structure of one (right side) resin material storage apparatus 100 is demonstrated concretely, and description of the structure of the other (left side) resin material storage apparatus 100 is abbreviate|omitted.

如圖3及圖4所示，樹脂材料收納裝置100主要包括：儲料器110、第一振動部120、料槽130、第二振動部140、重量計150及分配器160。再者，在圖3及圖4中，以陰影線表示收納在儲料器110及料槽130的樹脂材料。As shown in FIGS. 3 and 4 , the resin material storage device 100 mainly includes a stocker 110 , a first vibrating part 120 , a trough 130 , a second vibrating part 140 , a weight meter 150 and a distributor 160 . In addition, in FIG.3 and FIG.4, the resin material accommodated in the stocker 110 and the chute 130 is shown by hatching.

儲料器110收納樹脂材料，並將其供給至後述的料槽130。儲料器110主要包括收納部111及供給部112。The stocker 110 accommodates the resin material and supplies the resin material to a chute 130 to be described later. The stocker 110 mainly includes a storage part 111 and a supply part 112 .

收納部111是收納樹脂材料的部分。收納部111以在內部能夠收納樹脂材料的方式形成為中空狀。在收納部111的上部形成有用於將樹脂材料供給至內部的開口部（未圖示）。在適當的時機向收納部111供給（補充）樹脂材料。The accommodating part 111 is a part which accommodates a resin material. The accommodating part 111 is formed in a hollow shape so that a resin material can be accommodated inside. An opening (not shown) for supplying the resin material to the inside is formed in the upper portion of the housing portion 111 . The resin material is supplied (replenished) to the accommodating portion 111 at an appropriate timing.

供給部112是將收納在收納部111的樹脂材料供給至後述的料槽130的部分。供給部112以樹脂材料能夠在內部移動的方式形成為中空狀。供給部112以從收納部111的一側面的下部向後述的分配器160的上方延伸的方式形成。在供給部112的前端部（左端部）附近，設置用於將供給部112的內部的樹脂材料向下方排出的供給口112a。The supply part 112 is a part which supplies the resin material accommodated in the accommodating part 111 to the chute 130 mentioned later. The supply part 112 is formed in a hollow shape so that the resin material can move inside. The supply part 112 is formed so that it may extend from the lower part of the one side surface of the accommodating part 111 to the upper direction of the dispenser 160 mentioned later. In the vicinity of the front end portion (left end portion) of the supply portion 112 , a supply port 112 a for discharging the resin material inside the supply portion 112 downward is provided.

第一振動部120用於從儲料器110排出樹脂。第一振動部120設置在儲料器110的下部，可使儲料器110振動。第一振動部120通過使儲料器110振動，可使收納部111內的樹脂材料移動至供給部112，並使其從供給口112a向下方排出。The first vibrating part 120 is used to discharge resin from the stocker 110 . The first vibrating part 120 is disposed at the lower part of the stocker 110 and can vibrate the stocker 110 . By vibrating the stocker 110, the first vibrating part 120 can move the resin material in the accommodating part 111 to the supply part 112 and discharge it downward from the supply port 112a.

料槽130收納樹脂材料，並將其供給至小托盤41。再者，料槽130是本發明的樹脂材料供給部的一實施形態。如圖3所示，料槽130在儲料器110的下方以左右排列兩個的方式（在俯視時，在隔著儲料器110的供給口112a而左右對稱的位置）配置。料槽130主要包括收納部131及供給部132。The chute 130 accommodates the resin material and supplies it to the small tray 41 . In addition, the chute 130 is one Embodiment of the resin material supply part of this invention. As shown in FIG. 3 , the troughs 130 are arranged below the stocker 110 in two left and right rows (in a plan view, at positions symmetrical to each other across the supply port 112 a of the stocker 110 ). The trough 130 mainly includes a storage part 131 and a supply part 132 .

收納部131是收納樹脂材料的部分。收納部131以在內部能夠收納樹脂材料的方式形成為中空狀。在收納部131的上部形成有用於將樹脂材料供給至內部的開口部（未圖示）。The accommodating part 131 is a part which accommodates a resin material. The accommodating part 131 is formed in a hollow shape so that the resin material can be accommodated inside. An opening (not shown) for supplying the resin material to the inside is formed in the upper portion of the housing portion 131 .

供給部132是將收納在收納部131的樹脂材料供給至小托盤41的部分。供給部132以樹脂材料能夠在內部移動的方式形成為中空狀。供給部132以從收納部131的一側面的下部向單方向（後方）延伸的方式形成。在供給部132的前端部（後端部）附近設置用於將供給部132的內部的樹脂材料向下方排出的供給口132a。The supply part 132 is a part which supplies the resin material accommodated in the accommodating part 131 to the small tray 41 . The supply part 132 is formed in a hollow shape so that the resin material can move inside. The supply part 132 is formed so as to extend in one direction (rearward) from the lower part of one side surface of the storage part 131 . A supply port 132 a for discharging the resin material inside the supply portion 132 downward is provided in the vicinity of the front end portion (rear end portion) of the supply portion 132 .

再者，兩個料槽130配置在相互在某種程度上接近的位置，以便可同時對一個小托盤41供給樹脂材料。具體而言，兩個料槽130（尤其是供給口132a）以左右方向上的間隔成為小托盤41的左右寬度的大約二分之一的方式配置。Furthermore, the two troughs 130 are arranged at positions close to each other to some extent so that the resin material can be supplied to one small tray 41 at the same time. Specifically, the two chutes 130 (particularly, the supply ports 132 a ) are arranged so that the interval in the left-right direction is approximately one-half of the left-right width of the small tray 41 .

圖4所示的第二振動部140用於從料槽130排出樹脂。第二振動部140設置在料槽130的下部，可使料槽130振動。第二振動部140通過使料槽130振動，可使收納部131內的樹脂材料移動至供給部132，並使其從供給口132a向下方排出。The second vibrating part 140 shown in FIG. 4 is used to discharge resin from the trough 130 . The second vibrating part 140 is disposed at the lower part of the material trough 130 and can vibrate the material trough 130 . By vibrating the trough 130, the second vibrating part 140 can move the resin material in the accommodating part 131 to the supply part 132 and discharge it downward from the supply port 132a.

重量計150用於測定收納在料槽130的樹脂材料的重量。重量計150設置在第二振動部140的下部，可測定料槽130及第二振動部140的重量。由於料槽130及第二振動部140的重量為已知，因此，通過從重量計150的測定值減去料槽130及第二振動部140的重量，可測定收納在料槽130的樹脂材料的重量。The weight meter 150 is used to measure the weight of the resin material accommodated in the chute 130 . The weight meter 150 is disposed at the lower part of the second vibrating part 140 , and can measure the weight of the trough 130 and the second vibrating part 140 . Since the weights of the trough 130 and the second vibrating part 140 are known, the resin material accommodated in the trough 130 can be measured by subtracting the weights of the trough 130 and the second vibrating part 140 from the measured value of the weight scale 150 . the weight of.

第二振動部140及重量計150分別設置在兩個料槽130。The second vibrating part 140 and the weight meter 150 are respectively disposed in the two troughs 130 .

圖3及圖4所示的分配器160用於將從儲料器110供給的樹脂材料分配給兩個料槽130。分配器160配置在儲料器110的供給口112a的下方。分配器160主要包括框體161及致動器164。The distributor 160 shown in FIGS. 3 and 4 is used to distribute the resin material supplied from the stocker 110 to the two troughs 130 . The dispenser 160 is arranged below the supply port 112 a of the stocker 110 . The dispenser 160 mainly includes a frame body 161 and an actuator 164 .

在框體161內，形成樹脂材料的流通路徑。致動器164通過適當使配置在框體161內的切換構件（未圖示）工作，而可切換在框體161內流通的樹脂材料的流通路徑。致動器164通過切換樹脂材料的流通路徑，而可將從上方（儲料器110的供給口112a）供給的樹脂材料分配給配置在下方的左右一對料槽130中的任一者。Inside the casing 161, a flow path of the resin material is formed. The actuator 164 can switch the flow path of the resin material flowing in the casing 161 by appropriately operating a switching member (not shown) arranged in the casing 161 . The actuator 164 can distribute the resin material supplied from above (the supply port 112 a of the stocker 110 ) to any one of the pair of left and right troughs 130 arranged below by switching the flow path of the resin material.

接著，使用圖5及圖6對將從樹脂材料收納裝置100接收的樹脂材料供給至成形模塊30的小托盤41及大托盤43進行具體說明。再者，圖5及圖6是用於說明各構件的結構的示意性的圖，圖示的各構件的相對位置關係與實際的位置關係不同。另外，在圖5及圖6以外的圖中，簡化小托盤41的形狀而圖示。Next, the small tray 41 and the large tray 43 for supplying the resin material received from the resin material storage device 100 to the molding module 30 will be specifically described with reference to FIGS. 5 and 6 . 5 and 6 are schematic diagrams for explaining the structure of each member, and the relative positional relationship of each member shown in the figure is different from the actual positional relationship. In addition, in figures other than FIGS. 5 and 6 , the shape of the small tray 41 is simplified and illustrated.

小托盤41主要包括樹脂保持部41a及擋板41b。The small tray 41 mainly includes a resin holding portion 41a and a shutter 41b.

樹脂保持部41a是保持樹脂材料的部分。樹脂保持部41a形成為俯視時大致正方形的板狀。在樹脂保持部41a，以前後排列多個的方式形成有左右延伸的狹縫41c。The resin holding portion 41a is a portion holding the resin material. The resin holding portion 41a is formed in a substantially square plate shape in plan view. In the resin holding part 41a, a plurality of slits 41c extending left and right are formed so as to be arranged in a row.

擋板41b是能夠從下方阻塞樹脂保持部41a的狹縫41c的部分。擋板41b形成為俯視時大致正方形的板狀。在擋板41b，以與樹脂保持部41a的狹縫41c對應的方式形成有狹縫41d。即，擋板41b的狹縫41d以左右延伸的方式，且以前後排列多個的方式形成。另外，擋板41b的狹縫41d的前後間隔以成為與樹脂保持部41a的狹縫41c的前後間隔相同的方式形成。擋板41b配置在樹脂保持部41a的靠近其的下方。擋板41b可通過未圖示的移動機構相對於樹脂保持部41a前後相對地移動。The shutter 41b is a part which can block the slit 41c of the resin holding|maintenance part 41a from below. The baffle plate 41b is formed in a substantially square plate shape in plan view. In the shutter 41b, a slit 41d is formed so as to correspond to the slit 41c of the resin holding portion 41a. That is, the slits 41d of the shutter 41b are formed so as to extend left and right, and a plurality of them are arranged in a row. Moreover, the front-rear space|interval of the slit 41d of the shutter 41b is formed so that it may become the same as the front-rear space|interval of the slit 41c of the resin holding|maintenance part 41a. The baffle 41b is arranged below the resin holding portion 41a close to it. The shutter 41b is relatively movable back and forth with respect to the resin holding portion 41a by a movement mechanism not shown.

如圖5所示，在擋板41b的狹縫41d與樹脂保持部41a的狹縫41c不上下相向的情況下，樹脂保持部41a的狹縫41c被擋板41b從下方阻塞。在所述狀態下，可在小托盤41的上表面（具體而言，樹脂保持部41a的狹縫41c內）保持樹脂材料。另外，通過使擋板41b移動，使樹脂保持部41a的狹縫41c與擋板41b的狹縫41d相向，可將保持在樹脂保持部41a的狹縫41c內的樹脂材料向下方排出。從小托盤41排出的樹脂材料被供給至後述的大托盤43的收納部43b。As shown in FIG. 5, when the slit 41d of the shutter 41b and the slit 41c of the resin holding part 41a do not face up and down, the slit 41c of the resin holding part 41a is blocked by the shutter 41b from below. In this state, the resin material can be held on the upper surface of the small tray 41 (specifically, in the slit 41c of the resin holding portion 41a). Further, by moving the shutter 41b so that the slit 41c of the resin holding portion 41a faces the slit 41d of the shutter 41b, the resin material held in the slit 41c of the resin holding portion 41a can be discharged downward. The resin material discharged from the small tray 41 is supplied to the accommodating part 43b of the large tray 43 mentioned later.

大托盤43主要包括框構件43a及收納部43b。The large tray 43 mainly includes a frame member 43a and a storage portion 43b.

框構件43a是支撐收納部43b的構件。框構件43a形成為俯視時大致正方形的框狀。即，框構件43a形成為在俯視時大致中央部開口。The frame member 43a is a member that supports the accommodating portion 43b. The frame member 43a is formed in a substantially square frame shape in plan view. That is, the frame member 43a is formed so that a substantially central portion thereof is opened in a plan view.

收納部43b是收納樹脂材料的部分。收納部43b形成為大致圓柱狀。收納部43b使長度方向朝向左右，配置在框構件43a的內側（開口部分）。收納部43b的左右兩端部能夠相對於框構件43a轉動地受到支撐。在收納部43b的側面形成能夠收納樹脂材料的槽43c。槽43c以沿著收納部43b的長度方向延伸的方式形成。收納部43b以前後排列多個的方式設置。鄰接的收納部43b彼此的前後間隔（間距）以成為與小托盤41的狹縫41c的前後間隔（間距）相同的方式形成。收納部43b可通過未圖示的驅動機構相對於框構件43a以任意的角度轉動。The accommodating part 43b is a part which accommodates a resin material. The housing portion 43b is formed in a substantially columnar shape. The accommodating part 43b is arrange|positioned in the inner side (opening part) of the frame member 43a so that the longitudinal direction is oriented to the left and right. Left and right end portions of the housing portion 43b are supported so as to be rotatable with respect to the frame member 43a. A groove 43c capable of accommodating a resin material is formed on the side surface of the accommodating portion 43b. The groove 43c is formed so as to extend along the longitudinal direction of the housing portion 43b. The accommodating part 43b is provided so that a plurality of them may be arranged in a row. The front-rear space|interval (pitch) of the accommodating part 43b adjacent to each other is formed so that it may become the same as the front-rear space|interval (pitch) of the slit 41c of the small tray 41. FIG. The accommodating part 43b can be rotated by an arbitrary angle with respect to the frame member 43a by the drive mechanism which is not shown in figure.

如圖5所示，在收納部43b的槽43c朝向上方的情況下，可在槽43c的內部收納樹脂材料。另外，通過使收納部43b轉動，使槽43c朝向下方，可將收納在槽43c內的樹脂材料向下方排出。As shown in FIG. 5 , when the groove 43c of the accommodating portion 43b faces upward, the resin material can be accommodated in the groove 43c. In addition, the resin material accommodated in the groove 43c can be discharged downward by turning the accommodating portion 43b so that the groove 43c faces downward.

此處，小托盤41的狹縫41c的左右長度以成為大托盤43的收納部43b（槽43c）的左右長度的大約一半的方式形成。另外，小托盤41的狹縫41c的個數以成為大托盤43的收納部43b的個數的一半的方式形成。如此，小托盤41的俯視時的大小以成為大托盤43的大小的四分之一左右的方式形成。因此，為了使用小托盤41向大托盤43的收納部43b整體供給樹脂材料，需要使用總計四個小托盤41。Here, the left-right length of the slit 41c of the small tray 41 is formed so that it may become about half of the left-right length of the accommodating part 43b (groove 43c) of the large tray 43. Moreover, the number of objects of the slit 41c of the small tray 41 is formed so that it may become half the number of objects of the storage part 43b of the large tray 43. In this way, the size of the small tray 41 in plan view is formed to be about a quarter of the size of the large tray 43 . Therefore, in order to supply the resin material to the entire storage portion 43b of the large tray 43 using the small trays 41, it is necessary to use four small trays 41 in total.

接著，對如上所述那樣構成的樹脂供給模塊40的動作（用於將樹脂材料從料槽130經由小托盤41及大托盤43而供給至成形模31的動作）進行說明。Next, the operation of the resin supply module 40 configured as described above (operation for supplying the resin material from the chute 130 to the molding die 31 via the small tray 41 and the large tray 43 ) will be described.

在通過重量計150檢測到收納在料槽130的樹脂材料的重量低於規定值的情況下，利用控制部50對第一振動部120及分配器160的動作進行控制，對料槽130供給樹脂材料。When the weight meter 150 detects that the weight of the resin material accommodated in the trough 130 is lower than a predetermined value, the controller 50 controls the operations of the first vibrating part 120 and the distributor 160 to supply resin to the trough 130 . Material.

具體而言，通過第一振動部120工作，而將樹脂材料從儲料器110的供給口112a排出。所述樹脂材料由分配器160適當分配，並供給至樹脂材料的重量低於規定值的料槽130。由此，在料槽130內始終收納規定值以上的重量的樹脂材料。Specifically, the resin material is discharged from the supply port 112 a of the stocker 110 by the operation of the first vibrating part 120 . The resin material is appropriately distributed by the distributor 160 and supplied to the trough 130 in which the weight of the resin material is lower than a predetermined value. Thereby, the resin material of the predetermined value or more is always accommodated in the chute 130 .

以如上所述方式收納在左右的料槽130的樹脂材料經由小托盤41而供給至大托盤43。以下，進行具體說明。The resin material accommodated in the chute 130 on the left and right as described above is supplied to the large tray 43 via the small tray 41 . Hereinafter, it demonstrates concretely.

如圖7的（a）所示，在向小托盤41供給樹脂材料的情況下，通過小托盤搬送機構42（參照圖1），被供給樹脂材料之前的小托盤41向兩個料槽130的下方移動。此時，調節小托盤41的位置，以使得兩個料槽130的供給口132a位於規定的開始位置S的正上方。As shown in FIG. 7( a ), when the resin material is supplied to the small tray 41 , the small tray 41 before being supplied with the resin material is moved to the two chutes 130 by the small tray conveying mechanism 42 (see FIG. 1 ). Move down. At this time, the positions of the small trays 41 are adjusted so that the supply ports 132a of the two chutes 130 are located directly above the predetermined start position S.

接著，第二振動部140工作，而將樹脂材料分別從兩個料槽130的供給口132a供給至小托盤41。另外，與第二振動部140的工作同時地，開始小托盤41向水平方向的移動。具體而言，通過小托盤搬送機構42而小托盤41向前後及左右適當移動。小托盤搬送機構42使小托盤41移動，以使得兩個料槽130的供給口132a通過小托盤41的一半（前半部分）的區域。另外，小托盤搬送機構42使小托盤41移動，以使得兩個料槽130的供給口132a最終返回至開始位置S的正上方。在圖7的（a）中示出了兩個料槽130的相對於小托盤41的相對的移動軌跡的一例。Next, the second vibrating part 140 operates to supply the resin material to the small tray 41 from the supply ports 132 a of the two troughs 130 , respectively. In addition, at the same time as the operation of the second vibrating part 140, the movement of the small tray 41 in the horizontal direction is started. Specifically, the small tray 41 is appropriately moved back and forth and left and right by the small tray conveyance mechanism 42 . The small-tray conveying mechanism 42 moves the small-tray 41 so that the supply ports 132 a of the two chutes 130 pass through a half (front half) area of the small-tray 41 . In addition, the small-tray conveyance mechanism 42 moves the small-tray 41 so that the supply ports 132a of the two chutes 130 are finally returned to just above the start position S. An example of the relative movement trajectory with respect to the small tray 41 of the two chutes 130 is shown in FIG.7(a).

當兩個料槽130的供給口132a返回至開始位置S的正上方時，第二振動部140停止，而將樹脂材料從料槽130向小托盤41的供給停止。When the supply ports 132a of the two chutes 130 return to just above the start position S, the second vibrating part 140 stops, and the supply of the resin material from the chutes 130 to the small trays 41 stops.

如此，向小托盤41的一半（前半部分）的區域供給樹脂材料（參照圖7的（b））。在圖7的（a）～圖7的（d）中，以陰影示出了供給有樹脂材料的區域。再者，通過利用料槽130進行的一次樹脂材料的供給（從第二振動部140工作至停止為止的樹脂材料的供給），對供給至小托盤41的樹脂材料的重量進行控制，以使其成為預先設定的目標值（目標供給量）。具體而言，通過適當對第二振動部140及小托盤搬送機構42的動作進行控制，而將目標供給量的樹脂材料供給至小托盤41。In this way, the resin material is supplied to a half (front half) area of the small tray 41 (see FIG. 7( b )). In FIGS. 7( a ) to 7 ( d ), the region to which the resin material is supplied is shown by hatching. Furthermore, by the primary supply of the resin material by the trough 130 (the supply of the resin material from the operation to the stop of the second vibrating part 140 ), the weight of the resin material supplied to the small tray 41 is controlled so as to be It becomes the preset target value (target supply amount). Specifically, by appropriately controlling the operations of the second vibrating portion 140 and the small tray conveying mechanism 42 , the target supply amount of the resin material is supplied to the small tray 41 .

接著，通過小托盤搬送機構42而小托盤41的前後朝向反轉（參照圖7的（c）），從兩個料槽130向小托盤41的未供給有樹脂材料的剩餘一半的區域供給樹脂材料（參照圖7的（d））。在此情況下，也沿著圖7的（a）所示那樣的移動軌跡使小托盤41移動，同時將樹脂材料從料槽130供給至小托盤41。如此，在對一個小托盤41供給樹脂材料的情況下，使小托盤41的前後方向反轉，分成兩次供給樹脂材料。Next, the front-rear direction of the small tray 41 is reversed by the small tray conveying mechanism 42 (refer to FIG. 7( c )), and resin is supplied from the two chutes 130 to the area where the remaining half of the small tray 41 is not supplied with the resin material. material (refer to (d) of FIG. 7 ). Also in this case, the small tray 41 is moved along the movement trajectory shown in FIG. 7( a ), and the resin material is supplied from the chute 130 to the small tray 41 . In this way, when the resin material is supplied to one small tray 41, the front-rear direction of the small tray 41 is reversed, and the resin material is supplied in two times.

在本實施方式中，通過設為使用多個（兩個）料槽130將樹脂材料供給至一個小托盤41的結構，可縮短樹脂材料向小托盤41的供給時間。In the present embodiment, the supply time of the resin material to the small tray 41 can be shortened by using a plurality of (two) troughs 130 to supply the resin material to one small tray 41 .

再者，如本實施方式那樣，在並非使用多個料槽130，而是使用一個料槽130來縮短樹脂材料向小托盤41的供給時間的情況下，也考慮使從料槽130供給至小托盤41的樹脂材料的流速增加的方法。然而，為此有時需要料槽130的大型化，從而不優選。另外，伴隨於此，有樹脂材料的供給量的控制的精度（例如，重量計150的測定精度、或利用料槽130進行的樹脂材料的流速的精度）下降之虞，在這一點上也不優選。相對於此，在本實施方式中，通過使用多個料槽130，來抑制各個料槽130的大型化、樹脂材料的供給量的控制的精度的下降。In addition, in the case of shortening the supply time of the resin material to the small tray 41 by using not a plurality of troughs 130 but one trough 130 as in the present embodiment, it is also considered to supply the resin material from the trough 130 to the small tray 41 . A method of increasing the flow rate of the resin material of the tray 41 . However, it may be necessary to increase the size of the chute 130 for this, which is not preferable. In addition, there is a possibility that the accuracy of the control of the supply amount of the resin material (for example, the measurement accuracy of the weight scale 150 or the accuracy of the flow rate of the resin material by the trough 130 ) may be lowered due to this. Preferred. On the other hand, in the present embodiment, by using a plurality of troughs 130 , an increase in size of each trough 130 and a decrease in the accuracy of the control of the supply amount of the resin material are suppressed.

進而，在本實施方式中，在樹脂供給模塊40設置有兩個樹脂材料收納裝置100（參照圖1及圖2）。由此，可對兩個小托盤41並行地供給樹脂材料，因此可縮短樹脂材料向大托盤43及成形模31的供給時間，進而可實現利用樹脂成形裝置1進行的樹脂成形品的製造的效率化。Furthermore, in the present embodiment, two resin material storage devices 100 are provided in the resin supply module 40 (see FIGS. 1 and 2 ). Accordingly, since the resin material can be supplied to the two small trays 41 in parallel, the time required for supplying the resin material to the large tray 43 and the molding die 31 can be shortened, and the resin molding apparatus 1 can be used to efficiently manufacture resin molded products. change.

以如上所述方式供給至小托盤41的樹脂材料經由大托盤43而供給至成形模31的模腔。具體而言，保持有樹脂材料的小托盤41通過小托盤搬送機構42向大托盤43的上方移動（參照圖5）。其後，通過使小托盤41的擋板41b相對於樹脂保持部41a相對地移動，樹脂保持部41a的狹縫41c打開，而將樹脂材料從小托盤41供給至大托盤43。供給至大托盤43的樹脂材料收納在收納部43b的槽43c內。The resin material supplied to the small tray 41 as described above is supplied to the cavity of the molding die 31 via the large tray 43 . Specifically, the small tray 41 holding the resin material is moved above the large tray 43 by the small tray conveyance mechanism 42 (see FIG. 5 ). Then, by relatively moving the shutter 41b of the small tray 41 with respect to the resin holding part 41a, the slit 41c of the resin holding part 41a is opened, and the resin material is supplied from the small tray 41 to the large tray 43. The resin material supplied to the large tray 43 is accommodated in the groove 43c of the accommodating part 43b.

此處，如上文所述，小托盤41形成為大托盤43的大小的四分之一左右。因此，如圖6所示，分別對在俯視時，將大托盤43四等分而得的四個區域（參照圖6的雙點劃線）供給來自小托盤41的樹脂材料。即，從總計四個小托盤41向大托盤43供給樹脂材料。Here, as described above, the small tray 41 is formed to be about a quarter of the size of the large tray 43 . Therefore, as shown in FIG. 6 , the resin material from the small tray 41 is supplied to each of the four regions (refer to the two-dot chain line in FIG. 6 ) obtained by dividing the large tray 43 into quarters in plan view. That is, the resin material is supplied from the four small trays 41 to the large tray 43 in total.

通過從總計四個小托盤41接受樹脂材料的供給，在大托盤43的整個區域中收納樹脂材料。收納有樹脂材料的大托盤43通過大托盤搬送機構44搬送至成形模塊30的成形模31的上方。其後，大托盤43的收納部43b上下反轉，而將樹脂材料從大托盤43供給至成形模31的模腔。The resin material is accommodated in the entire area of the large tray 43 by receiving the supply of the resin material from the four small trays 41 in total. The large tray 43 containing the resin material is conveyed above the forming die 31 of the forming module 30 by the large tray conveying mechanism 44 . After that, the accommodating portion 43 b of the large tray 43 is reversed up and down, and the resin material is supplied from the large tray 43 to the cavity of the molding die 31 .

此時，在大托盤43與成形模31的模腔之間配置圖5所示那樣的擴散板31a。在擴散板31a設置多個貫通孔。另外，擴散板31a可通過未圖示的驅動機構進行振動。從大托盤43落下的樹脂材料被振動的擴散板31a擴散。由此，可實現成形模31的模腔內的樹脂材料的均勻化。At this time, a diffuser plate 31 a as shown in FIG. 5 is arranged between the large tray 43 and the cavity of the molding die 31 . A plurality of through holes are provided in the diffuser plate 31a. In addition, the diffuser plate 31a can be vibrated by a drive mechanism not shown. The resin material dropped from the large tray 43 is diffused by the vibrating diffuser plate 31a. Thereby, the homogenization of the resin material in the cavity of the molding die 31 can be achieved.

接著，對用於實現利用如上所述那樣構成的樹脂材料收納裝置100進行的樹脂供給量的精度的提高的控制的一例進行說明。Next, an example of the control for realizing the improvement of the precision of the resin supply amount by the resin material storage apparatus 100 comprised as mentioned above is demonstrated.

如上所述，在本實施方式中，料槽130相對於一個小托盤41設置有多個。由此，樹脂材料收納裝置100使用兩個料槽130向一個小托盤41供給樹脂材料（參照圖7的（a）～圖7的（d））。另外，樹脂成形裝置1包括兩個樹脂材料收納裝置100（參照圖2）。即，本實施方式的樹脂成形裝置1可使用四個料槽130，向兩個小托盤41同時供給樹脂材料。As described above, in this embodiment, a plurality of troughs 130 are provided with respect to one small tray 41 . As a result, the resin material storage device 100 supplies the resin material to one small tray 41 using the two chutes 130 (see FIGS. 7( a ) to 7 ( d )). In addition, the resin molding apparatus 1 includes two resin material storage apparatuses 100 (see FIG. 2 ). That is, the resin molding apparatus 1 of the present embodiment can use the four troughs 130 to simultaneously supply the resin material to the two small trays 41 .

另外，在本實施方式中，小托盤41相對於一個大托盤43設置有多個（例如四個）。由此，從總計四個小托盤41向大托盤43供給樹脂材料（參照圖6）。另外，樹脂材料收納裝置100分成兩次將樹脂材料供給至小托盤41（參照圖7的（a）～圖7的（d））。In addition, in the present embodiment, a plurality of (for example, four) small trays 41 are provided with respect to one large tray 43 . Thereby, the resin material is supplied from the four small trays 41 to the large tray 43 in total (see FIG. 6 ). In addition, the resin material storage device 100 supplies the resin material to the small tray 41 in two steps (see FIGS. 7( a ) to 7 ( d )).

若對這些進行總結，則如圖8所示，在本實施方式中，在向一個大托盤43供給樹脂材料的情況下，四個料槽130（在圖8中，為了區別四個料槽130，標記為料槽（1）～料槽（4））將樹脂材料向小托盤41分別供給四次。Summarizing these, as shown in FIG. 8 , in the present embodiment, when the resin material is supplied to one large tray 43 , four troughs 130 (in FIG. 8 , in order to distinguish the four troughs 130 , marked as trough (1) to trough (4), respectively supply the resin material to the small tray 41 four times.

如此，若使用多個料槽130進行多次的樹脂材料的供給，則樹脂材料的供給量的誤差累積，而有向大托盤43供給的樹脂材料的總供給量與目標值（目標總供給量）大不相同的可能性。因此，在本實施方式中，在如上所述那樣將收納在料槽130的樹脂材料經由小托盤41而供給至大托盤43時，進行用於將樹脂材料的總供給量的誤差抑制得小的控制。以下，使用圖7至圖12，對所述控制中的具體的處理內容進行說明。再者，圖8所示的數值是為了說明本控制而方便起見設定的值，並不限定實際上進行本控制時的值。In this way, if the supply of the resin material is performed multiple times using the plurality of troughs 130, errors in the supply amount of the resin material are accumulated, and the total supply amount of the resin material supplied to the large tray 43 and the target value (target total supply amount) ) are very different possibilities. Therefore, in the present embodiment, when the resin material stored in the chute 130 is supplied to the large tray 43 via the small tray 41 as described above, it is performed to minimize the error in the total supply amount of the resin material. control. Hereinafter, specific processing contents in the control will be described with reference to FIGS. 7 to 12 . In addition, the numerical value shown in FIG. 8 is the value set for the convenience of description of this control, and does not limit the value when this control is actually performed.

在圖9所示的步驟S101中，控制部50將1的值代入至變量N。再者，本實施方式中的變量N用於掌握樹脂材料從料槽130向小托盤41的供給次數。控制部50在進行步驟S101的處理之後，轉移至步驟S102。In step S101 shown in FIG. 9 , the control unit 50 substitutes the value of 1 into the variable N. Furthermore, the variable N in this embodiment is used to grasp the number of times the resin material is supplied from the chute 130 to the small tray 41 . After the control part 50 performs the process of step S101, it transfers to step S102.

在步驟S102中，控制部50設定最初（第一次）從料槽130供給至小托盤41的樹脂材料的重量的目標值（目標供給量）。作為第一次的目標供給量的設定方法，可採用各種方法。In step S102 , the control unit 50 sets a target value (target supply amount) of the weight of the resin material to be supplied from the chute 130 to the small tray 41 initially (for the first time). Various methods can be adopted as a method of setting the first target supply amount.

在本實施方式中，控制部50將通過利用四個料槽130進行的四次的樹脂供給而供給的樹脂材料的目標總供給量（應向一個大托盤43供給的樹脂材料的重量的目標值）除以樹脂從料槽130向小托盤41供給的總計次數，由此計算每一次的供給量的平均值（平均供給量），並將所述平均值設定為第一次的目標供給量。在圖8所示的例子中，目標總供給量為160.0 g，利用料槽130進行的樹脂供給的總計次數為16次。因此，各料槽130的第一次的目標供給量為10.0 g。控制部50在進行步驟S102的處理之後，轉移至步驟S103。In the present embodiment, the control unit 50 sets the target total supply amount of the resin material (target value of the weight of the resin material to be supplied to one large tray 43 ) to be supplied by the resin supply four times by the four troughs 130 . ) divided by the total number of times the resin is supplied from the trough 130 to the small tray 41 to calculate an average value (average supply amount) of each supply amount, and set the average value as the first target supply amount. In the example shown in FIG. 8 , the target total supply amount is 160.0 g, and the total number of times of resin supply by the tank 130 is 16 times. Therefore, the first target supply amount of each trough 130 is 10.0 g. The control unit 50 proceeds to step S103 after performing the process of step S102.

在步驟S103中，控制部50對第二振動部140輸出控制訊號（指令值），將樹脂材料從料槽130供給至小托盤41。控制部50對第二振動部140進行控制，以將所設定的目標供給量的樹脂材料供給至小托盤41。此時，如圖10所示，控制部50在第一期間（第一階段）中連續地將樹脂材料供給至小托盤41，在第一期間之後的第二期間（第二階段）中將樹脂材料間歇地供給至小托盤41。如此，通過將樹脂材料的連續的供給與間歇的供給組合，可迅速且高精度地進行樹脂材料的供給。再者，步驟S103中的處理的詳細情況將在後面敘述。控制部50在進行步驟S103的處理之後，轉移至步驟S104。In step S103 , the control unit 50 outputs a control signal (command value) to the second vibrating unit 140 to supply the resin material from the trough 130 to the small tray 41 . The control unit 50 controls the second vibration unit 140 to supply the set target supply amount of the resin material to the small tray 41 . At this time, as shown in FIG. 10 , the control unit 50 continuously supplies the resin material to the small tray 41 in the first period (first stage), and supplies the resin material in the second period (second stage) after the first period The material is supplied to the small tray 41 intermittently. In this way, by combining the continuous supply of the resin material with the intermittent supply, the supply of the resin material can be performed quickly and accurately. In addition, the details of the process in step S103 will be described later. The control unit 50 proceeds to step S104 after performing the process of step S103.

在步驟S104中，控制部50停止來自料槽130的樹脂供給。再者，通過步驟S103及步驟S104的處理，控制部50對第二振動部140進行控制，以將目標供給量的樹脂材料供給至小托盤41，但實際上有產生少許誤差的可能性。例如，在圖8所示的例子中，若著眼於利用料槽（1）及料槽（2）進行的第一次的樹脂供給，則可知相對於目標供給量產生了誤差。控制部50在進行步驟S104的處理之後，轉移至步驟S105。In step S104, the control part 50 stops the resin supply from the tank 130. Furthermore, through the processing of steps S103 and S104, the control unit 50 controls the second vibrating unit 140 to supply the target supply amount of the resin material to the small tray 41, but a slight error may actually occur. For example, in the example shown in FIG. 8, when focusing on the first resin supply by the trough (1) and the trough (2), it can be seen that an error occurred with respect to the target supply amount. After the control part 50 performs the process of step S104, it transfers to step S105.

在步驟S105中，控制部50判定變量N是否為奇數。步驟S105的處理是用於決定小托盤41的動作（步驟S106或步驟S107）的處理。控制部50在判定為變量N為奇數的情況下，轉移至步驟S106。另一方面，控制部50在判定為變量N並非奇數的情況下，轉移至步驟S107。In step S105, the control unit 50 determines whether or not the variable N is an odd number. The process of step S105 is a process for determining the operation of the small tray 41 (step S106 or step S107 ). When the control unit 50 determines that the variable N is an odd number, the process proceeds to step S106. On the other hand, when it is determined that the variable N is not an odd number, the control unit 50 proceeds to step S107.

在步驟S106中，控制部50使小托盤41旋轉（反轉）。如此，在變量N為奇數的情況下（在步驟S105中為是），如圖7的（b）所示，為向小托盤41的一半區域供給樹脂材料的狀態，因此控制部50使小托盤41旋轉（反轉），成為能夠向剩餘一半的區域供給樹脂材料的狀態。In step S106 , the control unit 50 rotates (reverses) the small tray 41 . In this way, when the variable N is an odd number (YES in step S105 ), as shown in FIG. 7( b ), since the resin material is supplied to the half area of the small tray 41 , the control unit 50 causes the small tray to 41 is rotated (reversed), and the resin material can be supplied to the remaining half of the area.

另一方面，在步驟S107中，控制部50將小托盤41搬送至大托盤43，並將樹脂材料供給至大托盤43。如此，在變量N為偶數的情況下（在步驟S105中為否），如圖7的（d）所示，為向小托盤41的整個區域供給樹脂材料的狀態，因此控制部50將樹脂材料從小托盤41供給至大托盤43。On the other hand, in step S107 , the control unit 50 conveys the small tray 41 to the large tray 43 and supplies the resin material to the large tray 43 . In this way, when the variable N is an even number (NO in step S105 ), as shown in FIG. 7( d ), since the resin material is supplied to the entire area of the small tray 41 , the control unit 50 sends the resin material It is supplied from the small tray 41 to the large tray 43 .

控制部50在進行了步驟S106或步驟S107的處理之後，轉移至步驟S108。The control unit 50 proceeds to step S108 after performing the processing of step S106 or step S107.

在步驟S108中，控制部50判定變量N是否為4。步驟S108的處理是用於判定向一個大托盤43的樹脂供給是否完成的處理。若變量N為4，則可判定為從各料槽130完成了四次的樹脂供給（參照圖8），即，向一個大托盤43的樹脂供給完成。再者，在本實施方式中，各料槽130向一個大托盤43進行四次的樹脂供給，因此在步驟S108中判定變量N是否為4，但用於所述判定的數值並不限於4，可根據樹脂材料向大托盤43供給的所需次數任意設定。In step S108, the control unit 50 determines whether the variable N is 4 or not. The process of step S108 is a process for determining whether or not the resin supply to one large tray 43 is completed. When the variable N is 4, it can be determined that the resin supply from each trough 130 has been completed four times (see FIG. 8 ), that is, the resin supply to one large tray 43 has been completed. Furthermore, in the present embodiment, each trough 130 supplies resin to one large tray 43 four times, so it is determined in step S108 whether the variable N is 4, but the numerical value used for the determination is not limited to 4, It can be arbitrarily set according to the required number of times the resin material is supplied to the large tray 43 .

控制部50在判定為變量N為4的情況下，結束本控制。另一方面，控制部50在判定為變量N並非4的情況下，轉移至步驟S109。When the control unit 50 determines that the variable N is 4, the control unit 50 ends the present control. On the other hand, when it is determined that the variable N is not 4, the control unit 50 proceeds to step S109.

在步驟S109中，控制部50存儲步驟S103中實際供給至小托盤41的樹脂材料的量（供給量）。再者，樹脂材料向小托盤41的供給量可通過利用重量計150測定收納在料槽130的樹脂材料的重量的變化（減少量）來掌握。控制部50在進行步驟S109的處理之後，轉移至步驟S110。In step S109 , the control unit 50 stores the amount (supply amount) of the resin material actually supplied to the small tray 41 in step S103 . In addition, the supply amount of the resin material to the small tray 41 can be grasped by measuring the change (decrease) of the weight of the resin material accommodated in the chute 130 with the weight meter 150 . After the control part 50 performs the process of step S109, it transfers to step S110.

在步驟S110中，控制部50將N+1的值代入至變量N。即，控制部50使變量N的值增加1個。控制部50在進行步驟S110的處理之後，轉移至步驟S111。In step S110 , the control unit 50 substitutes the value of N+1 into the variable N. That is, the control unit 50 increases the value of the variable N by one. After the control part 50 performs the process of step S110, it transfers to step S111.

在步驟S111中，控制部50設定第N次的目標供給量。控制部50以成為消除上次（第N-1次）的樹脂材料的供給中產生的誤差那樣的值的方式設定（調整）目標供給量。具體而言，控制部50計算從上次的目標供給量減去上次的實際供給量而得的值（差分），並將其與第一次的目標供給量（平均供給量）相加，由此計算此次（第N次）的目標供給量。In step S111, the control unit 50 sets the target supply amount for the Nth time. The control unit 50 sets (adjusts) the target supply amount so that the error that occurs in the supply of the resin material in the previous (N-1 th) time can be eliminated. Specifically, the control unit 50 calculates a value (difference) obtained by subtracting the previous actual supply amount from the previous target supply amount, and adds this to the first target supply amount (average supply amount), From this, the target supply amount for this time (Nth time) is calculated.

例如，在圖8所示的例子中，料槽（1）的第一次的目標供給量為10.0 g，與此相對，實際供給量為10.1 g。因此，控制部50計算其差分（-0.1 g），並將其與第一次的目標供給量相加，由此將第二次的目標供給量決定為9.9 g。在利用料槽（1）進行的第二次的樹脂供給中，若可供給如此設定的目標供給量的樹脂材料，則第一次與第二次的供給量的平均為10.0 g。即，可消除第一次的樹脂材料的供給中產生的誤差。For example, in the example shown in FIG. 8, the target supply amount for the first time of the chute (1) is 10.0 g, while the actual supply amount is 10.1 g. Therefore, the control part 50 calculates the difference (-0.1 g), adds this to the target supply amount for the first time, and determines the target supply amount for the second time as 9.9 g. In the second resin supply by the tank (1), if the resin material of the target supply amount set in this way can be supplied, the average of the first and second supply amounts is 10.0 g. That is, the error occurred in the first supply of the resin material can be eliminated.

控制部50在進行步驟S111的處理之後，轉移至步驟S103，將目標供給量的樹脂材料供給至小托盤41。After the control part 50 performs the process of step S111, it transfers to step S103, and supplies the resin material of the target supply amount to the small tray 41.

如此，控制部50在第二次以後的樹脂供給中，基於上次的樹脂材料的供給量來設定目標供給量（步驟S111），並進行樹脂的供給（步驟S103）。控制部50反復進行所述處理，直至在步驟S108中N=4為止（即，從各料槽130進行四次的樹脂供給為止）。In this way, in the second and subsequent resin supply, the control unit 50 sets the target supply amount based on the previous supply amount of the resin material (step S111 ), and supplies the resin (step S103 ). The control part 50 repeats the said process until N=4 in step S108 (that is, until resin supply is performed four times from each trough 130).

在圖8中示出了由控制部50設定了直至第四次為止的目標供給量的結果與實際供給量的一例。如此，在第二次以後的各次的樹脂材料的供給時，通過進行修正利用各料槽130進行的樹脂材料的目標供給量的控制，可將相對於目標總供給量的誤差抑制得小。FIG. 8 shows an example of the result of setting the target supply amount up to the fourth time by the control unit 50 and the actual supply amount. In this way, in the second and subsequent times of supplying the resin material, by performing control to correct the target supply amount of the resin material by each trough 130, the error with respect to the target total supply amount can be suppressed to be small.

再者，在本實施方式中，示出了基於上次的樹脂材料的目標供給量與實際供給量的差分來調整各次（第二次以後）的目標供給量的例子，但本發明並不限於此。例如，也能夠並非如本實施方式那樣每次調整第二次以後的樹脂材料的目標供給量，而是基於第一次至第三次為止的樹脂材料的供給量，僅調整第四次的樹脂材料的目標供給量。在此情況下，可基於第一次至第三次為止的樹脂材料的目標供給量的合計與實際供給量的合計的差分，調整第四次的目標供給量。如此，本發明可基於上次以前的樹脂材料的供給量來進行樹脂材料的供給量的調整。In addition, in the present embodiment, the example in which the target supply amount of each time (the second and subsequent times) is adjusted based on the difference between the previous target supply amount and the actual supply amount of the resin material is shown, but the present invention does not limited to this. For example, instead of adjusting the target supply amount of the resin material for the second and subsequent times as in the present embodiment, only the resin for the fourth time may be adjusted based on the supply amount of the resin material for the first to third times. The target supply of the material. In this case, the target supply amount for the fourth time may be adjusted based on the difference between the total target supply amount of the resin material for the first to third time and the total actual supply amount. In this way, in the present invention, the supply amount of the resin material can be adjusted based on the previous supply amount of the resin material.

另外，在本實施方式中，示出了通過將上次的樹脂材料的目標供給量與實際供給量的差分和第一次的目標供給量（平均供給量）相加來計算此次的目標供給量的例子，但本發明並不限於此，目標供給量的計算方法可任意設定。例如，不僅可考慮樹脂材料的目標供給量與實際供給量的差分，還可考慮誤差的傾向來計算目標供給量。具體而言，在各次的樹脂材料的供給中，也能夠學習料槽130的誤差的傾向（相對於目標供給量容易產生X%～Y%的誤差等），計算消除所述傾向那樣的目標供給量。In addition, in the present embodiment, it is shown that the current target supply is calculated by adding the difference between the previous target supply amount and the actual supply amount of the resin material to the first target supply amount (average supply amount). However, the present invention is not limited to this, and the calculation method of the target supply amount can be arbitrarily set. For example, the target supply amount may be calculated not only by considering the difference between the target supply amount and the actual supply amount of the resin material, but also in consideration of the tendency of errors. Specifically, in each supply of the resin material, it is possible to learn the tendency of the errors in the trough 130 (errors of X% to Y% are likely to occur with respect to the target supply amount, etc.), and to calculate the target for eliminating the tendency. Supply amount.

進而，在本實施方式中，在圖9的步驟S103的處理中，通過將樹脂材料的連續的供給與間歇的供給組合，進行高精度的樹脂材料的供給。以下，對步驟S103的控制進行具體說明。Furthermore, in the present embodiment, in the process of step S103 in FIG. 9 , by combining the continuous supply of the resin material with the intermittent supply, the supply of the resin material is performed with high precision. Hereinafter, the control of step S103 will be specifically described.

如圖10所示，控制部50對賦予至第二振動部140的指令值的大小進行控制，以使得在第一階段中，樹脂材料的供給速度（每單位時間的供給量）成為一定。第二振動部140的振動強度根據指令值的大小而變化。指令值的大小是根據供給速度的目標值與供給速度的實測值的偏差而逐次計算。例如，指令值的大小是通過將供給速度的目標值與供給速度的實測值作為輸入的反饋控制而逐次計算。作為反饋控制的典型例，可使用比例積分微分（Proportional Integral Differential，PID）控制。再者，在圖10中，為了簡化記載，呈大致直線狀地示出指令值。As shown in FIG. 10 , the control unit 50 controls the magnitude of the command value given to the second vibration unit 140 so that the supply speed (supply amount per unit time) of the resin material becomes constant in the first stage. The vibration intensity of the second vibration unit 140 changes according to the magnitude of the command value. The magnitude of the command value is calculated successively based on the deviation between the target value of the supply speed and the actual measured value of the supply speed. For example, the magnitude of the command value is successively calculated by feedback control using the target value of the supply speed and the actual measured value of the supply speed as inputs. As a typical example of feedback control, Proportional Integral Differential (PID) control can be used. In addition, in FIG. 10, in order to simplify description, the command value is shown in a substantially linear shape.

第一階段（時刻t1～時刻t2）中的樹脂供給在樹脂材料的供給量的實測值達到比目標量少預定的量的結束判定值的時間點結束。即，在第一階段的結束時間點，指令值被更新為零。結束第一階段的結束判定值被設定在以下範圍：在第二振動部140的振動停止之後，利用從料槽130的供給口132a吐出的樹脂材料（即，振動停止後的流入），樹脂材料的供給量不超過目標量。The resin supply in the first stage (time t1 to time t2 ) ends when the actually measured value of the supply amount of the resin material reaches a termination determination value less than the target amount by a predetermined amount. That is, at the end time point of the first stage, the command value is updated to zero. The end determination value for ending the first stage is set in the following range: after the vibration of the second vibrating part 140 is stopped, the resin material is discharged from the supply port 132a of the trough 130 (that is, the inflow after the vibration is stopped), and the resin material The supply quantity does not exceed the target quantity.

如此，在第一階段中，使第二振動部140連續地振動，因此從料槽130的供給口132a連續地吐出樹脂材料。In this way, in the first stage, since the second vibrating part 140 is continuously vibrated, the resin material is continuously discharged from the supply port 132a of the trough 130 .

控制部50在第一階段之後的第二階段（時刻t2～時刻t3）中，以樹脂材料的供給量成為目標量的方式從料槽130間歇地吐出樹脂材料。第二階段相當於用於實現供給量的高精度化的調整期間。具體而言，控制部50對第二振動部140間歇地賦予規定的大小的指令值。即，控制部50在第二階段中，將脈衝狀的指令值賦予至第二振動部140。In the second stage (time t2 to time t3 ) following the first stage, the control unit 50 intermittently discharges the resin material from the chute 130 so that the supply amount of the resin material becomes the target amount. The second stage corresponds to an adjustment period for realizing high precision of the supply amount. Specifically, the control unit 50 intermittently gives a command value of a predetermined magnitude to the second vibration unit 140 . That is, in the second stage, the control unit 50 applies a pulse-like command value to the second vibration unit 140 .

此處，控制部50也可基於在第一階段中賦予至第二振動部140的指令值的大小（料槽130所產生的振動強度），決定第二階段中的指令值的大小。具體而言，可使第二階段的指令值的大小與第一階段即將結束之前的指令值的大小大致一致。Here, the control unit 50 may determine the magnitude of the command value in the second stage based on the magnitude of the command value given to the second vibrating section 140 in the first stage (vibration intensity generated by the chute 130 ). Specifically, the magnitude of the command value in the second stage can be approximately equal to the magnitude of the command value immediately before the end of the first stage.

另外，第二階段中的指令值的大小只要適當設為在實際的使用中沒有問題的程度的值即可。例如，可將第二階段的指令值的大小相對於第一階段即將結束之前的指令值的大小設為-50%～+10%，更具體而言，可設為從-50%、-45%、-40%、-35%、-30%、-25%、-20%、-15%、-10%、-9%、-8%、-7%、-6%、-5%、-4%、-3%、-2%、-1%、0%、+1%、+2%、+3%、+4%、+5%、+6%、+7%、+8%、+9%、+10%中選擇的兩個之間，也可設為從這些之中選擇的至少一個。In addition, the magnitude of the command value in the second stage may be appropriately set to a value such that there is no problem in actual use. For example, the magnitude of the command value of the second stage can be set to -50% to +10% with respect to the magnitude of the command value immediately before the end of the first stage, and more specifically, it can be set from -50% to -45%. %, -40%, -35%, -30%, -25%, -20%, -15%, -10%, -9%, -8%, -7%, -6%, -5%, -4%, -3%, -2%, -1%, 0%, +1%, +2%, +3%, +4%, +5%, +6%, +7%, +8% , +9%, and +10%, or at least one of them may be selected.

通過使第二階段的指令值的大小與第一階段即將結束之前的指令值的大小大致一致，並在第一階段與第二階段之間維持指令值的大小的連續性，可維持殘留在作為粉粒體供給路的料槽130的樹脂材料的分布狀態，由此，即便在下一次的樹脂材料的供給開始時，也可連續地吐出樹脂材料。By making the magnitude of the command value of the second stage approximately the same as the magnitude of the command value immediately before the end of the first stage, and maintaining the continuity of the magnitude of the command value between the first stage and the second stage, it is possible to maintain the remaining value as According to the distribution state of the resin material in the chute 130 of the powder or granular material supply path, the resin material can be continuously discharged even when the next supply of the resin material is started.

以下，使用圖10至圖12，對第一階段（圖11的步驟S201～步驟S206）及第二階段（圖12的步驟S211～步驟S214）中的具體的處理內容進行說明。Hereinafter, specific processing contents in the first stage (step S201 to step S206 in FIG. 11 ) and the second stage (step S211 to step S214 in FIG. 12 ) will be described with reference to FIGS. 10 to 12 .

首先，使用圖11對第一階段的處理內容進行說明。First, the processing content of the first stage will be described with reference to FIG. 11 .

在步驟S201中，控制部50決定指令值的初始值即指令初始值。控制部50在進行步驟S201的處理之後，轉移至步驟S202。In step S201, the control unit 50 determines the initial value of the command value, that is, the initial value of the command. After the control part 50 performs the process of step S201, it transfers to step S202.

在步驟S202中，控制部50在預定的初始動作時間內，將指令初始值作為指令值輸出。如此，通過在初始動作時間內將指令值固定為指令初始值，可使樹脂材料的初始吐出的供給速度穩定。控制部50在進行步驟S202的處理之後，轉移至步驟S203。In step S202, the control unit 50 outputs the command initial value as the command value within a predetermined initial operation time. Thus, by fixing the command value to the command initial value within the initial operation time, the supply speed of the initial discharge of the resin material can be stabilized. The control unit 50 proceeds to step S203 after performing the process of step S202.

在步驟S203中，控制部50基於供給速度的目標值與供給速度的實測值，計算指令值。控制部50在進行步驟S203的處理之後，轉移至步驟S204。In step S203, the control unit 50 calculates a command value based on the target value of the supply speed and the actual measured value of the supply speed. The control unit 50 proceeds to step S204 after performing the process of step S203.

在步驟S204中，控制部50將所輸出的指令值更新為步驟S203中計算出的指令值。控制部50在進行步驟S204的處理之後，轉移至步驟S205。In step S204, the control unit 50 updates the outputted command value to the command value calculated in step S203. The control unit 50 proceeds to step S205 after performing the process of step S204.

在步驟S205中，控制部50判定樹脂材料的供給量是否達到結束判定值。控制部50在判定為樹脂材料的供給量達到結束判定值的情況下，轉移至步驟S206。另一方面，控制部50在判定為樹脂材料的供給量未達到結束判定值的情況下，再次轉移至步驟S203。In step S205 , the control unit 50 determines whether or not the supply amount of the resin material has reached the end determination value. When it is determined that the supply amount of the resin material has reached the end determination value, the control unit 50 proceeds to step S206. On the other hand, when it is determined that the supply amount of the resin material has not reached the end determination value, the control unit 50 proceeds to step S203 again.

在步驟S206中，控制部50停止指令值的輸出。由此，第一階段中的處理結束。控制部50在進行步驟S206的處理之後，轉移至圖12的步驟S211（第二階段）。In step S206, the control unit 50 stops the output of the command value. Thereby, the processing in the first stage ends. After the control unit 50 performs the process of step S206 , the process proceeds to step S211 (second stage) of FIG. 12 .

如此，在第一階段中，反復進行從步驟S203至步驟S205為止的處理，由此進行樹脂材料的供給速度成為一定那樣的反饋控制，連續地供給樹脂材料（參照圖10）。In this way, in the first stage, by repeating the processes from step S203 to step S205 , feedback control is performed so that the supply speed of the resin material becomes constant, and the resin material is continuously supplied (see FIG. 10 ).

接著，使用圖12對第二階段的處理內容進行說明。Next, the processing content of the second stage will be described with reference to FIG. 12 .

在步驟S211中，控制部50決定在第二階段中所使用的指令值的大小。控制部50例如可將第一階段即將結束之前的指令值的大小設為第二階段中所使用的指令值的大小。控制部50在進行步驟S211的處理之後，轉移至步驟S212。In step S211, the control unit 50 determines the magnitude of the command value used in the second stage. For example, the control unit 50 may set the magnitude of the command value immediately before the end of the first stage as the magnitude of the command value used in the second stage. The control unit 50 proceeds to step S212 after performing the process of step S211.

在步驟S212中，控制部50判定樹脂材料的供給量是否達到目標供給量。控制部50在判定為樹脂材料的供給量達到目標供給量的情況下，結束本控制。另一方面，控制部50在判定為樹脂材料的供給量未達到目標供給量的情況下，轉移至步驟S213。In step S212, the control unit 50 determines whether or not the supply amount of the resin material has reached the target supply amount. When it is determined that the supply amount of the resin material has reached the target supply amount, the control unit 50 ends the present control. On the other hand, when it is determined that the supply amount of the resin material has not reached the target supply amount, the control unit 50 proceeds to step S213.

在步驟S213中，控制部50判定指令輸出的輸出周期是否到來。控制部50在判定為指令輸出的輸出周期到來的情況下，轉移至步驟S214。另一方面，控制部50在判定為指令輸出的輸出周期未到來的情況下，再次轉移至步驟S213。In step S213, the control unit 50 determines whether or not the output cycle of the command output has come. When it is determined that the output cycle of the command output has come, the control unit 50 proceeds to step S214. On the other hand, when it is determined that the output cycle of the command output has not come, the control unit 50 proceeds to step S213 again.

在步驟S214中，控制部50在預定的時間寬度上輸出步驟S211中所決定的大小的指令值。控制部50在執行步驟S214的處理之後，再次轉移至步驟S212。In step S214, the control unit 50 outputs the command value of the magnitude determined in step S211 over a predetermined time width. After executing the process of step S214, the control unit 50 proceeds to step S212 again.

如此，在第二階段中，控制部50反復進行從步驟S212至步驟S214為止的處理，由此可輸出脈衝狀的指令值。由此，可間歇地供給樹脂材料，直至樹脂材料的供給量達到目標供給量為止（參照圖10）。In this way, in the second stage, the control unit 50 can output a pulse-like command value by repeating the processing from step S212 to step S214. Thereby, the resin material can be supplied intermittently until the supply amount of the resin material reaches the target supply amount (see FIG. 10 ).

再者，輸出脈衝狀的指令值的輸出周期（參照步驟S213）、或輸出指令值的時間寬度（或占空比）（參照步驟S214）可預定。In addition, the output period (refer to step S213 ) of outputting the pulse-like command value, or the time width (or duty ratio) (refer to step S214 ) of outputting the command value can be predetermined.

如此，在第一階段中，通過連續地供給樹脂材料，可迅速地進行樹脂的供給，從而可實現樹脂供給時間的縮短。另外，在第二階段中，通過間歇地供給樹脂材料，可實現樹脂材料的供給量的高精度化。In this way, in the first stage, by continuously supplying the resin material, the supply of the resin can be performed quickly, and the resin supply time can be shortened. In addition, in the second stage, by supplying the resin material intermittently, it is possible to achieve high precision in the supply amount of the resin material.

再者，在本實施方式中，示出了在第二階段中以一定的輸出周期及時間寬度輸出脈衝狀的指令值的例子，但本發明並不限於此。例如，也可設為在第二階段中，隨著樹脂材料的供給量靠近目標供給量，減少每單位時間的供給量。由此，可實現樹脂材料的供給量的進一步的高精度化。In addition, in the present embodiment, the example in which the pulse-like command value is output with a constant output cycle and time width in the second stage is shown, but the present invention is not limited to this. For example, in the second stage, the supply amount per unit time may be reduced as the supply amount of the resin material approaches the target supply amount. Thereby, further high precision of the supply amount of the resin material can be achieved.

作為一例，在圖13的（a）～圖13的（c）示出了將第二階段分割成兩個區間（第一子階段及第二子階段），使在各個子階段中所輸出的指令值不同的例子。As an example, FIG. 13( a ) to FIG. 13( c ) show that the second stage is divided into two sections (a first substage and a second substage), and the output in each substage is Examples of different command values.

再者，從第一子階段向第二子階段的轉變條件可任意設定。例如，也能夠將目標供給量與實際供給量之差成為規定值以下作為轉變條件。另外，也可將第二階段分割成並非兩個區間，而是分割成更多的區間（三個以上的子階段）。Furthermore, the transition conditions from the first sub-phase to the second sub-phase can be arbitrarily set. For example, it is also possible to make the transition condition the difference between the target supply amount and the actual supply amount being equal to or less than a predetermined value. In addition, the second stage may be divided into not two sections but more sections (three or more substages).

在圖13的（a）所示的例子中，示出了使第二子階段的輸出周期T2比第一子階段的輸出周期T1長的例子。由此，可使第二子階段中的每單位時間的樹脂供給量比第一子階段少。In the example shown in FIG. 13( a ), an example in which the output period T2 of the second sub-stage is made longer than the output period T1 of the first sub-stage is shown. Thereby, the resin supply amount per unit time in the second sub-stage can be made smaller than that in the first sub-stage.

在圖13的（b）所示的例子中，示出了與圖13的（a）所示的例子同樣地變更輸出周期，並且使第二子階段的指令輸出的大小Y2比第一子階段的指令輸出的大小Y1小的例子。由此，可使第二子階段中的每單位時間的樹脂供給量比第一子階段進一步更少。In the example shown in FIG. 13( b ), the output cycle is changed in the same manner as in the example shown in FIG. 13( a ), and the magnitude Y2 of the command output in the second sub-stage is made smaller than that in the first sub-stage. An example of an instruction output with a small size y1. Thereby, the resin supply amount per unit time in the second sub-stage can be made further smaller than that in the first sub-stage.

在圖13的（c）所示的例子中，示出了使第二子階段的指令輸出的時間寬度Td2比第一子階段的指令輸出的時間寬度Td1小的例子。由此，可使第二子階段中的每單位時間的樹脂供給量比第一子階段少。In the example shown in FIG. 13( c ), the time width Td2 of the command output in the second substage is shown to be smaller than the time width Td1 of the command output in the first substage. Thereby, the resin supply amount per unit time in the second sub-stage can be made smaller than that in the first sub-stage.

如此，在本實施方式的樹脂成形裝置1中，通過將樹脂材料的連續的供給與間歇的供給組合（參照圖10至圖13的（c）），可實現各次的樹脂材料的供給量的高精度化，同時通過進一步進行消除上次的樹脂供給的誤差那樣的樹脂材料供給量的調整（參照圖8及圖9），實現樹脂材料向一個大托盤43的總供給量的高精度化。As described above, in the resin molding apparatus 1 of the present embodiment, by combining the continuous supply of the resin material with the intermittent supply (refer to FIGS. 10 to 13( c )), it is possible to adjust the supply amount of the resin material each time. Accuracy is also improved by further adjusting the resin material supply amount (see FIGS. 8 and 9 ) to eliminate the error in the previous resin supply, so as to achieve higher precision in the total supply amount of resin material to one large tray 43 .

如上所述，本實施方式的樹脂材料供給裝置（樹脂供給模塊40）包括： 樹脂材料供給部（料槽130），供給樹脂材料； 第一樹脂材料搬送部（小托盤41），從所述樹脂材料供給部供給樹脂材料； 第二樹脂材料搬送部（大托盤43），將由所述第一樹脂材料搬送部搬送的樹脂材料搬送至成形模31；以及 控制部50，在將向一個所述第二樹脂材料搬送部供給的樹脂材料分成多次從所述樹脂材料供給部供給至所述第一樹脂材料搬送部的情況下，對於某一次的來自所述樹脂材料供給部的樹脂材料的供給量，基於所述某一次之前的一次的來自所述樹脂材料供給部的樹脂材料的供給量進行調整。As described above, the resin material supply device (resin supply module 40 ) of the present embodiment includes: The resin material supply part (the material tank 130 ) supplies the resin material; a first resin material conveying unit (small tray 41 ) for supplying resin material from the resin material supply unit; The second resin material conveying unit (large tray 43 ) conveys the resin material conveyed by the first resin material conveying unit to the molding die 31 ; and When the control unit 50 divides the resin material supplied to one of the second resin material conveying units into a plurality of times to be supplied from the resin material supply unit to the first resin material conveying unit, for any one of the The supply amount of the resin material by the resin material supply unit is adjusted based on the supply amount of the resin material from the resin material supply unit at one time before the one.

通過如此構成，可高精度地控制樹脂材料的供給量。即，通過基於上次以前的供給量來調整樹脂材料從料槽130向小托盤41的供給量，可消除上次以前所產生的誤差，從而可高精度地控制供給至大托盤43的樹脂材料的總供給量。With such a configuration, the supply amount of the resin material can be controlled with high accuracy. That is, by adjusting the supply amount of the resin material from the chute 130 to the small tray 41 based on the previous supply amount, the error occurred in the previous time can be eliminated, and the resin material supplied to the large tray 43 can be controlled with high precision total supply.

另外，所述第一樹脂材料搬送部（小托盤41）相對於一個所述第二樹脂材料搬送部（大托盤43）設置有多個。Moreover, the said 1st resin material conveyance part (small tray 41) is provided in plural for one said 2nd resin material conveyance part (large tray 43).

通過如此構成，即便在誤差容易累積的結構中，也可高精度地控制樹脂材料的供給量。即，通過設置多個小托盤41，可迅速地供給樹脂材料，相反，擔心因誤差的累積而導致誤差的增大，但通過如本申請那樣的樹脂材料的供給量的調整，可抑制誤差的增大。With such a configuration, even in a configuration in which errors are likely to accumulate, the supply amount of the resin material can be controlled with high accuracy. That is, by providing a plurality of small trays 41, the resin material can be rapidly supplied. On the contrary, there is a concern that the error will increase due to the accumulation of errors. However, by adjusting the supply amount of the resin material as in the present application, the error can be suppressed. increase.

另外，所述樹脂材料供給部（料槽130）相對於一個所述第一樹脂材料搬送部（小托盤41）設置有多個。Moreover, the said resin material supply part (the trough 130) is provided in plural with respect to one said 1st resin material conveyance part (small tray 41).

通過如此構成，即便在誤差容易累積的結構中，也可高精度地控制樹脂材料的供給量。即，通過設置多個料槽130，可迅速地供給樹脂材料，相反，擔心因誤差的累積而導致誤差的增大，但通過如本申請那樣的樹脂材料的供給量的調整，可抑制誤差的增大。With such a configuration, even in a configuration in which errors are likely to accumulate, the supply amount of the resin material can be controlled with high accuracy. That is, by providing the plurality of troughs 130, the resin material can be rapidly supplied. On the contrary, there is a concern that the error will increase due to the accumulation of errors. However, by adjusting the supply amount of the resin material as in the present application, the error can be suppressed. increase.

另外，在將樹脂材料從所述樹脂材料供給部（料槽130）供給至所述第一樹脂材料搬送部（小托盤41）的情況下，所述控制部50使所述第一樹脂材料搬送部旋轉，並分成多次對所述第一樹脂材料搬送部中的不同區域供給樹脂材料。In addition, when the resin material is supplied from the resin material supply unit (the trough 130 ) to the first resin material conveyance unit (the small tray 41 ), the control unit 50 causes the first resin material to be conveyed The part rotates, and the resin material is supplied to different regions in the first resin material conveying part in a plurality of times.

通過如此構成，可實現樹脂材料的均等化，同時高精度地控制樹脂材料的供給量。即，通過將小托盤41分成多個區域供給樹脂材料，可實現小托盤41中的樹脂材料的均等化，並且可利用此時的多次的樹脂材料的供給，進行消除誤差那樣的樹脂材料的調整。With such a configuration, it is possible to control the supply amount of the resin material with high accuracy while achieving the equalization of the resin material. That is, by dividing the small tray 41 into a plurality of areas and supplying the resin material, the uniformity of the resin material in the small tray 41 can be achieved, and at this time, the supply of the resin material multiple times can be used to eliminate errors. Adjustment.

另外，所述控制部50對所述樹脂材料供給部進行控制，以使在從所述樹脂材料供給部（料槽130）向所述第一樹脂材料搬送部（小托盤41）供給一次的樹脂材料中，在將樹脂材料連續地供給至所述第一樹脂材料搬送部之後，將樹脂材料間歇地供給至所述第一樹脂材料搬送部。In addition, the control unit 50 controls the resin material supply unit so that the resin is supplied once from the resin material supply unit (the trough 130 ) to the first resin material conveyance unit (the small tray 41 ). Among the materials, after the resin material is continuously supplied to the first resin material conveying portion, the resin material is intermittently supplied to the first resin material conveying portion.

通過如此構成，可更高精度地控制樹脂材料的供給量。即，通過間歇地供給樹脂材料，可實現一次的樹脂材料的供給的高精度化，進而可高精度地控制供給至大托盤43的樹脂材料的總供給量。With such a configuration, the supply amount of the resin material can be controlled with higher accuracy. That is, by supplying the resin material intermittently, it is possible to achieve high precision in supplying the resin material at one time, and it is possible to control the total supply amount of the resin material supplied to the large tray 43 with high precision.

另外，本實施方式的樹脂成形裝置1包括所述樹脂材料供給裝置（樹脂供給模塊40）。Further, the resin molding apparatus 1 of the present embodiment includes the above-described resin material supply device (resin supply module 40 ).

通過如此構成，可高精度地控制樹脂材料的供給量。With such a configuration, the supply amount of the resin material can be controlled with high accuracy.

另外，本實施方式的樹脂成形品的製造方法使用所述樹脂成形裝置1來製造樹脂成形品。In addition, the resin-molded product manufacturing method of the present embodiment manufactures a resin-molded product using the resin-molding apparatus 1 described above.

通過如此構成，可高精度地控制樹脂材料的供給量。With such a configuration, the supply amount of the resin material can be controlled with high accuracy.

以上，對本發明的實施方式進行了說明，但本發明並不限定於所述實施方式，能夠在權利要求書中所記載的發明的技術思想的範圍內進行適當的變更。As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, It can change suitably within the range of the technical idea of the invention described in the claim.

例如，在本實施方式中，例示了壓縮方式的樹脂成形裝置1，但本發明並不限於此，也能夠採用其他方式（例如，將熔融的樹脂移送至模腔內並使其硬化的傳送方式等）。For example, in the present embodiment, the resin molding apparatus 1 of the compression method is exemplified, but the present invention is not limited to this, and other methods (for example, a transfer method that transfers molten resin into a cavity and hardens it) may be adopted. Wait).

另外，本實施方式的樹脂成形裝置1所使用的構成元件（基板搬入搬出模塊10等）為一例，能夠適當進行裝卸或更換。例如，也能夠不設置基板搬入搬出模塊10，而作業者通過手動進行基板P的搬入搬出。In addition, the structural elements (board|substrate carrying-in and carrying-out module 10 etc.) used for the resin molding apparatus 1 of this embodiment are an example, and it can be attached and detached or replaced|exchanged suitably. For example, the board carrying-in and carry-out module 10 may not be provided, and the operator may carry out carrying in and carrying out the board P manually.

另外，在本實施方式中，例示了矩形板狀的基板P，但本發明並不限於此，能夠使用其他各種形狀（例如，圓形板狀等）的基板P。In addition, in this Embodiment, although the board|substrate P of a rectangular plate shape was illustrated, this invention is not limited to this, The board|substrate P of other various shapes (for example, circular plate shape etc.) can be used.

另外，本實施方式中所示的小托盤41及大托盤43的結構為一例，能夠變更為能夠搬送樹脂材料的適當的結構。In addition, the structure of the small tray 41 and the large tray 43 shown in this embodiment is an example, and can be changed to the appropriate structure which can convey a resin material.

另外，在本實施方式中，例示了相對於一個小托盤41包括兩個料槽130（樹脂材料供給部）的樹脂材料收納裝置100，但本發明並不限於此，並不限定料槽130的個數。In addition, in the present embodiment, the resin material storage device 100 including two troughs 130 (resin material supply parts) for one small tray 41 is exemplified, but the present invention is not limited to this, and the size of the troughs 130 is not limited. number.

另外，在本實施方式中，例示了相對於一個大托盤43包括四個小托盤41的樹脂材料收納裝置100，但本發明並不限於此，並不限定小托盤41的個數。In addition, in the present embodiment, the resin material storage device 100 including four small trays 41 for one large tray 43 is exemplified, but the present invention is not limited to this, and the number of small trays 41 is not limited.

另外，設為本實施方式的樹脂成形裝置1包括兩個樹脂材料收納裝置100，但本發明並不限於此，也可包括一個或三個以上的樹脂材料收納裝置100。In addition, although the resin molding apparatus 1 of this embodiment is assumed to include two resin material storage apparatuses 100, the present invention is not limited to this, and one or three or more resin material storage apparatuses 100 may be included.

另外，在本實施方式中，設為利用單個控制部50對各模塊的動作進行控制，但本發明並不限於此，也能夠設置多個控制部50。例如，也能夠針對各模塊或各裝置設置控制部50，使各模塊等的動作相互聯動，同時對其各別地進行控制。In addition, in this embodiment, it is assumed that the operation of each module is controlled by a single control unit 50 , but the present invention is not limited to this, and a plurality of control units 50 may be provided. For example, the control unit 50 may be provided for each module or each device, and the operations of each module or the like may be linked to each other, and each of them may be controlled individually.

1:樹脂成形裝置 10:基板搬入搬出模塊 11:搬入部 12:搬出部 13:檢查部 14:臂機構 14a:吸附手部 14b:臂部 14c:驅動部 20:基板交接模塊 21:裝載器 22:卸載器 30:成形模塊 31:成形模（下模） 31a:擴散板 40:樹脂供給模塊（樹脂材料供給裝置） 40a、161:框體 41:小托盤（第一樹脂材料搬送部） 41a:樹脂保持部 41b:擋板 41c、41d:狹縫 42:小托盤搬送機構 43:大托盤（第二樹脂材料搬送部） 43a:框構件 43b、111、131:收納部 43c:槽 44:大托盤搬送機構 50:控制部 100:樹脂材料收納裝置 110:儲料器 112、132:供給部 112a、132a:供給口 120:第一振動部 130:料槽（樹脂材料供給部） 140:第二振動部 150:重量計 160:分配器 164:致動器 B、D、F、L、R、U:箭頭 Lr:導軌 P:基板 S:開始位置 S101～S111、S201～S206、S211～S214:步驟 t1、t2、t3:時刻 T1、T2:輸出周期 Td1、Td2:時間寬度 Y1、Y2:大小1: Resin molding device 10: The board is loaded in and out of the module 11: Move-in Department 12: Move out department 13: Inspection Department 14: Arm mechanism 14a: Adsorb the hand 14b: Arm 14c: Drive Department 20: Substrate handover module 21: Loader 22: Uninstaller 30: Forming module 31: Forming die (lower die) 31a: Diffuser plate 40: Resin supply module (resin material supply device) 40a, 161: Frame 41: Small tray (first resin material conveying section) 41a: Resin holding part 41b: Baffle 41c, 41d: slit 42: Small pallet conveying mechanism 43: Large Tray (Second Resin Material Conveying Section) 43a: Frame member 43b, 111, 131: storage part 43c: Slot 44: Large pallet conveying mechanism 50: Control Department 100: Resin material storage device 110: Stocker 112, 132: Supply Department 112a, 132a: Supply port 120: First Vibration Department 130: Feed tank (resin material supply part) 140: Second Vibration Department 150: Weight meter 160: Dispenser 164: Actuator B, D, F, L, R, U: Arrow Lr: rail P: substrate S: start position S101～S111, S201～S206, S211～S214: Steps t1, t2, t3: moments T1, T2: output period Td1, Td2: time width Y1, Y2: size

圖1是表示本發明一實施方式的樹脂成形裝置的整體結構的平面示意圖。 圖2是表示樹脂材料收納裝置設置在樹脂供給模塊的狀態的前視圖。 圖3是表示樹脂材料收納裝置的前視圖。 圖4是表示樹脂材料收納裝置的側視圖。 圖5是表示小托盤、大托盤及擴散板的結構的側視剖面圖。 圖6是表示小托盤及大托盤的結構的平面圖。 圖7的（a）是表示料槽相對於小托盤的移動軌跡的平面圖。圖7的（b）是表示向托盤的一半供給樹脂材料的情況的平面圖。圖7的（c）是表示小托盤反轉的情況的平面圖。圖7的（d）表示向小托盤的整個區域供給樹脂材料的情況的平面圖。 圖8是表示供給了樹脂材料的結果的一例（目標供給量、實際的供給量）的圖。 圖9是表示用於基於上次的樹脂材料的供給量來設定目標供給量的處理內容的流程圖。 圖10是表示第一階段及第二階段中的樹脂材料的供給的一例的時序圖。 圖11是表示在第一階段中用於供給樹脂材料的處理內容的流程圖。 圖12是表示在第二階段中用於供給樹脂材料的處理內容的流程圖。 圖13的（a）是表示變更了第二階段的輸出周期的例子的時序圖。圖13的（b）是表示變更了第二階段的輸出周期及指令輸出的例子的時序圖。圖13的（c）是表示變更了第二階段的指令輸出的時間寬度的例子的時序圖。FIG. 1 is a schematic plan view showing the overall configuration of a resin molding apparatus according to an embodiment of the present invention. 2 is a front view showing a state in which the resin material storage device is installed in the resin supply module. FIG. 3 is a front view showing the resin material storage device. FIG. 4 is a side view showing the resin material storage device. 5 is a side sectional view showing the structure of a small tray, a large tray, and a diffuser plate. FIG. 6 is a plan view showing the structure of a small tray and a large tray. (a) of FIG. 7 is a plan view showing the movement locus of the chute with respect to the small tray. (b) of FIG. 7 is a plan view showing a state in which the resin material is supplied to half of the tray. (c) of FIG. 7 is a plan view showing a state where the small tray is reversed. (d) of FIG. 7 is a plan view showing a state in which the resin material is supplied to the entire area of the small tray. FIG. 8 is a diagram showing an example of a result of supplying a resin material (target supply amount, actual supply amount). 9 is a flowchart showing the content of processing for setting the target supply amount based on the last supply amount of the resin material. FIG. 10 is a timing chart showing an example of the supply of the resin material in the first stage and the second stage. FIG. 11 is a flowchart showing the content of processing for supplying the resin material in the first stage. FIG. 12 is a flowchart showing the content of processing for supplying the resin material in the second stage. (a) of FIG. 13 is a timing chart showing an example in which the output cycle of the second stage is changed. (b) of FIG. 13 is a timing chart showing an example in which the output cycle and command output of the second stage are changed. (c) of FIG. 13 is a timing chart showing an example in which the time width of the command output in the second stage is changed.

S101~S111:步驟S101~S111: Steps

Claims (9)

一種樹脂材料供給裝置，包括： 樹脂材料供給部，供給樹脂材料； 第一樹脂材料搬送部，從所述樹脂材料供給部供給樹脂材料； 第二樹脂材料搬送部，將由所述第一樹脂材料搬送部搬送的樹脂材料搬送至成形模；以及 控制部，在將向一個所述第二樹脂材料搬送部供給的樹脂材料分成多次從所述樹脂材料供給部供給至所述第一樹脂材料搬送部的情況下，對於某一次的來自所述樹脂材料供給部的樹脂材料的供給量，基於所述某一次之前的一次的來自所述樹脂材料供給部的樹脂材料的供給量進行調整。A resin material supply device, comprising: The resin material supply part supplies resin material; a first resin material conveying unit for supplying resin material from the resin material supply unit; a second resin material conveying unit that conveys the resin material conveyed by the first resin material conveying unit to a molding die; and The control unit, in the case where the resin material supplied to one of the second resin material conveying units is divided into a plurality of times and supplied from the resin material supply unit to the first resin material conveying unit, for a certain time from the The supply amount of the resin material by the resin material supply unit is adjusted based on the supply amount of the resin material from the resin material supply unit at one time before the one. 如請求項1所述的樹脂材料供給裝置，其中， 所述第一樹脂材料搬送部相對於一個所述第二樹脂材料搬送部設置有多個。The resin material supply device according to claim 1, wherein: The said 1st resin material conveyance part is provided in plural with respect to one said 2nd resin material conveyance part. 如請求項1所述的樹脂材料供給裝置，其中， 所述樹脂材料供給部相對於一個所述第一樹脂材料搬送部設置有多個。The resin material supply device according to claim 1, wherein: The said resin material supply part is provided in plural with respect to one said 1st resin material conveyance part. 如請求項2所述的樹脂材料供給裝置，其中， 所述樹脂材料供給部相對於一個所述第一樹脂材料搬送部設置有多個。The resin material supply device according to claim 2, wherein: The said resin material supply part is provided in plural with respect to one said 1st resin material conveyance part. 如請求項1至請求項4中任一項所述的樹脂材料供給裝置，其中， 在將樹脂材料從所述樹脂材料供給部供給至所述第一樹脂材料搬送部的情況下，所述控制部使所述第一樹脂材料搬送部旋轉，並分成多次對所述第一樹脂材料搬送部中的不同區域供給樹脂材料。The resin material supply device according to any one of claim 1 to claim 4, wherein: When the resin material is supplied from the resin material supply unit to the first resin material conveying unit, the control unit rotates the first resin material conveying unit and divides the first resin material into a plurality of times. Resin material is supplied to different areas in the material conveying section. 如請求項1至請求項4中任一項所述的樹脂材料供給裝置，其中， 所述控制部對所述樹脂材料供給部進行控制，以使在從所述樹脂材料供給部向所述第一樹脂材料搬送部供給一次的樹脂材料中，在將樹脂材料連續地供給至所述第一樹脂材料搬送部之後，將樹脂材料間歇地供給至所述第一樹脂材料搬送部。The resin material supply device according to any one of claim 1 to claim 4, wherein: The control unit controls the resin material supply unit so that the resin material is continuously supplied to the After the first resin material conveying unit, the resin material is intermittently supplied to the first resin material conveying unit. 如請求項5所述的樹脂材料供給裝置，其中， 所述控制部對所述樹脂材料供給部進行控制，以使在從所述樹脂材料供給部向所述第一樹脂材料搬送部供給一次的樹脂材料中，在將樹脂材料連續地供給至所述第一樹脂材料搬送部之後，將樹脂材料間歇地供給至所述第一樹脂材料搬送部。The resin material supply device according to claim 5, wherein: The control unit controls the resin material supply unit so that the resin material is continuously supplied to the After the first resin material conveying unit, the resin material is intermittently supplied to the first resin material conveying unit. 一種樹脂成形裝置，包括如請求項1至請求項7中任一項所述的樹脂材料供給裝置。A resin molding device comprising the resin material supply device according to any one of claim 1 to claim 7. 一種樹脂成形品的製造方法，使用如請求項8所述的樹脂成形裝置來製造樹脂成形品。A method for producing a resin molded product, using the resin molding apparatus according to claim 8 to produce a resin molded product.
TW110118326A 2020-07-14 2021-05-20 Resin material supply device, resin molding device, and method for manufacturing resin molded products TWI833082B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020120415A JP7360365B2 (en) 2020-07-14 2020-07-14 Resin material supply device, resin molding device, and method for manufacturing resin molded products
JP2020-120415 2020-07-14

Publications (2)

Publication Number Publication Date
TW202202311A true TW202202311A (en) 2022-01-16
TWI833082B TWI833082B (en) 2024-02-21

Family

ID=79274191

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110118326A TWI833082B (en) 2020-07-14 2021-05-20 Resin material supply device, resin molding device, and method for manufacturing resin molded products

Country Status (4)

Country Link
JP (1) JP7360365B2 (en)
KR (1) KR102600927B1 (en)
CN (1) CN113927787A (en)
TW (1) TWI833082B (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3826886B2 (en) * 2003-01-21 2006-09-27 松下電工株式会社 Molding material weighing device
JP4675314B2 (en) * 2006-12-11 2011-04-20 住友重機械工業株式会社 Resin feeder
JP5074050B2 (en) 2007-01-30 2012-11-14 住友重機械工業株式会社 Resin supply mechanism
KR101950894B1 (en) * 2011-11-08 2019-04-22 아피쿠 야마다 가부시키가이샤 Resin molding apparatus
JP2014231185A (en) 2013-05-29 2014-12-11 アピックヤマダ株式会社 Resin molding apparatus and resin molding method
JP6049597B2 (en) * 2013-11-28 2016-12-21 Ｔｏｗａ株式会社 Resin material supply method and supply mechanism of compression molding apparatus, and compression molding method and compression molding apparatus
JP6104787B2 (en) * 2013-12-18 2017-03-29 Ｔｏｗａ株式会社 Resin molding apparatus and resin molding method
US20150321860A1 (en) * 2014-02-20 2015-11-12 Stephen B. Maguire Vacuum powered resin loading system without central control
JP6039750B1 (en) * 2015-06-10 2016-12-07 Ｔｏｗａ株式会社 Resin material supply device and compression molding device for compression molding device
JP6774865B2 (en) * 2016-12-13 2020-10-28 アピックヤマダ株式会社 Frame jig, resin supply jig and its weighing method, mold resin measuring device and method, resin supply device, resin supply measuring device and method, and resin molding device and method
JP6598918B2 (en) 2018-04-16 2019-10-30 Ｔｏｗａ株式会社 Granule supply device, resin molding device, powder supply method, and method of manufacturing resin molded product
JP6894403B2 (en) * 2018-05-24 2021-06-30 Ｔｏｗａ株式会社 Resin molding equipment and manufacturing method of resin molded products

Also Published As

Publication number Publication date
KR20220008746A (en) 2022-01-21
JP7360365B2 (en) 2023-10-12
KR102600927B1 (en) 2023-11-13
JP2022017710A (en) 2022-01-26
TWI833082B (en) 2024-02-21
CN113927787A (en) 2022-01-14

Similar Documents

Publication Publication Date Title
KR101741390B1 (en) Method and mechanism for supplying resin material of compression molding apparatus, compression molding method and compression molding apparatus
CN103930252B (en) Resin sealing apparatus
KR102074404B1 (en) Apparatus and method for supplying resin material, resin molding apparatus and resin molded product manufacturing method
KR102007566B1 (en) Apparatus and method for supplying resin material, resin molding apparatus and resin molded product manufacturing method
TW202202311A (en) Resin material supply device, resin molding device, and method for producing resin molded product capable of precisely controlling the supply amount of a resin material
CN110385813B (en) Powder supply device and method, resin molding device and molded product manufacturing method
KR101841831B1 (en) Apparatus and method for supplying resin material of compression molding apparatus, compression molding apparatus and compression molding method
KR102467782B1 (en) Resin material supply device, resin molding device, and method for manufacturing resin molded product
TWI781662B (en) Resin molding device and method for manufacturing a resin molded product
JP7240300B2 (en) Particle supply device, resin molding device, and method for manufacturing resin molded product
WO2023228462A1 (en) Resin molding device, and method for manufacturing resin molded article