TW202200658A - 樹脂組成物、樹脂糊料、硬化物、樹脂薄片、印刷配線板、半導體晶片封裝及半導體裝置 - Google Patents

樹脂組成物、樹脂糊料、硬化物、樹脂薄片、印刷配線板、半導體晶片封裝及半導體裝置 Download PDF

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Publication number
TW202200658A
TW202200658A TW110110996A TW110110996A TW202200658A TW 202200658 A TW202200658 A TW 202200658A TW 110110996 A TW110110996 A TW 110110996A TW 110110996 A TW110110996 A TW 110110996A TW 202200658 A TW202200658 A TW 202200658A
Authority
TW
Taiwan
Prior art keywords
resin composition
resin
group
cured product
mass
Prior art date
Application number
TW110110996A
Other languages
English (en)
Chinese (zh)
Inventor
池平秀
阪內啓之
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW202200658A publication Critical patent/TW202200658A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW110110996A 2020-03-31 2021-03-26 樹脂組成物、樹脂糊料、硬化物、樹脂薄片、印刷配線板、半導體晶片封裝及半導體裝置 TW202200658A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020063138A JP7424168B2 (ja) 2020-03-31 2020-03-31 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置
JP2020-063138 2020-03-31

Publications (1)

Publication Number Publication Date
TW202200658A true TW202200658A (zh) 2022-01-01

Family

ID=78004480

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110110996A TW202200658A (zh) 2020-03-31 2021-03-26 樹脂組成物、樹脂糊料、硬化物、樹脂薄片、印刷配線板、半導體晶片封裝及半導體裝置

Country Status (3)

Country Link
JP (1) JP7424168B2 (ko)
KR (1) KR20210122173A (ko)
TW (1) TW202200658A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023157542A1 (ja) * 2022-02-21 2023-08-24 味の素株式会社 樹脂組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011192818A (ja) 2010-03-15 2011-09-29 Sekisui Chem Co Ltd 半導体チップ接合用接着フィルム
KR101825259B1 (ko) 2011-08-31 2018-02-02 히타치가세이가부시끼가이샤 수지 조성물, 수지 시트, 금속박 구비 수지 시트, 수지 경화물 시트, 구조체, 및 동력용 또는 광원용 반도체 디바이스
JP5344022B2 (ja) 2011-11-16 2013-11-20 住友ベークライト株式会社 エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置
JP6052868B2 (ja) 2012-05-11 2016-12-27 エア・ウォーター株式会社 エポキシ樹脂の硬化剤、製法、およびその用途
TWI694109B (zh) 2013-06-12 2020-05-21 日商味之素股份有限公司 樹脂組成物
TWI668269B (zh) 2014-06-30 2019-08-11 日商味之素股份有限公司 Resin composition
JP6927717B2 (ja) 2016-03-31 2021-09-01 積水化学工業株式会社 絶縁材料及び電子部品
JP7154732B2 (ja) 2016-03-31 2022-10-18 味の素株式会社 樹脂組成物
JP2020023643A (ja) 2018-08-08 2020-02-13 住友ベークライト株式会社 封止用樹脂組成物、ウエハーレベルパッケージ、パネルレベルパッケージおよび電子装置

Also Published As

Publication number Publication date
KR20210122173A (ko) 2021-10-08
JP7424168B2 (ja) 2024-01-30
JP2021161206A (ja) 2021-10-11

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