JP7424168B2 - 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置 - Google Patents

樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置 Download PDF

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Publication number
JP7424168B2
JP7424168B2 JP2020063138A JP2020063138A JP7424168B2 JP 7424168 B2 JP7424168 B2 JP 7424168B2 JP 2020063138 A JP2020063138 A JP 2020063138A JP 2020063138 A JP2020063138 A JP 2020063138A JP 7424168 B2 JP7424168 B2 JP 7424168B2
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Prior art keywords
resin composition
group
resin
mass
cured product
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English (en)
Japanese (ja)
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JP2021161206A (ja
Inventor
秀 池平
啓之 阪内
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Ajinomoto Co Inc
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Ajinomoto Co Inc
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Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2020063138A priority Critical patent/JP7424168B2/ja
Priority to TW110110996A priority patent/TW202200658A/zh
Priority to KR1020210040576A priority patent/KR20210122173A/ko
Publication of JP2021161206A publication Critical patent/JP2021161206A/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2020063138A 2020-03-31 2020-03-31 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置 Active JP7424168B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2020063138A JP7424168B2 (ja) 2020-03-31 2020-03-31 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置
TW110110996A TW202200658A (zh) 2020-03-31 2021-03-26 樹脂組成物、樹脂糊料、硬化物、樹脂薄片、印刷配線板、半導體晶片封裝及半導體裝置
KR1020210040576A KR20210122173A (ko) 2020-03-31 2021-03-29 수지 조성물, 수지 페이스트, 경화물, 수지 시트, 프린트 배선판, 반도체 칩 패키지 및 반도체 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020063138A JP7424168B2 (ja) 2020-03-31 2020-03-31 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置

Publications (2)

Publication Number Publication Date
JP2021161206A JP2021161206A (ja) 2021-10-11
JP7424168B2 true JP7424168B2 (ja) 2024-01-30

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JP2020063138A Active JP7424168B2 (ja) 2020-03-31 2020-03-31 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置

Country Status (3)

Country Link
JP (1) JP7424168B2 (ko)
KR (1) KR20210122173A (ko)
TW (1) TW202200658A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023157542A1 (ja) * 2022-02-21 2023-08-24 味の素株式会社 樹脂組成物

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011192818A (ja) 2010-03-15 2011-09-29 Sekisui Chem Co Ltd 半導体チップ接合用接着フィルム
WO2013030998A1 (ja) 2011-08-31 2013-03-07 日立化成工業株式会社 樹脂組成物、樹脂シート、金属箔付き樹脂シート、樹脂硬化物シート、構造体、および動力用又は光源用半導体デバイス
JP2013104029A (ja) 2011-11-16 2013-05-30 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置
JP2013253220A (ja) 2012-05-11 2013-12-19 Air Water Inc エポキシ樹脂の硬化剤、製法、およびその用途
JP2015017247A (ja) 2013-06-12 2015-01-29 味の素株式会社 樹脂組成物
JP2016027097A (ja) 2014-06-30 2016-02-18 味の素株式会社 樹脂組成物
JP2017179279A (ja) 2016-03-31 2017-10-05 味の素株式会社 樹脂組成物
JP2020023643A (ja) 2018-08-08 2020-02-13 住友ベークライト株式会社 封止用樹脂組成物、ウエハーレベルパッケージ、パネルレベルパッケージおよび電子装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6927717B2 (ja) 2016-03-31 2021-09-01 積水化学工業株式会社 絶縁材料及び電子部品

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011192818A (ja) 2010-03-15 2011-09-29 Sekisui Chem Co Ltd 半導体チップ接合用接着フィルム
WO2013030998A1 (ja) 2011-08-31 2013-03-07 日立化成工業株式会社 樹脂組成物、樹脂シート、金属箔付き樹脂シート、樹脂硬化物シート、構造体、および動力用又は光源用半導体デバイス
JP2013104029A (ja) 2011-11-16 2013-05-30 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置
JP2013253220A (ja) 2012-05-11 2013-12-19 Air Water Inc エポキシ樹脂の硬化剤、製法、およびその用途
JP2015017247A (ja) 2013-06-12 2015-01-29 味の素株式会社 樹脂組成物
JP2016027097A (ja) 2014-06-30 2016-02-18 味の素株式会社 樹脂組成物
JP2017179279A (ja) 2016-03-31 2017-10-05 味の素株式会社 樹脂組成物
JP2020023643A (ja) 2018-08-08 2020-02-13 住友ベークライト株式会社 封止用樹脂組成物、ウエハーレベルパッケージ、パネルレベルパッケージおよび電子装置

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TW202200658A (zh) 2022-01-01
KR20210122173A (ko) 2021-10-08
JP2021161206A (ja) 2021-10-11

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