TW202027227A - 將測試基板、探針及檢查單元相對於彼此定位之方法以及執行此方法的探測器 - Google Patents
將測試基板、探針及檢查單元相對於彼此定位之方法以及執行此方法的探測器 Download PDFInfo
- Publication number
- TW202027227A TW202027227A TW108131957A TW108131957A TW202027227A TW 202027227 A TW202027227 A TW 202027227A TW 108131957 A TW108131957 A TW 108131957A TW 108131957 A TW108131957 A TW 108131957A TW 202027227 A TW202027227 A TW 202027227A
- Authority
- TW
- Taiwan
- Prior art keywords
- movement
- test substrate
- inspection unit
- unit
- manipulator
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018121911.3A DE102018121911A1 (de) | 2018-09-07 | 2018-09-07 | Verfahren zur Positionierung von Testsubstrat, Sonden und Inspektionseinheit relativ zueinander und Prober zu dessen Ausführung |
DE102018121911.3 | 2018-09-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202027227A true TW202027227A (zh) | 2020-07-16 |
Family
ID=68109075
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108131957A TW202027227A (zh) | 2018-09-07 | 2019-09-04 | 將測試基板、探針及檢查單元相對於彼此定位之方法以及執行此方法的探測器 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3847466A1 (de) |
KR (1) | KR20210055708A (de) |
CN (1) | CN112585485A (de) |
DE (1) | DE102018121911A1 (de) |
TW (1) | TW202027227A (de) |
WO (1) | WO2020048567A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023111575A (ja) * | 2022-01-31 | 2023-08-10 | ヤマハファインテック株式会社 | 電気検査装置及び電気検査方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1211812B (de) * | 1963-10-18 | 1966-03-03 | Zeiss Carl Fa | Optisches Beobachtungsinstrument, insbesondere Mikroskop, mit Einstrahlphotometer |
JP3208734B2 (ja) * | 1990-08-20 | 2001-09-17 | 東京エレクトロン株式会社 | プローブ装置 |
US5644245A (en) * | 1993-11-24 | 1997-07-01 | Tokyo Electron Limited | Probe apparatus for inspecting electrical characteristics of a microelectronic element |
KR100248569B1 (ko) * | 1993-12-22 | 2000-03-15 | 히가시 데쓰로 | 프로우브장치 |
JP3209641B2 (ja) * | 1994-06-02 | 2001-09-17 | 三菱電機株式会社 | 光加工装置及び方法 |
AU2003218348A1 (en) * | 2002-03-22 | 2003-10-13 | Electro Scientific Industries, Inc. | Test probe alignment apparatus |
JP4413130B2 (ja) * | 2004-11-29 | 2010-02-10 | Okiセミコンダクタ株式会社 | プローブカードを用いた半導体素子の検査方法およびその検査方法により検査した半導体装置 |
US8279451B2 (en) * | 2010-06-09 | 2012-10-02 | Star Technologies Inc. | Probing apparatus with on-probe device-mapping function |
DE102010040242B4 (de) * | 2010-09-03 | 2014-02-13 | Cascade Microtech Dresden Gmbh | Modularer Prober und Verfahren zu dessen Betrieb |
EP3034991B2 (de) * | 2014-12-19 | 2022-08-24 | Hexagon Technology Center GmbH | Verfahren und Vorrichtung zum aktiven Entgegenwirken gegen Verlagerungskräfte mit einer Tasteinheit |
-
2018
- 2018-09-07 DE DE102018121911.3A patent/DE102018121911A1/de active Pending
-
2019
- 2019-09-04 EP EP19780142.6A patent/EP3847466A1/de active Pending
- 2019-09-04 KR KR1020217007863A patent/KR20210055708A/ko not_active Application Discontinuation
- 2019-09-04 TW TW108131957A patent/TW202027227A/zh unknown
- 2019-09-04 CN CN201980055304.9A patent/CN112585485A/zh active Pending
- 2019-09-04 WO PCT/DE2019/100794 patent/WO2020048567A1/de unknown
Also Published As
Publication number | Publication date |
---|---|
WO2020048567A1 (de) | 2020-03-12 |
EP3847466A1 (de) | 2021-07-14 |
KR20210055708A (ko) | 2021-05-17 |
CN112585485A (zh) | 2021-03-30 |
DE102018121911A1 (de) | 2020-03-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4733959B2 (ja) | プローブ接触方法及び荷電粒子線装置 | |
US4934064A (en) | Alignment method in a wafer prober | |
JP2016072455A (ja) | 位置精度検査方法、位置精度検査装置及び位置検査ユニット | |
US11054465B2 (en) | Method of operating a probing apparatus | |
TW202247222A (zh) | 帶電粒子束系統及非暫時性電腦可讀媒體 | |
JP2015102478A (ja) | 検査装置、及び検査方法 | |
JP2008166806A (ja) | プロービング装置で焦点を合わせて多平面画像を取得する装置と方法 | |
JP2005167146A (ja) | プローブ付き複合顕微鏡、並びにプローブの高さ算出方法及びプローブ駆動方法 | |
TW202027227A (zh) | 將測試基板、探針及檢查單元相對於彼此定位之方法以及執行此方法的探測器 | |
JP3173676B2 (ja) | プローブ装置 | |
JP2012078330A (ja) | レンズ検査機のカメラユニット移動調整方法及びフォーカスチェック治具 | |
JP3248136B1 (ja) | プローブ方法及びプローブ装置 | |
TWI832284B (zh) | 探針裝置 | |
JP2002057196A (ja) | プローブ方法及びプローブ装置 | |
JP2001515594A (ja) | 裏面放出型顕微鏡検査を用いた探測 | |
JP2003294419A (ja) | 微小寸法測定装置 | |
JP4867219B2 (ja) | 検査装置及び検査装置の位置決め方法 | |
JP2005268486A (ja) | マーキング方法及びマーキング装置並びに検査装置 | |
KR101751801B1 (ko) | 기판 결함 검사 장치 및 이를 이용한 검사 방법 | |
JPH10339710A (ja) | 試料中心を検出できる蛍光x線分析装置 | |
KR20070116514A (ko) | 평판표시소자의 프로브 검사장치 및 이를 이용한 프로브검사방법 | |
JP5004454B2 (ja) | プローバ及びプローバにおける回転・移動制御方法 | |
CN113092895A (zh) | 一种自动测试方法及自动测试设备 | |
JPH02163601A (ja) | 走査型トンネル顕微鏡 | |
KR20200052027A (ko) | 프로브 스테이션 |