TW202027227A - 將測試基板、探針及檢查單元相對於彼此定位之方法以及執行此方法的探測器 - Google Patents

將測試基板、探針及檢查單元相對於彼此定位之方法以及執行此方法的探測器 Download PDF

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Publication number
TW202027227A
TW202027227A TW108131957A TW108131957A TW202027227A TW 202027227 A TW202027227 A TW 202027227A TW 108131957 A TW108131957 A TW 108131957A TW 108131957 A TW108131957 A TW 108131957A TW 202027227 A TW202027227 A TW 202027227A
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TW
Taiwan
Prior art keywords
movement
test substrate
inspection unit
unit
manipulator
Prior art date
Application number
TW108131957A
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English (en)
Chinese (zh)
Inventor
安東尼 詹姆士 洛德
彼得 安卓斯
法蘭克 提勒
顏斯 克拉坦霍夫
加文 費雪
勞夫 凱勒
彼得 許奈德
因瑞科 赫爾茨
漢斯 尤根 弗萊薛爾
優格 奇斯威特
Original Assignee
德商佛姆費克特有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德商佛姆費克特有限公司 filed Critical 德商佛姆費克特有限公司
Publication of TW202027227A publication Critical patent/TW202027227A/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
TW108131957A 2018-09-07 2019-09-04 將測試基板、探針及檢查單元相對於彼此定位之方法以及執行此方法的探測器 TW202027227A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018121911.3A DE102018121911A1 (de) 2018-09-07 2018-09-07 Verfahren zur Positionierung von Testsubstrat, Sonden und Inspektionseinheit relativ zueinander und Prober zu dessen Ausführung
DE102018121911.3 2018-09-07

Publications (1)

Publication Number Publication Date
TW202027227A true TW202027227A (zh) 2020-07-16

Family

ID=68109075

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108131957A TW202027227A (zh) 2018-09-07 2019-09-04 將測試基板、探針及檢查單元相對於彼此定位之方法以及執行此方法的探測器

Country Status (6)

Country Link
EP (1) EP3847466A1 (de)
KR (1) KR20210055708A (de)
CN (1) CN112585485A (de)
DE (1) DE102018121911A1 (de)
TW (1) TW202027227A (de)
WO (1) WO2020048567A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023111575A (ja) * 2022-01-31 2023-08-10 ヤマハファインテック株式会社 電気検査装置及び電気検査方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1211812B (de) * 1963-10-18 1966-03-03 Zeiss Carl Fa Optisches Beobachtungsinstrument, insbesondere Mikroskop, mit Einstrahlphotometer
JP3208734B2 (ja) * 1990-08-20 2001-09-17 東京エレクトロン株式会社 プローブ装置
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
KR100248569B1 (ko) * 1993-12-22 2000-03-15 히가시 데쓰로 프로우브장치
JP3209641B2 (ja) * 1994-06-02 2001-09-17 三菱電機株式会社 光加工装置及び方法
AU2003218348A1 (en) * 2002-03-22 2003-10-13 Electro Scientific Industries, Inc. Test probe alignment apparatus
JP4413130B2 (ja) * 2004-11-29 2010-02-10 Ｏｋｉセミコンダクタ株式会社 プローブカードを用いた半導体素子の検査方法およびその検査方法により検査した半導体装置
US8279451B2 (en) * 2010-06-09 2012-10-02 Star Technologies Inc. Probing apparatus with on-probe device-mapping function
DE102010040242B4 (de) * 2010-09-03 2014-02-13 Cascade Microtech Dresden Gmbh Modularer Prober und Verfahren zu dessen Betrieb
EP3034991B2 (de) * 2014-12-19 2022-08-24 Hexagon Technology Center GmbH Verfahren und Vorrichtung zum aktiven Entgegenwirken gegen Verlagerungskräfte mit einer Tasteinheit

Also Published As

Publication number Publication date
WO2020048567A1 (de) 2020-03-12
EP3847466A1 (de) 2021-07-14
KR20210055708A (ko) 2021-05-17
CN112585485A (zh) 2021-03-30
DE102018121911A1 (de) 2020-03-12

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