CN112585485A - 用于使测试基板、探针和检查单元相对彼此定位的方法以及用于实施该方法的试验机 - Google Patents

用于使测试基板、探针和检查单元相对彼此定位的方法以及用于实施该方法的试验机 Download PDF

Info

Publication number
CN112585485A
CN112585485A CN201980055304.9A CN201980055304A CN112585485A CN 112585485 A CN112585485 A CN 112585485A CN 201980055304 A CN201980055304 A CN 201980055304A CN 112585485 A CN112585485 A CN 112585485A
Authority
CN
China
Prior art keywords
movement
inspection unit
test substrate
chuck
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980055304.9A
Other languages
English (en)
Chinese (zh)
Inventor
A·J·洛德
P·D·安德鲁斯
F·蒂勒
J·克莱特霍夫
G·费希尔
R·克勒尔
P·施耐德
E·赫茨
H-J·弗莱舍尔
J·基塞韦特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fomfektor Co ltd
FormFactor GmbH
Original Assignee
Fomfektor Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fomfektor Co ltd filed Critical Fomfektor Co ltd
Publication of CN112585485A publication Critical patent/CN112585485A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
CN201980055304.9A 2018-09-07 2019-09-04 用于使测试基板、探针和检查单元相对彼此定位的方法以及用于实施该方法的试验机 Pending CN112585485A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018121911.3A DE102018121911A1 (de) 2018-09-07 2018-09-07 Verfahren zur Positionierung von Testsubstrat, Sonden und Inspektionseinheit relativ zueinander und Prober zu dessen Ausführung
DE102018121911.3 2018-09-07
PCT/DE2019/100794 WO2020048567A1 (de) 2018-09-07 2019-09-04 Verfahren zur positionierung von testsubstrat, sonden und inspektionseinheit relativ zueinander und prober zu dessen ausführung

Publications (1)

Publication Number Publication Date
CN112585485A true CN112585485A (zh) 2021-03-30

Family

ID=68109075

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980055304.9A Pending CN112585485A (zh) 2018-09-07 2019-09-04 用于使测试基板、探针和检查单元相对彼此定位的方法以及用于实施该方法的试验机

Country Status (6)

Country Link
EP (1) EP3847466A1 (de)
KR (1) KR20210055708A (de)
CN (1) CN112585485A (de)
DE (1) DE102018121911A1 (de)
TW (1) TW202027227A (de)
WO (1) WO2020048567A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI835495B (zh) * 2022-01-31 2024-03-11 日商山葉汎提克股份有限公司 電性檢查裝置及電性檢查方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3285127A (en) * 1963-10-18 1966-11-15 Zeiss Stiftung Magnetically attached microscope accessory for supporting comparison objects
US5436571A (en) * 1990-08-20 1995-07-25 Tokyo Electron Limited Probing test method of contacting a plurality of probes of a probe card with pads on a chip on a semiconductor wafer
CN1119975A (zh) * 1994-06-02 1996-04-10 三菱电机株式会社 光学处理方法及其实施装置
US5642056A (en) * 1993-12-22 1997-06-24 Tokyo Electron Limited Probe apparatus for correcting the probe card posture before testing
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
CN1639577A (zh) * 2002-03-22 2005-07-13 电子科学工业公司 测试探针对准设备
CN1782716A (zh) * 2004-11-29 2006-06-07 冲电气工业株式会社 探针板、使用其的检查方法及由该方法检查的半导体装置
CN102278941A (zh) * 2010-06-09 2011-12-14 思达科技股份有限公司 测试装置
US20140145743A1 (en) * 2010-09-03 2014-05-29 Cascade Micotech, Inc. Modular prober and method for operating same
CN105716559A (zh) * 2014-12-19 2016-06-29 赫克斯冈技术中心 坐标测量机、探测***以及补偿探针元件处的力的方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3285127A (en) * 1963-10-18 1966-11-15 Zeiss Stiftung Magnetically attached microscope accessory for supporting comparison objects
US5436571A (en) * 1990-08-20 1995-07-25 Tokyo Electron Limited Probing test method of contacting a plurality of probes of a probe card with pads on a chip on a semiconductor wafer
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
US5642056A (en) * 1993-12-22 1997-06-24 Tokyo Electron Limited Probe apparatus for correcting the probe card posture before testing
CN1119975A (zh) * 1994-06-02 1996-04-10 三菱电机株式会社 光学处理方法及其实施装置
CN1639577A (zh) * 2002-03-22 2005-07-13 电子科学工业公司 测试探针对准设备
CN1782716A (zh) * 2004-11-29 2006-06-07 冲电气工业株式会社 探针板、使用其的检查方法及由该方法检查的半导体装置
CN102278941A (zh) * 2010-06-09 2011-12-14 思达科技股份有限公司 测试装置
US20140145743A1 (en) * 2010-09-03 2014-05-29 Cascade Micotech, Inc. Modular prober and method for operating same
CN105716559A (zh) * 2014-12-19 2016-06-29 赫克斯冈技术中心 坐标测量机、探测***以及补偿探针元件处的力的方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI835495B (zh) * 2022-01-31 2024-03-11 日商山葉汎提克股份有限公司 電性檢查裝置及電性檢查方法

Also Published As

Publication number Publication date
WO2020048567A1 (de) 2020-03-12
EP3847466A1 (de) 2021-07-14
KR20210055708A (ko) 2021-05-17
TW202027227A (zh) 2020-07-16
DE102018121911A1 (de) 2020-03-12

Similar Documents

Publication Publication Date Title
TW201712346A (zh) 用於測試電路板之平行測試器的定位裝置及用於測試電路板的平行測試器
JP5613333B2 (ja) モジュール式プローバおよびこのプローバの運転方法
CN110211893A (zh) 一种晶圆测试***及晶圆测试方法
US9134343B2 (en) Sort probe gripper
US9110131B2 (en) Method and device for contacting a row of contact areas with probe tips
JP4130798B2 (ja) プローブ付き複合顕微鏡及びプローブ駆動方法
KR20190029697A (ko) 본딩 정렬을 위한 디바이스 및 방법
JP2000055971A (ja) 基板検査装置及び基板検査装置における基板と検査ヘッドとの相対位置調整方法
CN112585485A (zh) 用于使测试基板、探针和检查单元相对彼此定位的方法以及用于实施该方法的试验机
US20070001707A1 (en) Method and apparatus for electrical testing of a unit under test, as well as a method for production of a contact-making apparatus which is used for testing
CN111443320A (zh) 探针自我校正***及其方法
US11199509B2 (en) Inspection apparatus and inspection method
US10753725B2 (en) Measuring apparatus and method for controlling the illumination for a measuring apparatus
JP2012503189A (ja) 所定の温度条件下で繰り返しパターンの複数の電子部品を検査する方法
EP0692928A1 (de) Programierbare Vorbehandlungsvorrichtung für Anschlüsse
TWI735144B (zh) 具有物鏡組件碰撞偵測的顯微鏡及其使用之方法
CN102927911A (zh) 刀具测量***
CN107102249B (zh) 一种飞针测试机测试轴的自动避让方法
EP0309109B1 (de) Testmethode für elektronische Schaltungen
JP3902747B2 (ja) プローブ装置
CN111562413A (zh) 检测方法及检测***
CN109663861A (zh) 传感器引脚套筒铆压装置
JP2002365334A (ja) 微細作業用マイクロマニピュレーション装置
JP2932464B2 (ja) 半導体チップマーキング装置のマーキング位置決め方法
CN211826169U (zh) 电极探针连接装置和***

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination