CN112585485A - 用于使测试基板、探针和检查单元相对彼此定位的方法以及用于实施该方法的试验机 - Google Patents
用于使测试基板、探针和检查单元相对彼此定位的方法以及用于实施该方法的试验机 Download PDFInfo
- Publication number
- CN112585485A CN112585485A CN201980055304.9A CN201980055304A CN112585485A CN 112585485 A CN112585485 A CN 112585485A CN 201980055304 A CN201980055304 A CN 201980055304A CN 112585485 A CN112585485 A CN 112585485A
- Authority
- CN
- China
- Prior art keywords
- movement
- inspection unit
- test substrate
- chuck
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 103
- 238000007689 inspection Methods 0.000 title claims abstract description 71
- 239000000758 substrate Substances 0.000 title claims abstract description 69
- 239000000523 sample Substances 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 28
- 230000033001 locomotion Effects 0.000 claims description 150
- 238000005516 engineering process Methods 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 5
- 238000011065 in-situ storage Methods 0.000 claims description 2
- 230000000670 limiting effect Effects 0.000 claims description 2
- 238000000691 measurement method Methods 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims 1
- 230000001133 acceleration Effects 0.000 abstract 1
- 230000001360 synchronised effect Effects 0.000 description 11
- 230000008569 process Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000001960 triggered effect Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018121911.3A DE102018121911A1 (de) | 2018-09-07 | 2018-09-07 | Verfahren zur Positionierung von Testsubstrat, Sonden und Inspektionseinheit relativ zueinander und Prober zu dessen Ausführung |
DE102018121911.3 | 2018-09-07 | ||
PCT/DE2019/100794 WO2020048567A1 (de) | 2018-09-07 | 2019-09-04 | Verfahren zur positionierung von testsubstrat, sonden und inspektionseinheit relativ zueinander und prober zu dessen ausführung |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112585485A true CN112585485A (zh) | 2021-03-30 |
Family
ID=68109075
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201980055304.9A Pending CN112585485A (zh) | 2018-09-07 | 2019-09-04 | 用于使测试基板、探针和检查单元相对彼此定位的方法以及用于实施该方法的试验机 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3847466A1 (de) |
KR (1) | KR20210055708A (de) |
CN (1) | CN112585485A (de) |
DE (1) | DE102018121911A1 (de) |
TW (1) | TW202027227A (de) |
WO (1) | WO2020048567A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI835495B (zh) * | 2022-01-31 | 2024-03-11 | 日商山葉汎提克股份有限公司 | 電性檢查裝置及電性檢查方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3285127A (en) * | 1963-10-18 | 1966-11-15 | Zeiss Stiftung | Magnetically attached microscope accessory for supporting comparison objects |
US5436571A (en) * | 1990-08-20 | 1995-07-25 | Tokyo Electron Limited | Probing test method of contacting a plurality of probes of a probe card with pads on a chip on a semiconductor wafer |
CN1119975A (zh) * | 1994-06-02 | 1996-04-10 | 三菱电机株式会社 | 光学处理方法及其实施装置 |
US5642056A (en) * | 1993-12-22 | 1997-06-24 | Tokyo Electron Limited | Probe apparatus for correcting the probe card posture before testing |
US5644245A (en) * | 1993-11-24 | 1997-07-01 | Tokyo Electron Limited | Probe apparatus for inspecting electrical characteristics of a microelectronic element |
CN1639577A (zh) * | 2002-03-22 | 2005-07-13 | 电子科学工业公司 | 测试探针对准设备 |
CN1782716A (zh) * | 2004-11-29 | 2006-06-07 | 冲电气工业株式会社 | 探针板、使用其的检查方法及由该方法检查的半导体装置 |
CN102278941A (zh) * | 2010-06-09 | 2011-12-14 | 思达科技股份有限公司 | 测试装置 |
US20140145743A1 (en) * | 2010-09-03 | 2014-05-29 | Cascade Micotech, Inc. | Modular prober and method for operating same |
CN105716559A (zh) * | 2014-12-19 | 2016-06-29 | 赫克斯冈技术中心 | 坐标测量机、探测***以及补偿探针元件处的力的方法 |
-
2018
- 2018-09-07 DE DE102018121911.3A patent/DE102018121911A1/de active Pending
-
2019
- 2019-09-04 EP EP19780142.6A patent/EP3847466A1/de active Pending
- 2019-09-04 KR KR1020217007863A patent/KR20210055708A/ko not_active Application Discontinuation
- 2019-09-04 TW TW108131957A patent/TW202027227A/zh unknown
- 2019-09-04 CN CN201980055304.9A patent/CN112585485A/zh active Pending
- 2019-09-04 WO PCT/DE2019/100794 patent/WO2020048567A1/de unknown
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3285127A (en) * | 1963-10-18 | 1966-11-15 | Zeiss Stiftung | Magnetically attached microscope accessory for supporting comparison objects |
US5436571A (en) * | 1990-08-20 | 1995-07-25 | Tokyo Electron Limited | Probing test method of contacting a plurality of probes of a probe card with pads on a chip on a semiconductor wafer |
US5644245A (en) * | 1993-11-24 | 1997-07-01 | Tokyo Electron Limited | Probe apparatus for inspecting electrical characteristics of a microelectronic element |
US5642056A (en) * | 1993-12-22 | 1997-06-24 | Tokyo Electron Limited | Probe apparatus for correcting the probe card posture before testing |
CN1119975A (zh) * | 1994-06-02 | 1996-04-10 | 三菱电机株式会社 | 光学处理方法及其实施装置 |
CN1639577A (zh) * | 2002-03-22 | 2005-07-13 | 电子科学工业公司 | 测试探针对准设备 |
CN1782716A (zh) * | 2004-11-29 | 2006-06-07 | 冲电气工业株式会社 | 探针板、使用其的检查方法及由该方法检查的半导体装置 |
CN102278941A (zh) * | 2010-06-09 | 2011-12-14 | 思达科技股份有限公司 | 测试装置 |
US20140145743A1 (en) * | 2010-09-03 | 2014-05-29 | Cascade Micotech, Inc. | Modular prober and method for operating same |
CN105716559A (zh) * | 2014-12-19 | 2016-06-29 | 赫克斯冈技术中心 | 坐标测量机、探测***以及补偿探针元件处的力的方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI835495B (zh) * | 2022-01-31 | 2024-03-11 | 日商山葉汎提克股份有限公司 | 電性檢查裝置及電性檢查方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2020048567A1 (de) | 2020-03-12 |
EP3847466A1 (de) | 2021-07-14 |
KR20210055708A (ko) | 2021-05-17 |
TW202027227A (zh) | 2020-07-16 |
DE102018121911A1 (de) | 2020-03-12 |
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