TW201916998A - Resin molded product manufacturing apparatus and manufacturing method, resin molding system - Google Patents
Resin molded product manufacturing apparatus and manufacturing method, resin molding system Download PDFInfo
- Publication number
- TW201916998A TW201916998A TW107137653A TW107137653A TW201916998A TW 201916998 A TW201916998 A TW 201916998A TW 107137653 A TW107137653 A TW 107137653A TW 107137653 A TW107137653 A TW 107137653A TW 201916998 A TW201916998 A TW 201916998A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin molded
- pressure plate
- molded article
- mold
- platen
- Prior art date
Links
- 239000011347 resin Substances 0.000 title claims abstract description 188
- 229920005989 resin Polymers 0.000 title claims abstract description 188
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 91
- 238000000465 moulding Methods 0.000 title claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 8
- 238000012986 modification Methods 0.000 description 23
- 230000004048 modification Effects 0.000 description 23
- 238000003860 storage Methods 0.000 description 12
- 230000007246 mechanism Effects 0.000 description 11
- 238000007789 sealing Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 8
- 230000007723 transport mechanism Effects 0.000 description 8
- 238000009826 distribution Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002594 fluoroscopy Methods 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
- B29C45/66—Mould opening, closing or clamping devices mechanical
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
本發明是有關於一種樹脂成形品的製造裝置、樹脂成形系統以及樹脂成形品的製造方法。The present invention relates to a device for producing a resin molded article, a resin molding system, and a method for producing a resin molded article.
例如，在日本專利特開平11-74297號公報（專利文獻1）中揭示了使用帶加熱器的壓板（platen）對層壓有熱塑性塑料片（plastic sheet）的電子裝置（device）的已封裝的引線框架（lead frame）進行加壓及加熱，藉此來進行電子裝置的密封的樹脂成形裝置以及樹脂成形品的製造方法。For example, in Japanese Laid-Open Patent Publication No. Hei 11-74297 (Patent Document 1), the use of a platen with a heater for a packaged electronic device laminated with a thermoplastic sheet is disclosed. A resin molding apparatus for sealing an electronic device and a method of manufacturing a resin molded article by pressurizing and heating a lead frame.
專利文獻1所記載的樹脂成形裝置是以不使用金屬模具等成形用的模具為前提，所以關於使用用以對模具進行保持的模具支架，未進行記載及提示。然而，在使用模具進行樹脂成形的樹脂成形裝置中，有時會將用以保持模具的模具支架安裝於壓板。將模具支架安裝於壓板，以對模具進行保持，並且利用模具支架所配備的加熱器對模具進行加熱。The resin molding apparatus described in Patent Document 1 is based on the assumption that a mold for molding such as a metal mold is not used. Therefore, the mold holder for holding the mold is not described and presented. However, in a resin molding apparatus that performs resin molding using a mold, a mold holder for holding a mold is sometimes attached to a pressure plate. The mold holder is mounted to the pressure plate to hold the mold, and the mold is heated by the heater provided with the mold holder.
在模具加熱時熱從模具支架傳導至壓板的情況下，有時壓板因構成壓板的零件的熱膨脹而變形。因此，模具支架在加熱器的壓板側配備有隔熱構件以免熱傳導至壓板。In the case where heat is transferred from the mold holder to the pressure plate while the mold is being heated, the pressure plate may be deformed by thermal expansion of the parts constituting the pressure plate. Therefore, the mold holder is equipped with a heat insulating member on the pressure plate side of the heater to prevent heat from being conducted to the pressure plate.
然而，本發明人積極研究的結果，發現：即使利用模具支架的隔熱構件，也無法完全防止熱從加熱板向壓板的傳導，從而壓板因傳導至壓板的熱而變形，並且追隨壓板的變形，模具支架也變形。However, as a result of active research by the present inventors, it has been found that even with the heat insulating member of the mold holder, the conduction of heat from the heating plate to the pressure plate cannot be completely prevented, so that the pressure plate is deformed by heat transmitted to the pressure plate, and follows the deformation of the pressure plate. The mold holder is also deformed.
在利用安裝在變形了的模具支架上的模具進行樹脂形成的情況下，有時樹脂成形品的厚度的偏差變大而成為劣質品。When the resin is formed by a mold attached to a deformed mold holder, variations in the thickness of the resin molded article may become large and may become inferior products.
根據本文中揭示的實施方式，可提供一種樹脂成形品的製造裝置，其包括：第1壓板；第1模具支架，設於第1壓板，以對第1模具進行保持的方式構成；以及第2壓板，以與第1壓板相向的方式與第1壓板空開間隔而配置，第1模具支架在第1壓板側包括第1隔熱構件，並且在第2壓板側包括以對第1模具進行加熱的方式構成的第1模具支架加熱器，第1壓板包括以對第1壓板進行加熱的方式構成的第1壓板加熱器。According to the embodiment disclosed herein, there is provided a manufacturing apparatus of a resin molded article, comprising: a first pressure plate; the first mold holder is provided on the first pressure plate, and is configured to hold the first mold; and the second The pressure plate is disposed to be spaced apart from the first pressure plate so as to face the first pressure plate. The first mold holder includes a first heat insulating member on the first pressure plate side and includes heating the first mold on the second pressure plate side. In the first mold holder heater configured as described above, the first pressure plate includes a first platen heater configured to heat the first pressure plate.
根據本文中揭示的實施方式，可提供一種包括所述樹脂成形品的製造裝置的樹脂成形系統。According to the embodiment disclosed herein, a resin forming system including a manufacturing apparatus of the resin molded article can be provided.
根據本文中揭示的實施方式，可提供一種樹脂成形品的製造方法，其使用所述的樹脂成形品的製造裝置，並且包括：對第1模具設置支撐構件的步驟；對第2模具的模腔供給樹脂材料的步驟；對支撐構件進行加熱的步驟；對樹脂材料進行加熱的步驟；以及進行第1模具與第2模具的合模的步驟，還包括利用第1壓板加熱器對第1壓板進行加熱的步驟。According to the embodiment disclosed herein, there can be provided a method of producing a resin molded article using the above-described apparatus for manufacturing a resin molded article, and comprising: a step of providing a support member to the first mold; and a cavity for the second mold a step of supplying a resin material; a step of heating the support member; a step of heating the resin material; and a step of clamping the first mold and the second mold, and further comprising: performing the first platen by the first platen heater The step of heating.
本發明的所述及其他目的、特徵、局面及優點將根據與隨附的圖式相關聯來理解的關於本發明的以下的詳細說明而變得明確。The above and other objects, features, aspects and advantages of the present invention will become apparent from the accompanying claims
以下，對實施方式進行說明。另外，在用於實施方式的說明的圖式中，同一個參照符號表示同一部分或相當部分。Hereinafter, an embodiment will be described. In addition, in the drawings for the description of the embodiments, the same reference numerals indicate the same or equivalent parts.
圖1表示實施方式的樹脂成形品的製造裝置的示意性的正視圖。實施方式的樹脂成形品的製造裝置1包括第1壓板11、第2壓板12、及第3壓板13。第3壓板13的兩端分別固定有從第3壓板13起朝鉛垂上方延伸的型壓框架（pressed frame）17的其中一端，第1壓板11的兩端分別固定有型壓框架17的另一端。另外，第1壓板11與第3壓板13及型壓框架17例如也可以是作為鑄件而一體形成者。Fig. 1 is a schematic front view showing an apparatus for manufacturing a resin molded article according to an embodiment. The apparatus 1 for manufacturing a resin molded article according to the embodiment includes a first pressure plate 11 , a second pressure plate 12 , and a third pressure plate 13 . One end of a press frame 17 extending vertically upward from the third pressure plate 13 is fixed to both ends of the third pressure plate 13, and the other ends of the first pressure plate 11 are respectively fixed with a press frame 17 One end. Further, the first pressure plate 11 , the third pressure plate 13 , and the press frame 17 may be integrally formed as a casting, for example.
在第1壓板11與第3壓板13之間，以第2壓板12能夠朝鉛垂上方及鉛垂下方移動的方式安裝有型壓框架17。在第3壓板13的型壓框架17之間的區域設置有以使第2壓板12能夠朝鉛垂上方及鉛垂下方移動的方式構成的驅動機構16。另外，在本實施方式中，第1壓板11受到了固定，所以第2壓板12能夠相對於第1壓板11進行相對移動。Between the first pressure plate 11 and the third pressure plate 13, the pressure frame 17 is attached so that the second pressure plate 12 can move vertically upward and downward. In the region between the press frames 17 of the third pressure plate 13, a drive mechanism 16 configured to move the second pressure plate 12 vertically upward and vertically downward is provided. Further, in the present embodiment, since the first pressure plate 11 is fixed, the second pressure plate 12 can relatively move relative to the first pressure plate 11.
在第1壓板11的鉛垂下方側安裝有以對第1模具（未圖示）進行保持的方式構成的第1模具支架14。在第2壓板12的鉛垂上方側安裝有以對第2模具（未圖示）進行保持的方式構成的第2模具支架15。在第1壓板11中內置有以對第1壓板11進行加熱的方式構成的第1壓板加熱器18。在第2壓板12中內置有以對第2壓板12進行加熱的方式構成的第2壓板加熱器19。在本實施方式中，第1壓板加熱器18及第2壓板加熱器19在圖1的紙面的法線方向上延伸。而且，在本實施方式中，第2壓板加熱器19比第1壓板加熱器18更靠外側，但第2壓板加熱器19也可以位於與第1壓板加熱器18相向的位置或與第1壓板加熱器18相向的位置的內側。另外，第2壓板加熱器19與第1壓板加熱器18相向的位置，只要成為如下構成即可：在假定從第3壓板13的底面沿第3壓板13的底面的法線方向對樹脂成形品的製造裝置1的內部進行透視時，第2壓板加熱器19的至少一部分與第1壓板加熱器18的至少一部分重複。A first mold holder 14 configured to hold a first mold (not shown) is attached to the vertically lower side of the first pressure plate 11 . A second mold holder 15 configured to hold a second mold (not shown) is attached to the vertically upper side of the second pressure plate 12 . The first platen heater 18 configured to heat the first platen 11 is incorporated in the first pressure plate 11 . The second platen heater 19 configured to heat the second platen 12 is incorporated in the second pressure plate 12. In the present embodiment, the first platen heater 18 and the second platen heater 19 extend in the normal direction of the paper surface of Fig. 1 . Further, in the present embodiment, the second platen heater 19 is located outside the first platen heater 18, but the second platen heater 19 may be located at a position facing the first platen heater 18 or with the first platen. The inside of the position where the heaters 18 face each other. In addition, the position of the second platen heater 19 and the first platen heater 18 may be such that the resin molded article is assumed to be in the normal direction from the bottom surface of the third platen 13 along the bottom surface of the third platen 13 When the inside of the manufacturing apparatus 1 is fluoroscopy, at least a part of the second platen heater 19 is overlapped with at least a part of the first platen heater 18.
圖2表示圖1中所示的第1模具支架14及第2模具支架15的示意性的立體圖。第1模具支架14在第1壓板11側包括第1隔熱構件22，並且在第2壓板12側的第1加熱板23中包括以對第1模具（未圖示）進行加熱的方式構成的第1模具支架加熱器25。而且，第1模具支架14在比第1隔熱構件22更靠近第1壓板11側包括第1板21，並且包括從第1加熱板23的邊緣朝鉛垂下方延伸的第1側壁24。在本實施方式中，第1加熱板23內置有彼此空開間隔在水平方向上延伸的四根第1模具支架加熱器25。FIG. 2 is a schematic perspective view showing the first mold holder 14 and the second mold holder 15 shown in FIG. 1 . The first mold holder 14 includes the first heat insulating member 22 on the first pressure plate 11 side, and the first heating plate 23 on the second pressure plate 12 side includes a first mold (not shown). The first mold holder heater 25 is provided. Further, the first die holder 14 includes the first plate 21 on the side closer to the first pressure plate 11 than the first heat insulating member 22, and includes a first side wall 24 that extends vertically downward from the edge of the first heating plate 23. In the present embodiment, the first heating plate 23 has four first mold holder heaters 25 that extend in the horizontal direction at intervals.
第2模具支架15在第2壓板12側包括第2隔熱構件32，並且在第1壓板11側的第2加熱板33中包括以對第2模具（未圖示）進行加熱的方式構成的第2模具支架加熱器35。而且，第2模具支架15在比第2隔熱構件32更靠近第2壓板12側包括第2板31，並且包括從第2隔熱構件32的邊緣朝鉛垂上方延伸的第2側壁34。在本實施方式中，第2加熱板33內置有彼此空開間隔在水平方向上延伸的四根第2模具支架加熱器35。The second mold holder 15 includes the second heat insulating member 32 on the second pressure plate 12 side, and the second heating plate 33 on the first pressure plate 11 side includes a second mold (not shown). The second mold holder heater 35. Further, the second mold holder 15 includes the second plate 31 on the side closer to the second pressure plate 12 than the second heat insulating member 32, and includes a second side wall 34 that extends vertically upward from the edge of the second heat insulating member 32. In the present embodiment, the second heating plate 33 has four second mold holder heaters 35 that extend in the horizontal direction at intervals.
以下，參照圖3～圖11對使用實施方式的樹脂成形品的製造裝置1來製造樹脂成形品的方法的一例即實施方式的樹脂成形品的製造方法進行說明。首先，如圖3的示意性的剖面圖所示，將第1模具41固定在第1模具支架14的第1加熱板23上，並且將第2模具42固定在第2模具支架15的第2加熱板33上。在第2模具42的第1模具41側設置有模腔43。In the following, a method of manufacturing a resin molded article which is an example of a method of producing a resin molded article using the apparatus 1 for producing a resin molded article of the embodiment will be described with reference to FIG. 3 to FIG. First, as shown in the schematic cross-sectional view of FIG. 3, the first mold 41 is fixed to the first heating plate 23 of the first mold holder 14, and the second mold 42 is fixed to the second mold holder 15. On the heating plate 33. A cavity 43 is provided on the first mold 41 side of the second mold 42.
繼而，如圖4的示意性剖面圖所示，以覆蓋第2模具42的模腔43的方式設置脫模膜52。繼而，將由脫模膜52覆蓋的模腔43內的空間抽成真空，藉此如圖5的示意性剖面圖所示，使脫模膜52密接在構成模腔43的第2模具42的表面上。Then, as shown in the schematic cross-sectional view of FIG. 4, the release film 52 is provided so as to cover the cavity 43 of the second mold 42. Then, the space in the cavity 43 covered by the release film 52 is evacuated, whereby the release film 52 is adhered to the surface of the second mold 42 constituting the cavity 43 as shown in the schematic sectional view of Fig. 5 . on.
繼而，從圖6的示意性平面圖中所示的實施方式的樹脂成形系統1000的供給模塊1001的支撐構件供給裝置201，將成為樹脂成形的成形對象物的支撐構件51供給至搬送機構301的上側。Then, the support member supply device 201 of the supply module 1001 of the resin molding system 1000 of the embodiment shown in the schematic plan view of FIG. 6 supplies the support member 51 which is a molded object of resin molding to the upper side of the conveyance mechanism 301. .
支撐構件51例如可包含：可支撐半導體芯片、芯片狀電子零件、或膜（包含導電性膜、絕緣性膜、半導體膜）等的例如引線框架、基底、內插器（interposer）、半導體基板（矽晶片等）、金屬基板、玻璃基板、陶瓷基板、樹脂基板、及配線基板等。而且，支撐構件51的形狀並無特別限定，支撐構件51的表面形狀例如可以是圓形，也可以是四邊形。而且，支撐構件51可以包含配線，也可以不包含配線。而且，支撐構件51也可以包含扇出型晶片級封裝（Fan Out Wafer Level Package，FO-WLP）或扇出型面板級封裝（Fan Out Panel Level Package，FO-PLP）中所使用的板狀構件的載體。The support member 51 may include, for example, a lead frame, a substrate, an interposer, or a semiconductor substrate that can support a semiconductor chip, a chip-shaped electronic component, or a film (including a conductive film, an insulating film, a semiconductor film) or the like ( A germanium wafer, etc.), a metal substrate, a glass substrate, a ceramic substrate, a resin substrate, a wiring board, and the like. Further, the shape of the support member 51 is not particularly limited, and the surface shape of the support member 51 may be, for example, a circular shape or a quadrangular shape. Further, the support member 51 may or may not include wiring. Moreover, the support member 51 may also include a plate-shaped member used in a fan-out wafer level package (FO-WLP) or a fan-out panel level package (FO-PLP). Carrier.
繼而，供給有支撐構件51的搬送機構301沿著設置在供給模塊1001中的縱向移動導軌401進行移動，而到達樹脂材料供給裝置202中。Then, the transport mechanism 301 to which the support member 51 is supplied is moved along the longitudinal movement guide 401 provided in the supply module 1001 to reach the resin material supply device 202.
繼而，樹脂材料供給裝置202將樹脂材料61供給至搬送機構301的下側，以使搬送機構301在搬送機構301的下側保持固體的樹脂材料61。因此，在此階段，搬送機構301在上側保持支撐構件51，並且在下側保持樹脂材料61。Then, the resin material supply device 202 supplies the resin material 61 to the lower side of the transport mechanism 301 so that the transport mechanism 301 holds the solid resin material 61 on the lower side of the transport mechanism 301. Therefore, at this stage, the conveying mechanism 301 holds the support member 51 on the upper side and holds the resin material 61 on the lower side.
繼而，搬送機構301以在上側保持支撐構件51，並且在下側保持樹脂材料61的狀態，沿著橫向移動導軌402進行橫向移動，而到達實施方式的樹脂成形系統1000的樹脂密封模塊1002中。已到達樹脂密封模塊1002中的搬送機構301沿著縱向移動導軌403進行縱向移動，而到達實施方式的樹脂成形品的製造裝置1中。另外，在圖6中記載有四個樹脂密封模塊1002，但並不限定於此，樹脂密封模塊1002的數量可增減。Then, the conveyance mechanism 301 is moved to the resin sealing module 1002 of the resin molding system 1000 of the embodiment in a state where the support member 51 is held on the upper side and the resin material 61 is held on the lower side, and is moved laterally along the lateral movement guide 402. The conveying mechanism 301 that has reached the resin sealing module 1002 is longitudinally moved along the longitudinal moving rail 403, and reaches the manufacturing apparatus 1 of the resin molded article of the embodiment. Further, although four resin sealing modules 1002 are described in FIG. 6, the present invention is not limited thereto, and the number of the resin sealing modules 1002 may be increased or decreased.
繼而，如圖7的示意性剖面圖所示，從搬送機構301將支撐構件51設置在第1模具41上，並且從搬送機構301將樹脂材料61供給至密接在第2模具42上的脫模膜52上。另外，在本實施方式中，使用包括半導體基板51a與半導體基板51a上的半導體芯片51b的支撐構件51。Then, as shown in the schematic cross-sectional view of FIG. 7, the support member 51 is placed on the first mold 41 from the transport mechanism 301, and the resin material 61 is supplied from the transport mechanism 301 to the release mold adhered to the second mold 42. On the membrane 52. Further, in the present embodiment, the support member 51 including the semiconductor substrate 51a and the semiconductor chip 51b on the semiconductor substrate 51a is used.
繼而，通過第1加熱板23的第1模具支架加熱器25來對第1模具41進行加熱，並且通過第2加熱板33的第2模具支架加熱器35來對第2模具42進行加熱。此時，通過第1壓板加熱器18來對第1壓板11進行加熱。另外，樹脂材料61因第2模具支架加熱器35對於第2模具42的加熱而熔融，如圖8的示意性剖面圖所示製作流動性樹脂71。Then, the first mold 41 is heated by the first mold holder heater 25 of the first heating plate 23, and the second mold 42 is heated by the second mold holder heater 35 of the second heating plate 33. At this time, the first platen 11 is heated by the first platen heater 18. In addition, the resin material 61 is melted by the heating of the second die 42 by the second die holder heater 35, and the fluid resin 71 is produced as shown in the schematic cross-sectional view of FIG.
繼而，如圖9的示意性正視圖所示，使第2壓板12朝鉛垂上方移動，藉此進行第1模具41與第2模具42的合模。此時，如圖10的示意性剖面圖所示，流動性樹脂71接觸支撐構件51的表面。Then, as shown in the schematic front view of FIG. 9, the second press plate 12 is moved vertically upward, thereby clamping the first mold 41 and the second mold 42. At this time, as shown in the schematic cross-sectional view of FIG. 10, the fluid resin 71 contacts the surface of the support member 51.
繼而，使流動性樹脂71硬化後使第2壓板12朝鉛垂下方移動。藉此，如圖11的示意性剖面圖所示，製造支撐構件51的表面由硬化樹脂81密封的樹脂成形品82。Then, the fluid resin 71 is cured, and then the second pressure plate 12 is moved vertically downward. Thereby, as shown in the schematic cross-sectional view of FIG. 11, the resin molded article 82 whose surface of the support member 51 is sealed by the hardening resin 81 is manufactured.
如所述製造的樹脂成形品82通過圖6中所示的搬送機構301而從樹脂成形品的製造裝置1中搬出。然後，保持有樹脂成形品82的搬送機構301沿著設置在樹脂密封模塊1002中的縱向移動導軌403朝橫向移動導軌402移動。然後，搬送機構301沿著橫向移動導軌402橫向移動至實施方式的樹脂成形系統1000的收納模塊1003為止。已到達收納模塊1003中的搬送機構301沿著設置在收納模塊1003中的縱向移動導軌404朝樹脂成形品收納裝置203移動。其後，樹脂成形品82被從搬送機構301收納至樹脂成形品收納裝置203中。The resin molded product 82 produced as described above is carried out from the resin molded article manufacturing apparatus 1 by the transport mechanism 301 shown in Fig. 6 . Then, the conveyance mechanism 301 holding the resin molded article 82 moves toward the lateral movement guide rail 402 along the longitudinal movement guide rail 403 provided in the resin sealing module 1002. Then, the conveyance mechanism 301 is moved laterally along the lateral movement guide 402 to the storage module 1003 of the resin molding system 1000 of the embodiment. The conveyance mechanism 301 that has reached the storage module 1003 moves toward the resin molded article storage device 203 along the longitudinal movement guide 404 provided in the storage module 1003. Thereafter, the resin molded article 82 is stored in the resin molded article storage device 203 from the transport mechanism 301.
圖12（a）～圖12（c）表示對利用實施方式的樹脂成形品的製造方法製造的樹脂成形品82的厚度的偏差進行測定的結果。圖12（a）示出了對將樹脂成形品82的表面的以a行～c行這三行及A列～E列這五列進行分割而得的15個單獨的區域的厚度的偏差進行測定的結果。(a) to (c) of FIG. 12 show the results of measurement of variations in the thickness of the resin molded article 82 produced by the method for producing a resin molded article of the embodiment. (a) of FIG. 12 shows a variation in thickness of 15 separate regions obtained by dividing five rows of a row to c row and five columns of column A to column E on the surface of the resin molded article 82. The result of the measurement.
圖12（a）所示的數值示出了對15個區域的各者中的樹脂成形品82的厚度進行測定並使其平均值為0時的15個區域的各者中的樹脂成形品82的厚度的增減。在圖12（a）所示的數值為正的情況下，代表只比樹脂成形品82的厚度的平均值厚所顯示的數值大小。而且，在圖12（a）所示的數值為負的情況下，代表只比樹脂成形品82的厚度的平均值薄所顯示的數值大小。The numerical value shown in Fig. 12 (a) shows the resin molded article 82 in each of the 15 regions when the thickness of the resin molded article 82 in each of the 15 regions is measured and the average value is 0. The increase or decrease in thickness. When the numerical value shown in FIG. 12(a) is positive, it represents a magnitude larger than the average value of the thickness of the resin molded article 82. Further, when the numerical value shown in FIG. 12(a) is negative, it represents a numerical value which is displayed only thinner than the average value of the thickness of the resin molded article 82.
圖12（b）示出了圖12（a）所示的數值的最大值及最小值、以及所述最大值與最小值之差。如圖12（b）所示，樹脂成形品82的厚度的最大值為+0.003 mm，樹脂成形品82的厚度的最小值為-0.003 mm。因此，最大值與最小值之差為0.006 mm。Fig. 12(b) shows the maximum value and the minimum value of the numerical values shown in Fig. 12(a), and the difference between the maximum value and the minimum value. As shown in Fig. 12 (b), the maximum value of the thickness of the resin molded article 82 is +0.003 mm, and the minimum value of the thickness of the resin molded article 82 is -0.003 mm. Therefore, the difference between the maximum value and the minimum value is 0.006 mm.
圖12（c）示出了圖12（a）所示的樹脂成形品82的A列～E列這五列的區域中的樹脂成形品82的厚度的變化。如圖12（c）所示，確認到存在樹脂成形品82的中央的C列及兩端的A列及E列的厚度與B列及D列的區域相比變厚的傾向。(c) of FIG. 12 shows a change in the thickness of the resin molded article 82 in the region of the five rows from the A column to the E column of the resin molded article 82 shown in Fig. 12 (a). As shown in FIG. 12( c ), it is confirmed that the thickness of the C column and the both ends of the A column and the E column in the center of the resin molded article 82 tends to be thicker than the regions in the B column and the D column.
圖13（a）～圖13（c）表示對除未配備第1壓板加熱器18而未通過第1壓板加熱器18對第1壓板11進行加熱以外利用實施方式的樹脂成形品的製造方法製造的參考例的樹脂成形品的表面的平坦性進行測定的結果。圖13（a）與圖12（a）對應，圖13（b）與圖12（b）對應，圖13（c）與圖12（c）對應。(a) to (c) of FIG. 13 are produced by the method of manufacturing a resin molded article of the embodiment, except that the first platen heater 18 is not provided, and the first platen heater 18 is not heated by the first platen heater 18; The flatness of the surface of the resin molded article of the reference example was measured. 13(a) corresponds to FIG. 12(a), FIG. 13(b) corresponds to FIG. 12(b), and FIG. 13(c) corresponds to FIG. 12(c).
如圖13（a）及圖13（b）所示，參考例的樹脂成形品的厚度的最大值為+0.007 mm，厚度的最小值為-0.004 mm，最大值與最小值之差為0.011 mm。而且，如圖13（c）所示，在參考例的樹脂成形品中，確認到E列的區域局部地變厚的傾向。As shown in Fig. 13 (a) and Fig. 13 (b), the maximum thickness of the resin molded article of the reference example is +0.007 mm, the minimum value of the thickness is -0.004 mm, and the difference between the maximum value and the minimum value is 0.011 mm. . Furthermore, as shown in FIG. 13(c), in the resin molded article of the reference example, it was confirmed that the region of the E column partially became thick.
根據以上結果，確認到：在第1壓板11配備有第1壓板加熱器18的實施方式的樹脂成形品的製造裝置1中，通過在製造樹脂成形品時利用第1壓板加熱器18對第1壓板11進行加熱，可製造厚度的偏差少的樹脂成形品82。According to the above-described results, it is confirmed that the first platen heater 18 is used in the first embodiment of the first platen heater 18, and the first molded plate heater 18 is used to manufacture the resin molded article. The platen 11 is heated to produce a resin molded article 82 having a small variation in thickness.
另外，在所述實施方式的樹脂成形品的製造方法中，未利用第2壓板加熱器19對第2壓板12進行加熱。然而，在通過第1壓板加熱器18對第1壓板11進行了加熱並且通過第2壓板加熱器19對第2壓板12進行了加熱的情況下，可抑制第1壓板11的變形並且也可抑制第2壓板12的變形，所以能夠製造厚度的偏差更少的樹脂成形品82。Further, in the method of manufacturing a resin molded article of the embodiment, the second platen 12 is not heated by the second platen heater 19. However, when the first platen 11 is heated by the first platen heater 18 and the second platen 12 is heated by the second platen heater 19, deformation of the first platen 11 can be suppressed and suppression can be suppressed. Since the second pressure plate 12 is deformed, it is possible to manufacture the resin molded article 82 having less variation in thickness.
圖14表示實施方式的樹脂成形品的製造裝置的變形例的示意性的正視圖。圖14所示的樹脂成形品的製造裝置1的特徵在於包括：第1壓板11與第2壓板12之間的中間板91；第3模具支架93，設於中間板91的第1壓板11側，以對第3模具（未圖示）進行保持的方式構成；以及第4模具支架94，設於中間板91的第2壓板12側，以對第4模具（未圖示）進行保持的方式構成。Fig. 14 is a schematic front view showing a modification of the apparatus for manufacturing a resin molded article of the embodiment. The apparatus 1 for manufacturing a resin molded article shown in FIG. 14 includes an intermediate plate 91 between the first pressure plate 11 and the second pressure plate 12, and a third mold holder 93 provided on the first pressure plate 11 side of the intermediate plate 91. The third mold (not shown) is held; and the fourth mold holder 94 is provided on the second pressure plate 12 side of the intermediate plate 91 to hold the fourth mold (not shown). Composition.
圖15表示圖14所示的樹脂成形品的製造裝置1的示意性的放大剖面圖。第3模具支架93在中間板91側包括第3隔熱構件102，並且在第1壓板11側的第3加熱板103中包括以對具有模腔97的第3模具96進行加熱的方式構成的第3模具支架加熱器105。而且，第3模具支架93在比第3隔熱構件102更靠近中間板91側包括第3板101，並且包括從第3隔熱構件102的邊緣朝鉛垂上方延伸的第3側壁104。在本實施方式中，第3加熱板103包括彼此空開間隔在水平方向上延伸的四根第3模具支架加熱器105。Fig. 15 is a schematic enlarged cross-sectional view showing the apparatus 1 for manufacturing a resin molded article shown in Fig. 14 . The third mold holder 93 includes the third heat insulating member 102 on the side of the intermediate plate 91, and the third heating plate 103 on the side of the first pressure plate 11 includes a third mold 96 having a cavity 97. The third mold holder heater 105. Further, the third mold holder 93 includes the third plate 101 on the side closer to the intermediate plate 91 than the third heat insulating member 102, and includes a third side wall 104 that extends vertically upward from the edge of the third heat insulating member 102. In the present embodiment, the third heating plate 103 includes four third mold holder heaters 105 that are spaced apart from each other in the horizontal direction.
第4模具支架94在中間板91側包括第4隔熱構件112，並且在第2壓板12側的第4加熱板113中包括以對第4模具98進行加熱的方式構成的第4模具支架加熱器115。而且，第4模具支架94在比第4隔熱構件112更靠近中間板91側包括第4板111，並且包括從第4隔熱構件112的邊緣朝鉛垂下方延伸的第4側壁114。在本實施方式中，第4加熱板113包括彼此空開間隔在水平方向上延伸的四根第4模具支架加熱器115。The fourth mold holder 94 includes the fourth heat insulating member 112 on the side of the intermediate plate 91, and includes the fourth mold holder heated to heat the fourth mold 98 on the fourth heating plate 113 on the second pressure plate 12 side. 115. Further, the fourth mold holder 94 includes the fourth plate 111 on the side closer to the intermediate plate 91 than the fourth heat insulating member 112, and includes a fourth side wall 114 that extends downward from the edge of the fourth heat insulating member 112. In the present embodiment, the fourth heating plate 113 includes four fourth mold holder heaters 115 that are spaced apart from each other in the horizontal direction.
圖16表示實施方式的樹脂成形品的製造裝置的另一變形例的局部示意性的放大正視圖。圖16所示的樹脂成形品的製造裝置1的特徵在於，在第1壓板11的下表面設置有切口123，並且在第1壓板11的上表面設置有階差122及傾斜面121。在此情況下，可在對第1模具41與第2模具42進行合模時，利用切口123緩和第1壓板11所受的應力，所以可進一步抑制製造樹脂成形品82時第1壓板11的變形。因此，能夠製造厚度的偏差更少的樹脂成形品82。Fig. 16 is a partially schematic enlarged front elevational view showing another modification of the apparatus for manufacturing a resin molded article of the embodiment. The apparatus 1 for manufacturing a resin molded article shown in FIG. 16 is characterized in that a slit 123 is provided on the lower surface of the first pressure plate 11, and a step 122 and an inclined surface 121 are provided on the upper surface of the first pressure plate 11. In this case, when the first mold 41 and the second mold 42 are clamped, the stress applied to the first pressure plate 11 can be relieved by the slits 123. Therefore, the first pressure plate 11 when the resin molded product 82 is manufactured can be further suppressed. Deformation. Therefore, it is possible to manufacture the resin molded article 82 having less variation in thickness.
另外，在圖16所示的樹脂成形品的製造裝置中，切口123例如能夠以包圍第1模具支架14的方式構成。而且，在圖16所示的樹脂成形品的製造裝置中，傾斜面121能夠以從階差122起朝外側並朝斜下方延伸的方式構成。Further, in the apparatus for manufacturing a resin molded article shown in FIG. 16, the slit 123 can be configured to surround the first mold holder 14, for example. Further, in the apparatus for manufacturing a resin molded article shown in FIG. 16, the inclined surface 121 can be configured to extend outward from the step 122 and obliquely downward.
在圖16所示的樹脂成形品的製造裝置1中，切口123的外側端部124處的第1壓板11的鉛垂方向的厚度a變得比切口123的內側端部125處的第1壓板11的鉛垂方向的厚度b薄。在本實施方式中，切口123的外側端部124處的第1壓板11的厚度a是指從第1壓板11的下表面的切口123的外側端部124起至第1壓板11的上表面為止的厚度a。而且，在本實施方式中，切口123的內側端部125處的第1壓板11的厚度b是指從第1壓板11的下表面的切口123的內側端部125起至第1壓板11的上表面為止的厚度b。In the apparatus 1 for manufacturing a resin molded article shown in FIG. 16 , the thickness a of the first platen 11 in the vertical direction at the outer end portion 124 of the slit 123 becomes larger than the first plate at the inner end portion 125 of the slit 123 . The thickness b of the vertical direction of 11 is thin. In the present embodiment, the thickness a of the first pressure plate 11 at the outer end portion 124 of the slit 123 is from the outer end portion 124 of the slit 123 on the lower surface of the first pressure plate 11 to the upper surface of the first pressure plate 11. The thickness a. Further, in the present embodiment, the thickness b of the first pressure plate 11 at the inner end portion 125 of the slit 123 is from the inner end portion 125 of the slit 123 on the lower surface of the first pressure plate 11 to the first pressure plate 11 The thickness b from the surface.
圖17表示利用第1壓板加熱器18對第1壓板11進行加熱來製造樹脂成形品時的圖16所示的樹脂成形品的製造裝置1的溫度分佈。而且，圖18表示除未利用第1壓板加熱器18對第1壓板11進行加熱以外其餘以與圖17所示的情況相同的方式來製造樹脂成形品時的參考例的樹脂成形品的溫度分佈。根據圖17與圖18的比較可明確，可瞭解到：圖17所示的樹脂成形品的製造裝置1的溫度分佈比圖18所示的溫度分佈變得均勻。FIG. 17 shows a temperature distribution of the manufacturing apparatus 1 of the resin molded article shown in FIG. 16 when the first press plate 11 is heated by the first platen heater 18 to produce a resin molded article. In addition, FIG. 18 shows a temperature distribution of a resin molded article of a reference example when a resin molded article is produced in the same manner as in the case shown in FIG. 17 except that the first platen heater 18 is not heated by the first platen heater 18. . As is clear from the comparison between Fig. 17 and Fig. 18, it is understood that the temperature distribution of the apparatus 1 for manufacturing a resin molded article shown in Fig. 17 is made uniform as compared with the temperature distribution shown in Fig. 18.
圖19表示實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。圖19所示的實施方式的樹脂成形品的製造裝置1與圖16所示的實施方式的樹脂成形品的製造裝置1的不同點在於，第1壓板11的上表面變平坦。Fig. 19 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article of the embodiment. The apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 19 is different from the apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 16 in that the upper surface of the first pressure plate 11 is flat.
圖20表示實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。圖20所示的實施方式的樹脂成形品的製造裝置1與圖16所示的實施方式的樹脂成形品的製造裝置1的不同點在於，在第1壓板11的上表面未設置傾斜面121。Fig. 20 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article of the embodiment. The apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 20 is different from the apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 16 in that an inclined surface 121 is not provided on the upper surface of the first pressure plate 11.
圖21表示實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。圖21所示的實施方式的樹脂成形品的製造裝置1與圖16所示的實施方式的樹脂成形品的製造裝置1的不同點在於，在第1壓板11的上表面未設置階差122，而設置有凹進部127。Fig. 21 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article of the embodiment. The apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 21 is different from the apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 16 in that a step 122 is not provided on the upper surface of the first pressure plate 11 . A recess 127 is provided.
圖22表示實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。圖22所示的實施方式的樹脂成形品的製造裝置1與圖21所示的實施方式的樹脂成形品的製造裝置1的不同點在於，在第1壓板11的上表面設置有階差122來代替傾斜面121。Fig. 22 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article of the embodiment. The apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 22 is different from the apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 21 in that a step 122 is provided on the upper surface of the first pressure plate 11 . Instead of the inclined surface 121.
圖23表示實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。圖23所示的實施方式的樹脂成形品的製造裝置1與圖16所示的實施方式的樹脂成形品的製造裝置1的不同點在於，加厚了第1壓板11的厚度。Fig. 23 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article of the embodiment. The apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 23 is different from the apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 16 in that the thickness of the first pressure plate 11 is increased.
圖24表示實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。圖24所示的實施方式的樹脂成形品的製造裝置1與圖21所示的實施方式的樹脂成形品的製造裝置1的不同點在於，在第1壓板11的上表面未設置凹進部127。Fig. 24 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article of the embodiment. The apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 24 is different from the apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 21 in that a recessed portion 127 is not provided on the upper surface of the first platen 11. .
圖25表示實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。圖25所示的實施方式的樹脂成形品的製造裝置1與圖23所示的實施方式的樹脂成形品的製造裝置1的不同點在於，在第1壓板11的上表面設置有凹進部127。Fig. 25 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article of the embodiment. The apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 25 is different from the apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 23 in that a recessed portion 127 is provided on the upper surface of the first platen 11 . .
圖26表示實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。圖26所示的實施方式的樹脂成形品的製造裝置1與圖23所示的實施方式的樹脂成形品的製造裝置1的不同點在於，在第1壓板11的上表面設置有兩個圓柱狀的突起126。Fig. 26 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article of the embodiment. The apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 26 is different from the apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 23 in that two cylindrical shapes are provided on the upper surface of the first pressure plate 11. Protrusion 126.
另外，在圖19～圖26中，為了方便說明，省略了內置於第1壓板11中的第1壓板加熱器18的記載，但圖19～圖26所示的實施方式的樹脂成形品的製造裝置1也包括內置於第1壓板11中的第1壓板加熱器18。因此，在圖19～圖26所示的實施方式的樹脂成形品的製造裝置1中，也可通過在製造樹脂成形品82時利用第1壓板加熱器18對第1壓板11進行加熱而抑制第1壓板11的變形，因此，可抑制樹脂成形品82的厚度的偏差。In addition, in FIG. 19 to FIG. 26, the description of the first platen heater 18 incorporated in the first platen 11 is omitted for convenience of explanation, but the manufacture of the resin molded article of the embodiment shown in FIGS. 19 to 26 is performed. The device 1 also includes a first platen heater 18 built in the first pressure plate 11. Therefore, in the apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 19 to FIG. 26, when the resin molded article 82 is manufactured, the first platen heater 18 can be heated by the first platen heater 18 to suppress the first step. Since the deformation of the pressure plate 11 is performed, variations in the thickness of the resin molded article 82 can be suppressed.
而且，作為圖6中所示的實施方式的樹脂成形系統的變形例，可例示不使用收納模塊1003，而將樹脂成形品收納裝置203設置在供給模塊1001內的實施方式。在此情況下，一個搬送機構可將支撐構件51從供給模塊1001供給至樹脂密封模塊1002中，並且將利用樹脂成形品的製造裝置1進行製造後的樹脂成形品82再次收納在供給模塊1001內的樹脂成形品收納裝置203中。In addition, as a modification of the resin molding system of the embodiment shown in FIG. 6 , an embodiment in which the resin molded article storage device 203 is provided in the supply module 1001 without using the storage module 1003 can be exemplified. In this case, the one transporting means can supply the support member 51 from the supply module 1001 to the resin sealing module 1002, and the resin molded article 82 manufactured by the manufacturing apparatus 1 of the resin molded product can be accommodated again in the supply module 1001. In the resin molded article storage device 203.
而且，作為圖6中所示的實施方式的樹脂成形系統的變形例，也可以例示將樹脂材料供給裝置202設置在收納模塊1003內的實施方式。在此情況下，未圖示的搬送機構可將脫模膜52與樹脂材料61從收納模塊1003一併供給至設置在樹脂密封模塊1002中的樹脂成形品的製造裝置1中，並且在利用樹脂成形品的製造裝置1製造樹脂成形品82後，此搬送機構可回收脫模膜52。Moreover, as a modification of the resin molding system of the embodiment shown in FIG. 6, an embodiment in which the resin material supply device 202 is provided in the storage module 1003 can be exemplified. In this case, the transfer mechanism (not shown) can supply the release film 52 and the resin material 61 together from the storage module 1003 to the manufacturing apparatus 1 of the resin molded product provided in the resin sealing module 1002, and the resin is used. After the resin molded product 82 is manufactured by the manufacturing apparatus 1 of a molded article, this conveyance mechanism can collect the release film 52.
如以上述對實施方式進行了說明，但將所述各實施方式的結構適宜組合也從最初進行了預定。Although the embodiment has been described above, the configuration of each of the above-described embodiments is appropriately combined and predetermined from the beginning.
對本發明的實施方式進行了說明，但本次所揭示的實施方式應認為在所有方面均為例示而非進行限制者。本發明的範圍由申請專利範圍表示，且意圖包含與申請專利範圍均等的含義及範圍內的所有變更。The embodiments of the present invention have been described, but the embodiments disclosed herein are intended to be illustrative and not restrictive. The scope of the present invention is defined by the scope of the claims, and is intended to include all modifications within the meaning and scope of the claims.
產業上的可利用性 根據本文中揭示的實施方式，可提供一種樹脂成形品的製造裝置、樹脂成形系統以及樹脂成形品的製造方法。Industrial Applicability According to the embodiments disclosed herein, a device for producing a resin molded article, a resin molding system, and a method for producing a resin molded article can be provided.
1‧‧‧樹脂成形品的製造裝置1‧‧‧Manufacturer of resin molded articles
11‧‧‧第1壓板11‧‧‧1st platen
12‧‧‧第2壓板12‧‧‧2nd platen
13‧‧‧第3壓板13‧‧‧3rd platen
14‧‧‧第1模具支架14‧‧‧1st mold holder
15‧‧‧第2模具支架15‧‧‧2nd mold holder
16‧‧‧驅動機構16‧‧‧Drive mechanism
17‧‧‧型壓框架17‧‧‧ Type pressure frame
18‧‧‧第1壓板加熱器18‧‧‧1st platen heater
19‧‧‧第2壓板加熱器19‧‧‧2nd platen heater
21‧‧‧第1板21‧‧‧1st board
22‧‧‧第1隔熱構件22‧‧‧1st insulation member
23‧‧‧第1加熱板23‧‧‧1st heating plate
24‧‧‧第1側壁24‧‧‧1st side wall
25‧‧‧第1模具支架加熱器25‧‧‧1st mold holder heater
31‧‧‧第2板31‧‧‧2nd board
32‧‧‧第2隔熱構件32‧‧‧2nd insulation member
33‧‧‧第2加熱板33‧‧‧2nd heating plate
34‧‧‧第2側壁34‧‧‧ second side wall
35‧‧‧第2模具支架加熱器35‧‧‧2nd mold holder heater
41‧‧‧第1模具41‧‧‧1st mould
42‧‧‧第2模具42‧‧‧2nd mould
43‧‧‧模腔43‧‧‧ cavity
51‧‧‧支撐構件51‧‧‧Support members
51a‧‧‧半導體基板51a‧‧‧Semiconductor substrate
51b‧‧‧半導體芯片51b‧‧‧Semiconductor chip
52‧‧‧脫模膜52‧‧‧ release film
61‧‧‧樹脂材料61‧‧‧Resin materials
71‧‧‧流動性樹脂71‧‧‧Liquid resin
81‧‧‧硬化樹脂81‧‧‧ hardened resin
82‧‧‧樹脂成形品82‧‧‧Resin molded products
91‧‧‧中間板91‧‧‧Intermediate board
93‧‧‧第3模具支架93‧‧‧3rd mold holder
94‧‧‧第4模具支架94‧‧‧4th mold bracket
96‧‧‧第3模具96‧‧‧3rd mould
97‧‧‧模腔97‧‧‧ cavity
98‧‧‧第4模具98‧‧‧4th mould
101‧‧‧第3板101‧‧‧3rd board
102‧‧‧第3隔熱構件102‧‧‧3rd insulation member
103‧‧‧第3加熱板103‧‧‧3rd heating plate
104‧‧‧第3側壁104‧‧‧3rd side wall
105‧‧‧第3模具支架加熱器105‧‧‧3rd mold holder heater
111‧‧‧第4板111‧‧‧4th board
112‧‧‧第4隔熱構件112‧‧‧4th thermal insulation component
113‧‧‧第4加熱板113‧‧‧4th heating plate
114‧‧‧第4側壁114‧‧‧4th side wall
115‧‧‧第4模具支架加熱器115‧‧‧4th mold holder heater
121‧‧‧傾斜面121‧‧‧Sloping surface
122‧‧‧階差122‧‧ ‧ step
123‧‧‧切口123‧‧‧ incision
124‧‧‧外側端部124‧‧‧Outer end
125‧‧‧內側端部125‧‧‧Inside end
126‧‧‧突起126‧‧ ‧ prominence
127‧‧‧凹進部127‧‧‧ recessed
201‧‧‧支撐構件供給裝置201‧‧‧Support member supply device
202‧‧‧樹脂材料供給裝置202‧‧‧Resin material supply device
203‧‧‧樹脂成形品收納裝置203‧‧‧Resin molded product storage device
301‧‧‧搬送機構301‧‧‧Transportation agency
401‧‧‧縱向移動導軌401‧‧‧Longitudinal moving rail
402‧‧‧橫向移動導軌402‧‧‧Horizontal moving rail
403‧‧‧縱向移動導軌403‧‧‧Longitudinal moving rail
404‧‧‧縱向移動導軌404‧‧‧Longitudinal moving rail
1000‧‧‧樹脂成形系統1000‧‧‧Resin Forming System
1001‧‧‧供給模塊1001‧‧‧Supply module
1002‧‧‧樹脂密封模塊1002‧‧‧Resin Sealing Module
1003‧‧‧收納模塊1003‧‧‧Storage module
A～E‧‧‧列A to E‧‧‧
a～c‧‧‧行a~c‧‧‧
a、b‧‧‧厚度a, b‧‧‧ thickness
圖1是實施方式的樹脂成形品的製造裝置的示意性的正視圖。 圖2是圖1所示的第1模具支架及第2模具支架的示意性的立體圖。 圖3是對實施方式的樹脂成形品的製造方法的步驟的一部分進行圖解的示意性的剖面圖。 圖4是對實施方式的樹脂成形品的製造方法的步驟的一部分進行圖解的示意性的剖面圖。 圖5是對實施方式的樹脂成形品的製造方法的步驟的一部分進行圖解的示意性的剖面圖。 圖6是實施方式的樹脂成形系統的示意性的平面圖。 圖7是對實施方式的樹脂成形品的製造方法的步驟的一部分進行圖解的示意性的剖面圖。 圖8是對實施方式的樹脂成形品的製造方法的步驟的一部分進行圖解的示意性的剖面圖。 圖9是對實施方式的樹脂成形品的製造方法的步驟的一部分進行圖解的示意性的正視圖。 圖10是對實施方式的樹脂成形品的製造方法的步驟的一部分進行圖解的示意性的剖面圖。 圖11是對實施方式的樹脂成形品的製造方法的步驟的一部分進行圖解的示意性的剖面圖。 圖12（a）～圖12（c）是表示對利用實施方式的樹脂成形品的製造方法製造的樹脂成形品的厚度的偏差進行測定的結果的圖。 圖13（a）～圖13（c）是表示對參考例的樹脂成形品的厚度的偏差進行測定的結果的圖。 圖14是實施方式的樹脂成形品的製造裝置的變形例的示意性的正視圖。 圖15是圖14所示的樹脂成形品的製造裝置的示意性的放大剖面圖。 圖16是實施方式的樹脂成形品的製造裝置的另一變形例的局部的示意性的放大正視圖。 圖17是表示利用第1壓板加熱器對第1壓板進行加熱來製造樹脂成形品時的圖16所示的樹脂成形品的製造裝置的溫度分佈的圖。 圖18是表示除未利用第1壓板加熱器對第1壓板進行加熱以外其餘以與圖17所示的情況相同的方式來製造樹脂成形品時的參考例的樹脂成形品的溫度分佈的圖。 圖19是實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。 圖20是實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。 圖21是實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。 圖22是實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。 圖23是實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。 圖24是實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。 圖25是實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。 圖26是實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。Fig. 1 is a schematic front view of an apparatus for manufacturing a resin molded article according to an embodiment. Fig. 2 is a schematic perspective view of the first mold holder and the second mold holder shown in Fig. 1; 3 is a schematic cross-sectional view showing a part of the steps of a method of manufacturing a resin molded article of the embodiment. 4 is a schematic cross-sectional view showing a part of the steps of a method of manufacturing a resin molded article of the embodiment. Fig. 5 is a schematic cross-sectional view showing a part of a procedure of a method of manufacturing a resin molded article of the embodiment. Fig. 6 is a schematic plan view of a resin molding system of the embodiment. FIG. 7 is a schematic cross-sectional view showing a part of the procedure of the method of manufacturing the resin molded article of the embodiment. FIG. 8 is a schematic cross-sectional view illustrating a part of the procedure of the method of manufacturing the resin molded article of the embodiment. FIG. 9 is a schematic front view showing a part of the steps of the method of manufacturing the resin molded article of the embodiment. FIG. 10 is a schematic cross-sectional view showing a part of the procedure of the method of manufacturing the resin molded article of the embodiment. FIG. 11 is a schematic cross-sectional view showing a part of the procedure of the method of manufacturing the resin molded article of the embodiment. (a) to (c) of FIG. 12 are diagrams showing the results of measurement of variations in thickness of the resin molded article produced by the method for producing a resin molded article of the embodiment. (a) to (c) of FIG. 13 are views showing the results of measuring the variation in the thickness of the resin molded article of the reference example. FIG. 14 is a schematic front view showing a modification of the apparatus for manufacturing a resin molded article according to the embodiment. Fig. 15 is a schematic enlarged cross-sectional view showing the apparatus for manufacturing a resin molded article shown in Fig. 14; Fig. 16 is a partially schematic enlarged front elevational view showing another modification of the apparatus for manufacturing a resin molded article of the embodiment. FIG. 17 is a view showing a temperature distribution of the apparatus for manufacturing a resin molded article shown in FIG. 16 when the first press plate is heated by the first platen heater to produce a resin molded article. FIG. 18 is a view showing a temperature distribution of a resin molded article of a reference example when a resin molded article is produced in the same manner as in the case of FIG. 17 except that the first platen is not heated by the first platen heater. FIG. 19 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article according to the embodiment. FIG. 20 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article according to the embodiment. FIG. 21 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article according to the embodiment. Fig. 22 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article of the embodiment. FIG. 23 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article according to the embodiment. FIG. 24 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article according to the embodiment. Fig. 25 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article of the embodiment. FIG. 26 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article according to the embodiment.
Claims (9)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017206003A JP6560727B2 (en) | 2017-10-25 | 2017-10-25 | Resin molded product manufacturing apparatus, resin molded system, and resin molded product manufacturing method |
| JP2017-206003 | 2017-10-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201916998A true TW201916998A (en) | 2019-05-01 |
| TWI690404B TWI690404B (en) | 2020-04-11 |
Family
ID=66254717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107137653A TWI690404B (en) | 2017-10-25 | 2018-10-25 | Resin molded product manufacturing apparatus and manufacturing method, resin molding system |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6560727B2 (en) |
| KR (1) | KR102264543B1 (en) |
| CN (1) | CN109702943B (en) |
| SG (1) | SG10201808663YA (en) |
| TW (1) | TWI690404B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7341112B2 (en) * | 2020-10-06 | 2023-09-08 | Ｔｏｗａ株式会社 | Manufacturing method for resin molded products |
| JP7445974B2 (en) * | 2020-10-20 | 2024-03-08 | アピックヤマダ株式会社 | Resin sealing device |
| JP6900139B1 (en) * | 2020-12-22 | 2021-07-07 | 株式会社浅野研究所 | Thermoforming equipment and thermoforming method |
| JP7035243B1 (en) * | 2021-03-10 | 2022-03-14 | Ｔｏｗａ株式会社 | Resin molding equipment and manufacturing method of resin molded products |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0236038U (en) * | 1988-09-02 | 1990-03-08 | ||
| JPH0631736A (en) * | 1992-07-14 | 1994-02-08 | Apic Yamada Kk | Molding equipment |
| JPH0929747A (en) * | 1995-07-19 | 1997-02-04 | Ricoh Co Ltd | Mold heat insulating apparatus |
| JPH1174297A (en) | 1997-08-29 | 1999-03-16 | Nec Corp | Thin-walled resin sealing method of electronic device, etc., and device thereof |
| JP4625488B2 (en) * | 2007-09-10 | 2011-02-02 | 三菱重工プラスチックテクノロジー株式会社 | Mold platen, mold clamping device, injection molding machine |
| JP5215445B2 (en) * | 2011-10-17 | 2013-06-19 | ファナック株式会社 | Injection molding machine with adapter plate with temperature control piping |
| CN204011392U (en) * | 2014-07-01 | 2014-12-10 | 比亚迪股份有限公司 | Automobile, IGBT module and bottom deck assembly thereof |
| JP6440599B2 (en) | 2015-08-28 | 2018-12-19 | Ｔｏｗａ株式会社 | Resin molding apparatus and resin molding method |
-
2017
- 2017-10-25 JP JP2017206003A patent/JP6560727B2/en active Active
-
2018
- 2018-10-02 SG SG10201808663YA patent/SG10201808663YA/en unknown
- 2018-10-23 KR KR1020180126475A patent/KR102264543B1/en active IP Right Grant
- 2018-10-24 CN CN201811240535.0A patent/CN109702943B/en active Active
- 2018-10-25 TW TW107137653A patent/TWI690404B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019077105A (en) | 2019-05-23 |
| JP6560727B2 (en) | 2019-08-14 |
| CN109702943A (en) | 2019-05-03 |
| KR20190046660A (en) | 2019-05-07 |
| TWI690404B (en) | 2020-04-11 |
| CN109702943B (en) | 2021-05-04 |
| KR102264543B1 (en) | 2021-06-14 |
| SG10201808663YA (en) | 2019-05-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201916998A (en) | Resin molded product manufacturing apparatus and manufacturing method, resin molding system | |
| CN107921679B (en) | Resin molding apparatus and method for manufacturing resin molded product | |
| KR102237166B1 (en) | Resin molding apparatus and resin molded product manufacturing method | |
| JP6923503B2 (en) | Resin molding equipment and manufacturing method of resin molded products | |
| KR102266607B1 (en) | Resin molding apparatus and method for manufacturing resin molded article | |
| TW201916997A (en) | Resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method | |
| KR102202436B1 (en) | Resin molding apparatus, resin molding method and resin molded product manufacturing method | |
| JP2021014017A (en) | Resin molding apparatus, and manufacturing method of resin molded products | |
| JP6271193B2 (en) | Semiconductor device manufacturing method, semiconductor manufacturing apparatus, and sheet-like resin for resin sealing | |
| TW202306741A (en) | Resin molding device and method for manufacturing resin molded article | |
| JP5694486B2 (en) | Resin sealing device | |
| JP6371816B2 (en) | Semiconductor device manufacturing method and semiconductor manufacturing apparatus | |
| KR101441981B1 (en) | Resin molding apparatus and method of the same | |
| WO2022075121A1 (en) | Method for manufacturing resin molded article |