TWI690404B - Resin molded product manufacturing apparatus and manufacturing method, resin molding system - Google Patents

Resin molded product manufacturing apparatus and manufacturing method, resin molding system Download PDF

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Publication number
TWI690404B
TWI690404B TW107137653A TW107137653A TWI690404B TW I690404 B TWI690404 B TW I690404B TW 107137653 A TW107137653 A TW 107137653A TW 107137653 A TW107137653 A TW 107137653A TW I690404 B TWI690404 B TW I690404B
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Taiwan
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resin molded
platen
molded product
mold
manufacturing
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TW107137653A
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Chinese (zh)
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TW201916998A (en
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市橋秀男
下多祐輔
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日商Ｔｏｗａ股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B29C45/66—Mould opening, closing or clamping devices mechanical
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

There is provided a resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method that can reduce variation in thickness of a resin molded product. The resin molded product manufacturing apparatus includes a first platen, a first mold chase holder provided on the first platen, and a second platen disposed so as to face the first platen. The first mold chase holder includes a first heat insulating member on a side closer to the first platen, and a first mold chase holder heater on a side closer to the second platen. The first platen includes a first platen heater configured to heat the first platen.

Description

樹脂成形品的製造裝置與製造方法、樹脂成形系統Manufacturing device and manufacturing method of resin molded product, resin molding system

本發明是有關於一種樹脂成形品的製造裝置、樹脂成形系統以及樹脂成形品的製造方法。 The present invention relates to a resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method.

例如，在日本專利特開平11-74297號公報(專利文獻1)中揭示了使用帶加熱器的壓板(platen)對層壓有熱塑性塑料片(plastic sheet)的電子裝置(device)的已封裝的引線框架(lead frame)進行加壓及加熱，藉此來進行電子裝置的密封的樹脂成形裝置以及樹脂成形品的製造方法。 For example, Japanese Patent Laid-Open No. 11-74297 (Patent Document 1) discloses the use of a heater-equipped platen to encapsulate an electronic device laminated with a plastic sheet The lead frame pressurizes and heats the resin molding device and the method of manufacturing the resin molded product for sealing the electronic device.

專利文獻1所記載的樹脂成形裝置是以不使用金屬模具等成形用的模具為前提，所以關於使用用以對模具進行保持的模具支架，未進行記載及提示。然而，在使用模具進行樹脂成形的樹脂成形裝置中，有時會將用以保持模具的模具支架安裝於壓 板。將模具支架安裝於壓板，以對模具進行保持，並且利用模具支架所配備的加熱器對模具進行加熱。 The resin molding apparatus described in Patent Document 1 assumes that a mold for molding such as a metal mold is not used. Therefore, there is no description or suggestion of using a mold holder for holding the mold. However, in a resin molding apparatus that uses a mold for resin molding, a mold holder for holding the mold may be attached to a press board. The mold holder is mounted on the pressing plate to hold the mold, and the mold is heated by the heater provided in the mold holder.

在模具加熱時熱從模具支架傳導至壓板的情況下，有時壓板因構成壓板的零件的熱膨脹而變形。因此，模具支架在加熱器的壓板側配備有隔熱構件以免熱傳導至壓板。 When heat is transferred from the mold holder to the pressure plate when the mold is heated, the pressure plate may be deformed due to thermal expansion of parts constituting the pressure plate. Therefore, the mold holder is equipped with a heat insulating member on the pressure plate side of the heater to prevent heat conduction to the pressure plate.

然而，本發明人積極研究的結果，發現：即使利用模具支架的隔熱構件，也無法完全防止熱從加熱板向壓板的傳導，從而壓板因傳導至壓板的熱而變形，並且追隨壓板的變形，模具支架也變形。 However, as a result of active research by the present inventors, it was found that even if the heat insulating member of the mold holder is used, the conduction of heat from the heating plate to the platen cannot be completely prevented, so that the platen is deformed by the heat conducted to the platen and follows the deformation of the platen , The mold bracket is also deformed.

在利用安裝在變形了的模具支架上的模具進行樹脂形成的情況下，有時樹脂成形品的厚度的偏差變大而成為劣質品。 When resin is formed using a mold attached to a deformed mold holder, the thickness of the resin molded product may vary in thickness and become inferior.

根據本文中揭示的實施方式，可提供一種樹脂成形品的製造裝置，其包括：第1壓板；第1模具支架，設於第1壓板，以對第1模具進行保持的方式構成；以及第2壓板，以與第1壓板相向的方式與第1壓板空開間隔而配置，第1模具支架在第1壓板側包括第1隔熱構件，並且在第2壓板側包括以對第1模具進行加熱的方式構成的第1模具支架加熱器，第1壓板包括以對第1壓板進行加熱的方式構成的第1壓板加熱器。 According to the embodiments disclosed herein, there can be provided a device for manufacturing a resin molded product, which includes: a first pressure plate; a first mold holder provided on the first pressure plate and configured to hold the first mold; and a second The pressure plate is arranged spaced apart from the first pressure plate so as to face the first pressure plate, the first mold holder includes a first heat insulating member on the first pressure plate side, and includes a second heat plate side to heat the first mold The first mold holder heater is configured such that the first platen includes a first platen heater configured to heat the first platen.

根據本文中揭示的實施方式，可提供一種包括所述樹脂成形品的製造裝置的樹脂成形系統。 According to the embodiments disclosed herein, it is possible to provide a resin molding system including the apparatus for manufacturing the resin molded article.

根據本文中揭示的實施方式，可提供一種樹脂成形品的製造方法，其使用所述的樹脂成形品的製造裝置，並且包括：對 第1模具設置支撐構件的步驟；對第2模具的模腔供給樹脂材料的步驟；對支撐構件進行加熱的步驟；對樹脂材料進行加熱的步驟；以及進行第1模具與第2模具的合模的步驟，還包括利用第1壓板加熱器對第1壓板進行加熱的步驟。 According to the embodiments disclosed herein, it is possible to provide a method for manufacturing a resin molded product using the apparatus for manufacturing a resin molded product, and including: The step of providing a support member in the first mold; the step of supplying resin material to the cavity of the second mold; the step of heating the support member; the step of heating the resin material; and the closing of the first mold and the second mold The step further includes the step of heating the first platen with the first platen heater.

本發明的所述及其他目的、特徵、局面及優點將根據與隨附的圖式相關聯來理解的關於本發明的以下的詳細說明而變得明確。 The above and other objects, features, aspects, and advantages of the present invention will become clear from the following detailed description of the present invention that is understood in association with the accompanying drawings.

1:樹脂成形品的製造裝置 1: Manufacturing equipment for resin molded products

11:第1壓板 11: 1st pressure plate

12:第2壓板 12: 2nd pressure plate

13:第3壓板 13: 3rd pressure plate

14:第1模具支架 14: The first mold support

15:第2模具支架 15: Second mold support

16:驅動機構 16: Drive mechanism

17:型壓框架 17: Shaped frame

18:第1壓板加熱器 18: The first platen heater

19:第2壓板加熱器 19: 2nd platen heater

21:第1板 21: 1st board

22:第1隔熱構件 22: The first heat insulation member

23:第1加熱板 23: The first heating plate

24:第1側壁 24: 1st side wall

25:第1模具支架加熱器 25: The first mold holder heater

31:第2板 31: 2nd board

32:第2隔熱構件 32: The second heat insulation member

33:第2加熱板 33: 2nd heating plate

34:第2側壁 34: 2nd side wall

35:第2模具支架加熱器 35: 2nd mold bracket heater

41:第1模具 41: The first mold

42:第2模具 42: 2nd mold

43:模腔 43: cavity

51:支撐構件 51: Supporting member

51a:半導體基板 51a: Semiconductor substrate

51b:半導體芯片 51b: Semiconductor chip

52:脫模膜 52: Release film

61:樹脂材料 61: resin material

71:流動性樹脂 71: Flowable resin

81:硬化樹脂 81: hardened resin

82:樹脂成形品 82: Resin molded product

91:中間板 91: midplane

93:第3模具支架 93: 3rd mold bracket

94:第4模具支架 94: 4th mold bracket

96:第3模具 96: 3rd mold

97:模腔 97: cavity

98:第4模具 98: 4th mold

101:第3板 101: 3rd board

102:第3隔熱構件 102: The third heat insulation member

103:第3加熱板 103: 3rd heating plate

104:第3側壁 104: 3rd side wall

105:第3模具支架加熱器 105: 3rd mold holder heater

111:第4板 111: 4th board

112:第4隔熱構件 112: 4th heat insulation member

113:第4加熱板 113: 4th heating plate

114:第4側壁 114: 4th side wall

115:第4模具支架加熱器 115: 4th mold bracket heater

121:傾斜面 121: inclined surface

122:階差 122: step difference

123:切口 123: incision

124:外側端部 124: outer end

125:內側端部 125: medial end

126:突起 126: protrusion

127:凹進部 127: recessed part

201:支撐構件供給裝置 201: Support member supply device

202:樹脂材料供給裝置 202: Resin material supply device

203:樹脂成形品收納裝置 203: Resin molded product storage device

301:搬送機構 301: Transport mechanism

401:縱向移動導軌 401: Longitudinal moving rail

402:橫向移動導軌 402: Lateral moving rail

403:縱向移動導軌 403: Longitudinal moving guide

404:縱向移動導軌 404: Longitudinal moving guide

1000:樹脂成形系統 1000: resin molding system

1001:供給模塊 1001: Supply module

1002:樹脂密封模塊 1002: resin-sealed module

1003:收納模塊 1003: Storage module

A~E:列 A~E: Column

a~c:行 a~c: OK

a、b:厚度 a, b: thickness

圖1是實施方式的樹脂成形品的製造裝置的示意性的正視圖。 FIG. 1 is a schematic front view of an apparatus for manufacturing a resin molded article of an embodiment.

圖2是圖1所示的第1模具支架及第2模具支架的示意性的立體圖。 FIG. 2 is a schematic perspective view of the first mold holder and the second mold holder shown in FIG. 1.

圖3是對實施方式的樹脂成形品的製造方法的步驟的一部分進行圖解的示意性的剖面圖。 3 is a schematic cross-sectional view illustrating a part of the steps of the method for manufacturing a resin molded article of the embodiment.

圖4是對實施方式的樹脂成形品的製造方法的步驟的一部分進行圖解的示意性的剖面圖。 4 is a schematic cross-sectional view illustrating a part of the steps of the method for manufacturing a resin molded article of the embodiment.

圖5是對實施方式的樹脂成形品的製造方法的步驟的一部分進行圖解的示意性的剖面圖。 5 is a schematic cross-sectional view illustrating a part of the steps of the method for manufacturing a resin molded article of the embodiment.

圖6是實施方式的樹脂成形系統的示意性的平面圖。 6 is a schematic plan view of the resin molding system of the embodiment.

圖7是對實施方式的樹脂成形品的製造方法的步驟的一部分進行圖解的示意性的剖面圖。 7 is a schematic cross-sectional view illustrating a part of the steps of the method for manufacturing a resin molded article of the embodiment.

圖8是對實施方式的樹脂成形品的製造方法的步驟的一部分進行圖解的示意性的剖面圖。 8 is a schematic cross-sectional view illustrating a part of the steps of the method for manufacturing a resin molded article of the embodiment.

圖9是對實施方式的樹脂成形品的製造方法的步驟的一部分進行圖解的示意性的正視圖。 9 is a schematic front view illustrating a part of the steps of the method for manufacturing a resin molded article of the embodiment.

圖10是對實施方式的樹脂成形品的製造方法的步驟的一部分進行圖解的示意性的剖面圖。 10 is a schematic cross-sectional view illustrating a part of the steps of the method for manufacturing a resin molded article of the embodiment.

圖11是對實施方式的樹脂成形品的製造方法的步驟的一部分進行圖解的示意性的剖面圖。 11 is a schematic cross-sectional view illustrating a part of the steps of the method for manufacturing a resin molded article of the embodiment.

圖12是表示對利用實施方式的樹脂成形品的製造方法製造的樹脂成形品的厚度的偏差進行測定的結果的圖。 FIG. 12 is a diagram showing the results of measuring the variation in the thickness of the resin molded product manufactured by the method for manufacturing a resin molded product of the embodiment.

圖13是表示對參考例的樹脂成形品的厚度的偏差進行測定的結果的圖。 FIG. 13 is a graph showing the results of measuring the thickness variation of the resin molded product of the reference example.

圖14是實施方式的樹脂成形品的製造裝置的變形例的示意性的正視圖。 14 is a schematic front view of a modification of the apparatus for manufacturing a resin molded product of the embodiment.

圖15是圖14所示的樹脂成形品的製造裝置的示意性的放大剖面圖。 15 is a schematic enlarged cross-sectional view of the apparatus for manufacturing a resin molded product shown in FIG. 14.

圖16是實施方式的樹脂成形品的製造裝置的另一變形例的局部的示意性的放大正視圖。 16 is a partially schematic enlarged front view of another modification of the apparatus for manufacturing a resin molded product of the embodiment.

圖17是表示利用第1壓板加熱器對第1壓板進行加熱來製造樹脂成形品時的圖16所示的樹脂成形品的製造裝置的溫度分佈的圖。 17 is a diagram showing the temperature distribution of the apparatus for manufacturing a resin molded product shown in FIG. 16 when the first platen heater is used to heat the first platen to produce a resin molded product.

圖18是表示除未利用第1壓板加熱器對第1壓板進行加熱以 外其餘以與圖17所示的情況相同的方式來製造樹脂成形品時的參考例的樹脂成形品的溫度分佈的圖。 18 is a diagram showing that the first pressing plate heater is not heated by the first pressing plate heater to Except for the above, the temperature distribution of the resin molded product of the reference example when the resin molded product is manufactured in the same manner as in the case shown in FIG. 17 is shown.

圖19是實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。 19 is a schematic perspective view of another modification of the apparatus for manufacturing a resin molded product of the embodiment.

圖20是實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。 20 is a schematic perspective view of another modification of the apparatus for manufacturing a resin molded product of the embodiment.

圖21是實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。 21 is a schematic perspective view of another modification of the apparatus for manufacturing a resin molded product of the embodiment.

圖22是實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。 22 is a schematic perspective view of another modification of the apparatus for manufacturing a resin molded product of the embodiment.

圖23是實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。 23 is a schematic perspective view of another modification of the apparatus for manufacturing a resin molded product of the embodiment.

圖24是實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。 24 is a schematic perspective view of another modification of the apparatus for manufacturing a resin molded product of the embodiment.

圖25是實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。 25 is a schematic perspective view of another modification of the apparatus for manufacturing a resin molded product of the embodiment.

圖26是實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。 FIG. 26 is a schematic perspective view of another modification of the apparatus for manufacturing a resin molded product of the embodiment.

以下，對實施方式進行說明。另外，在用於實施方式的說明的圖式中，同一個參照符號表示同一部分或相當部分。 Hereinafter, the embodiment will be described. In addition, in the drawings used for the description of the embodiments, the same reference symbol indicates the same part or a corresponding part.

圖1表示實施方式的樹脂成形品的製造裝置的示意性的 正視圖。實施方式的樹脂成形品的製造裝置1包括第1壓板11、第2壓板12、及第3壓板13。第3壓板13的兩端分別固定有從第3壓板13起朝鉛垂上方延伸的型壓框架(pressed frame)17的其中一端，第1壓板11的兩端分別固定有型壓框架17的另一端。另外，第1壓板11與第3壓板13及型壓框架17例如也可以是作為鑄件而一體形成者。 FIG. 1 shows a schematic of an apparatus for manufacturing a resin molded product of an embodiment Front view. The apparatus 1 for manufacturing a resin molded product of the embodiment includes a first pressure plate 11, a second pressure plate 12, and a third pressure plate 13. One end of a pressed frame 17 extending vertically upward from the third press plate 13 is fixed to both ends of the third press plate 13, and the other of the press frame 17 is fixed to both ends of the first press plate 11. One end. In addition, the first pressure plate 11, the third pressure plate 13, and the molding frame 17 may be integrally formed as a casting, for example.

在第1壓板11與第3壓板13之間，以第2壓板12能夠朝鉛垂上方及鉛垂下方移動的方式安裝有型壓框架17。在第3壓板13的型壓框架17之間的區域設置有以使第2壓板12能夠朝鉛垂上方及鉛垂下方移動的方式構成的驅動機構16。另外，在本實施方式中，第1壓板11受到了固定，所以第2壓板12能夠相對於第1壓板11進行相對移動。 Between the first pressure plate 11 and the third pressure plate 13, a profile pressure frame 17 is attached so that the second pressure plate 12 can move vertically upward and vertically downward. A driving mechanism 16 configured so that the second pressing plate 12 can move vertically upward and vertically downward is provided in a region between the profile pressing frames 17 of the third pressing plate 13. In this embodiment, the first pressure plate 11 is fixed, so the second pressure plate 12 can move relative to the first pressure plate 11.

在第1壓板11的鉛垂下方側安裝有以對第1模具(未圖示)進行保持的方式構成的第1模具支架14。在第2壓板12的鉛垂上方側安裝有以對第2模具(未圖示)進行保持的方式構成的第2模具支架15。在第1壓板11中內置有以對第1壓板11進行加熱的方式構成的第1壓板加熱器18。在第2壓板12中內置有以對第2壓板12進行加熱的方式構成的第2壓板加熱器19。在本實施方式中，第1壓板加熱器18及第2壓板加熱器19在圖1的紙面的法線方向上延伸。而且，在本實施方式中，第2壓板加熱器19比第1壓板加熱器18更靠外側，但第2壓板加熱器19也可以位於與第1壓板加熱器18相向的位置或與第1壓板加熱器18相向的位 置的內側。另外，第2壓板加熱器19與第1壓板加熱器18相向的位置，只要成為如下構成即可：在假定從第3壓板13的底面沿第3壓板13的底面的法線方向對樹脂成形品的製造裝置1的內部進行透視時，第2壓板加熱器19的至少一部分與第1壓板加熱器18的至少一部分重複。 A first mold holder 14 configured to hold a first mold (not shown) is attached to the vertically lower side of the first pressure plate 11. A second mold holder 15 configured to hold a second mold (not shown) is attached to the vertically upper side of the second pressure plate 12. A first platen heater 18 configured to heat the first platen 11 is built into the first platen 11. A second platen heater 19 configured to heat the second platen 12 is built into the second platen 12. In the present embodiment, the first platen heater 18 and the second platen heater 19 extend in the normal direction of the paper surface in FIG. 1. Furthermore, in the present embodiment, the second platen heater 19 is more outside than the first platen heater 18, but the second platen heater 19 may be located opposite the first platen heater 18 or with the first platen Heater 18 opposite position Set inside. In addition, the position where the second platen heater 19 and the first platen heater 18 face each other may be configured as follows: The resin molded product is assumed to face the normal direction of the bottom surface of the third platen 13 from the bottom surface of the third platen 13 When the inside of the manufacturing apparatus 1 of FIG. 1 is seen through, at least a part of the second platen heater 19 and at least a part of the first platen heater 18 overlap.

圖2表示圖1中所示的第1模具支架14及第2模具支架15的示意性的立體圖。第1模具支架14在第1壓板11側包括第1隔熱構件22，並且在第2壓板12側的第1加熱板23中包括以對第1模具(未圖示)進行加熱的方式構成的第1模具支架加熱器25。而且，第1模具支架14在比第1隔熱構件22更靠近第1壓板11側包括第1板21，並且包括從第1加熱板23的邊緣朝鉛垂下方延伸的第1側壁24。在本實施方式中，第1加熱板23內置有彼此空開間隔在水平方向上延伸的四根第1模具支架加熱器25。 FIG. 2 shows a schematic perspective view of the first mold holder 14 and the second mold holder 15 shown in FIG. 1. The first mold holder 14 includes a first heat insulating member 22 on the first platen 11 side, and includes a first heating plate 23 on the second platen 12 side configured to heat the first mold (not shown) The first mold holder heater 25. Further, the first mold holder 14 includes the first plate 21 on the first platen 11 side closer to the first heat insulating member 22 and includes the first side wall 24 extending vertically downward from the edge of the first heating plate 23. In the present embodiment, the first heating plate 23 incorporates four first mold holder heaters 25 extending in the horizontal direction at an interval from each other.

第2模具支架15在第2壓板12側包括第2隔熱構件32，並且在第1壓板11側的第2加熱板33中包括以對第2模具(未圖示)進行加熱的方式構成的第2模具支架加熱器35。而且，第2模具支架15在比第2隔熱構件32更靠近第2壓板12側包括第2板31，並且包括從第2隔熱構件32的邊緣朝鉛垂上方延伸的第2側壁34。在本實施方式中，第2加熱板33內置有彼此空開間隔在水平方向上延伸的四根第2模具支架加熱器35。 The second mold holder 15 includes a second heat insulating member 32 on the second platen 12 side, and includes a second heating plate 33 on the first platen 11 side configured to heat the second mold (not shown) Second mold holder heater 35. Furthermore, the second mold holder 15 includes a second plate 31 on the second platen 12 side closer to the second heat insulating member 32 and includes a second side wall 34 extending vertically upward from the edge of the second heat insulating member 32. In the present embodiment, the second heating plate 33 incorporates four second mold holder heaters 35 extending in the horizontal direction with a space therebetween.

以下，參照圖3~圖11對使用實施方式的樹脂成形品的製造裝置1來製造樹脂成形品的方法的一例即實施方式的樹脂成 形品的製造方法進行說明。首先，如圖3的示意性的剖面圖所示，將第1模具41固定在第1模具支架14的第1加熱板23上，並且將第2模具42固定在第2模具支架15的第2加熱板33上。在第2模具42的第1模具41側設置有模腔43。 Hereinafter, referring to FIGS. 3 to 11, the resin composition of the embodiment, which is an example of a method of manufacturing a resin molded product using the resin molded product manufacturing apparatus 1 of the embodiment, is described. The manufacturing method of the shaped product will be described. First, as shown in the schematic cross-sectional view of FIG. 3, the first mold 41 is fixed to the first heating plate 23 of the first mold holder 14, and the second mold 42 is fixed to the second of the second mold holder 15 On the heating plate 33. A cavity 43 is provided on the first mold 41 side of the second mold 42.

繼而，如圖4的示意性剖面圖所示，以覆蓋第2模具42的模腔43的方式設置脫模膜52。繼而，將由脫模膜52覆蓋的模腔43內的空間抽成真空，藉此如圖5的示意性剖面圖所示，使脫模膜52密接在構成模腔43的第2模具42的表面上。 Next, as shown in the schematic cross-sectional view of FIG. 4, the release film 52 is provided so as to cover the cavity 43 of the second mold 42. Then, the space in the cavity 43 covered by the mold release film 52 is evacuated, whereby the mold release film 52 is in close contact with the surface of the second mold 42 constituting the cavity 43 as shown in the schematic cross-sectional view of FIG. 5 on.

繼而，從圖6的示意性平面圖中所示的實施方式的樹脂成形系統1000的供給模塊1001的支撐構件供給裝置201，將成為樹脂成形的成形對象物的支撐構件51供給至搬送機構301的上側。 Then, from the support member supply device 201 of the supply module 1001 of the resin molding system 1000 of the embodiment shown in the schematic plan view of FIG. 6, the support member 51 that is a resin-molded object is supplied to the upper side of the transport mechanism 301 .

支撐構件51例如可包含：可支撐半導體芯片、芯片狀電子零件、或膜(包含導電性膜、絕緣性膜、半導體膜)等的例如引線框架、基底、內插器(interposer)、半導體基板(矽晶片等)、金屬基板、玻璃基板、陶瓷基板、樹脂基板、及配線基板等。而且，支撐構件51的形狀並無特別限定，支撐構件51的表面形狀例如可以是圓形，也可以是四邊形。而且，支撐構件51可以包含配線，也可以不包含配線。而且，支撐構件51也可以包含扇出型晶片級封裝(Fan Out Wafer Level Package，FO-WLP)或扇出型面板級封裝(Fan Out Panel Level Package，FO-PLP)中所使用的板狀構件的載體。 The support member 51 may include, for example, a lead frame, a base, an interposer, or a semiconductor substrate that can support semiconductor chips, chip-shaped electronic parts, or films (including conductive films, insulating films, and semiconductor films). Silicon wafers, etc.), metal substrates, glass substrates, ceramic substrates, resin substrates, wiring substrates, etc. In addition, the shape of the support member 51 is not particularly limited, and the surface shape of the support member 51 may be, for example, circular or quadrangular. Furthermore, the support member 51 may or may not include wiring. Furthermore, the supporting member 51 may also include a plate-like member used in a fan-out wafer level package (FO-WLP) or a fan-out panel level package (FO-PLP) Carrier.

繼而，供給有支撐構件51的搬送機構301沿著設置在供給模塊1001中的縱向移動導軌401進行移動，而到達樹脂材料供給裝置202中。 Then, the transport mechanism 301 supplied with the support member 51 moves along the longitudinally moving guide rail 401 provided in the supply module 1001 and reaches the resin material supply device 202.

繼而，樹脂材料供給裝置202將樹脂材料61供給至搬送機構301的下側，以使搬送機構301在搬送機構301的下側保持固體的樹脂材料61。因此，在此階段，搬送機構301在上側保持支撐構件51，並且在下側保持樹脂材料61。 Then, the resin material supply device 202 supplies the resin material 61 to the lower side of the transport mechanism 301 so that the transport mechanism 301 holds the solid resin material 61 below the transport mechanism 301. Therefore, at this stage, the transport mechanism 301 holds the support member 51 on the upper side and the resin material 61 on the lower side.

繼而，搬送機構301以在上側保持支撐構件51，並且在下側保持樹脂材料61的狀態，沿著橫向移動導軌402進行橫向移動，而到達實施方式的樹脂成形系統1000的樹脂密封模塊1002中。已到達樹脂密封模塊1002中的搬送機構301沿著縱向移動導軌403進行縱向移動，而到達實施方式的樹脂成形品的製造裝置1中。另外，在圖6中記載有四個樹脂密封模塊1002，但並不限定於此，樹脂密封模塊1002的數量可增減。 Then, the conveyance mechanism 301 laterally moves along the lateral movement guide rail 402 while holding the support member 51 on the upper side and the resin material 61 on the lower side, and reaches the resin sealing module 1002 of the resin molding system 1000 of the embodiment. The conveyance mechanism 301 that has reached the resin sealing module 1002 moves longitudinally along the longitudinal movement guide 403 and reaches the resin molded product manufacturing apparatus 1 of the embodiment. In addition, although four resin-sealed modules 1002 are shown in FIG. 6, it is not limited to this, and the number of resin-sealed modules 1002 can be increased or decreased.

繼而，如圖7的示意性剖面圖所示，從搬送機構301將支撐構件51設置在第1模具41上，並且從搬送機構301將樹脂材料61供給至密接在第2模具42上的脫模膜52上。另外，在本實施方式中，使用包括半導體基板51a與半導體基板51a上的半導體芯片51b的支撐構件51。 Next, as shown in the schematic cross-sectional view of FIG. 7, the support member 51 is provided on the first mold 41 from the transport mechanism 301, and the resin material 61 is supplied from the transport mechanism 301 to the mold release closely adhering to the second mold 42.膜52上。 Film 52. In addition, in this embodiment, the support member 51 including the semiconductor substrate 51 a and the semiconductor chip 51 b on the semiconductor substrate 51 a is used.

繼而，通過第1加熱板23的第1模具支架加熱器25來對第1模具41進行加熱，並且通過第2加熱板33的第2模具支架加熱器35來對第2模具42進行加熱。此時，通過第1壓板加熱器 18來對第1壓板11進行加熱。另外，樹脂材料61因第2模具支架加熱器35對於第2模具42的加熱而熔融，如圖8的示意性剖面圖所示製作流動性樹脂71。 Then, the first mold 41 is heated by the first mold holder heater 25 of the first heating plate 23, and the second mold 42 is heated by the second mold holder heater 35 of the second heating plate 33. At this time, the first platen heater 18 to heat the first platen 11. In addition, the resin material 61 is melted by the heating of the second mold holder heater 35 to the second mold 42, and a fluid resin 71 is produced as shown in the schematic cross-sectional view of FIG. 8.

繼而，如圖9的示意性正視圖所示，使第2壓板12朝鉛垂上方移動，藉此進行第1模具41與第2模具42的合模。此時，如圖10的示意性剖面圖所示，流動性樹脂71接觸支撐構件51的表面。 Next, as shown in the schematic front view of FIG. 9, the second pressing plate 12 is moved vertically upward, thereby closing the first mold 41 and the second mold 42. At this time, as shown in the schematic cross-sectional view of FIG. 10, the fluid resin 71 contacts the surface of the support member 51.

繼而，使流動性樹脂71硬化後使第2壓板12朝鉛垂下方移動。藉此，如圖11的示意性剖面圖所示，製造支撐構件51的表面由硬化樹脂81密封的樹脂成形品82。 Then, after the fluid resin 71 is hardened, the second pressure plate 12 is moved vertically downward. Thereby, as shown in the schematic cross-sectional view of FIG. 11, a resin molded product 82 whose surface of the support member 51 is sealed with the cured resin 81 is manufactured.

如所述製造的樹脂成形品82通過圖6中所示的搬送機構301而從樹脂成形品的製造裝置1中搬出。然後，保持有樹脂成形品82的搬送機構301沿著設置在樹脂密封模塊1002中的縱向移動導軌403朝橫向移動導軌402移動。然後，搬送機構301沿著橫向移動導軌402橫向移動至實施方式的樹脂成形系統1000的收納模塊1003為止。已到達收納模塊1003中的搬送機構301沿著設置在收納模塊1003中的縱向移動導軌404朝樹脂成形品收納裝置203移動。其後，樹脂成形品82被從搬送機構301收納至樹脂成形品收納裝置203中。 The resin molded product 82 manufactured as described above is carried out of the resin molded product manufacturing apparatus 1 by the conveyance mechanism 301 shown in FIG. 6. Then, the conveyance mechanism 301 holding the resin molded product 82 moves along the longitudinal movement guide rail 403 provided in the resin sealing module 1002 toward the lateral movement guide rail 402. Then, the conveyance mechanism 301 laterally moves along the lateral movement guide rail 402 until the storage module 1003 of the resin molding system 1000 of the embodiment. The transport mechanism 301 that has reached the storage module 1003 moves toward the resin molded product storage device 203 along the longitudinal movement guide rail 404 provided in the storage module 1003. Thereafter, the resin molded product 82 is stored in the resin molded product storage device 203 from the transport mechanism 301.

圖12表示對利用實施方式的樹脂成形品的製造方法製造的樹脂成形品82的厚度的偏差進行測定的結果。表1示出了對將樹脂成形品82的表面的以a行~c行這三行及A列~E列這五列 進行分割而得的15個單獨的區域的厚度的偏差進行測定的結果。 FIG. 12 shows the results of measuring the variation in the thickness of the resin molded product 82 manufactured by the method for manufacturing a resin molded product of the embodiment. Table 1 shows three rows a to c and five columns A to E for the surface of the resin molded product 82 The result of measurement of the thickness deviation of 15 separate regions obtained by dividing.

Figure 107137653-A0305-02-0013-1
Figure 107137653-A0305-02-0013-1

表1所示的數值示出了對15個區域的各者中的樹脂成形品82的厚度進行測定並使其平均值為0時的15個區域的各者中的樹脂成形品82的厚度的增減。在表1所示的數值為正的情況下，代表只比樹脂成形品82的厚度的平均值厚所顯示的數值大小。而且，在表1所示的數值為負的情況下，代表只比樹脂成形品82的厚度的平均值薄所顯示的數值大小。 The numerical values shown in Table 1 show the thickness of the resin molded product 82 in each of the 15 regions when the thickness of the resin molded product 82 in each of the 15 regions was measured and the average value was 0. Increase or decrease. When the numerical value shown in Table 1 is positive, it represents the magnitude of the numerical value shown only thicker than the average value of the thickness of the resin molded product 82. In addition, when the numerical value shown in Table 1 is negative, it represents the magnitude of the numerical value displayed only thinner than the average value of the thickness of the resin molded product 82.

表2示出了表1所示的數值的最大值及最小值、以及所述最大值與最小值之差。如表2所示，樹脂成形品82的厚度的最大值為+0.003mm，樹脂成形品82的厚度的最小值為-0.003mm。因此，最大值與最小值之差為0.006mm。 Table 2 shows the maximum and minimum values of the values shown in Table 1, and the difference between the maximum and minimum values. As shown in Table 2, the maximum value of the thickness of the resin molded product 82 is +0.003 mm, and the minimum value of the thickness of the resin molded product 82 is -0.003 mm. Therefore, the difference between the maximum value and the minimum value is 0.006 mm.

Figure 107137653-A0305-02-0013-2
Figure 107137653-A0305-02-0013-2

圖12示出了表1所示的樹脂成形品82的A列~E列這五列的區域中的樹脂成形品82的厚度的變化。如圖12所示，確認 到存在樹脂成形品82的中央的C列及兩端的A列及E列的厚度與B列及D列的區域相比變厚的傾向。 FIG. 12 shows the change in the thickness of the resin molded product 82 in the five-column area of the columns A to E of the resin molded product 82 shown in Table 1. As shown in Figure 12, confirm The thickness of the row C in the center and the rows A and E at both ends of the resin molded product 82 tends to be thicker than the area in the rows B and D.

圖13表示對除未配備第1壓板加熱器18而未通過第1壓板加熱器18對第1壓板11進行加熱以外利用實施方式的樹脂成形品的製造方法製造的參考例的樹脂成形品的表面的平坦性進行測定的結果。表3與表1對應，表4與表2對應，圖13與圖12對應。 13 shows a surface of a resin molded product of a reference example manufactured by the method for manufacturing a resin molded product of the embodiment except that the first platen heater 18 is not provided and the first platen 11 is not heated by the first platen heater 18; The flatness was measured. Table 3 corresponds to Table 1, Table 4 corresponds to Table 2, and Figure 13 corresponds to Figure 12.

Figure 107137653-A0305-02-0014-3
Figure 107137653-A0305-02-0014-3

Figure 107137653-A0305-02-0014-4
Figure 107137653-A0305-02-0014-4

如表3及表4所示，參考例的樹脂成形品的厚度的最大值為+0.007mm，厚度的最小值為-0.004mm，最大值與最小值之差為0.011mm。而且，如圖13所示，在參考例的樹脂成形品中，確認到E列的區域局部地變厚的傾向。 As shown in Tables 3 and 4, the maximum value of the thickness of the resin molded product of the reference example is +0.007 mm, the minimum value of the thickness is -0.004 mm, and the difference between the maximum value and the minimum value is 0.011 mm. Furthermore, as shown in FIG. 13, in the resin molded article of the reference example, the tendency of the area of column E to locally become thick was confirmed.

根據以上結果，確認到：在第1壓板11配備有第1壓板加熱器18的實施方式的樹脂成形品的製造裝置1中，通過在製造 樹脂成形品時利用第1壓板加熱器18對第1壓板11進行加熱，可製造厚度的偏差少的樹脂成形品82。 From the above results, it was confirmed that in the apparatus 1 for manufacturing a resin molded product of the embodiment in which the first platen 11 is equipped with the first platen heater 18, the When molding a resin, the first platen heater 18 is heated by the first platen heater 18, and a resin molded article 82 with a small variation in thickness can be manufactured.

另外，在所述實施方式的樹脂成形品的製造方法中，未利用第2壓板加熱器19對第2壓板12進行加熱。然而，在通過第1壓板加熱器18對第1壓板11進行了加熱並且通過第2壓板加熱器19對第2壓板12進行了加熱的情況下，可抑制第1壓板11的變形並且也可抑制第2壓板12的變形，所以能夠製造厚度的偏差更少的樹脂成形品82。 In addition, in the method for manufacturing a resin molded product of the above embodiment, the second platen heater 12 is not heated by the second platen heater 19. However, in the case where the first platen 11 is heated by the first platen heater 18 and the second platen 12 is heated by the second platen heater 19, the deformation of the first platen 11 can be suppressed and also suppressed The deformation of the second pressure plate 12 makes it possible to manufacture the resin molded product 82 with less variation in thickness.

圖14表示實施方式的樹脂成形品的製造裝置的變形例的示意性的正視圖。圖14所示的樹脂成形品的製造裝置1的特徵在於包括：第1壓板11與第2壓板12之間的中間板91；第3模具支架93，設於中間板91的第1壓板11側，以對第3模具(未圖示)進行保持的方式構成；以及第4模具支架94，設於中間板91的第2壓板12側，以對第4模具(未圖示)進行保持的方式構成。 FIG. 14 shows a schematic front view of a modification of the apparatus for manufacturing a resin molded product of the embodiment. The manufacturing apparatus 1 for a resin molded product shown in FIG. 14 is characterized by including an intermediate plate 91 between the first platen 11 and the second platen 12 and a third mold holder 93 provided on the intermediate plate 91 on the side of the first platen 11 , Configured to hold the third mold (not shown); and the fourth mold holder 94 is provided on the second platen 12 side of the intermediate plate 91 to hold the fourth mold (not shown) constitute.

圖15表示圖14所示的樹脂成形品的製造裝置1的示意性的放大剖面圖。第3模具支架93在中間板91側包括第3隔熱構件102，並且在第1壓板11側的第3加熱板103中包括以對具有模腔97的第3模具96進行加熱的方式構成的第3模具支架加熱器105。而且，第3模具支架93在比第3隔熱構件102更靠近中間板91側包括第3板101，並且包括從第3隔熱構件102的邊緣朝鉛垂上方延伸的第3側壁104。在本實施方式中，第3加熱板103包括彼此空開間隔在水平方向上延伸的四根第3模具支架加熱器105。 FIG. 15 shows a schematic enlarged cross-sectional view of the apparatus 1 for manufacturing a resin molded product shown in FIG. 14. The third mold holder 93 includes a third heat insulating member 102 on the intermediate plate 91 side, and includes a third heating plate 103 on the first platen 11 side configured to heat the third mold 96 having a cavity 97 The third mold holder heater 105. Further, the third mold holder 93 includes the third plate 101 closer to the intermediate plate 91 than the third heat insulating member 102 and includes a third side wall 104 extending vertically upward from the edge of the third heat insulating member 102. In the present embodiment, the third heating plate 103 includes four third mold holder heaters 105 extending in the horizontal direction with a space therebetween.

第4模具支架94在中間板91側包括第4隔熱構件112，並且在第2壓板12側的第4加熱板113中包括以對第4模具98進行加熱的方式構成的第4模具支架加熱器115。而且，第4模具支架94在比第4隔熱構件112更靠近中間板91側包括第4板111，並且包括從第4隔熱構件112的邊緣朝鉛垂下方延伸的第4側壁114。在本實施方式中，第4加熱板113包括彼此空開間隔在水平方向上延伸的四根第4模具支架加熱器115。 The fourth mold holder 94 includes a fourth heat insulating member 112 on the intermediate plate 91 side, and includes a fourth mold holder heating configured to heat the fourth mold 98 in the fourth heating plate 113 on the second platen 12 side器115. Furthermore, the fourth mold holder 94 includes a fourth plate 111 on the intermediate plate 91 side of the fourth heat insulating member 112 and a fourth side wall 114 extending vertically downward from the edge of the fourth heat insulating member 112. In the present embodiment, the fourth heating plate 113 includes four fourth mold holder heaters 115 extending in the horizontal direction with an interval therebetween.

圖16表示實施方式的樹脂成形品的製造裝置的另一變形例的局部示意性的放大正視圖。圖16所示的樹脂成形品的製造裝置1的特徵在於，在第1壓板11的下表面設置有切口123，並且在第1壓板11的上表面設置有階差122及傾斜面121。在此情況下，可在對第1模具41與第2模具42進行合模時，利用切口123緩和第1壓板11所受的應力，所以可進一步抑制製造樹脂成形品82時第1壓板11的變形。因此，能夠製造厚度的偏差更少的樹脂成形品82。 FIG. 16 shows a partially schematic enlarged front view of another modification of the apparatus for manufacturing a resin molded product of the embodiment. The manufacturing apparatus 1 for a resin molded product shown in FIG. 16 is characterized in that a cutout 123 is provided on the lower surface of the first platen 11 and a step 122 and an inclined surface 121 are provided on the upper surface of the first platen 11. In this case, when the first mold 41 and the second mold 42 are clamped, the notch 123 can be used to relax the stress received by the first platen 11, so that the first platen 11 can be further suppressed when the resin molded product 82 is manufactured. Deformed. Therefore, the resin molded product 82 with less variation in thickness can be manufactured.

另外，在圖16所示的樹脂成形品的製造裝置中，切口123例如能夠以包圍第1模具支架14的方式構成。而且，在圖16所示的樹脂成形品的製造裝置中，傾斜面121能夠以從階差122起朝外側並朝斜下方延伸的方式構成。 In addition, in the apparatus for manufacturing a resin molded product shown in FIG. 16, the notch 123 can be configured to surround the first mold holder 14, for example. In addition, in the apparatus for manufacturing a resin molded product shown in FIG. 16, the inclined surface 121 can be configured to extend outward and diagonally downward from the step 122.

在圖16所示的樹脂成形品的製造裝置1中，切口123的外側端部124處的第1壓板11的鉛垂方向的厚度a變得比切口123的內側端部125處的第1壓板11的鉛垂方向的厚度b薄。在本實 施方式中，切口123的外側端部124處的第1壓板11的厚度a是指從第1壓板11的下表面的切口123的外側端部124起至第1壓板11的上表面為止的厚度a。而且，在本實施方式中，切口123的內側端部125處的第1壓板11的厚度b是指從第1壓板11的下表面的切口123的內側端部125起至第1壓板11的上表面為止的厚度b。 In the apparatus 1 for manufacturing a resin molded product shown in FIG. 16, the vertical thickness a of the first platen 11 at the outer end 124 of the cutout 123 becomes larger than the first platen at the inner end 125 of the cutout 123 The thickness b of 11 in the vertical direction is thin. In reality In the embodiment, the thickness a of the first pressure plate 11 at the outer end 124 of the notch 123 refers to the thickness from the outer end 124 of the notch 123 on the lower surface of the first pressure plate 11 to the upper surface of the first pressure plate 11 a. In the present embodiment, the thickness b of the first pressure plate 11 at the inner end 125 of the notch 123 refers to the upper end of the first pressure plate 11 from the inner end 125 of the notch 123 on the lower surface of the first pressure plate 11. Thickness b up to the surface.

圖17表示利用第1壓板加熱器18對第1壓板11進行加熱來製造樹脂成形品時的圖16所示的樹脂成形品的製造裝置1的溫度分佈。而且，圖18表示除未利用第1壓板加熱器18對第1壓板11進行加熱以外其餘以與圖17所示的情況相同的方式來製造樹脂成形品時的參考例的樹脂成形品的溫度分佈。根據圖17與圖18的比較可明確，可瞭解到：圖17所示的樹脂成形品的製造裝置1的溫度分佈比圖18所示的溫度分佈變得均勻。 FIG. 17 shows the temperature distribution of the resin molded product manufacturing apparatus 1 shown in FIG. 16 when the first press plate heater 18 heats the first press plate 11 to produce a resin molded product. 18 shows the temperature distribution of the resin molded product of the reference example when the resin molded product is manufactured in the same manner as in the case shown in FIG. 17 except that the first platen heater 18 is not used to heat the first platen 11 . From the comparison between FIG. 17 and FIG. 18, it is clear that the temperature distribution of the resin molded product manufacturing apparatus 1 shown in FIG. 17 is more uniform than the temperature distribution shown in FIG. 18.

圖19表示實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。圖19所示的實施方式的樹脂成形品的製造裝置1與圖16所示的實施方式的樹脂成形品的製造裝置1的不同點在於，第1壓板11的上表面變平坦。 FIG. 19 shows a schematic perspective view of another modification of the apparatus for manufacturing a resin molded article of the embodiment. The manufacturing apparatus 1 for a resin molded product of the embodiment shown in FIG. 19 is different from the manufacturing apparatus 1 for a resin molded product of the embodiment shown in FIG. 16 in that the upper surface of the first platen 11 is flattened.

圖20表示實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。圖20所示的實施方式的樹脂成形品的製造裝置1與圖16所示的實施方式的樹脂成形品的製造裝置1的不同點在於，在第1壓板11的上表面未設置傾斜面121。 FIG. 20 shows a schematic perspective view of another modification of the apparatus for manufacturing a resin molded article of the embodiment. The resin molded product manufacturing apparatus 1 of the embodiment shown in FIG. 20 is different from the resin molded product manufacturing apparatus 1 of the embodiment shown in FIG. 16 in that the inclined surface 121 is not provided on the upper surface of the first pressure plate 11.

圖21表示實施方式的樹脂成形品的製造裝置的另一變形 例的示意性的立體圖。圖21所示的實施方式的樹脂成形品的製造裝置1與圖16所示的實施方式的樹脂成形品的製造裝置1的不同點在於，在第1壓板11的上表面未設置階差122，而設置有凹進部127。 21 shows another modification of the apparatus for manufacturing a resin molded product of the embodiment A schematic perspective view of an example. 21 is different from the resin molded product manufacturing apparatus 1 of the embodiment shown in FIG. 16 in that the step 122 is not provided on the upper surface of the first pressure plate 11, Instead, a recess 127 is provided.

圖22表示實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。圖22所示的實施方式的樹脂成形品的製造裝置1與圖21所示的實施方式的樹脂成形品的製造裝置1的不同點在於，在第1壓板11的上表面設置有階差122來代替傾斜面121。 22 shows a schematic perspective view of another modification of the apparatus for manufacturing a resin molded product of the embodiment. The resin molded product manufacturing apparatus 1 of the embodiment shown in FIG. 22 differs from the resin molded product manufacturing apparatus 1 of the embodiment shown in FIG. 21 in that a step 122 is provided on the upper surface of the first pressure plate 11. Instead of the inclined surface 121.

圖23表示實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。圖23所示的實施方式的樹脂成形品的製造裝置1與圖16所示的實施方式的樹脂成形品的製造裝置1的不同點在於，加厚了第1壓板11的厚度。 FIG. 23 shows a schematic perspective view of another modification of the apparatus for manufacturing a resin molded product of the embodiment. The manufacturing apparatus 1 for a resin molded product of the embodiment shown in FIG. 23 differs from the manufacturing apparatus 1 for a resin molded product of the embodiment shown in FIG. 16 in that the thickness of the first pressure plate 11 is increased.

圖24表示實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。圖24所示的實施方式的樹脂成形品的製造裝置1與圖21所示的實施方式的樹脂成形品的製造裝置1的不同點在於，在第1壓板11的上表面未設置凹進部127。 FIG. 24 shows a schematic perspective view of another modification of the apparatus for manufacturing a resin molded article of the embodiment. The manufacturing apparatus 1 for a resin molded product of the embodiment shown in FIG. 24 differs from the manufacturing apparatus 1 for a resin molded product of the embodiment shown in FIG. 21 in that no recessed portion 127 is provided on the upper surface of the first pressure plate 11 .

圖25表示實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。圖25所示的實施方式的樹脂成形品的製造裝置1與圖23所示的實施方式的樹脂成形品的製造裝置1的不同點在於，在第1壓板11的上表面設置有凹進部127。 FIG. 25 shows a schematic perspective view of another modification of the apparatus for manufacturing a resin molded article of the embodiment. The resin molded product manufacturing apparatus 1 of the embodiment shown in FIG. 25 differs from the resin molded product manufacturing apparatus 1 of the embodiment shown in FIG. 23 in that a recessed portion 127 is provided on the upper surface of the first pressure plate 11 .

圖26表示實施方式的樹脂成形品的製造裝置的另一變形例的示意性的立體圖。圖26所示的實施方式的樹脂成形品的製造 裝置1與圖23所示的實施方式的樹脂成形品的製造裝置1的不同點在於，在第1壓板11的上表面設置有兩個圓柱狀的突起126。 FIG. 26 shows a schematic perspective view of another modification of the apparatus for manufacturing a resin molded product of the embodiment. Manufacturing of the resin molded product of the embodiment shown in FIG. 26 The device 1 is different from the resin molded product manufacturing device 1 of the embodiment shown in FIG. 23 in that two cylindrical protrusions 126 are provided on the upper surface of the first pressure plate 11.

另外，在圖19~圖26中，為了方便說明，省略了內置於第1壓板11中的第1壓板加熱器18的記載，但圖19~圖26所示的實施方式的樹脂成形品的製造裝置1也包括內置於第1壓板11中的第1壓板加熱器18。因此，在圖19~圖26所示的實施方式的樹脂成形品的製造裝置1中，也可通過在製造樹脂成形品82時利用第1壓板加熱器18對第1壓板11進行加熱而抑制第1壓板11的變形，因此，可抑制樹脂成形品82的厚度的偏差。 In addition, in FIGS. 19 to 26, for convenience of description, the description of the first platen heater 18 built into the first platen 11 is omitted, but the production of the resin molded product of the embodiment shown in FIGS. 19 to 26 is omitted. The device 1 also includes a first platen heater 18 built into the first platen 11. Therefore, in the apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIGS. 19 to 26, the first platen heater 11 can be heated by the first platen heater 18 when manufacturing the resin molded article 82 to suppress the first The deformation of the pressure plate 11 can suppress variations in the thickness of the resin molded product 82.

而且，作為圖6中所示的實施方式的樹脂成形系統的變形例，可例示不使用收納模塊1003，而將樹脂成形品收納裝置203設置在供給模塊1001內的實施方式。在此情況下，一個搬送機構可將支撐構件51從供給模塊1001供給至樹脂密封模塊1002中，並且將利用樹脂成形品的製造裝置1進行製造後的樹脂成形品82再次收納在供給模塊1001內的樹脂成形品收納裝置203中。 In addition, as a modification of the resin molding system of the embodiment shown in FIG. 6, an embodiment in which the resin molded product storage device 203 is provided in the supply module 1001 without using the storage module 1003 can be exemplified. In this case, one conveying mechanism can supply the support member 51 from the supply module 1001 to the resin-sealed module 1002, and store the resin molded product 82 manufactured by the resin molded product manufacturing apparatus 1 in the supply module 1001 again. In the resin molded product storage device 203.

而且，作為圖6中所示的實施方式的樹脂成形系統的變形例，也可以例示將樹脂材料供給裝置202設置在收納模塊1003內的實施方式。在此情況下，未圖示的搬送機構可將脫模膜52與樹脂材料61從收納模塊1003一併供給至設置在樹脂密封模塊1002中的樹脂成形品的製造裝置1中，並且在利用樹脂成形品的製造裝置1製造樹脂成形品82後，此搬送機構可回收脫模膜52。 Furthermore, as a modification of the resin molding system of the embodiment shown in FIG. 6, an embodiment in which the resin material supply device 202 is provided in the storage module 1003 may also be exemplified. In this case, a conveying mechanism (not shown) can supply the release film 52 and the resin material 61 from the storage module 1003 to the resin molded product manufacturing apparatus 1 provided in the resin sealing module 1002, and use the resin After the molded product manufacturing apparatus 1 manufactures the resin molded product 82, this transport mechanism can collect the release film 52.

如以上述對實施方式進行了說明，但將所述各實施方式 的結構適宜組合也從最初進行了預定。 The embodiments have been described as above, but each of the above embodiments The suitable combination of the structure was also scheduled from the beginning.

對本發明的實施方式進行了說明，但本次所揭示的實施方式應認為在所有方面均為例示而非進行限制者。本發明的範圍由申請專利範圍表示，且意圖包含與申請專利範圍均等的含義及範圍內的所有變更。 The embodiment of the present invention has been described, but the embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is indicated by the scope of patent application, and is intended to include all modifications within the meaning and scope equivalent to the scope of patent application.

產業上的可利用性 Industrial availability

根據本文中揭示的實施方式，可提供一種樹脂成形品的製造裝置、樹脂成形系統以及樹脂成形品的製造方法。 According to the embodiments disclosed herein, it is possible to provide a resin molded product manufacturing apparatus, a resin molding system, and a resin molded product manufacturing method.

1‧‧‧樹脂成形品的製造裝置 1‧‧‧Manufacturer of resin molded products

11‧‧‧第1壓板 11‧‧‧ 1st pressure plate

12‧‧‧第2壓板 12‧‧‧ 2nd pressure plate

13‧‧‧第3壓板 13‧‧‧The third pressure plate

14‧‧‧第1模具支架 14‧‧‧The first mold support

15‧‧‧第2模具支架 15‧‧‧Second mold support

16‧‧‧驅動機構 16‧‧‧Drive mechanism

17‧‧‧型壓框架 17‧‧‧Type pressure frame

18‧‧‧第1壓板加熱器 18‧‧‧The first platen heater

19‧‧‧第2壓板加熱器 19‧‧‧ 2nd platen heater

Claims (9)

一種樹脂成形品的製造裝置，包括：第1壓板；第1模具支架，設於所述第1壓板，以對第1模具進行保持的方式構成；以及第2壓板，以與所述第1壓板相向的方式與所述第1壓板空開間隔而配置，所述第1模具支架在所述第1壓板側包括第1隔熱構件，並且在所述第2壓板側包括以對所述第1模具進行加熱的方式構成的第1模具支架加熱器，所述第1壓板包括以對所述第1壓板進行加熱的方式構成的第1壓板加熱器。 An apparatus for manufacturing a resin molded product, comprising: a first pressure plate; a first mold holder provided on the first pressure plate and configured to hold the first mold; and a second pressure plate to communicate with the first pressure plate The first mold holder includes a first heat insulating member on the side of the first pressure plate, and includes a first heat plate on the side of the second pressure plate. In a first mold holder heater configured to heat a mold, the first platen includes a first platen heater configured to heat the first platen. 如申請專利範圍第1項所述的樹脂成形品的製造裝置，還包括：第2模具支架，設於所述第2壓板，以對第2模具進行保持的方式構成，所述第2模具支架在所述第2壓板側包括第2隔熱構件，並且在所述第1壓板側包括以對所述第2模具進行加熱的方式構成的第2模具支架加熱器。 The apparatus for manufacturing a resin molded product according to item 1 of the patent application scope further includes: a second mold holder provided on the second pressure plate and configured to hold the second mold, and the second mold holder A second heat insulating member is included on the second platen side, and a second mold holder heater configured to heat the second mold is included on the first platen side. 如申請專利範圍第1項所述的樹脂成形品的製造裝置，其中，所述第2壓板包括以對所述第2壓板進行加熱的方式構成的第2壓板加熱器。 The apparatus for manufacturing a resin molded product according to item 1 of the patent application range, wherein the second platen includes a second platen heater configured to heat the second platen. 如申請專利範圍第3項所述的樹脂成形品的製造裝置，其中，所述第2壓板加熱器位於與所述第1壓板加熱器相向的位置或所述位置的外側。 The apparatus for manufacturing a resin molded product according to item 3 of the patent application range, wherein the second platen heater is located at a position facing the first platen heater or outside the position. 如申請專利範圍第1項所述的樹脂成形品的製造裝置，其中，包括：所述第1壓板與所述第2壓板之間的中間板；第3模具支架，設於所述中間板的所述第1壓板側，以對第3模具進行保持的方式構成；以及第4模具支架，設於所述中間板的所述第2壓板側，以對第4模具進行保持的方式構成，所述第3模具支架在所述中間板側包括第3隔熱構件，並且在所述第1壓板側包括以對所述第3模具進行加熱的方式構成的第3模具支架加熱器，所述第4模具支架在所述中間板側包括第4隔熱構件，並且在所述第2壓板側包括以對所述第4模具進行加熱的方式構成的第4模具支架加熱器。 The apparatus for manufacturing a resin molded product according to item 1 of the patent application scope, which includes: an intermediate plate between the first pressure plate and the second pressure plate; and a third mold holder provided on the intermediate plate The first platen side is configured to hold the third mold; and the fourth mold holder is provided on the second platen side of the intermediate plate and is configured to hold the fourth mold. The third mold holder includes a third heat insulating member on the intermediate plate side, and includes a third mold holder heater configured to heat the third mold on the first platen side, the third The 4-die holder includes a fourth heat insulating member on the intermediate plate side, and includes a fourth die holder heater configured to heat the fourth mold on the second platen side. 如申請專利範圍第1項所述的樹脂成形品的製造裝置，其中，在所述第1壓板的所述第2壓板側設置有切口，所述切口的外側的端部處的所述第1壓板的厚度比所述切口的內側的端部處的所述第1壓板的厚度薄。 The apparatus for manufacturing a resin molded product according to item 1 of the patent application range, wherein a cutout is provided on the second platen side of the first platen, and the first The thickness of the pressure plate is thinner than the thickness of the first pressure plate at the inner end of the cut. 如申請專利範圍第1項至第6項中任一項所述的樹脂成形品的製造裝置，其中，在所述第1壓板的與所述第2壓板相反的一側，設置有選自階差、傾斜及凹進部所組成的群組中的至少一者。 The apparatus for manufacturing a resin molded product according to any one of claims 1 to 6, wherein the side of the first pressure plate opposite to the second pressure plate is provided with a step At least one of the group consisting of difference, slope, and recess. 一種樹脂成形系統，包括如申請專利範圍第1項至第7項中任一項所述的樹脂成形品的製造裝置。 A resin molding system including the apparatus for manufacturing a resin molded article as described in any one of the patent application items 1 to 7. 一種樹脂成形品的製造方法，其使用如申請專利範圍第1項至第7項中任一項所述的樹脂成形品的製造裝置，所述樹脂成形品的製造裝置包括第2模具支架，設於所述第2壓板，以對第2模具進行保持的方式構成，所述樹脂成形品的製造方法包括：對所述第1模具設置支撐構件的步驟；對所述第2模具的模腔供給樹脂材料的步驟；對所述支撐構件進行加熱的步驟；對所述樹脂材料進行加熱的步驟；以及進行所述第1模具與所述第2模具的合模的步驟，還包括利用所述第1壓板加熱器對所述第1壓板進行加熱的步驟。 A method for manufacturing a resin molded product using the apparatus for manufacturing a resin molded product as described in any one of claims 1 to 7, the resin molded product manufacturing apparatus including a second mold holder, provided The second pressure plate is configured to hold the second mold, and the method for manufacturing the resin molded product includes: a step of providing a support member to the first mold; and supplying the cavity of the second mold A step of resin material; a step of heating the support member; a step of heating the resin material; and a step of closing the first mold and the second mold, further including using the first 1 Step for heating the first platen by the platen heater.
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