JP6371816B2 - Semiconductor device manufacturing method and semiconductor manufacturing apparatus - Google Patents

Semiconductor device manufacturing method and semiconductor manufacturing apparatus Download PDF

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Publication number
JP6371816B2
JP6371816B2 JP2016215430A JP2016215430A JP6371816B2 JP 6371816 B2 JP6371816 B2 JP 6371816B2 JP 2016215430 A JP2016215430 A JP 2016215430A JP 2016215430 A JP2016215430 A JP 2016215430A JP 6371816 B2 JP6371816 B2 JP 6371816B2
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resin
mold
sheet
semiconductor chip
recess
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JP2017034286A (en
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竹識 前田
竹識 前田
雅敏 川戸
雅敏 川戸
良二 松嶋
良二 松嶋
福田　昌利
昌利 福田
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Kioxia Corp
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Toshiba Memory Corp
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Description

本発明の実施形態は、半導体装置の製造方法、半導体製造装置、および樹脂封止用シー
ト状樹脂に関する。 Embodiments described herein relate generally to a method for manufacturing a semiconductor device, a semiconductor manufacturing apparatus, and a sheet-like resin for resin sealing.

半導体チップの樹脂封止方式の一つとして圧縮成形方式が知られている。圧縮成形方式
は、上型および下型に分かれた金型を用い、上型に封止する半導体チップを配置し、下型
に樹脂を配置し、上型と下型とを接近させ、溶融させた下側の樹脂に上側の半導体チップ
を浸漬させ、圧縮成形することにより樹脂封止を行う方式である。例えば、金型の側面か
ら樹脂を注入するトランスファ成形方式と比較して、圧縮成形方式は、半導体チップを樹
脂に浸漬させる際の樹脂流動量が少ないためワイヤが変形しにくく、また、半導体チップ
の表面全体に樹脂を行き渡らせやすいといった利点がある。 A compression molding method is known as one of resin sealing methods for semiconductor chips. The compression molding method uses a mold divided into an upper mold and a lower mold, a semiconductor chip to be sealed in the upper mold, a resin in the lower mold, the upper mold and the lower mold are brought close to each other and melted. In this method, the upper semiconductor chip is immersed in the lower resin and the resin is sealed by compression molding. For example, compared to the transfer molding method in which resin is injected from the side of the mold, the compression molding method has less resin flow when the semiconductor chip is immersed in the resin, so that the wire is less likely to be deformed. There is an advantage that the resin is easily spread over the entire surface.

上記圧縮成形方式の際に用いられる樹脂としては、例えば顆粒状樹脂やシート状樹脂な
どが挙げられる。特にシート状樹脂は、顆粒状樹脂よりも樹脂の厚さの均一性を高めるこ
とができ、例えば大型の基板を封止する場合にタクト（ｔａｋｔ ｔｉｍｅ）を向上させ
ることができるために好ましい。 Examples of the resin used in the compression molding method include granular resins and sheet resins. In particular, a sheet-like resin is more preferable than a granular resin because the uniformity of the thickness of the resin can be improved and, for example, when a large substrate is sealed, a takt time can be improved.

上記樹脂としてシート状樹脂を用いる場合、例えば圧縮成形時のシート状樹脂の溶融が
不均一となったり、また圧縮成形後にシミが発生することにより外観品質が低下すること
がある。また、上記溶融の不均一やシミは、例えば封止する半導体チップのサイズや数が
増大するにつれて発生しやすくなる。よって、圧縮成形方式では、シート状樹脂の溶融を
均一にし、シミによる外観品質の低下を抑制することが求められる。 When a sheet-shaped resin is used as the resin, for example, the melting of the sheet-shaped resin at the time of compression molding may become uneven, or the appearance quality may be deteriorated due to the occurrence of spots after compression molding. Further, the non-uniformity of melting and spots are likely to occur as the size and number of semiconductor chips to be sealed increase, for example. Therefore, in the compression molding method, it is required to make the sheet-like resin evenly melted and to suppress deterioration in appearance quality due to spots.

特開２００４−１４６５５６号公報JP 2004-146556 A

本発明が解決しようとする課題は、シート状樹脂の溶融の不均一およびシミによる外観
品質の低下の少なくとも一つを抑制することが可能な半導体装置の製造方法を提供するこ
とである。 The problem to be solved by the present invention is to provide a method of manufacturing a semiconductor device capable of suppressing at least one of non-uniform melting of a sheet-like resin and deterioration of appearance quality due to spots.

実施形態の半導体装置の製造方法は、貫通孔を含む凹部を有するシート状樹脂を用意する工程と、圧縮成形用の第１の型内に半導体チップが設けられた回路基材を配置する工程と、圧縮成形用の第２の型内に凹部を有するシート状樹脂を半導体チップと対向するように配置する工程と、凹部を有するシート状樹脂を加熱する工程と、第１の型と第２の型とを接近させ、加熱されて溶融した溶融樹脂に半導体チップを浸漬させて圧縮成形を行うことにより、半導体チップを前記溶融樹脂の硬化物で封止する工程と、を具備し、前記凹部を有するシート状樹脂を用意する工程は、前記半導体チップの封止に必要な樹脂の量に基づいて供給源となる樹脂の一部から分離された樹脂に対して、一部をくり抜いて前記凹部を複数形成し、前記分離された樹脂の量を前記必要な樹脂の量となるように微調整する工程を具備する。前記凹部の体積は前記分離された樹脂を前記第２の型に配置する際に残存する空気の気泡の体積よりも小さく、前記複数の凹部の間隔は前記空気の気泡の幅よりも狭い。 The method for manufacturing a semiconductor device according to the embodiment includes a step of preparing a sheet-like resin having a recess including a through hole, a step of arranging a circuit substrate provided with a semiconductor chip in a first mold for compression molding, and A step of disposing a sheet-shaped resin having a recess in the second mold for compression molding so as to face the semiconductor chip, a step of heating the sheet-shaped resin having a recess, a first mold and a second mold Sealing the semiconductor chip with a cured product of the molten resin by immersing the semiconductor chip in a molten resin that has been heated and melted and performing compression molding, The step of preparing a sheet-shaped resin having a recess is formed by hollowing out a part of the resin separated from a part of the resin serving as a supply source based on the amount of resin necessary for sealing the semiconductor chip. Multiple formed and separated Comprising the step of fine adjustment to the amount of fat Amount of the required resin. The volume of the recess is smaller than the volume of air bubbles remaining when the separated resin is placed in the second mold, and the interval between the plurality of recesses is narrower than the width of the air bubbles.

第１の実施形態における半導体製造装置および半導体装置の製造方法を示す模式図である。It is a schematic diagram which shows the semiconductor manufacturing apparatus and the manufacturing method of a semiconductor device in 1st Embodiment. 第２の実施形態におけるシート状樹脂の例を示す図である。It is a figure which shows the example of the sheet-like resin in 2nd Embodiment. 第２の実施形態におけるシート状樹脂の例を示す図である。It is a figure which shows the example of the sheet-like resin in 2nd Embodiment. 第２の実施形態におけるシート状樹脂の例を示す図である。It is a figure which shows the example of the sheet-like resin in 2nd Embodiment. 第２の実施形態におけるシート状樹脂の例を示す図である。It is a figure which shows the example of the sheet-like resin in 2nd Embodiment.

以下、実施形態の半導体装置について、図面を参照して説明する。   The semiconductor device of the embodiment will be described below with reference to the drawings.

（第１の実施形態）
図１は、実施形態の半導体製造装置および半導体装置の製造方法を示す模式図である。
図１に示す半導体製造装置は、樹脂加工部３１と、圧縮成形部３２と、基板（回路基材）
搬送部３３と、樹脂搬送部３４と、を具備する。 (First embodiment)
FIG. 1 is a schematic diagram illustrating a semiconductor manufacturing apparatus and a semiconductor device manufacturing method according to an embodiment.
The semiconductor manufacturing apparatus shown in FIG. 1 includes a resin processing part 31, a compression molding part 32, and a substrate (circuit base material).
A transport unit 33 and a resin transport unit 34 are provided.

樹脂加工部３１では、半導体チップ１８の封止に必要な樹脂の量を計量し、計量した樹
脂の量に基づいて供給源となる樹脂１０の一部を分離する。さらに、樹脂加工部３１では
、分離したシート状樹脂１に凹部を形成することにより凹部２を有するシート状樹脂１を
形成する。 The resin processing unit 31 measures the amount of resin necessary for sealing the semiconductor chip 18 and separates a part of the resin 10 serving as a supply source based on the measured amount of resin. Furthermore, in the resin processing part 31, the sheet-like resin 1 which has the recessed part 2 is formed by forming a recessed part in the separated sheet-like resin 1. FIG.

供給源となる樹脂１０としては、例えば板状樹脂またはロール状樹脂を用いることがで
きる。板状樹脂またはロール状樹脂の場合、分離する樹脂の長さによって樹脂の量を調整
することができる。図１では、一例としてロール状樹脂を用いた場合について図示してい
る。樹脂１０としては、エポキシ樹脂組成物、シリコーン樹脂組成物、ポリイミド樹脂組
成物等が挙げられる。なお、封止に必要な樹脂量に加工された板状樹脂を樹脂１０として
樹脂加工部３１に供給してもよい。 As the resin 10 serving as the supply source, for example, a plate-shaped resin or a roll-shaped resin can be used. In the case of plate-shaped resin or roll-shaped resin, the amount of resin can be adjusted by the length of the resin to be separated. In FIG. 1, the case where roll-shaped resin is used is illustrated as an example. Examples of the resin 10 include an epoxy resin composition, a silicone resin composition, a polyimide resin composition, and the like. In addition, you may supply the plate-shaped resin processed into the resin amount required for sealing to the resin processing part 31 as the resin 10. FIG.

シート状樹脂１の凹部２は、例えば凹部形成器２０を用いて形成される。凹部形成器２
０は、例えば図１に示すように、凸部が設けられた構造であって該凸部でシート状樹脂１
を押圧することにより凹部２を形成してもよい。なお、これに限定されず、例えば凹部形
成器２０を複数の凸部を有するローラーとし、ローラーでシート状樹脂１を延伸させつつ
該凸部で押圧することにより凹部２を形成してもよい。また、凹部形成器２０の構造を、
シート状樹脂１の一部をくり抜くことができる構造にし、シート状樹脂１の一部をくり抜
くことにより凹部を形成してもよい。例えば、多品種の半導体装置を製造する場合、半導
体チップのサイズや数によって封止に必要な樹脂量が変化する。このような場合、シート
状樹脂１の一部をくり抜いて凹部を形成することにより、必要な樹脂の量になるようにシ
ート状樹脂１の量を調節してもよい。加工されたシート状樹脂１を樹脂加工部３１に供給
する場合、凹部２により樹脂量を調整することは有効である。シート状樹脂１を加工して
樹脂量を調整することにより、シート状樹脂１の量の微調整が可能になるため、封止の際
に余分な樹脂を少なくすることができ、また製造コストを抑えることができる。 The recess 2 of the sheet-like resin 1 is formed using, for example, a recess forming device 20. Concave formation device 2
For example, as shown in FIG. 1, 0 is a structure in which a convex portion is provided.
You may form the recessed part 2 by pressing. In addition, it is not limited to this, For example, you may form the recessed part 2 by making the recessed part formation device 20 into the roller which has a some convex part, and pressing the sheet-like resin 1 with this roller, extending | stretching with the convex part. Also, the structure of the recess forming device 20 is
The structure may be such that a part of the sheet-like resin 1 can be hollowed out, and the concave part may be formed by hollowing out a part of the sheet-like resin 1. For example, when manufacturing various types of semiconductor devices, the amount of resin required for sealing varies depending on the size and number of semiconductor chips. In such a case, the amount of the sheet-like resin 1 may be adjusted so as to be a necessary amount of resin by hollowing out a part of the sheet-like resin 1 to form a recess. When the processed sheet-like resin 1 is supplied to the resin processing portion 31, it is effective to adjust the resin amount by the recess 2. By processing the sheet-like resin 1 and adjusting the amount of resin, the amount of the sheet-like resin 1 can be finely adjusted, so that excess resin can be reduced during sealing, and the manufacturing cost can be reduced. Can be suppressed.

凹部２は、特に限定されないが、例えば貫通孔または非貫通穴の少なくとも一方を有す
ることが好ましい。圧縮成形時において、シート状樹脂１の溶融が不均一となったり、ま
た圧縮成形後に大きなシミが発生することにより外観品質が低下する現象が、シート状樹
脂１と圧縮成形用の型との間に残存する比較的大きな気泡に起因することが明らかとなっ
た。これに対し、例えば凹部２として貫通孔を設けることにより、圧縮成形の際にシート
状樹脂１の下の気泡を逃がすことができる。凹部２として非貫通穴を設けることにより、
圧縮成形の際にシート状樹脂１の下に残存する気泡を分散させることができる。図１では
、一例として非貫通穴である複数の凹部２を有する場合について図示している。 Although the recessed part 2 is not specifically limited, For example, it is preferable to have at least one of a through hole or a non-through hole. During compression molding, the phenomenon that the appearance quality deteriorates due to non-uniform melting of the sheet-shaped resin 1 or generation of large spots after compression molding occurs between the sheet-shaped resin 1 and the compression molding mold. It was revealed that this was caused by relatively large bubbles remaining in the film. On the other hand, for example, by providing a through-hole as the concave portion 2, bubbles under the sheet-like resin 1 can escape during compression molding. By providing a non-through hole as the recess 2,
Air bubbles remaining under the sheet-like resin 1 during compression molding can be dispersed. In FIG. 1, the case where it has the some recessed part 2 which is a non-through hole as an example is illustrated.

圧縮成形部３２は、圧縮成形用の型１２および型１３を用いた圧縮成形型と、圧縮成形
型を加熱するヒーター１４と、を有する。型１２および型１３によりキャビティが形成さ
れる。また、キャビティ部分の側面にはキャビティブロック１６が設けられる。圧縮成形
部３２では、型１２と型１３とを接近させて圧縮成形を行うことにより、半導体チップ１
８をシート状樹脂１で封止する。なお、図１では、型１２内に半導体チップ１８が設けら
れた基板１９を配置し、型１３内に凹部２を有するシート状樹脂１を配置する例について
示しているが、これに限定されず、型１２内に凹部２を有するシート状樹脂１を配置し、
型１３内に半導体チップ１８が設けられた基板１９を配置してもよい。 The compression molding unit 32 includes a compression molding die using the compression molding die 12 and the die 13 and the heater 14 for heating the compression molding die. A cavity is formed by the mold 12 and the mold 13. A cavity block 16 is provided on the side surface of the cavity portion. In the compression molding unit 32, the semiconductor chip 1 is obtained by performing compression molding by bringing the mold 12 and the mold 13 close to each other.
8 is sealed with the sheet-like resin 1. Although FIG. 1 shows an example in which the substrate 19 provided with the semiconductor chip 18 is disposed in the mold 12 and the sheet-like resin 1 having the recess 2 is disposed in the mold 13, the present invention is not limited thereto. The sheet-like resin 1 having the recess 2 is placed in the mold 12,
A substrate 19 provided with a semiconductor chip 18 may be disposed in the mold 13.

基板搬送部３３では、半導体チップ１８が設けられた基板１９を型１２および型１３の
一方（第１の型）内に配置する。なお、基板１９としては、例えば配線基板やリードフレ
ーム等の回路基材を用いることができる。また、半導体チップ１８は、内部配線を介して
回路基材と金属ワイヤ等に電気的に接続されていてもよい。基板搬送部３３には、例えば
基板１９の搬送が可能なロボットアーム等を設けてもよい。 In the substrate transport unit 33, the substrate 19 provided with the semiconductor chip 18 is arranged in one of the mold 12 and the mold 13 (first mold). In addition, as the board | substrate 19, circuit base materials, such as a wiring board and a lead frame, can be used, for example. Further, the semiconductor chip 18 may be electrically connected to a circuit substrate and a metal wire or the like via an internal wiring. The substrate transport unit 33 may be provided with, for example, a robot arm that can transport the substrate 19.

樹脂搬送部３４では、半導体チップ１８に対向するように、凹部２を有するシート状樹
脂１を型１２および型１３の他方（第２の型）内に配置する。なお、凹部２が貫通孔を有
する場合、第２の型に接する面がシート状樹脂１のどちらの面であってもよく、また、凹
部２が非貫通穴を有する場合も、第２の型に接する面がシート状樹脂１のどちらの面であ
ってもよい。例えば、第２の型とシート状樹脂１との間に残存する気泡に基づくシート状
樹脂１の溶融の不均一化やシミの発生等を抑制するためには、シート状樹脂１の凹部２が
形成された面が第２の型に接するように配置されることが好ましい。樹脂搬送部３４には
、例えばシート状樹脂１の搬送が可能なロボットアーム等を設けてもよい。 In the resin transport section 34, the sheet-like resin 1 having the recess 2 is disposed in the other of the mold 12 and the mold 13 (second mold) so as to face the semiconductor chip 18. In addition, when the recessed part 2 has a through-hole, the surface which contact | connects a 2nd type | mold may be any surface of the sheet-like resin 1, and also when the recessed part 2 has a non-through-hole, it is 2nd type | mold. Any surface of the sheet-like resin 1 may be in contact with the surface. For example, in order to suppress non-uniform melting of the sheet-shaped resin 1 based on bubbles remaining between the second mold and the sheet-shaped resin 1, the occurrence of spots, etc., the concave portion 2 of the sheet-shaped resin 1 is provided. It is preferable that the formed surface is arranged so as to contact the second mold. For example, a robot arm capable of transporting the sheet-like resin 1 may be provided in the resin transport unit 34.

次に、半導体装置の製造方法例について図１を参照して説明する。本実施形態の半導体
装置の製造方法は、計量・加工工程、搬送工程、圧縮成形工程に大きく分けることができ
る。なお、上記半導体製造装置を用いて半導体装置を製造する場合には、該半導体製造装
置に制御部を設け、制御部により各工程の動作を制御するものとする。 Next, an example of a method for manufacturing a semiconductor device will be described with reference to FIG. The manufacturing method of the semiconductor device according to the present embodiment can be roughly divided into a weighing / processing step, a conveying step, and a compression molding step. When a semiconductor device is manufactured using the semiconductor manufacturing apparatus, a control unit is provided in the semiconductor manufacturing apparatus, and the operation of each process is controlled by the control unit.

まず、計量・加工工程では、半導体チップ１８の封止に必要な樹脂の量を計量し、供給
源となる樹脂１０から樹脂の一部を分離する。分離したシート状樹脂１に凹部２を形成す
ることにより、凹部２を有するシート状樹脂１を形成する。このとき、凹部形成器２０に
よりシート状樹脂１の一部をくり抜くことにより樹脂の量を調節してもよい。なお、樹脂
加工部３１を設けずに別で凹部２を有するシート状樹脂を予め用意してもよい。 First, in the weighing / processing step, the amount of resin necessary for sealing the semiconductor chip 18 is measured, and a part of the resin is separated from the resin 10 serving as a supply source. By forming the recessed part 2 in the separated sheet-like resin 1, the sheet-like resin 1 having the recessed part 2 is formed. At this time, you may adjust the quantity of resin by hollowing out a part of sheet-like resin 1 with the recessed part formation device 20. FIG. In addition, you may prepare beforehand the sheet-like resin which has the recessed part 2 separately, without providing the resin process part 31. FIG.

次に、搬送工程では、基板搬送部３３を経由して半導体チップ１８が設けられた基板１
９を圧縮成形部３２における第１の型（型１２および型１３の一方）内に配置する。樹脂
搬送部３４までは例えばベルトコンベア等を用いてシート状樹脂１を搬送してもよい。樹
脂搬送部３４を経由してシート状樹脂１を圧縮成形部３２における第２の型（型１２およ
び型１３の他方）内に配置する。このとき、凹部２を有する面を下にし、かつシート状樹
脂１が半導体チップ１８に対向するように、シート状樹脂１を第２の型に配置する。 Next, in the transfer process, the substrate 1 on which the semiconductor chip 18 is provided via the substrate transfer unit 33.
9 is disposed in the first mold (one of the mold 12 and the mold 13) in the compression molding section 32. You may convey the sheet-like resin 1 to the resin conveyance part 34 using a belt conveyor etc., for example. The sheet-like resin 1 is disposed in the second mold (the other of the mold 12 and the mold 13) in the compression molding section 32 via the resin transport section 34. At this time, the sheet-shaped resin 1 is disposed in the second mold so that the surface having the concave portion 2 faces down and the sheet-shaped resin 1 faces the semiconductor chip 18.

次に、圧縮成形工程では、ヒーター１４により型１２および型１３を加熱し、シート状
樹脂１を溶融することにより溶融樹脂を形成する。さらに、型１２と型１３とを接近させ
ることにより半導体チップ１８を溶融樹脂に浸漬させて圧縮成形を行う。半導体チップ１
８を溶融樹脂の硬化物で封止する。樹脂による封止後、ダイシングを行うことで半導体チ
ップ１８毎に個片化することにより半導体装置を得ることができる。 Next, in the compression molding step, the mold 12 and the mold 13 are heated by the heater 14 to melt the sheet-like resin 1 to form a molten resin. Further, the mold 12 and the mold 13 are brought close to each other so that the semiconductor chip 18 is immersed in the molten resin and compression molding is performed. Semiconductor chip 1
8 is sealed with a cured product of molten resin. After sealing with resin, dicing is performed to separate each semiconductor chip 18 to obtain a semiconductor device.

搬送工程でシート状樹脂１を第２の型に配置した際、図１に示すように、第２の型とシ
ート状樹脂１との間に空気の気泡５０が残存する場合がある。シート状樹脂１を溶融させ
る際の加熱により気泡５０が膨張してしまうと、圧縮成形時に気泡５０により熱伝導が変
化しシート状樹脂１の溶融が不均一となり、また圧縮成形後に大きなシミが発生すること
により外観品質が低下する。本実施形態では、シート状樹脂１に凹部２を形成しているた
め、貫通孔により気泡５０を外部に逃がしたり、非貫通穴により気泡５０を複数の凹部２
に分散し、気泡５０を小さくすることができる。よって、圧縮成形後に生じるシミによる
影響を小さくすることができるため、外観品質を向上させることができる。 When the sheet-shaped resin 1 is arranged in the second mold in the conveying step, air bubbles 50 may remain between the second mold and the sheet-shaped resin 1 as shown in FIG. If the bubbles 50 expand due to heating when the sheet-shaped resin 1 is melted, the heat conduction changes due to the bubbles 50 during compression molding, and the melting of the sheet-shaped resin 1 becomes non-uniform, and large spots are generated after compression molding. Doing so reduces the appearance quality. In the present embodiment, since the concave portion 2 is formed in the sheet-like resin 1, the bubbles 50 are allowed to escape to the outside through the through holes, or the bubbles 50 are formed into the plurality of concave portions 2 through the non-through holes.
The bubbles 50 can be reduced. Therefore, since the influence by the stain which arises after compression molding can be made small, appearance quality can be improved.

（第２の実施形態）
図２ないし図６は、圧縮成形による樹脂封止用シート状樹脂としての凹部２を有するシ
ート状樹脂１の例を示す図である。なお、凹部２を有するシート状樹脂１は、例えば第１
の実施形態の凹部２を有するシート状樹脂１として用いることができる。 (Second Embodiment)
2-6 is a figure which shows the example of the sheet-like resin 1 which has the recessed part 2 as a sheet-like resin for resin sealing by compression molding. In addition, the sheet-like resin 1 having the recess 2 is, for example, the first
It can use as the sheet-like resin 1 which has the recessed part 2 of embodiment.

図２（Ａ）は、シート状樹脂１の一例の上面を示す上面図であり、図２（Ｂ−１）ない
し図２（Ｂ−５）のそれぞれは、図２（Ａ）における線分Ａ−Ｂの断面の一例を示す断面
図である。 2A is a top view showing an upper surface of an example of the sheet-like resin 1, and each of FIGS. 2B-1 to 2B-5 is a line segment A in FIG. It is sectional drawing which shows an example of the cross section of -B.

図２（Ａ）に示すように、シート状樹脂１は、複数の凹部２を有する。凹部２は、図２
（Ｂ−１）に示すように、貫通孔であってもよい。また、図２（Ｂ−２）に示すように、
凹部２が貫通孔であって貫通孔の径が深さ方向に小さくなっていてもよい。また、図２（
Ｂ−３）に示すように、凹部２が非貫通穴であって非貫通穴の径が深さ方向に狭くなって
いてもよい。また、図２（Ｂ−４）に示すように、凹部２が非貫通穴であって非貫通穴の
径が深さ方向に狭くなり、かつ非貫通穴の周縁が***していてもよい。また、図２（Ｂ−
５）に示すように、凹部２は、非貫通穴であって非貫通穴の底面が曲面であってもよい。 As shown in FIG. 2A, the sheet-like resin 1 has a plurality of recesses 2. The recess 2 is shown in FIG.
As shown in (B-1), it may be a through hole. In addition, as shown in FIG.
The recess 2 may be a through hole, and the diameter of the through hole may be reduced in the depth direction. In addition, FIG.
As shown in B-3), the recess 2 may be a non-through hole, and the diameter of the non-through hole may be narrowed in the depth direction. Further, as shown in FIG. 2 (B-4), the recess 2 may be a non-through hole, the diameter of the non-through hole may be narrowed in the depth direction, and the periphery of the non-through hole may be raised. In addition, FIG.
As shown in 5), the recess 2 may be a non-through hole and the bottom surface of the non-through hole may be a curved surface.

また、凹部２の体積は、シート状樹脂１を圧縮成形部３２の型１３に配置した際に残存
する空気の気泡の体積よりも小さいことが好ましい。また、複数の凹部２の間隔は、空気
の気泡の幅よりも狭いことが好ましい。これにより、残存する空気の気泡が一つの凹部２
のみに溜まらずに複数の凹部２に分散しやすくなり、残存する空気の気泡を小さくするこ
とができる。よって、圧縮成形後に生じるシミによる影響を小さくすることができるため
、外観品質を向上させることができる。 The volume of the recess 2 is preferably smaller than the volume of air bubbles remaining when the sheet-like resin 1 is disposed in the mold 13 of the compression molding section 32. Moreover, it is preferable that the space | interval of the some recessed part 2 is narrower than the width | variety of the bubble of air. As a result, the remaining air bubbles become one recess 2.
It becomes easy to disperse | distribute to the several recessed part 2 without accumulating only, and the bubble of the remaining air can be made small. Therefore, since the influence by the stain which arises after compression molding can be made small, appearance quality can be improved.

さらに、図２（Ａ）において、複数の凹部２の形状および配置間隔が均一であるがこれ
に限定されない。図３（Ａ）ないし図３（Ｃ）のそれぞれは、シート状樹脂１における上
面の他の例を示す上面図である。 Further, in FIG. 2A, the shape and arrangement interval of the plurality of recesses 2 are uniform, but the present invention is not limited to this. Each of FIGS. 3A to 3C is a top view illustrating another example of the top surface of the sheet-like resin 1.

図３（Ａ）に示すように、複数の凹部２の位置は不均一であってもよい。また、図３（
Ｂ）に示すように、複数の凹部２の径は不均一であってもよく、例えば中心部の凹部２ａ
の径を周縁部の凹部２ｂの径よりも大きくしてもよい。これによって、中心部に残存しや
すい空気の気泡を凹部２ａおよび凹部２ｂに逃がしやすくすることができるため、残存す
る空気の気泡を分散させて気泡を小さくすることができる。また、図３（Ｃ）に示すよう
に、中心部の凹部２の数を周縁部の凹部２の数よりも多くしてもよい。これによって、中
心部に発生しやすい残存する空気の気泡を凹部２に逃がしやすくすることができるため、
気泡による影響を小さくすることができる。また、周縁部の凹部２の数が少ない分、シー
ト状樹脂１の熱伝導性を高めることができる。 As shown in FIG. 3A, the positions of the plurality of recesses 2 may be non-uniform. In addition, FIG.
As shown in B), the diameters of the plurality of recesses 2 may be non-uniform, for example, the recess 2a at the center.
The diameter may be larger than the diameter of the recess 2b at the peripheral edge. Accordingly, air bubbles that are likely to remain in the central portion can be easily released to the recesses 2a and 2b, so that the remaining air bubbles can be dispersed to reduce the bubbles. Moreover, as shown in FIG.3 (C), you may increase the number of the recessed parts 2 of a center part from the number of the recessed parts 2 of a peripheral part. As a result, it is possible to make it easier for the remaining air bubbles that are likely to be generated in the central portion to escape to the concave portion 2,
The influence of air bubbles can be reduced. Moreover, the thermal conductivity of the sheet-like resin 1 can be increased by the amount of the number of recesses 2 at the peripheral edge.

また、シート状樹脂１は、図２および図３に示す構成に限定されない。図４（Ａ）は、
シート状樹脂１の他の例の上面を示す上面図であり、図４（Ｂ−１）ないし図４（Ｂ−３
）のそれぞれは、図４（Ａ）における線分Ｃ−Ｄの断面の一例を示す断面図である。 Moreover, the sheet-like resin 1 is not limited to the structure shown in FIG. 2 and FIG. FIG. 4 (A)
It is a top view which shows the upper surface of the other example of the sheet-like resin 1, and is FIG. 4 (B-1) thru | or FIG. 4 (B-3).
) Are cross-sectional views showing an example of the cross section of the line segment CD in FIG.

図４（Ａ）に示すように、シート状樹脂１は、縦横に交差するように延在する格子状に
設けられた凹部２を有する。凹部２は、図４（Ｂ−１）に示すように、溝であって溝の幅
が深さ方向に狭くなっていてもよい。また、図４（Ｂ−２）に示すように、凹部２が溝で
あって溝の幅が深さ方向に狭くなり、かつ溝の周縁が***してもよい。また、図４（Ｂ−
３）に示すように、凹部２が溝であって溝の底面が曲面であってもよい。なお、溝の幅は
不均一であってもよい。 As shown in FIG. 4A, the sheet-like resin 1 has recesses 2 provided in a lattice shape extending so as to intersect vertically and horizontally. As shown in FIG. 4 (B-1), the recess 2 is a groove, and the width of the groove may be narrowed in the depth direction. Further, as shown in FIG. 4B-2, the recess 2 may be a groove, the width of the groove may be narrowed in the depth direction, and the periphery of the groove may be raised. In addition, FIG.
As shown in 3), the recess 2 may be a groove, and the bottom surface of the groove may be a curved surface. The groove width may be non-uniform.

さらに、図４（Ａ）において、凹部２が縦横に交差する格子状に形成されているがこれ
に限定されない。図５（Ａ）ないし図５（Ｃ）のそれぞれは、シート状樹脂１における上
面の他の例を示す上面図である。図５（Ａ）に示すように、凹部２を縦方向に延在する格
子状に複数設けてもよい。また、図５（Ｂ）に示すように、斜め方向に延在する格子状に
複数設けてもよい。また、図５（Ｃ）に示すように、斜め方向に延在する２方向の直線が
交差する格子状に凹部２を設けてもよい。 Further, in FIG. 4A, the recesses 2 are formed in a lattice shape that intersects vertically and horizontally, but the present invention is not limited to this. Each of FIG. 5A to FIG. 5C is a top view illustrating another example of the top surface of the sheet-like resin 1. As shown in FIG. 5A, a plurality of the recesses 2 may be provided in a lattice shape extending in the vertical direction. Further, as shown in FIG. 5B, a plurality may be provided in a lattice shape extending in an oblique direction. Further, as shown in FIG. 5C, the recesses 2 may be provided in a lattice shape in which two straight lines extending in an oblique direction intersect.

シート状樹脂１に凹部を設けることにより、圧縮成形部の型に配置する際に発生する残
存気泡を分散させ、気泡を小さくすることができる。よって、圧縮成形後に生じるシミに
よる影響を小さくすることができるため、外観品質を向上させることができる。 By providing the concave portion in the sheet-like resin 1, it is possible to disperse the remaining bubbles generated when the sheet-shaped resin 1 is arranged in the mold of the compression molding portion, and to reduce the bubbles. Therefore, since the influence by the stain which arises after compression molding can be made small, appearance quality can be improved.

なお、本発明のいくつかの実施形態を説明したが、これらの実施形態は例として提示し
たものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、
その他の様々な形態で実施し得るものであり、発明の要旨を逸脱しない範囲で、種々の省
略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要
旨に含まれると共に、特許請求の範囲に記載された発明とその均等の範囲に含まれる。 In addition, although several embodiment of this invention was described, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments are:
Various other forms can be implemented, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

１…シート状樹脂、２…凹部、２ａ…凹部、２ｂ…凹部、１０…樹脂、１２…型、１３
…型、１４…ヒーター、１８…半導体チップ、１９…基板、２０…凹部形成器、３１…樹
脂加工部、３２…圧縮成形部、３３…基板搬送部、３４…樹脂搬送部、５０…気泡。 DESCRIPTION OF SYMBOLS 1 ... Sheet-like resin, 2 ... Recessed part, 2a ... Recessed part, 2b ... Recessed part, 10 ... Resin, 12 ... Mold, 13
DESCRIPTION OF SYMBOLS ... Type | mold, 14 ... Heater, 18 ... Semiconductor chip, 19 ... Substrate, 20 ... Concave formation device, 31 ... Resin processing part, 32 ... Compression molding part, 33 ... Substrate conveyance part, 34 ... Resin conveyance part, 50 ... Air bubbles.

Claims (8)

貫通孔を含む凹部を有するシート状樹脂を用意する工程と、
圧縮成形用の第１の型内に半導体チップが設けられた回路基材を配置する工程と、
圧縮成形用の第２の型内に前記凹部を有するシート状樹脂を前記半導体チップと対向するように配置する工程と、
前記凹部を有するシート状樹脂を加熱する工程と、
前記第１の型と前記第２の型とを接近させ、加熱されて溶融した溶融樹脂に前記半導体チップを浸漬させて圧縮成形を行うことにより、前記半導体チップを前記溶融樹脂の硬化物で封止する工程と、を具備し、
前記凹部を有するシート状樹脂を用意する工程は、
前記半導体チップの封止に必要な樹脂の量に基づいて供給源となる樹脂の一部から分離された樹脂に対して、一部をくり抜いて前記凹部を複数形成し、前記分離された樹脂の量を前記必要な樹脂の量となるように微調整する工程を具備し、
前記凹部の体積は前記分離された樹脂を前記第２の型に配置する際に残存する空気の気泡の体積よりも小さく、前記複数の凹部の間隔は前記空気の気泡の幅よりも狭い半導体装置の製造方法。 Preparing a sheet-like resin having a recess including a through hole;
Placing a circuit substrate provided with a semiconductor chip in a first mold for compression molding;
Disposing a sheet-like resin having the recess in the second mold for compression molding so as to face the semiconductor chip;
Heating the sheet-shaped resin having the recesses;
The semiconductor chip is sealed with a cured product of the molten resin by bringing the first mold and the second mold close to each other and immersing the semiconductor chip in a molten resin heated and melted to perform compression molding. A process of stopping,
The step of preparing a sheet-like resin having the concave portion
The resin separated from a part of the resin serving as a supply source based on the amount of the resin necessary for sealing the semiconductor chip is hollowed out to form a plurality of the recesses. comprising the step of fine adjustment to the amount amount of the required resin,
The volume of the recess is smaller than the volume of air bubbles remaining when the separated resin is disposed in the second mold, and the interval between the plurality of recesses is narrower than the width of the air bubbles. Manufacturing method. 前記供給源となる樹脂は板状樹脂またはロール状樹脂で有り、前記凹部を有するシート状樹脂を用意する工程は、前記分離される樹脂の長さにより前記分離される樹脂の量を調整する工程を具備する請求項１の半導体装置の製造方法。   The resin serving as the supply source is a plate-shaped resin or a roll-shaped resin, and the step of preparing the sheet-shaped resin having the concave portion is a step of adjusting the amount of the separated resin according to the length of the separated resin. A method of manufacturing a semiconductor device according to claim 1. 前記凹部を複数形成する工程は、
前記複数の凹部が形成されるシート状樹脂の面の中心部に形成される前記凹部の径を周辺部の凹部の径よりも大きく形成することを備える請求項１に記載の半導体装置の製造方法。 The step of forming a plurality of the recesses includes:
2. The method of manufacturing a semiconductor device according to claim 1, further comprising forming a diameter of the recess formed in a central portion of a surface of the sheet-like resin in which the plurality of recesses are formed larger than a diameter of the recess in the peripheral portion. . 非貫通穴を含む凹部を有するシート状樹脂を用意する工程と、
圧縮成形用の第１の型内に半導体チップが設けられた回路基材を配置する工程と、
圧縮成形用の第２の型内に前記凹部を有するシート状樹脂が前記半導体チップと対向し、前記シート状樹脂の前記非貫通穴が形成された面が前記第２の型と接するように配置する工程と、
前記凹部を有するシート状樹脂を加熱する工程と、
前記第１の型と前記第２の型とを接近させ、加熱されて溶融した溶融樹脂に前記半導体チップを浸漬させて圧縮成形を行うことにより、前記半導体チップを前記溶融樹脂の硬化物で封止する工程と、を具備し、
前記凹部を有するシート状樹脂を用意する工程は、
前記半導体チップの封止に必要な樹脂の量に基づいて供給源となる樹脂の一部から分離された樹脂に対して、凹部形成器に備えられた凸部で押圧することにより前記凹部を複数形成する工程を具備し、
前記凹部の体積は前記分離された樹脂を前記第２の型に配置する際に残存する空気の気泡の体積よりも小さく、前記複数の凹部の間隔は前記空気の気泡の幅よりも狭い半導体装置の製造方法。 Preparing a sheet-like resin having a recess including a non-through hole;
Placing a circuit substrate provided with a semiconductor chip in a first mold for compression molding;
As the sheet-like resin having the recess in the second mold for compression molding is opposed to the semiconductor chip, the non-through hole is formed a surface of the sheet-like resin is contact with the second mold Arranging, and
Heating the sheet-shaped resin having the recesses;
The semiconductor chip is sealed with a cured product of the molten resin by bringing the first mold and the second mold close to each other and immersing the semiconductor chip in a molten resin heated and melted to perform compression molding. A process of stopping,
The step of preparing a sheet-like resin having the concave portion
A plurality of the recesses are formed by pressing the resin separated from a part of the resin serving as a supply source based on the amount of the resin necessary for sealing the semiconductor chip with a protrusion provided in the recess forming device. Comprising the step of forming,
The volume of the recess is smaller than the volume of air bubbles remaining when the separated resin is disposed in the second mold, and the interval between the plurality of recesses is narrower than the width of the air bubbles. Manufacturing method. 前記供給源となる樹脂は板状樹脂またはロール状樹脂で有り、前記凹部を有するシート状樹脂を用意する工程は、前記分離される樹脂の長さにより前記分離される樹脂の量を調整する工程を具備する請求項４の半導体装置の製造方法。   The resin serving as the supply source is a plate-shaped resin or a roll-shaped resin, and the step of preparing the sheet-shaped resin having the concave portion is a step of adjusting the amount of the separated resin according to the length of the separated resin. A method for manufacturing a semiconductor device according to claim 4, comprising: 前記凹部を複数形成する工程は、
前記複数の凹部が形成されるシート状樹脂の面の中心部に形成される前記凹部の径を周辺部の凹部の径よりも大きく形成することを備える請求項４に記載の半導体装置の製造方法。 The step of forming a plurality of the recesses includes:
5. The method of manufacturing a semiconductor device according to claim 4, further comprising forming a diameter of the concave portion formed at a central portion of the surface of the sheet-like resin on which the plurality of concave portions are formed larger than a diameter of the concave portion at the peripheral portion. . シート状樹脂に貫通孔を含む凹部を形成する樹脂加工部と、
第１の型および第２の型を有する圧縮成形型と、前記圧縮成形型を加熱する加熱部とを備え、前記第１の型と前記第２の型とを接近させて圧縮成形することにより、前記シート状樹脂で半導体チップを封止する圧縮成形部と、
前記半導体チップが設けられた回路基材を、前記第１の型内に配置する回路基材搬送部と、
前記凹部を有するシート状樹脂を、前記半導体チップと対向するように前記第２の型内に配置する樹脂搬送部と、
を具備し、
前記樹脂加工部は、
前記半導体チップの封止に必要な樹脂の量に基づいて供給源となる樹脂の一部から分離された樹脂に対して、一部をくり抜いて前記凹部を複数形成し、前記分離された樹脂の量の微調整し、
前記凹部の体積は前記シート状樹脂を前記第２の型に配置する際に残存する空気の気泡の体積よりも小さく、前記複数の凹部の間隔は前記空気の気泡の幅よりも狭い半導体製造装置。 A resin processed part that forms a recess including a through hole in the sheet-like resin;
A compression mold having a first mold and a second mold; and a heating section for heating the compression mold; and compression molding by bringing the first mold and the second mold closer to each other , A compression molding part for sealing the semiconductor chip with the sheet-like resin,
A circuit base material transport unit for disposing the circuit base material provided with the semiconductor chip in the first mold;
A resin-conveying section that arranges the sheet-shaped resin having the concave portion in the second mold so as to face the semiconductor chip;
Comprising
The resin processing part is
The resin separated from a part of the resin serving as a supply source based on the amount of the resin necessary for sealing the semiconductor chip is hollowed out to form a plurality of the recesses. Tweak the amount ,
The volume of the recess is smaller than the volume of air bubbles remaining when the sheet-like resin is disposed in the second mold, and the interval between the plurality of recesses is narrower than the width of the air bubbles. . 前記供給源となる樹脂は板状樹脂またはロール状樹脂で有り、前記樹脂加工部は、前記分離される樹脂の長さにより前記分離される樹脂の量を調整する請求項７に記載の半導体製造装置。The semiconductor manufacturing according to claim 7, wherein the supply source resin is a plate-shaped resin or a roll-shaped resin, and the resin processing unit adjusts the amount of the separated resin according to a length of the separated resin. apparatus.
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