TW201908266A - 附有密封材料層封裝基體之製造方法及氣密封裝之製造方法 - Google Patents

附有密封材料層封裝基體之製造方法及氣密封裝之製造方法 Download PDF

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Publication number
TW201908266A
TW201908266A TW107122237A TW107122237A TW201908266A TW 201908266 A TW201908266 A TW 201908266A TW 107122237 A TW107122237 A TW 107122237A TW 107122237 A TW107122237 A TW 107122237A TW 201908266 A TW201908266 A TW 201908266A
Authority
TW
Taiwan
Prior art keywords
sealing material
material layer
manufacturing
sealing
substrate
Prior art date
Application number
TW107122237A
Other languages
English (en)
Chinese (zh)
Inventor
廣瀬将行
Original Assignee
日商日本電氣硝子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本電氣硝子股份有限公司 filed Critical 日商日本電氣硝子股份有限公司
Publication of TW201908266A publication Critical patent/TW201908266A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
TW107122237A 2017-07-14 2018-06-28 附有密封材料層封裝基體之製造方法及氣密封裝之製造方法 TW201908266A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017137680A JP7047270B2 (ja) 2017-07-14 2017-07-14 封着材料層付きパッケージ基体の製造方法及び気密パッケージの製造方法
JP2017-137680 2017-07-14

Publications (1)

Publication Number Publication Date
TW201908266A true TW201908266A (zh) 2019-03-01

Family

ID=65002459

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107122237A TW201908266A (zh) 2017-07-14 2018-06-28 附有密封材料層封裝基體之製造方法及氣密封裝之製造方法

Country Status (3)

Country Link
JP (1) JP7047270B2 (ja)
TW (1) TW201908266A (ja)
WO (1) WO2019013009A1 (ja)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4556624B2 (ja) * 2004-11-12 2010-10-06 日本電気硝子株式会社 封着用粉末および封着用ペースト
JP5370011B2 (ja) 2009-08-31 2013-12-18 旭硝子株式会社 封着材料層付きガラス部材の製造方法と電子デバイスの製造方法
JP2012041196A (ja) * 2010-08-12 2012-03-01 Asahi Glass Co Ltd 封着材料層付きガラス部材とそれを用いた電子デバイスおよびその製造方法
JPWO2012117978A1 (ja) * 2011-02-28 2014-07-07 旭硝子株式会社 気密部材とその製造方法
JP5733279B2 (ja) 2012-07-30 2015-06-10 日立化成株式会社 電子部品及びその製法、並びにそれに用いる封止材料ペースト
WO2014092013A1 (ja) 2012-12-10 2014-06-19 旭硝子株式会社 封着材料、封着材料層付き基板、積層体および電子デバイス
JP6237989B2 (ja) 2013-07-24 2017-11-29 日本電気硝子株式会社 電気素子パッケージの製造方法及び電気素子パッケージ
JP2016027610A (ja) 2014-06-27 2016-02-18 旭硝子株式会社 パッケージ基板、パッケージ、および電子デバイス
TWI686968B (zh) 2015-02-26 2020-03-01 日商日本電氣硝子股份有限公司 氣密封裝及其製造方法
JP6493798B2 (ja) 2015-05-28 2019-04-03 日本電気硝子株式会社 気密パッケージの製造方法

Also Published As

Publication number Publication date
JP7047270B2 (ja) 2022-04-05
WO2019013009A1 (ja) 2019-01-17
JP2019021716A (ja) 2019-02-07

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