TW201908266A - 附有密封材料層封裝基體之製造方法及氣密封裝之製造方法 - Google Patents
附有密封材料層封裝基體之製造方法及氣密封裝之製造方法 Download PDFInfo
- Publication number
- TW201908266A TW201908266A TW107122237A TW107122237A TW201908266A TW 201908266 A TW201908266 A TW 201908266A TW 107122237 A TW107122237 A TW 107122237A TW 107122237 A TW107122237 A TW 107122237A TW 201908266 A TW201908266 A TW 201908266A
- Authority
- TW
- Taiwan
- Prior art keywords
- sealing material
- material layer
- manufacturing
- sealing
- substrate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017137680A JP7047270B2 (ja) | 2017-07-14 | 2017-07-14 | 封着材料層付きパッケージ基体の製造方法及び気密パッケージの製造方法 |
JP2017-137680 | 2017-07-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201908266A true TW201908266A (zh) | 2019-03-01 |
Family
ID=65002459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107122237A TW201908266A (zh) | 2017-07-14 | 2018-06-28 | 附有密封材料層封裝基體之製造方法及氣密封裝之製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7047270B2 (ja) |
TW (1) | TW201908266A (ja) |
WO (1) | WO2019013009A1 (ja) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4556624B2 (ja) * | 2004-11-12 | 2010-10-06 | 日本電気硝子株式会社 | 封着用粉末および封着用ペースト |
JP5370011B2 (ja) | 2009-08-31 | 2013-12-18 | 旭硝子株式会社 | 封着材料層付きガラス部材の製造方法と電子デバイスの製造方法 |
JP2012041196A (ja) * | 2010-08-12 | 2012-03-01 | Asahi Glass Co Ltd | 封着材料層付きガラス部材とそれを用いた電子デバイスおよびその製造方法 |
JPWO2012117978A1 (ja) * | 2011-02-28 | 2014-07-07 | 旭硝子株式会社 | 気密部材とその製造方法 |
JP5733279B2 (ja) | 2012-07-30 | 2015-06-10 | 日立化成株式会社 | 電子部品及びその製法、並びにそれに用いる封止材料ペースト |
WO2014092013A1 (ja) | 2012-12-10 | 2014-06-19 | 旭硝子株式会社 | 封着材料、封着材料層付き基板、積層体および電子デバイス |
JP6237989B2 (ja) | 2013-07-24 | 2017-11-29 | 日本電気硝子株式会社 | 電気素子パッケージの製造方法及び電気素子パッケージ |
JP2016027610A (ja) | 2014-06-27 | 2016-02-18 | 旭硝子株式会社 | パッケージ基板、パッケージ、および電子デバイス |
TWI686968B (zh) | 2015-02-26 | 2020-03-01 | 日商日本電氣硝子股份有限公司 | 氣密封裝及其製造方法 |
JP6493798B2 (ja) | 2015-05-28 | 2019-04-03 | 日本電気硝子株式会社 | 気密パッケージの製造方法 |
-
2017
- 2017-07-14 JP JP2017137680A patent/JP7047270B2/ja active Active
-
2018
- 2018-06-28 WO PCT/JP2018/024616 patent/WO2019013009A1/ja active Application Filing
- 2018-06-28 TW TW107122237A patent/TW201908266A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP7047270B2 (ja) | 2022-04-05 |
WO2019013009A1 (ja) | 2019-01-17 |
JP2019021716A (ja) | 2019-02-07 |
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