TW201828401A

TW201828401A - Apparatus for picking up a semiconductor chip

Info

Publication number: TW201828401A
Application number: TW106140856A
Authority: TW
Inventors: 呂亨彬; 李龍玹; 李在壹; 李赫柱
Original assignee: 南韓細美事有限公司
Priority date: 2016-11-30
Filing date: 2017-11-24
Publication date: 2018-08-01
Also published as: TWI680530B; KR20180062066A; KR101896800B1

Abstract

An apparatus includes a nozzle body having a hollow extending along a longitudinal direction and being configured to vacuum adsorb a semiconductor chip using a vacuum force delivered to the hollow, an ejecting pin movably inserted into the hollow, the ejecting pin being configured to push downward the semiconductor chip to separate the semiconductor chip from the nozzle body, when releasing the vacuum force in the hollow and a plurality of magnets disposed in the hollow, the magnets being configured to apply a magnetic force to the ejecting pin to move downward the ejecting pin from inside of the hollow to outside of the hollow, when releasing the vacuum force in the hollow. As described above, the apparatus uses the durability and strong stain-resistant magnets for downward movement of the ejecting pin, thereby being capable of preventing a malfunction of the ejecting pin to perform an operation for lowering the semiconductor chip stably.

Description

半導體芯片拾取設備Semiconductor chip picking equipment

本發明的示例性實施例涉及半導體芯片拾取設備。更具體地說，本發明涉及一種半導體芯片拾取設備，藉由切割過程將半導體芯片個體化，並藉由切割程序和分類程序對半導體芯片進行等級分類以便傳輸半導體芯片。An exemplary embodiment of the present invention relates to a semiconductor chip pickup apparatus. More specifically, the present invention relates to a semiconductor chip pick-up device that individualizes a semiconductor chip by a dicing process, and classifies the semiconductor chip by a dicing program and a classification program to transfer the semiconductor chip.

通常，可藉由對半導體晶片重複執行一系列半導體程序來形成半導體裝置。可藉由切割程序、晶粒黏著程序和模鑄程序形成半導體裝置，進而將半導體裝置製造成由多個半導體芯片組成的半導體帶。藉由鋸切以及分選程序將半導體帶分成多個個體化的半導體芯片，並分選為良品以及不良品。將半導體帶裝載到吸盤台，使用切割刀片執行切割和分選程序將半導體帶分割成多個半導體芯片，並且利用拾取裝置選擇性地拾取個體化的半導體芯片並將其清潔和乾燥。此後，可以將個體化的半導體芯片裝載在轉移台上並使用視覺模組來檢查，並且根據檢查結果將半導體芯片分類為良品與不良品的，並且將半導體芯片分別轉移到良品不良品的托盤。芯片轉移單元將半導體芯片由轉移台轉移到良品或不良品的托盤。芯片轉移單元包括用於真空吸附半導體芯片的多個芯片拾取器。芯片拾取器用於拾取半導體芯片和真空吸附半導體芯片的裝置。通常，半導體芯片的表面並非是平滑的，因為其表面上形成有電路圖案和焊球。因此，封裝拾取器的吸附表面與半導體芯片之間的真空可能會洩漏，並且可能會讓封裝拾取器的抽吸壓力降低，使得半導體芯片無法被穩定地真空吸附到封裝拾取器。為了防止這種情況，封裝拾取器可以設置有彈性墊，該彈性墊使得用來吸附半導體芯片的吸附表面與半導體芯片之間的附著度提高。彈性墊利用諸如海綿或橡膠的彈性材料製成，並可容易地附著到半導體芯片的表面。然而，即使釋放真空力而使得芯片拾取器將半導體芯片拾取至良品或不良品的托盤，彈性墊的附著性也會將半導體芯片保持在吸附狀態，而無法從封裝拾取器的吸附表面掉落。這可能會導致半導體芯片損壞或無法堆疊在托盤的適當位置上等問題。Generally, a semiconductor device can be formed by repeatedly performing a series of semiconductor processes on a semiconductor wafer. The semiconductor device can be formed by a cutting process, a die bonding process, and a die casting process, and then the semiconductor device can be manufactured into a semiconductor tape composed of a plurality of semiconductor chips. The semiconductor tape is divided into a plurality of individualized semiconductor chips by a sawing and sorting process, and is sorted into good and bad products. The semiconductor tape is loaded on a chuck table, the cutting and sorting procedure is performed using a dicing blade to divide the semiconductor tape into a plurality of semiconductor chips, and the individualized semiconductor chips are selectively picked up by a picking device and cleaned and dried. After that, the individualized semiconductor chips can be loaded on a transfer table and inspected using a vision module, and the semiconductor chips are classified into good and defective products according to the inspection results, and the semiconductor chips are respectively transferred to a tray of defective products. The chip transfer unit transfers semiconductor chips from a transfer table to a tray of good or defective products. The chip transfer unit includes a plurality of chip pickers for vacuum-absorbing a semiconductor chip. The chip picker is a device for picking up a semiconductor chip and a vacuum suction semiconductor chip. Generally, the surface of a semiconductor chip is not smooth because circuit patterns and solder balls are formed on the surface. Therefore, the vacuum between the suction surface of the package pickup and the semiconductor chip may leak, and the suction pressure of the package pickup may be reduced, so that the semiconductor chip cannot be stably vacuum-adsorbed to the package pickup. In order to prevent this, the packaging picker may be provided with an elastic pad, which improves the adhesion between the adsorption surface used to adsorb the semiconductor chip and the semiconductor chip. The elastic pad is made of an elastic material such as sponge or rubber, and can be easily attached to the surface of a semiconductor chip. However, even if the vacuum force is released and the chip picker picks up a semiconductor chip to a tray of good or bad products, the adhesiveness of the elastic pad will keep the semiconductor chip in an adsorbed state and cannot fall off the adsorption surface of the package picker. This can cause problems such as damage to the semiconductor chip or failure to stack it in place on the tray.

本發明的示例性實施例提供一種穩定拾取半導體芯片的設備，能夠藉由真空吸附改善與已被個體化的半導體芯片之間的附著度，將半導體芯片穩定地承載到托盤上。根據本發明的一個方面，提供一種半導體芯片拾取設備。該設備包括噴嘴主體、噴出銷與多個磁鐵。噴嘴主體具有沿著縱向方向延伸的中空部，噴嘴主體被配置成使用傳送至中空部的真空力來真空吸附半導體芯片。噴出銷可移動地***中空部，當中空部內的真空力被釋放，噴出銷被配置成向下推動半導體芯片，使半導體芯片從噴嘴主體脫離。多個磁鐵設置在中空部內，當中空部內的真空力被釋放，磁鐵被配置成施加磁力至噴出銷，使噴出銷由中空部內部向下移動至中空部外部。如上所述，設備使用耐久性和抗污性強的磁鐵使噴出銷向下運動，因此能防止噴射銷的故障，執行使半導體芯片穩定下降的操作。在示例性實施例中，設備進一步包括設置在中空部內的止動件，當噴出銷藉由磁鐵產生的磁力而下降時，止動件被配置成限制噴出銷的最低位置。此時，在垂直方向上，止動件覆蓋磁鐵。在示例性實施例中，磁鐵沿著中空部的內壁環狀設置。在示例性實施例中，磁鐵包括至少一個第一磁鐵與至少一個第二磁鐵，第一磁鐵覆蓋噴出銷並且固定在中空部的內壁，第二磁鐵設置在第一磁鐵之下並且固定在噴出銷的上表面，第二磁鐵與彼此相對的第一磁鐵具有相同的一極性，在第一磁鐵與第二磁鐵之間產生了互斥力。此時，其中多個第一磁鐵沿著中空部的內壁環狀設置。在示例性實施例中，噴出銷包括設置在中空部內的頭部以及活塞。活塞在噴嘴主體的縱向方向上從頭部延伸，當真空力被釋放，活塞被配置成與半導體芯片接觸並向下推動半導體芯片。此時，頭部包括多個穿孔用來提供從中空部傳送真空力至半導體芯片的路徑。在示例性實施例中，噴嘴主體包括真空孔，真空孔形成在噴嘴主體的吸附表面上並與中空孔連通，半導體芯片被真空吸附於吸附表面。當中空部內的真空力被釋放，噴出銷通過真空孔部分突出於噴嘴主體而向下推動半導體芯片。在示例性實施例中，設備進一步包括設置於噴嘴主體的吸附表面之下的吸盤，吸盤包括與真空孔連通的吸引孔，並且吸盤以彈性物質製成以提高對半導體芯片的附著度。在示例性實施例中，設備進一步包括視覺反射板，視覺反射板設置於噴嘴主體的吸附表面下方並且耦合於噴嘴主體，視覺反射板包括氣流孔，氣流孔與真空孔連通並且被配置成反射朝向視覺反射板的下表面照射的光。因此，如上所述，根據本發明示例性實施例，設備包括噴出銷與磁鐵，噴出銷能夠藉由使用物理力將半導體芯片下推使半導體芯片脫離噴嘴主體，磁鐵提供向下推動噴出銷的磁力以促進噴出銷的向下運動。特別地，由於相比於使用彈力推動物品的彈簧，磁鐵的耐久性和抗污染性更強，所以能夠防止噴出銷的錯誤操作，能夠穩定地進行使半導體芯片下降的放置操作。此外，止動件設置於設備中，以限制噴出銷的向下移動，藉此避免噴出銷對過度加壓半導體芯片而導致的半導體芯片損壞。Exemplary embodiments of the present invention provide a device for stably picking up semiconductor chips, which can improve the adhesion with the individualized semiconductor chips by vacuum suction, and stably carry the semiconductor chips on a tray. According to one aspect of the present invention, a semiconductor chip pickup device is provided. The device includes a nozzle body, an ejection pin, and a plurality of magnets. The nozzle body has a hollow portion extending in the longitudinal direction, and the nozzle body is configured to vacuum-suck the semiconductor chip using a vacuum force transmitted to the hollow portion. The ejection pin is movably inserted into the hollow portion, and the vacuum force in the hollow portion is released, and the ejection pin is configured to push the semiconductor chip downward to disengage the semiconductor chip from the nozzle body. A plurality of magnets are disposed in the hollow portion, the vacuum force in the hollow portion is released, and the magnet is configured to apply a magnetic force to the ejection pin, so that the ejection pin moves downward from the hollow portion to the outside of the hollow portion. As described above, the equipment uses a magnet with strong durability and anti-fouling property to move the ejection pin downward, so that the malfunction of the ejection pin can be prevented and the operation of stably lowering the semiconductor chip can be performed. In an exemplary embodiment, the apparatus further includes a stopper disposed in the hollow portion, and the stopper is configured to limit the lowest position of the ejection pin when the ejection pin is lowered by the magnetic force generated by the magnet. At this time, in the vertical direction, the stopper covers the magnet. In an exemplary embodiment, the magnet is provided annularly along the inner wall of the hollow portion. In an exemplary embodiment, the magnet includes at least one first magnet and at least one second magnet, the first magnet covers the ejection pin and is fixed to the inner wall of the hollow portion, and the second magnet is disposed below the first magnet and fixed to the ejection On the upper surface of the pin, the second magnet and the first magnet facing each other have the same polarity, and a mutual repulsive force is generated between the first magnet and the second magnet. At this time, the plurality of first magnets are arranged annularly along the inner wall of the hollow portion. In an exemplary embodiment, the ejection pin includes a head portion provided in the hollow portion and a piston. The piston extends from the head in the longitudinal direction of the nozzle body. When the vacuum force is released, the piston is configured to contact the semiconductor chip and push the semiconductor chip downward. At this time, the head includes a plurality of perforations to provide a path for transmitting a vacuum force from the hollow portion to the semiconductor chip. In an exemplary embodiment, the nozzle body includes a vacuum hole, the vacuum hole is formed on the adsorption surface of the nozzle body and communicates with the hollow hole, and the semiconductor chip is vacuum-adsorbed on the adsorption surface. The vacuum force in the hollow portion is released, and the ejection pin protrudes from the nozzle body through the vacuum hole portion to push the semiconductor chip downward. In an exemplary embodiment, the apparatus further includes a suction cup disposed below the suction surface of the nozzle body, the suction cup includes a suction hole communicating with the vacuum hole, and the suction cup is made of an elastic substance to improve the adhesion to the semiconductor chip. In an exemplary embodiment, the device further includes a visual reflection plate disposed below the suction surface of the nozzle body and coupled to the nozzle body, and the visual reflection plate includes an airflow hole that communicates with the vacuum hole and is configured to reflect toward Light shining on the lower surface of the visual reflection plate. Therefore, as described above, according to an exemplary embodiment of the present invention, the device includes an ejection pin and a magnet. The ejection pin can push the semiconductor chip down by using a physical force to detach the semiconductor chip from the nozzle body. The magnet provides a magnetic force that pushes the ejection pin downward. To promote downward movement of the ejection pin. In particular, compared with a spring that uses an elastic force to push the article, the magnet is more durable and resistant to contamination. Therefore, it is possible to prevent an erroneous operation of the ejection pin and to stably perform a placement operation for lowering the semiconductor chip. In addition, a stopper is provided in the device to restrict the downward movement of the ejection pin, thereby avoiding damage to the semiconductor chip caused by the ejection pin over-pressurizing the semiconductor chip.

在下文中，將參照附圖詳細描述特定實施例。然而，本發明可用不同的形式實施，並且不應被解釋為限制在本文所闡述的實施例內，而是提供這些實施例讓本發明徹底完整，並且對於本領域技術人員充分地傳達本發明的範圍。相同的附圖標號表示相同的元件。為了清楚說明，在附圖中會將層和區域的尺寸放大。應該理解的是，當元件或層被稱為“在......上”、“連接到”或“耦合到”另一元件或層時，表示它直接位在另一元件或層上、連接或耦合到另一元件或層，或是可以存在***元件或層。相反地，當元件被稱為“直接在......上”、“直接連接到”或“直接耦合到”另一元件或層時，即表示不存在有***元件或層。相似的數字始終代表相同的元素。如本文所使用的，術語“和/或”包括一個以上的相關所列項目的任何和所有組合。諸如第一、第二等等的術語可以用於描述各種元件，但是上述元件不應被上述術語所限制。以上這些術語僅用於將一個元件與另一元件做區分。例如，在不脫離本發明第一部件到第二部件的範圍，可用類似方式命名，也可命名為第二部件到第一部件。為了便於描述，在此使用空間相對術語，諸如“下方”、“在...之下”、“下部的”、“在......之上”、“上部的”等等，用來描述一個元件或特徵與另一個元件或特徵的關係如圖中所示）。將理解的是，空間相對術語意圖包括除了附圖中描繪的方位之外的裝置在使用或操作中的不同方位。例如，將附圖中的設備翻轉，則被描述為在其他元件或特徵“之下”或“下方”的元件將被定向為在其他元件或特徵“之上”。因此，示例性術語“在...下面”可以涵蓋上方和下方兩種方位。裝置可利用其他方式定向（旋轉90度或在其他方向）並且相應地解釋在此使用的空間相對描述符號。本文使用的術語僅用於描述特定示例性實施例的目的，而不是限制本發明的構思。除非上下文另有明確指出，如本文所使用的單數形式“a”、“an”和“the”也意味包括複數形式。可進一步理解，在本說明書中使用的術語“包括”和/或“包含”，是指出所述特徵、整體、步驟、操作、元件和/或部件的存在，但不是排除其存在或添加一個以上的其它特徵、整體、步驟、操作、元件、部件和/或其組合。本文參照作為本發明的理想實施例（和中間結構）的示意圖的剖面圖來描述本發明的實施例。因此，預期會產生例如像是製造技術和/或公差所導致的圖示形狀變化。因此，本發明的實施例不應該被解釋為僅限制於本文所示出的區域特定形狀，而是包括例如因為製造引起的形狀偏差。舉例來說，示出為矩形的注入區域，其邊緣通常具有圓形或彎曲的特徵和/或注入濃度梯度，而非從注入區域到非注入區域之間的二元變化。類似地，由於注入所形成的掩埋區會導致在掩埋區和發生注入的表面之間的區域中的一些注入。因此，附圖中示出的區域本質上是示意性的，並且它們的形狀不旨在示出裝置區域的實際形狀，並且不旨在限制本發明的範圍。除非另有定義，本文使用的所有術語（包括技術和科學術語）的含意與本發明構思所屬領域的一般技術人員通常理解的含意相同。可進一步理解，諸如常用詞典中定義的術語應被解釋為具有與相關領域背景一致的含意，並且不會以理想化或過度正式的方式解釋，除非有明確的定義。圖1是具有半導體芯片拾取設備的芯片傳輸系統的示意圖。參照圖1，根據示例性實施例，為了傳輸半導體芯片而利用芯片傳輸系統將多個半導體芯片分選為良品和不良品。芯片傳輸系統200包括傳輸台210、拖盤220、芯片傳輸器230以及低視覺相機240。傳輸台210用來傳輸半導體芯片10，托盤220用來承載和傳輸分選為良品與不良品的半導體芯片10至外部，芯片傳輸器230用來拾取堆疊在傳輸台上的半導體芯片10並將半導體芯片傳輸到托盤220，低視覺相機240用來檢查正被芯片傳輸器拾取的半導體芯片。特別來說，傳輸台210可支撐半導體芯片10。傳輸台210在水平方向上可移動，以將半導體芯片10從清潔/乾燥模組（未示出）傳輸至托盤220。此時，切割模組（未示出）使半導體芯片10個體化，清潔/乾燥模組對半導體芯片10進行清洗與乾燥。之後，半導體芯片10裝載到傳輸台210上。雖然圖上未示出，芯片傳輸系統200另外包括高視覺相機（未示出）用來檢查傳輸台210上支撐的半導體芯片10。上視覺相機設於傳輸台210上方，並且藉由對半導體芯片10成像而生成圖片用來檢查半導體芯片10。托盤220設於傳輸台210的一側。托盤200可水平移動。托盤200具有用來容納半導體芯片10的芯片容器222。此時，托盤220可承載被判定為良品的半導體芯片。托盤220儲存被判定為良品的半導體芯片，並將這些半導體芯片送至外部。芯片傳輸器230被設置成可在垂直方向上與水平方向上活動。芯片傳輸器從傳輸台210上拾取被上視覺相機判定為良品的半導體芯片10，並且將該半導體芯片10傳輸至托盤220。雖然圖上未示出，芯片傳輸器230從傳輸台210上拾取被上視覺相機判定為不良品的半導體芯片10，並且將不良品傳輸至一容器（未示出）。芯片傳輸器230包括使用真空吸力來半導體芯片拾取設備101。根據本發明的實施例，用來半導體芯片拾取設備101從傳輸台210上真空吸附半導體芯片10。另外，設備101會卸載被拾取到托盤220的半導體芯片10。稍後將參照圖2對用來半導體芯片拾取設備101進行詳細描述。低視覺相機240設置於芯片傳輸器230下方。低視覺相機240設於傳輸台210的行駛途徑與托盤220的行駛途徑之間。當設備101拾取半導體芯片10來檢查被設備101拾取的半導體芯片10的對準狀態時，低視覺相機240對半導體芯片10進行成像。芯片傳輸器230根據透過低視覺相機240識別出的半導體芯片10的對準狀態來調整半導體芯片10的位置，並且將半導體芯片10放置在托盤220上。在下文中，將詳細描述半導體芯片拾取設備101的結構和操作。圖2是根據本發明的示例實施例的半導體芯片拾取設備的縱向剖面圖。圖3是圖2的磁鐵的配置狀態的剖面圖。圖4是圖2的半導體芯片拾取設備的操作狀態的縱向剖面圖。參照圖2至4，根據本發明實施例的半導體芯片拾取設備101是作為拾取器而使用真空吸附來拾取個體化的半導體芯片10。設備101包括噴嘴主體110、噴出銷120和多個磁鐵130。噴嘴主體110包括中空部112。為了利用真空力來固定半導體芯片10，中空部112沿縱向方向延伸來提供路徑以傳遞用於真空吸附的真空力。磁鐵130定位於中空部112內。當釋放真空力時，磁鐵130向噴出銷120提供驅動力，噴出銷120藉由作為驅動力的磁力而向下下降。特別來說，噴嘴主體101為圖2和3所示的圓柱狀，而中空部112形成於噴嘴主體101之中。噴嘴主體101使用中空部112內提供的真空力來真空吸附與固定設置於傳輸台210（見圖1）的半導體芯片10。設備101讓半導體芯片10維持被真空吸附的狀態，同時芯片傳輸器230朝著托盤220移動。為了將半導體芯片10承載至托盤220，將被設備101拾取的半導體芯片10放置在托盤220上，接著將透過中空部112提供的真空力釋放。螺帽232使噴嘴主體110與芯片傳輸器230耦合。特別來說，螺帽232耦合於噴嘴主體110的中空部112進而連接於噴嘴主體110的上部。噴嘴主體100包括真空孔116，真空孔116形成於噴嘴主體110的下表面114並且與中空部112連通。因此，用來真空吸附半導體芯片10的真空力透過真空孔116傳送到噴嘴主體110的下表面。噴出銷120可移動地***噴嘴主體110的中空部112。當施加到中空部112的真空力被釋放，噴出銷120朝向噴嘴主體110的下表面114下降，而將半導體芯片10從下表面114朝向托盤220推動。特別來說，噴出銷120包括頭部122與活塞124，活塞124從頭部122的中間部沿著噴嘴主體110的縱向方向延伸。當釋放施加在半導體芯片10的真空力時，活塞124被配置為與藉由噴嘴主體110真空吸附的半導體芯片10接觸，並且活塞124向下推動半導體芯片10。頭部122的直徑小於中空部112的直徑。頭部122包括多個穿孔126，因此供應至中空部112的真空力透過穿孔126施加到半導體芯片10。穿透頭部122而形成穿孔126。活塞124從頭部122的下表面的中間部延伸，並且為棒狀。當真空力供應至中空部112時，噴出銷120藉由真空力向上移動，且不露出於設備101的外部，如圖2所示。同時，頭部122的上表面與螺帽232的下表面接觸。也就是說，螺帽232當成止動件而限制噴出銷120的向上移動，因此噴出銷120不會再向上上升。另一方面，當釋放中空部112內的真空力，噴出銷120向下移動，如圖4所示。特別地，活塞124的下端部穿過噴嘴主體110的真空孔116往設備101的外部突出，而與半導體芯片10接觸。當活塞124的下端部接觸到半導體芯片10的同時進一步向下移動。因此，吸附到噴嘴主體110的半導體芯片10能夠藉由噴射銷120施加到半導體芯片10的物理力而由噴嘴主體110分離。藉此，設備101更容易地將半導體芯片10向下放置到托盤220。磁鐵130提供噴出銷120磁力以促進噴出銷120的向下運動。特別來說，如圖3所示，磁鐵130沿著噴嘴主體110的內壁環狀配置。另外，磁鐵130設置於噴出銷120的頭部下方。特別地，磁鐵130可使用吸引力讓噴出銷120下降。此時，噴出銷120的頭部122由磁性物質製成而能夠在頭部122與磁鐵130之間產生磁力。如圖4所示，當釋放中空部112內的真空力，包括頭部122的噴出銷120藉由頭部122和磁鐵130之間的吸引力可更快速地向下移動。設備101也包括用來判定噴出銷120的最低位置的止動件140。止動件140設置於中空部112中。止動件140在垂直方向上設於噴出銷120的頭部122與磁鐵130之間。止動件140由非磁性物質製成。本發明的實施例中，止動件140由噴嘴主體110的內壁朝中空部110的中心點突出，如圖2所示。當釋放中空部112的真空力且噴出銷120藉由磁鐵130與噴出銷120之間產生的磁力而下降時，噴出銷120移動至最低位置。噴出銷的向下移動受到限制因此不會過度地向下下降。也就是說，當釋放中空部112的真空力並且噴出銷120下降，噴出銷120的頭部122可移動到止動件140所在的位置。因此，止動件140支撐頭部122的下表面以限制噴出銷120的向下移動。當半導體芯片10放置在托盤220上時，包括在設備101之中的止動件140位於防止活塞124從噴嘴主體110的下表面向外過度突出的位置。另外，當噴出銷120的活塞120作用時，磁鐵130能降低半導體芯片10所受到的衝擊。因此，半導體芯片10在放置程序中能避免受到損傷，且托盤220可穩定地承載半導體芯片10。設備101也包括視覺反射板150以及吸盤160。視覺反射板150反射光線用來更精確地對於被設備101拾取的半導體芯片10的對準狀態進行成像。吸盤160以彈性物質製成，如海綿或橡膠，以增進視覺反射板150與半導體芯片10之間的附著度。特別地，視覺反射板150設於噴嘴主體110的下表面之下。視覺反射板150耦合於噴嘴主體110。視覺反射板150定位於面對形成在下表面114的真空孔116之處。視覺反射板150具有連通於真空孔116的氣流孔152，視覺反射板150反射光線朝向下表面114入射。吸盤160設於視覺反射板150的下表面上。吸盤160的尺寸比視覺反射板150的尺寸大。吸盤160耦合於視覺反射板150的下表面，吸盤160包括吸引孔162，吸引孔162對應並連通於真空孔116。半導體芯片10藉由供應至吸引孔162的真空力從中空部112將吸盤160吸引穿過真空孔116與氣流孔152。特別來說，如圖2與4所示，當半導體芯片10的表面上具有焊球、電路圖案或類似物，半導體芯片10的表面會不平滑。吸盤160增強設備101與半導體芯片10之間的附著性以避免真空洩漏。藉此，設備101可更穩定地拾取半導體芯片10。因此，當設備101拾取半導體芯片10時，可能可以防止芯片10的損壞。藉由設備101與半導體芯片10之間的附著性，吸盤160能協助更穩定地真空吸附半導體芯片10。然而，即使在放置操作中釋放中空部112的真空，半導體芯片10仍然可能會因為吸盤的特質而持續與吸盤160接合。同時間，藉由板操作期間使用物理力來推動半導體芯片10向下，噴出銷120讓半導體芯片10與吸盤160脫離。如上所述，設備101藉由推動半導體芯片10向下的物理力，讓半導體芯片10由設備101脫離。另外，磁鐵130藉由提供讓噴出銷120向下下降的磁力，能輕易讓噴出銷120向下移動。特別地，由於磁鐵130具有良好的特性，例如相比於使用彈力而推動物品的彈簧，磁鐵130具有良好的耐久性和抗污染性，因此避免噴出銷120產生故障，並穩定地進行放置操作，提高設備101的良率和耐久性。此外，由於設備101包括用來限制噴出銷120向下移動的止動件140，所以止動件140能防止由於過度推動噴出銷120而導致的半導體芯片10損壞。因此，設備101能更有效地執行放置操作，並可以提高設備101的良品率。圖5是根據本發明的示例性實施例的半導體芯片拾取設備的縱向剖面圖。圖6是圖5的拾取半導體芯片拾取設備的操作狀態的縱向剖面圖。參照圖5與6，根據本發明的實施例，設備102與圖2所示的設備101具有相同配置，除了多個磁鐵170。與圖2中設備101相同的元件具有相同的標號，並省略重複的描述。設備102包括噴嘴主體110、噴出銷120與磁鐵170，噴嘴主體110藉由真空力吸附半導體芯片10，噴出銷設於噴嘴主體110的中空部112內，磁鐵170藉由磁力將噴出銷120向下移動。特別地，磁鐵170包括至少一個第一磁鐵172與至少一個第二磁鐵174。第一磁鐵172設於中空部112內並覆蓋噴出銷120的頭部122。第二磁鐵174設於第一磁鐵172下方且耦合於噴出銷120的上表面（也就是頭部122的上表面）。多個第一磁鐵172沿著噴嘴主體110的內壁環狀設置，如圖3中的磁鐵130。如圖2所示，當真空力傳輸到中空部11讓噴出銷向上移動，第一磁鐵172使噴出銷120更向上移動。此外，第一磁鐵172可當作止動件用來限制噴出銷120向上移動的路徑。第二磁鐵174耦合於頭部122並與頭部122一起移動。特別地，第二磁鐵174與彼此相對的第一磁鐵172具有相同的一極性，在第一磁鐵172與第二磁鐵174之間產生了互斥力。第一磁鐵172與第二磁鐵174之間產生的互斥力促使噴出銷120向下移動。如圖6所示，當從中空部112釋放真空力使得半導體芯片10下降至托盤220，第一磁鐵172與第二磁鐵174之間產生的互斥力向下推動頭部122，因此噴出銷120可向下移動地更快。本發明的實施例中，如圖3所示，第二磁鐵174可以設置成不干擾頭部122的穿孔126，如圖5所示。例如，第二磁鐵174形成為環狀，並且設置在頭部122的上表面的邊緣部。前述內容是對本發明的說明，並不構成對本發明做出限制。儘管已經描述了本發明的一些示例性實施例，但是本領域技術人員將容易理解，在示例性實施例中可以進行許多修改而不實質上脫離本發明的新穎教示和優點。因此，這樣的修改意圖都被包括在如專利範圍中所限定的本發明的範圍內。在專利範圍中，裝置加功能的條款旨在覆蓋在此描述的執行所述功能的結構，不僅是結構等同物也包括等效結構。因此，應該理解的是，前述內容是對本發明的說明，並不被解釋為限制於所公開的特定實施例，並且對所公開的實施例以及其他實施例的修改旨在被包括在所附專利範圍的領域中。由所附專利範圍對於本發明做出限制，其中包括專利範圍的等同物。Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. However, the present invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein, but rather, these embodiments are provided to make the present invention completely complete and to fully convey the present invention to those skilled in the art. range. The same reference numerals denote the same elements. For clarity, the dimensions of layers and regions are exaggerated in the drawings. It should be understood that when an element or layer is referred to as being "on", "connected to" or "coupled to" another element or layer, it means that it is directly on the other element or layer. , Connected or coupled to another element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element or layer, it means that there are no intervening elements or layers present. Similar numbers always represent the same elements. As used herein, the term "and / or" includes any and all combinations of more than one of the associated listed items. Terms such as first, second, etc. may be used to describe various elements, but the above elements should not be limited by the above terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the first component to the second component of the present invention, the names may be similarly named, and the second component to the first component may also be named. For ease of description, spatially relative terms such as "below", "below", "lower", "above", "upper", etc. are used here, using To describe the relationship between one element or feature and another element or feature as shown in the figure). It will be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatially relative descriptors used herein interpreted accordingly. The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the idea of the invention. Unless the context clearly indicates otherwise, as used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well. It can be further understood that the terms "including" and / or "comprising" used in the present specification refer to the presence of the described features, wholes, steps, operations, elements and / or components, but do not exclude their existence or add more than one Other features, wholes, steps, operations, elements, components, and / or combinations thereof. Embodiments of the present invention are described herein with reference to a cross-sectional view that is a schematic view of a preferred embodiment (and intermediate structure) of the present invention. Accordingly, variations in the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are expected. Therefore, embodiments of the present invention should not be interpreted as being limited to the region-specific shapes shown herein, but include shape deviations due to, for example, manufacturing. For example, an implanted region shown as a rectangle whose edges generally have rounded or curved features and / or implanted concentration gradients, rather than a binary change from an implanted region to a non-implanted region. Similarly, the buried area formed by the implantation may cause some implantation in the area between the buried area and the surface where the implantation takes place. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the invention. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this inventive concept belongs. It can be further understood that terms such as those defined in commonly used dictionaries should be interpreted to have meanings consistent with the background of the relevant field, and will not be interpreted in an idealized or overly formal manner, unless clearly defined. FIG. 1 is a schematic diagram of a chip transfer system having a semiconductor chip pickup device. Referring to FIG. 1, according to an exemplary embodiment, a plurality of semiconductor chips are sorted into a good product and a defective product using a chip transfer system in order to transfer a semiconductor chip. The chip transfer system 200 includes a transfer stage 210, a tray 220, a chip transfer 230, and a low vision camera 240. The transfer table 210 is used to transfer the semiconductor chips 10, the tray 220 is used to carry and transfer the semiconductor chips 10 sorted into good and bad products to the outside, and the chip transferer 230 is used to pick up the semiconductor chips 10 stacked on the transfer table and transfer the semiconductors The chip is transferred to the tray 220, and the low vision camera 240 is used to check the semiconductor chip being picked up by the chip transferer. In particular, the transfer stage 210 can support the semiconductor chip 10. The transfer stage 210 is movable in a horizontal direction to transfer the semiconductor chip 10 from the cleaning / drying module (not shown) to the tray 220. At this time, the dicing module (not shown) individualizes the semiconductor chip 10, and the cleaning / drying module cleans and dries the semiconductor chip 10. After that, the semiconductor chip 10 is loaded on the transfer stage 210. Although not shown in the figure, the chip transfer system 200 additionally includes a high-vision camera (not shown) for inspecting the semiconductor chip 10 supported on the transfer table 210. The top vision camera is disposed above the transfer table 210 and generates a picture for inspecting the semiconductor chip 10 by imaging the semiconductor chip 10. The tray 220 is provided on one side of the transfer table 210. The tray 200 can be moved horizontally. The tray 200 has a chip container 222 for containing the semiconductor chips 10. At this time, the tray 220 may carry a semiconductor chip determined to be a good product. The tray 220 stores semiconductor chips determined to be good products, and sends these semiconductor chips to the outside. The chip transmitter 230 is provided to be movable in a vertical direction and a horizontal direction. The chip transferor picks up the semiconductor chip 10 judged to be a good product by the upper vision camera from the transfer stage 210 and transfers the semiconductor chip 10 to the tray 220. Although not shown in the figure, the chip transferer 230 picks up the semiconductor chip 10 judged as a defective product by the upper vision camera from the transfer stage 210 and transfers the defective product to a container (not shown). The chip transferer 230 includes a semiconductor chip pickup device 101 using a vacuum suction force. According to the embodiment of the present invention, the semiconductor chip pickup device 101 is used to vacuum-suck the semiconductor chip 10 from the transfer stage 210. In addition, the device 101 unloads the semiconductor chip 10 picked up to the tray 220. A detailed description of the semiconductor chip pickup apparatus 101 will be made later with reference to FIG. 2. The low-vision camera 240 is disposed below the chip transmitter 230. The low-vision camera 240 is provided between the travel path of the transfer table 210 and the travel path of the tray 220. When the device 101 picks up the semiconductor chip 10 to check the alignment state of the semiconductor chip 10 picked up by the device 101, the low-vision camera 240 images the semiconductor chip 10. The chip transmitter 230 adjusts the position of the semiconductor chip 10 according to the alignment state of the semiconductor chip 10 recognized through the low-vision camera 240, and places the semiconductor chip 10 on the tray 220. Hereinafter, the structure and operation of the semiconductor chip pickup apparatus 101 will be described in detail. FIG. 2 is a longitudinal sectional view of a semiconductor chip pickup apparatus according to an exemplary embodiment of the present invention. FIG. 3 is a cross-sectional view of an arrangement state of the magnets of FIG. 2. FIG. 4 is a longitudinal sectional view of an operating state of the semiconductor chip pickup apparatus of FIG. 2. Referring to FIGS. 2 to 4, a semiconductor chip pickup apparatus 101 according to an embodiment of the present invention is a pickup that uses vacuum suction to pick up an individualized semiconductor chip 10. The apparatus 101 includes a nozzle body 110, a discharge pin 120, and a plurality of magnets 130. The nozzle body 110 includes a hollow portion 112. In order to fix the semiconductor chip 10 with a vacuum force, the hollow portion 112 extends in a longitudinal direction to provide a path to transfer a vacuum force for vacuum adsorption. The magnet 130 is positioned inside the hollow portion 112. When the vacuum force is released, the magnet 130 provides a driving force to the ejection pin 120, and the ejection pin 120 is lowered downward by a magnetic force as a driving force. In particular, the nozzle body 101 has a cylindrical shape as shown in FIGS. 2 and 3, and a hollow portion 112 is formed in the nozzle body 101. The nozzle body 101 uses a vacuum force provided in the hollow portion 112 to vacuum-suck and fix the semiconductor chip 10 provided on the transfer stage 210 (see FIG. 1). The device 101 keeps the semiconductor chip 10 in a state of being vacuum-adsorbed, and at the same time, the chip conveyor 230 is moved toward the tray 220. In order to carry the semiconductor chip 10 to the tray 220, the semiconductor chip 10 picked up by the device 101 is placed on the tray 220, and then the vacuum force provided through the hollow portion 112 is released. The nut 232 couples the nozzle body 110 and the chip transfer 230. In particular, the nut 232 is coupled to the hollow portion 112 of the nozzle body 110 and is further connected to an upper portion of the nozzle body 110. The nozzle body 100 includes a vacuum hole 116 formed in the lower surface 114 of the nozzle body 110 and communicating with the hollow portion 112. Therefore, the vacuum force used to vacuum-adsorb the semiconductor chip 10 is transmitted to the lower surface of the nozzle body 110 through the vacuum hole 116. The ejection pin 120 is movably inserted into the hollow portion 112 of the nozzle body 110. When the vacuum force applied to the hollow portion 112 is released, the ejection pin 120 descends toward the lower surface 114 of the nozzle body 110 and pushes the semiconductor chip 10 from the lower surface 114 toward the tray 220. In particular, the ejection pin 120 includes a head 122 and a piston 124, and the piston 124 extends from the middle portion of the head 122 along the longitudinal direction of the nozzle body 110. When the vacuum force applied to the semiconductor chip 10 is released, the piston 124 is configured to contact the semiconductor chip 10 vacuum-adsorbed by the nozzle body 110, and the piston 124 pushes the semiconductor chip 10 downward. The diameter of the head portion 122 is smaller than the diameter of the hollow portion 112. The head 122 includes a plurality of perforations 126, and thus the vacuum force supplied to the hollow portion 112 is applied to the semiconductor chip 10 through the perforations 126. The head 122 penetrates to form a perforation 126. The piston 124 extends from a middle portion of the lower surface of the head 122 and is rod-shaped. When a vacuum force is supplied to the hollow portion 112, the ejection pin 120 moves upward by the vacuum force and is not exposed to the outside of the device 101, as shown in FIG. At the same time, the upper surface of the head 122 is in contact with the lower surface of the nut 232. That is, the nut 232 acts as a stopper to restrict the upward movement of the ejection pin 120, so the ejection pin 120 will not rise upward any more. On the other hand, when the vacuum force in the hollow portion 112 is released, the ejection pin 120 moves downward, as shown in FIG. 4. In particular, the lower end portion of the piston 124 projects through the vacuum hole 116 of the nozzle body 110 to the outside of the device 101 and contacts the semiconductor chip 10. When the lower end portion of the piston 124 contacts the semiconductor chip 10, it moves further downward. Therefore, the semiconductor chip 10 adsorbed to the nozzle body 110 can be separated by the nozzle body 110 by the physical force applied to the semiconductor chip 10 by the ejection pin 120. Thereby, the device 101 more easily places the semiconductor chip 10 down on the tray 220. The magnet 130 provides the magnetic force of the ejection pin 120 to promote downward movement of the ejection pin 120. Specifically, as shown in FIG. 3, the magnet 130 is arranged annularly along the inner wall of the nozzle body 110. The magnet 130 is provided below the head of the ejection pin 120. In particular, the magnet 130 may use the attractive force to lower the ejection pin 120. At this time, the head 122 of the ejection pin 120 is made of a magnetic substance, and a magnetic force can be generated between the head 122 and the magnet 130. As shown in FIG. 4, when the vacuum force in the hollow portion 112 is released, the ejection pin 120 including the head 122 can move down more quickly by the attractive force between the head 122 and the magnet 130. The device 101 also includes a stopper 140 for determining the lowest position of the ejection pin 120. The stopper 140 is disposed in the hollow portion 112. The stopper 140 is provided between the head 122 of the ejection pin 120 and the magnet 130 in the vertical direction. The stopper 140 is made of a non-magnetic substance. In the embodiment of the present invention, the stopper 140 protrudes from the inner wall of the nozzle body 110 toward the center point of the hollow portion 110 as shown in FIG. 2. When the vacuum force of the hollow portion 112 is released and the ejection pin 120 is lowered by the magnetic force generated between the magnet 130 and the ejection pin 120, the ejection pin 120 moves to the lowest position. The downward movement of the ejection pin is restricted so that it does not descend excessively. That is, when the vacuum force of the hollow portion 112 is released and the ejection pin 120 is lowered, the head 122 of the ejection pin 120 can be moved to the position where the stopper 140 is located. Therefore, the stopper 140 supports the lower surface of the head 122 to restrict the downward movement of the ejection pin 120. When the semiconductor chip 10 is placed on the tray 220, the stopper 140 included in the device 101 is located at a position that prevents the piston 124 from protruding excessively outward from the lower surface of the nozzle body 110. In addition, when the piston 120 of the ejection pin 120 functions, the magnet 130 can reduce the impact received by the semiconductor chip 10. Therefore, the semiconductor chip 10 can be prevented from being damaged during the placement process, and the tray 220 can stably carry the semiconductor chip 10. The device 101 also includes a visual reflection plate 150 and a suction cup 160. The light reflected by the visual reflecting plate 150 is used to more accurately image the alignment state of the semiconductor chip 10 picked up by the device 101. The suction cup 160 is made of an elastic material, such as a sponge or rubber, to improve the adhesion between the visual reflection plate 150 and the semiconductor chip 10. In particular, the visual reflection plate 150 is provided below the lower surface of the nozzle body 110. The visual reflection plate 150 is coupled to the nozzle body 110. The visual reflection plate 150 is positioned to face the vacuum hole 116 formed in the lower surface 114. The visual reflection plate 150 has an air flow hole 152 communicating with the vacuum hole 116, and the visual reflection plate 150 reflects light and is incident toward the lower surface 114. The suction cup 160 is provided on a lower surface of the visual reflection plate 150. The size of the suction cup 160 is larger than that of the visual reflection plate 150. The suction cup 160 is coupled to the lower surface of the visual reflection plate 150. The suction cup 160 includes a suction hole 162, which corresponds to and communicates with the vacuum hole 116. The semiconductor chip 10 sucks the suction cup 160 through the vacuum hole 116 and the air flow hole 152 from the hollow portion 112 by the vacuum force supplied to the suction hole 162. In particular, as shown in FIGS. 2 and 4, when the surface of the semiconductor chip 10 has solder balls, circuit patterns, or the like, the surface of the semiconductor chip 10 is not smooth. The suction cup 160 enhances the adhesion between the device 101 and the semiconductor chip 10 to avoid a vacuum leak. Thereby, the device 101 can pick up the semiconductor chip 10 more stably. Therefore, when the device 101 picks up the semiconductor chip 10, it may be possible to prevent the chip 10 from being damaged. With the adhesion between the device 101 and the semiconductor chip 10, the chuck 160 can assist in more stable vacuum suction of the semiconductor chip 10. However, even if the vacuum of the hollow portion 112 is released during the placement operation, the semiconductor chip 10 may continue to be engaged with the suction cup 160 due to the characteristics of the suction cup. At the same time, by using physical force to push the semiconductor chip 10 downwards during the operation of the board, the ejection pin 120 disengages the semiconductor chip 10 from the suction cup 160. As described above, the device 101 detaches the semiconductor chip 10 from the device 101 by a physical force pushing the semiconductor chip 10 downward. In addition, the magnet 130 can easily move the ejection pin 120 downward by providing a magnetic force that causes the ejection pin 120 to descend downward. In particular, since the magnet 130 has good characteristics, for example, compared with a spring that pushes an item with an elastic force, the magnet 130 has good durability and anti-pollution, so that the ejection pin 120 is prevented from malfunctioning, and the placement operation is stably performed, Improve the yield and durability of the device 101. In addition, since the device 101 includes a stopper 140 for restricting downward movement of the ejection pin 120, the stopper 140 can prevent the semiconductor chip 10 from being damaged due to excessively pushing the ejection pin 120. Therefore, the device 101 can perform the placing operation more efficiently, and the yield of the device 101 can be improved. FIG. 5 is a longitudinal sectional view of a semiconductor chip pickup apparatus according to an exemplary embodiment of the present invention. FIG. 6 is a longitudinal sectional view of an operating state of the pickup semiconductor chip pickup apparatus of FIG. 5. 5 and 6, according to an embodiment of the present invention, the device 102 has the same configuration as the device 101 shown in FIG. 2, except for a plurality of magnets 170. The same elements as those of the device 101 in FIG. 2 have the same reference numerals, and repeated descriptions are omitted. The device 102 includes a nozzle body 110, an ejection pin 120, and a magnet 170. The nozzle body 110 adsorbs the semiconductor chip 10 by a vacuum force. The ejection pin is provided in the hollow portion 112 of the nozzle body 110. The magnet 170 lowers the ejection pin 120 downward by magnetic force. mobile. Specifically, the magnet 170 includes at least one first magnet 172 and at least one second magnet 174. The first magnet 172 is disposed in the hollow portion 112 and covers the head portion 122 of the ejection pin 120. The second magnet 174 is disposed below the first magnet 172 and is coupled to an upper surface of the ejection pin 120 (that is, an upper surface of the head 122). The plurality of first magnets 172 are arranged annularly along the inner wall of the nozzle body 110, such as the magnet 130 in FIG. 3. As shown in FIG. 2, when the vacuum force is transmitted to the hollow portion 11 to move the ejection pin upward, the first magnet 172 moves the ejection pin 120 upward. In addition, the first magnet 172 can be used as a stopper to restrict the path of the ejection pin 120 moving upward. The second magnet 174 is coupled to the head 122 and moves with the head 122. In particular, the second magnet 174 and the first magnet 172 facing each other have the same polarity, and a mutual repulsive force is generated between the first magnet 172 and the second magnet 174. The repulsive force generated between the first magnet 172 and the second magnet 174 causes the ejection pin 120 to move downward. As shown in FIG. 6, when the vacuum force is released from the hollow portion 112 and the semiconductor chip 10 is lowered to the tray 220, the mutual repulsive force generated between the first magnet 172 and the second magnet 174 pushes the head 122 downward, so the ejection pin 120 may Move down faster. In the embodiment of the present invention, as shown in FIG. 3, the second magnet 174 may be disposed so as not to interfere with the perforation 126 of the head 122, as shown in FIG. 5. For example, the second magnet 174 is formed in a ring shape and is provided on an edge portion of the upper surface of the head 122. The foregoing is a description of the present invention and does not constitute a limitation on the present invention. Although some exemplary embodiments of the invention have been described, those skilled in the art will readily understand that many modifications can be made in the exemplary embodiments without substantially departing from the novel teachings and advantages of the invention. Therefore, all such modifications are intended to be included in the scope of the present invention as defined in the patent scope. In the scope of the patent, the device-plus-function clause is intended to cover structures described herein that perform the recited function, and not only structural equivalents but also equivalent structures. Therefore, it should be understood that the foregoing is an illustration of the present invention and is not to be construed as being limited to the particular embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are intended to be included in the appended patents Range of fields. The invention is limited by the scope of the appended patents, including equivalents of the patent scope.

10‧‧‧半導體芯片10‧‧‧ semiconductor chip

101‧‧‧設備101‧‧‧ Equipment

110‧‧‧噴嘴主體110‧‧‧Nozzle body

112‧‧‧中空部112‧‧‧Hollow Department

114‧‧‧下表面114‧‧‧ lower surface

116‧‧‧真空孔116‧‧‧Vacuum hole

120‧‧‧噴出銷120‧‧‧Ejection Pin

122‧‧‧頭部122‧‧‧Head

124‧‧‧活塞124‧‧‧Piston

126‧‧‧穿孔126‧‧‧perforation

130‧‧‧磁鐵130‧‧‧magnet

140‧‧‧止動件140‧‧‧stop

150‧‧‧視覺反射板150‧‧‧vision reflector

152‧‧‧氣流孔152‧‧‧air hole

160‧‧‧吸盤160‧‧‧ Suction cup

162‧‧‧吸引孔162‧‧‧Attraction hole

170‧‧‧磁鐵170‧‧‧magnet

172‧‧‧第一磁鐵172‧‧‧First magnet

174‧‧‧第二磁鐵174‧‧‧Second magnet

200‧‧‧芯片傳輸系統200‧‧‧Chip Transmission System

210‧‧‧傳輸台210‧‧‧Transmission Station

220‧‧‧托盤220‧‧‧Tray

222‧‧‧芯片容器222‧‧‧Chip Container

230‧‧‧芯片傳輸器230‧‧‧Chip Transmitter

232‧‧‧螺帽232‧‧‧nut

240‧‧‧下視覺相機240‧‧‧ Lower Vision Camera

藉由參照附圖詳細描述本發明示例性實施例，本發明的上述和其他特徵和優點將變得更加明顯。圖1是具有半導體芯片拾取設備的芯片傳輸系統的示意圖；圖2是根據本發明的示例實施例的半導體芯片拾取設備的縱向剖面圖；圖3是圖2的磁鐵的配置狀態的剖面圖；圖4是圖2的半導體芯片拾取設備的操作狀態的縱向剖面圖；圖5是根據本發明的示例性實施例的半導體芯片拾取設備的縱向剖面圖；以及圖6是圖5的拾取半導體芯片拾取設備的操作狀態的縱向剖面圖。The above and other features and advantages of the present invention will become more apparent by describing the exemplary embodiments of the present invention in detail with reference to the accompanying drawings. 1 is a schematic diagram of a chip transfer system having a semiconductor chip pickup device; FIG. 2 is a longitudinal sectional view of a semiconductor chip pickup device according to an exemplary embodiment of the present invention; FIG. 3 is a sectional view of a configuration state of a magnet of FIG. 2; 4 is a longitudinal sectional view of an operating state of the semiconductor chip pickup apparatus of FIG. 2; FIG. 5 is a longitudinal sectional view of a semiconductor chip pickup apparatus according to an exemplary embodiment of the present invention; and FIG. 6 is a pickup semiconductor chip pickup apparatus of FIG. Longitudinal sectional view of the operating state.

Claims

一種半導體芯片拾取設備，該設備包括：具有中空部的噴嘴主體，該中空部沿著縱向方向延伸，該噴嘴主體被配置成使用傳送至該中空部的真空力來真空吸附半導體芯片；可移動地***該中空部的噴出銷，當該中空部中的該真空力被釋放，該噴出銷被配置成向下推動該半導體芯片，使得該半導體芯片與該噴嘴主體脫離；以及設置在該中空部內的多個磁鐵，該磁鐵被配置成對該噴出銷提供磁力，當該中空部中的該真空力被釋放，使得該噴出銷由該中空部內部向下移動至該中空部外部。A semiconductor chip pick-up device includes: a nozzle body having a hollow portion extending in a longitudinal direction, the nozzle body being configured to vacuum-suck a semiconductor chip using a vacuum force transmitted to the hollow portion; and movablely The ejection pin inserted into the hollow portion, when the vacuum force in the hollow portion is released, the ejection pin is configured to push down the semiconductor chip so that the semiconductor chip is separated from the nozzle body; and A plurality of magnets are configured to provide a magnetic force to the ejection pin, and when the vacuum force in the hollow portion is released, the ejection pin moves downward from the inside of the hollow portion to the outside of the hollow portion.

根據申請專利範圍第1項所述的設備，進一步包括：設置在該中空部內的止動件，當該噴出銷藉由該磁鐵產生的該磁力而下降時，該止動件被配置成限制該噴出銷的最低位置。The device according to item 1 of the scope of patent application, further comprising: a stopper provided in the hollow portion, when the ejection pin is lowered by the magnetic force generated by the magnet, the stopper is configured to limit the The lowest position of the ejection pin.

根據申請專利範圍第2所述的設備，其中在垂直方向上，該止動件覆蓋該磁鐵。The device according to claim 2, wherein the stopper covers the magnet in a vertical direction.

根據申請專利範圍第1所述的設備，其中該磁鐵沿著該中空部的內壁環狀設置。The device according to claim 1, wherein the magnet is annularly disposed along an inner wall of the hollow portion.

根據申請專利範圍第1所述的設備，其中該磁鐵包括：至少一個第一磁鐵，該第一磁鐵覆蓋該噴出銷並且固定在該中空部的內壁；以及至少一個第二磁鐵，該第二磁鐵設置在該第一磁鐵之下並且固定在該噴出銷的上表面，該第二磁鐵與彼此相對的該第一磁鐵具有相同的一極性，在該第一磁鐵與該第二磁鐵之間產生了互斥力。The device according to claim 1, wherein the magnet includes: at least one first magnet covering the ejection pin and fixed to an inner wall of the hollow portion; and at least one second magnet, the second magnet The magnet is disposed below the first magnet and fixed on the upper surface of the ejection pin. The second magnet has the same polarity as the first magnet opposite to each other, and is generated between the first magnet and the second magnet. For mutual exclusion.

根據申請專利範圍第5所述的設備，其中多個第一磁鐵沿著該中空部的內壁環狀設置。The device according to claim 5, wherein the plurality of first magnets are arranged annularly along the inner wall of the hollow portion.

根據申請專利範圍第1所述的設備，其中該噴出銷包括：設置在該中空部內的頭部；以及活塞，該活塞在該噴嘴主體的縱向方向上從該頭部延伸，當該真空力被釋放，該活塞被配置成與該半導體芯片接觸並向下推動該半導體芯片。The device according to claim 1, wherein the ejection pin includes: a head provided in the hollow portion; and a piston extending from the head in a longitudinal direction of the nozzle body, when the vacuum force is applied Released, the piston is configured to contact the semiconductor chip and push the semiconductor chip downward.

根據申請專利範圍第7所述的設備，其中該頭部包括多個穿孔用來提供從該中空部傳送該真空力至該半導體芯片的路徑。The device according to claim 7, wherein the head includes a plurality of perforations for providing a path for transmitting the vacuum force from the hollow portion to the semiconductor chip.

根據申請專利範圍第1所述的設備，其中該噴嘴主體包括真空孔，該真空孔形成在該噴嘴主體的吸附表面上並與該中空孔連通，該半導體芯片被真空吸附於該吸附表面；以及當該中空部內的該真空力被釋放，該噴出銷通過該真空孔部分突出於該噴嘴主體而向下推動該半導體芯片。The apparatus according to claim 1, wherein the nozzle body includes a vacuum hole formed on an adsorption surface of the nozzle body and communicating with the hollow hole, and the semiconductor chip is vacuum-adsorbed on the adsorption surface; and When the vacuum force in the hollow portion is released, the ejection pin protrudes from the nozzle body through the vacuum hole portion to push the semiconductor chip downward.

根據申請專利範圍第9所述的設備，進一步包括：設置於該噴嘴主體的該吸附表面之下的吸盤，該吸盤包括與該真空孔連通的吸引孔，並且該吸盤以彈性物質製成以提高對該半導體芯片的附著度。The device according to claim 9 of the patent application scope, further comprising: a suction cup disposed below the suction surface of the nozzle body, the suction cup including a suction hole communicating with the vacuum hole, and the suction cup made of an elastic substance to improve Degree of adhesion to the semiconductor chip.

根據申請專利範圍第9所述的設備，進一步包括：視覺反射板，該視覺反射板設置於該噴嘴主體的該吸附表面下方並且耦合於該噴嘴主體，該視覺反射板包括氣流孔，該氣流孔與該真空孔連通並且被配置成反射朝向該視覺反射板的下表面照射的光。The device according to claim 9 of the patent application scope, further comprising: a visual reflecting plate disposed below the suction surface of the nozzle body and coupled to the nozzle body, the visual reflecting plate including an airflow hole, the airflow hole Communicating with the vacuum hole and configured to reflect light irradiated toward a lower surface of the visual reflection plate.