CN109969792A - Dry type wafer separator for semiconductor crystal wafer - Google Patents
Dry type wafer separator for semiconductor crystal wafer Download PDFInfo
- Publication number
- CN109969792A CN109969792A CN201910373694.6A CN201910373694A CN109969792A CN 109969792 A CN109969792 A CN 109969792A CN 201910373694 A CN201910373694 A CN 201910373694A CN 109969792 A CN109969792 A CN 109969792A
- Authority
- CN
- China
- Prior art keywords
- material frame
- cylinder
- dry type
- semiconductor crystal
- electric cylinders
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 26
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 62
- 241000252254 Catostomidae Species 0.000 claims abstract description 5
- 239000012634 fragment Substances 0.000 abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/02—Devices for feeding articles or materials to conveyors
- B65G47/04—Devices for feeding articles or materials to conveyors for feeding articles
- B65G47/06—Devices for feeding articles or materials to conveyors for feeding articles from a single group of articles arranged in orderly pattern, e.g. workpieces in magazines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/918—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with at least two picking-up heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
This application discloses a kind of dry type wafer separators for semiconductor crystal wafer, including rack and it is arranged on the rack multiple material frames, conveyer belt, lateral electric cylinders and longitudinal electric cylinders, multiple material frames and conveyer belt are set gradually on the same line, the top of multiple material frames and conveyer belt is arranged in lateral electric cylinders, longitudinal cylinder is arranged below multiple material frames, the first cylinder is connected with by sliding block on lateral cylinder, the output end of first cylinder connects multiple suckers by connecting plate, sucker is arranged towards material frame top, multiple support rods are connected with by sliding block in longitudinal electric cylinders, support rod is arranged towards material frame bottom, material frame bottom is equipped with the through-hole passed through for support rod, the side of each material frame is equipped with towards the nozzle being arranged in material frame, nozzle is connect by the second cylinder with rack.The dry type wafer separator for being used for semiconductor crystal wafer realizes automation dry type fragment by cooperating between each structure, instead of original artificial fragment, high-efficient and saving cost of labor.
Description
Technical field
This application involves semiconductor crystal wafer apparatus field, especially a kind of dry type wafer separator for semiconductor crystal wafer.
Background technique
In existing semiconductor crystal wafer silicon wafer production process, Wafer Cleaning etc. after processing is completed, by manually by be equipped with vacuum
The manipulator of sucker carries out dry type fragment, and efficiency is lower and cost of labor is higher.
Summary of the invention
It is in the prior art to overcome the purpose of the present invention is to provide a kind of dry type wafer separator for semiconductor crystal wafer
It is insufficient.
To achieve the above object, the invention provides the following technical scheme:
The embodiment of the present application discloses the dry type wafer separator for semiconductor crystal wafer, including rack and is arranged on the rack
Multiple material frames, conveyer belt, lateral electric cylinders and longitudinal electric cylinders, multiple material frames and conveyer belt are set gradually on the same line,
The top of multiple material frames and conveyer belt is arranged in the transverse direction electric cylinders, and the longitudinal cylinder is arranged below multiple material frames, described
The first cylinder is connected with by sliding block on lateral cylinder, the output end of first cylinder connects multiple suckers by connecting plate,
Multiple suckers are arranged in a one-to-one correspondence with multiple material frames, and the sucker is arranged towards material frame top, are led in the longitudinal direction electric cylinders
It crosses sliding block and is connected with multiple support rods, multiple support rods are arranged in a one-to-one correspondence with multiple material frames, the support rod direction material
Frame bottom setting, the material frame bottom are equipped with the through-hole passed through for support rod, and the side of each material frame is equipped with towards material frame
The nozzle of interior setting, the nozzle are connect by the second cylinder with rack.
Preferably, in the above-mentioned dry type wafer separator for semiconductor crystal wafer, there are two the material frames, and the sucker has
Two, the support rod has two.
Preferably, in the above-mentioned dry type wafer separator for semiconductor crystal wafer, the side of material frame is arranged in the nozzle
Top.
Preferably, in the above-mentioned dry type wafer separator for semiconductor crystal wafer, the rack, which is equipped with, places multiple material
The groove of frame.
Compared with the prior art, the advantages of the present invention are as follows:
The dry type wafer separator for being used for semiconductor crystal wafer realizes automation dry type fragment by cooperating between each structure, instead of
Original artificial fragment, high-efficient and saving cost of labor.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The some embodiments recorded in application are not making the creative labor according to this for those of ordinary skill in the art
A little attached drawings obtain other attached drawings.
Fig. 1 show the structural schematic diagram in the specific embodiment of the invention for the dry type wafer separator of semiconductor crystal wafer；
Fig. 2 show the structural schematic diagram of material frame in the specific embodiment of the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out detailed retouch
It states, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, those of ordinary skill in the art's every other implementation obtained without making creative work
Example, shall fall within the protection scope of the present invention.
Join shown in Fig. 1, the dry type wafer separator for semiconductor crystal wafer in the present embodiment, including rack 1 and setting exist
Two material frames 2, conveyer belt 3, lateral electric cylinders 4 and longitudinal electric cylinders 5 in rack 1.
Two material frames 2 and conveyer belt 3 are set gradually on the same line, and the lateral setting of electric cylinders 4 is in two material frames 2 and conveying
With 3 top, first cylinder 6 is connected with by sliding block on lateral cylinder 4, the output end of the first cylinder 6 is connected by connecting plate
Two vacuum chucks 7, two vacuum chucks 7 are arranged in a one-to-one correspondence with two material frames 2, and vacuum chuck 7 is towards setting at the top of material frame 2
It sets.
In the technical scheme, sucker grabs the semiconductor crystal wafer silicon wafer in material frame under the first cylinder action,
It is conveyed semiconductor crystal wafer silicon wafer is placed on conveyer belt by lateral electric cylinders drive.
Join shown in Fig. 1~2, longitudinal cylinder 5 is arranged below two material frames 2, is connected with two by sliding block in longitudinal electric cylinders 5
A support rod 8, two support rods 8 are arranged in a one-to-one correspondence with two material frames 2, and support rod 8 is arranged towards 2 bottom of material frame, 2 bottom of material frame
Portion is equipped with the through-hole 9 passed through for support rod 8.
In the technical scheme, the semiconductor crystal wafer silicon wafer in material frame gradually decreased during continuous crawl and height by
It gradually reduces, support plate passes through semiconductor crystal wafer silicon wafer of longitudinal electric cylinders drive in the through-hole support material frame of material frame bottom at this time
It moves up, so that vacuum chuck be facilitated to be grabbed.
Join shown in Fig. 1, the side of each material frame 2 is equipped with towards the nozzle 10 being arranged in material frame 2, and nozzle 10 passes through the second gas
Cylinder 11 is connect with rack 1.
Further, the side top of material frame 2 is arranged in nozzle 10.
In the technical scheme, nozzle is blown semiconductor crystal wafer silicon wafer, facilitates and separates between each silicon wafer, and convenient point
Piece prevents from gluing between silicon wafer glutinous, it is ensured that monolithic fragment.
Join shown in Fig. 1, in one embodiment, rack 1 is equipped with the groove 12 for placing two material frames 2.
In the technical scheme, material frame is fixed by groove, prevents from generating shaking during crawl.
In other embodiments, the quantity of material frame, sucker and support rod can be adjusted, as needed to ensure fragment speed
Degree.
In conclusion the dry type wafer separator for being used for semiconductor crystal wafer realizes automation dry type by cooperating between each structure
Fragment, instead of original artificial fragment, high-efficient and saving cost of labor.
Principle is embodied:
1, the material frame for being mounted with semiconductor crystal wafer silicon wafer is arranged successively to groove.
2, nozzle is blown the silicon wafer at material frame port after adjusting position under the second cylinder action.
3, the first cylinder drives sucker to move down while grabbing the silicon wafer at the top of multiple material frames.
4, lateral electric cylinders drive sucker that silicon wafer is transferred to above conveyer belt, will crawl by the first cylinder and sucker cooperation
Silicon wafer be placed on conveyer belt and conveyed.
5, longitudinal electric cylinders will move to original height after driving support rod to pass through material frame bottom through-hole on the silicon wafer in material frame,
Lateral electric cylinders drive sucker to be back to initial position and carry out second of crawl.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including element.
The above is only the specific embodiments of the application, it is noted that those skilled in the art are come
It says, under the premise of not departing from the application principle, several improvements and modifications can also be made, these improvements and modifications also should be regarded as
The protection scope of the application.
Claims (4)
1. a kind of dry type wafer separator for semiconductor crystal wafer, it is characterised in that: including rack and be arranged on the rack multiple
Material frame, conveyer belt, lateral electric cylinders and longitudinal electric cylinders, multiple material frames and conveyer belt are set gradually on the same line, described
The top of multiple material frames and conveyer belt is arranged in lateral electric cylinders, and the longitudinal cylinder is arranged below multiple material frames, the transverse direction
The first cylinder is connected with by sliding block on cylinder, the output end of first cylinder connects multiple suckers by connecting plate, multiple
The sucker is arranged in a one-to-one correspondence with multiple material frames, and the sucker is arranged towards material frame top, passes through cunning in the longitudinal direction electric cylinders
Block is connected with multiple support rods, and multiple support rods are arranged in a one-to-one correspondence with multiple material frames, and the support rod is towards material frame bottom
Portion's setting, the material frame bottom are equipped with the through-hole that passes through for support rod, and the side of each material frame is equipped with towards setting in material frame
The nozzle set, the nozzle are connect by the second cylinder with rack.
2. a kind of dry type wafer separator for semiconductor crystal wafer according to claim 1, it is characterised in that: the material frame has
Two, there are two the suckers, and the support rod has two.
3. a kind of dry type wafer separator for semiconductor crystal wafer according to claim 1, it is characterised in that: the nozzle is set
Set the side top in material frame.
4. a kind of dry type wafer separator for semiconductor crystal wafer according to claim 1, it is characterised in that: in the rack
Equipped with the groove for placing multiple material frames.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910373694.6A CN109969792A (en) | 2019-05-07 | 2019-05-07 | Dry type wafer separator for semiconductor crystal wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910373694.6A CN109969792A (en) | 2019-05-07 | 2019-05-07 | Dry type wafer separator for semiconductor crystal wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109969792A true CN109969792A (en) | 2019-07-05 |
Family
ID=67072849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910373694.6A Pending CN109969792A (en) | 2019-05-07 | 2019-05-07 | Dry type wafer separator for semiconductor crystal wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109969792A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110980215A (en) * | 2019-12-17 | 2020-04-10 | 张家港市德昶自动化科技有限公司 | Tooling basket for semiconductor wafers |
| CN112978321A (en) * | 2019-12-02 | 2021-06-18 | 江西尚立动力科技有限公司 | Square battery device of being qualified for next round of competitions |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010046435A1 (en) * | 2000-05-26 | 2001-11-29 | Automation Technology, Inc. | Method and apparatus for separating wafers |
| KR20100115677A (en) * | 2009-04-20 | 2010-10-28 | 이세용 | Apparatus for inspecting and loading large films |
| JP2011029390A (en) * | 2009-07-24 | 2011-02-10 | Sumitomo Metal Fine Technology Co Ltd | Wafer conveying method and wafer conveying device |
| KR20130141004A (en) * | 2012-06-15 | 2013-12-26 | 주식회사 한광 | A workpiece separation apparatus of sheet-like workpiece lifter |
| CN107946212A (en) * | 2017-11-21 | 2018-04-20 | 乐山新天源太阳能科技有限公司 | The underwater automatic sheet-fetching plug-in sheet machine of silicon chip |
| CN107968063A (en) * | 2017-11-21 | 2018-04-27 | 乐山新天源太阳能科技有限公司 | The underwater automatic charging device of silicon chip |
| CN207632106U (en) * | 2017-12-16 | 2018-07-20 | 浙江永源机电制造有限公司 | A kind of buffer area loading and unloading mechanical arm |
| TW201828401A (en) * | 2016-11-30 | 2018-08-01 | 南韓細美事有限公司 | Apparatus for picking up a semiconductor chip |
| CN210012333U (en) * | 2019-05-07 | 2020-02-04 | 张家港市德昶自动化科技有限公司 | Dry wafer separator for semiconductor wafer |
-
2019
- 2019-05-07 CN CN201910373694.6A patent/CN109969792A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010046435A1 (en) * | 2000-05-26 | 2001-11-29 | Automation Technology, Inc. | Method and apparatus for separating wafers |
| KR20100115677A (en) * | 2009-04-20 | 2010-10-28 | 이세용 | Apparatus for inspecting and loading large films |
| JP2011029390A (en) * | 2009-07-24 | 2011-02-10 | Sumitomo Metal Fine Technology Co Ltd | Wafer conveying method and wafer conveying device |
| KR20130141004A (en) * | 2012-06-15 | 2013-12-26 | 주식회사 한광 | A workpiece separation apparatus of sheet-like workpiece lifter |
| TW201828401A (en) * | 2016-11-30 | 2018-08-01 | 南韓細美事有限公司 | Apparatus for picking up a semiconductor chip |
| CN107946212A (en) * | 2017-11-21 | 2018-04-20 | 乐山新天源太阳能科技有限公司 | The underwater automatic sheet-fetching plug-in sheet machine of silicon chip |
| CN107968063A (en) * | 2017-11-21 | 2018-04-27 | 乐山新天源太阳能科技有限公司 | The underwater automatic charging device of silicon chip |
| CN207632106U (en) * | 2017-12-16 | 2018-07-20 | 浙江永源机电制造有限公司 | A kind of buffer area loading and unloading mechanical arm |
| CN210012333U (en) * | 2019-05-07 | 2020-02-04 | 张家港市德昶自动化科技有限公司 | Dry wafer separator for semiconductor wafer |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112978321A (en) * | 2019-12-02 | 2021-06-18 | 江西尚立动力科技有限公司 | Square battery device of being qualified for next round of competitions |
| CN112978321B (en) * | 2019-12-02 | 2023-12-19 | 广西桂物中比新能源科技有限公司 | Square battery offline device |
| CN110980215A (en) * | 2019-12-17 | 2020-04-10 | 张家港市德昶自动化科技有限公司 | Tooling basket for semiconductor wafers |
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