KR20120029800A - Apparatus and method for precision loading of light emitting diode wafer - Google Patents

Apparatus and method for precision loading of light emitting diode wafer Download PDF

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KR20120029800A
KR20120029800A KR1020100091859A KR20100091859A KR20120029800A KR 20120029800 A KR20120029800 A KR 20120029800A KR 1020100091859 A KR1020100091859 A KR 1020100091859A KR 20100091859 A KR20100091859 A KR 20100091859A KR 20120029800 A KR20120029800 A KR 20120029800A
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led wafer
pocket
carrier
picker
magnification camera
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KR101214970B1 (en
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류인환
이학표
양일찬
최성규
이병승
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주식회사 로보스타
주식회사 엘지씨엔에스
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: An apparatus and method for precisely loading an LED wafer are provided to reduce process time by loading an LED wafer on a carrier. CONSTITUTION: A transfer robot(40) transfers an LED wafer from a cassette(10) to an aligning unit(93). A picker absorbs and releases an LED wafer which is transferred from the alignment unit. An imaging unit(80) fixes the picker and obtains location information of the pocket. An LED wafer mounting robot(95) transfers the picker and the imaging unit from the aligning unit to a carrier(30).

Description

ＬＥＤ 웨이퍼의 정밀 탑재 장치 및 방법{APPARATUS AND METHOD FOR PRECISION LOADING OF LIGHT EMITTING DIODE WAFER}TECHNICAL APPARATUS AND METHOD FOR PRECISION INSTALLATION OF LED WED wafers

본 발명은 LED 웨이퍼의 정밀 탑재 장치 및 방법에 관한 것으로, 더욱 상세하게는 MOCVD 장비용 LED 웨이퍼를 카세트로부터 캐리어로 이송하기 위한 LED 웨이퍼의 정밀 탑재 장치 및 방법에 관한 것이다.The present invention relates to a precision mounting apparatus and method of the LED wafer, and more particularly to a precision mounting apparatus and method of the LED wafer for transferring the LED wafer for MOCVD equipment from the cassette to the carrier.

일반적으로, 발광 다이오드(LED: Light Emitting Diode) 등의 제조를 위해 사파이어 웨이퍼가 사용되며, 이러한 LED 웨이퍼는 증착 챔버 등으로의 이송을 위해 캐리어(Carrier)에 로딩(Loading) 된다.In general, a sapphire wafer is used for manufacturing a light emitting diode (LED) or the like, and the LED wafer is loaded in a carrier for transfer to a deposition chamber or the like.

종래에는, LED 웨이퍼를 카세트로부터 캐리어로 이송하기 위해 작업자가 수동으로 작업을 수행할 경우, 작업 시간이 지연되고 인력의 소모가 크며 정밀성이 저하되는 문제점이 있었다.Conventionally, when an operator performs a manual operation to transfer an LED wafer from a cassette to a carrier, there is a problem in that work time is delayed, manpower is consumed, and precision is lowered.

이에 따라, 카세트에 탑재된 LED 웨이퍼를 피커를 이용하여 흡착하고, 피커를 고정하는 이송 로봇을 이용하여 LED 웨이퍼를 캐리어로 이송한 후, 피커의 흡착을 해제하여 LED 웨이퍼를 캐리어에 로딩하는 일련의 자동화된 LED 웨이퍼의 정밀 탑재 장치가 사용되었다.Accordingly, the LED wafer mounted on the cassette is sucked by the picker, the transfer robot fixing the picker is transferred to the carrier, and then the suction of the picker is released to load the LED wafer into the carrier. Precision mounting of automated LED wafers was used.

하지만, 종래의 LED 웨이퍼의 정밀 탑재 장치는 LED 웨이퍼를 캐리어에 정밀하게 안착하기 어려웠고, 만약 LED 웨이퍼를 캐리어에 정밀하게 안착하려면 작업 시간이 지체되는 단점이 있었다.However, the conventional LED wafer precision mounting apparatus has been difficult to accurately seat the LED wafer on the carrier, and if the LED wafer is accurately seated on the carrier, work time is delayed.

이와 같은 종래의 문제점을 해결하기 위하여, 본 발명에서는 LED 웨이퍼가 안착될 캐리어의 포켓에 대한 위치 정보를 획득하여 정밀하고 신속한 LED 웨이퍼의 이송 작업을 수행할 수 있는 LED 웨이퍼의 정밀 탑재 장치 및 방법을 제공하는 것을 목적으로 한다.In order to solve such a conventional problem, the present invention provides a device and method for precisely mounting the LED wafer capable of performing a precise and rapid transfer of the LED wafer by obtaining the position information on the pocket of the carrier on which the LED wafer is to be seated. It aims to provide.

본 발명에 따른 LED 웨이퍼의 정밀 탑재 장치는 다수의 LED 웨이퍼가 탑재되는 카세트와, 상기 LED 웨이퍼가 안착되기 위한 다수의 포켓이 형성된 캐리어와, 상기 캐리어로 안착될 상기 LED 웨이퍼를 정렬하는 얼라인부와, 상기 카세트로부터 상기 얼라인부로 상기 LED 웨이퍼를 이송하는 이송 로봇과, 상기 얼라인부로 이송된 상기 LED 웨이퍼를 흡착 및 흡착 해제시키는 피커와, 상기 피커를 고정시키며 상기 포켓의 위치 정보를 획득하는 촬상부, 및 상기 피커 및 상기 촬상부를 상기 얼라인부로부터 상기 캐리어까지 이송시키는 LED 웨이퍼 탑재로봇을 포함하는 것을 특징으로 한다.The precision mounting apparatus of the LED wafer according to the present invention includes a cassette on which a plurality of LED wafers are mounted, a carrier having a plurality of pockets for mounting the LED wafer, and an alignment portion for aligning the LED wafer to be seated with the carrier; A pick-up robot for transferring the LED wafer from the cassette to the alignment unit, a picker for attracting and releasing the LED wafer transferred to the alignment unit, and an image pickup for fixing the picker to obtain position information of the pocket. And an LED wafer mounting robot for transferring the picker and the image pickup unit from the alignment unit to the carrier.

이 경우, 상기 촬상부는 상기 포켓의 위치를 저배율로 촬상하는 저배율 카메라, 및 상기 포켓의 위치를 고배율로 촬상하는 고배율 카메라를 포함하는 것을 특징으로 한다.In this case, the imaging unit may include a low magnification camera for capturing the position of the pocket at low magnification, and a high magnification camera for capturing the position of the pocket at high magnification.

한편, 본 발명에 따른 LED 웨이퍼의 정밀 탑재 방법은 LED 웨이퍼의 플랫면이 일 방향을 향하도록 상기 LED 웨이퍼를 회전하는 단계와, 상기 LED 웨이퍼를 피커가 흡착하는 단계와, LED 웨이퍼 탑재로봇을 이용하여 상기 LED 웨이퍼를 캐리어로 이송하는 단계와, 저배율 카메라로 상기 캐리어에 형성된 포켓의 위치를 촬상하는 단계와, 고배율 카메라로 상기 캐리어에 형성된 포켓의 위치를 촬상하는 단계, 및 상기 LED 웨이퍼를 상기 포켓에 안착하는 단계를 포함한다.On the other hand, the method of accurately mounting the LED wafer according to the present invention comprises the steps of rotating the LED wafer so that the flat surface of the LED wafer toward one direction, the step of picking the LED wafer to the picker, using an LED wafer mounting robot Transferring the LED wafer to a carrier, imaging the position of the pocket formed on the carrier with a low magnification camera, imaging the position of the pocket formed on the carrier with a high magnification camera, and transferring the LED wafer to the pocket And seating on.

이 경우, 상기 저배율 카메라는 상기 포켓의 전체를 일 지점에서 촬상하고, 상기 고배율 카메라는 상기 포켓의 가장 자리 일부분을 다수 지점에서 촬상하는 것을 특징으로 한다.In this case, the low magnification camera captures the entirety of the pocket at one point, and the high magnification camera captures a portion of the edge portion of the pocket at a plurality of points.

본 발명에 따른 LED 웨이퍼의 정밀 탑재 장치 및 방법은 신속하고 정확하게 LED 웨이퍼를 캐리어에 로딩함으로써 전체적인 공정 타임을 줄일 수 있고 불량률을 현저히 낮출 수 있는 매우 유용한 발명이다.The device and method for precisely mounting an LED wafer according to the present invention is a very useful invention that can reduce the overall process time and significantly lower the defective rate by loading the LED wafer into the carrier quickly and accurately.

도 1은 본 발명의 일 실시 예에 따른 LED 웨이퍼의 정밀 탑재 장치의 평면도이고,
도 2는 본 발명의 일 실시 예에 따른 저배율 카메라의 측면도이며,
도 3은 본 발명의 일 실시 예에 따른 고배율 카메라의 측면도이고,
도 4는 본 발명의 일 실시 예에 따른 촬상부의 정면도이며,
도 5는 본 발명의 일 실시 예에 따른 캐리어의 평면도이고,
도 6은 본 발명의 일 실시 예에 따른 캐리어의 측 단면도이며,
도 7은 본 발명의 일 실시 예에 따른 LED 웨이퍼의 정밀 탑재 방법을 도시한 흐름도.1 is a plan view of a precision mounting apparatus of an LED wafer according to an embodiment of the present invention,
2 is a side view of a low magnification camera according to an embodiment of the present invention,
3 is a side view of a high magnification camera according to an embodiment of the present invention,
4 is a front view of an image capturing unit according to an embodiment of the present invention;
5 is a plan view of a carrier according to an embodiment of the present invention;
6 is a side cross-sectional view of a carrier according to an embodiment of the present invention.
7 is a flowchart illustrating a precision mounting method of the LED wafer according to an embodiment of the present invention.

이하 첨부된 도면에 따라서 LED 웨이퍼의 정밀 탑재 장치의 기술적 구성을 상세히 설명하면 다음과 같다.Hereinafter, the technical configuration of the precision mounting apparatus of the LED wafer according to the accompanying drawings in detail as follows.

도 1은 본 발명의 일 실시 예에 따른 LED 웨이퍼의 정밀 탑재 장치의 평면도이고, 도 2는 본 발명의 일 실시 예에 따른 저배율 카메라의 측면도이며, 도 3은 본 발명의 일 실시 예에 따른 고배율 카메라의 측면도이고, 도 4는 본 발명의 일 실시 예에 따른 촬상부의 정면도이며, 도 5는 본 발명의 일 실시 예에 따른 캐리어의 평면도이고, 도 6은 본 발명의 일 실시 예에 따른 캐리어의 측 단면도이다.1 is a plan view of an LED wafer precision mounting apparatus according to an embodiment of the present invention, Figure 2 is a side view of a low magnification camera according to an embodiment of the present invention, Figure 3 is a high magnification according to an embodiment of the present invention 4 is a side view of a camera, FIG. 4 is a front view of an imaging unit according to an embodiment of the present invention, FIG. 5 is a plan view of a carrier according to an embodiment of the present invention, and FIG. 6 is a view of the carrier according to an embodiment of the present invention. It is a side cross section.

도 1 내지 도 6에 도시된 바와 같이, 본 발명의 일 실시 예에 따른 LED 웨이퍼 정밀 탑재 장치는 카세트(10)와, 캐리어(30)와, 얼라인부(93)와, 이송 로봇(40)과, 피커(20)와, 촬상부(80), 및 LED 웨이퍼 탑재로봇(95)을 포함한다.1 to 6, the LED wafer precision mounting apparatus according to an embodiment of the present invention is a cassette 10, the carrier 30, the alignment unit 93, the transfer robot 40 and , A picker 20, an imaging unit 80, and an LED wafer-mounted robot 95.

카세트(10)는 다수의 LED 웨이퍼(99)가 탑재되는 것으로, 다수개가 설치된다.The cassette 10 is provided with a plurality of LED wafers 99, and a plurality of cassettes 10 are installed.

캐리어(30)는 상기 LED 웨이퍼(99)가 안착되기 위한 다수의 포켓(31)을 구비한다. 캐리어(30)는 원판 형상으로 이루어진다. 포켓(31)은 원판 형상의 캐리어(30) 중심을 기준으로 원주 방향으로 소정 간격 이격되게 방사형으로 다수 형성된다.The carrier 30 has a plurality of pockets 31 for seating the LED wafer 99. The carrier 30 has a disk shape. The pocket 31 is formed in a plurality of radially spaced apart at predetermined intervals in the circumferential direction with respect to the center of the disc-shaped carrier 30.

얼라인부(93)는 상기 캐리어(30)로 안착될 상기 LED 웨이퍼(99)를 정렬한다. 이경우, LED 웨이퍼(99)의 정렬은 광센서 등을 이용하여 LED 웨이퍼의 플랫면(98)을 확인하고 OCR CAM 검사를 수행한다.The alignment portion 93 aligns the LED wafer 99 to be seated with the carrier 30. In this case, the alignment of the LED wafer 99 confirms the flat surface 98 of the LED wafer using an optical sensor or the like and performs OCR CAM inspection.

이송 로봇(40)은 상기 카세트(10)로부터 상기 얼라인부(93)로 상기 LED 웨이퍼(99)를 이송한다.The transfer robot 40 transfers the LED wafer 99 from the cassette 10 to the alignment unit 93.

피커(20)는 상기 얼라인부(93)로 이송된 상기 LED 웨이퍼(99)를 흡착 및 흡착 해제시킨다. 피커(20)는 베르누이 원리를 이용하여 상부로 고압의 압축 공기를 공급하고 하부로 압축 공기가 토출되는 측에 유선형의 토출면을 형성하여, 상기 토출면을 따라 배출되는 압축 공기에 의해 토출면 중앙부에 진공을 형성함으로써 LED 웨이퍼(99)를 비접촉식으로 흡착한다. The picker 20 adsorbs and desorbs the LED wafer 99 transferred to the alignment unit 93. The picker 20 supplies a high pressure compressed air to the upper part by using the Bernoulli principle and forms a streamlined discharge surface on the side where the compressed air is discharged to the lower part, and the discharge surface center part by the compressed air discharged along the discharge surface. The vacuum is formed in the LED wafer 99 to be adsorbed in a non-contact manner.

이 경우, 하부로 배출되어 토출면을 따라 이동되는 압축 공기는 다시 상부로 빠지도록 한다. 그 이유는 압축 공기가 하부의 LED 웨이퍼(99) 측으로 내려가면 주변의 이물을 흩트려서 이물이 LED 웨이퍼(99)에 부착되어 불량을 발생시킬 수 있기 때문이다.In this case, the compressed air discharged to the lower side and moved along the discharge surface falls back to the upper side. The reason for this is that when compressed air descends to the lower side of the LED wafer 99, foreign matters in the surroundings may be scattered and foreign matter may adhere to the LED wafer 99 and cause a defect.

하지만, 피커(20)는 그 밖의 다른 방법을 통해 LED 웨이퍼(99)를 흡착하는 것도 가능하다.However, the picker 20 may also adsorb the LED wafer 99 through other methods.

촬상부(80)는 상기 포켓(31)의 위치 정보를 획득한다. 이와 같이 촬상부(80)에 의해 획득된 포켓(31)의 위치 정보는 제어부로 전송되며, 상기 제어부는 LED 웨이퍼(99)를 포켓(31)의 적절한 위치에 안착할 수 있도록 한다. 아울러, 촬상부(80)는 도 4에 도시된 것처럼 상기 피커(20)를 하부 중앙에 고정시킨다.The imaging unit 80 obtains position information of the pocket 31. In this way, the position information of the pocket 31 obtained by the imaging unit 80 is transmitted to the control unit, which allows the LED wafer 99 to be seated at an appropriate position of the pocket 31. In addition, the imaging unit 80 fixes the picker 20 to the lower center as shown in FIG. 4.

LED 웨이퍼 탑재로봇(95)은 상기 피커(20) 및 상기 촬상부(80)를 상기 얼라인부(93)로부터 상기 캐리어(30)까지 이송되도록 X축 방향으로 왕복 이동되게 구현된다.The LED wafer-mounted robot 95 is implemented to reciprocate in the X-axis direction so that the picker 20 and the imaging unit 80 are transferred from the alignment unit 93 to the carrier 30.

이 경우, 상기 촬상부(80)는 저배율 카메라(50), 및 고배율 카메라(60)를 포함한다.In this case, the imaging unit 80 includes a low magnification camera 50 and a high magnification camera 60.

저배율 카메라(50)는 상기 포켓(31)의 위치를 저배율로 촬상한다. 이 경우, 저배율 카메라(50)는 상기 포켓(31)의 전체를 일 지점에서 촬상한다. 결국, 저배율 카메라(50)는 포켓(31)의 상부에서 소정 거리 이격된 상태로 포켓(31)의 전체적인 형상을 획득함으로써, 비교적 빠른 속도로 포켓(31)의 위치를 찾는 기능을 수행한다.The low magnification camera 50 captures the position of the pocket 31 at low magnification. In this case, the low magnification camera 50 captures the entirety of the pocket 31 at one point. As a result, the low magnification camera 50 acquires the overall shape of the pocket 31 while being spaced a predetermined distance from the top of the pocket 31, thereby performing a function of finding the position of the pocket 31 at a relatively high speed.

고배율 카메라(60)는 상기 포켓(31)의 위치를 고배율로 촬상한다. 이 경우, 고배율 카메라(60)는 상기 포켓(31)의 일부분을 다수 지점(S1)(S2)(S3)(S4)에서 촬상한다. 결국, 고배율 카메라(60)는 포켓의 상부에서 소정 거리 이격된 상태로 포켓(31)의 가장 자리 위치를 다수 지점(S1)(S2)(S3)(S4)에서 획득하고 이를 바탕으로 포켓(31)의 정확한 위치를 찾는다.The high magnification camera 60 captures the position of the pocket 31 at high magnification. In this case, the high magnification camera 60 captures a portion of the pocket 31 at a plurality of points S1, S2, S3, and S4. As a result, the high magnification camera 60 obtains the edge position of the pocket 31 at a plurality of points S1, S2, S3, and S4 with a predetermined distance from the top of the pocket, and based on the pocket 31 Find the exact location of).

정리하면, 촬상부(80)가 저배율 카메라(50) 및 고배율 카메라(60)로 구성됨으로써, 캐리어(30)에 형성된 포켓(31)의 위치를 신속하면서도 정확하게 찾는 것이 가능해진다.In summary, since the imaging unit 80 is composed of the low magnification camera 50 and the high magnification camera 60, it is possible to quickly and accurately find the position of the pocket 31 formed in the carrier 30.

한편, 도 7은 본 발명의 일 실시 예에 따른 LED 웨이퍼의 정밀 탑재 방법을 도시한 흐름도이다.On the other hand, Figure 7 is a flow chart illustrating a precision mounting method of the LED wafer according to an embodiment of the present invention.

도 7에 도시된 바와 같이, LED 웨이퍼의 정밀 탑재 방법은 LED 웨이퍼(99)의 플랫면(98)이 일 방향을 향하도록 상기 LED 웨이퍼(99)를 회전하는 단계와, 상기 LED 웨이퍼(99)를 피커(20)가 흡착하는 단계와, LED 웨이퍼 탑재로봇(95)을 이용하여 상기 LED 웨이퍼(99)를 캐리어(30)로 이송하는 단계와, 저배율 카메라(50)로 상기 캐리어(30)에 형성된 포켓(31)의 위치를 촬상하는 단계와, 고배율 카메라(60)로 상기 캐리어(30)에 형성된 포켓(31)의 위치를 촬상하는 단계, 및 상기 LED 웨이퍼(99)를 상기 포켓(31)에 안착하는 단계를 포함한다.As shown in FIG. 7, the method of precisely mounting the LED wafer includes rotating the LED wafer 99 so that the flat surface 98 of the LED wafer 99 faces one direction, and the LED wafer 99. Is picked by the picker 20, and the LED wafer 99 is transferred to the carrier 30 using the LED wafer mounting robot 95, the low magnification camera 50 to the carrier 30 Imaging the position of the formed pocket 31, imaging the position of the pocket 31 formed in the carrier 30 with a high magnification camera 60, and taking the LED wafer 99 into the pocket 31; And seating on.

이 경우, 상기 저배율 카메라(50)는 상기 포켓(31)의 전체를 일 지점에서 촬상하고, 상기 고배율 카메라(60)는 상기 포켓(31)의 가장 자리 일부분을 다수 지점(S1)(S2)(S3)(S4)에서 촬상한다.In this case, the low magnification camera 50 captures the entirety of the pocket 31 at one point, and the high magnification camera 60 takes a portion of the edge of the pocket 31 at multiple points S1 and S2 ( The imaging is performed in S3) (S4).

즉, 먼저 카세트(10)에 다수의 LED 웨이퍼(99)가 공급된다. 이후에, 이송 로봇(40)이 카세트(10)에 탑재된 LED 웨이퍼(99)를 얼라인부(93)로 이송한다. 이와 같이 공급된 LED 웨이퍼(99)는 얼라인부(93)에서 플랫면(98)이 일 방향을 향하도록 회전 정렬된다. 이는 플랫면(98)이 캐리어(30)의 중심을 향한 상태로 LED 웨이퍼(99)가 캐리어(30)에 안착되기 위함이다. 이후에, 이와 같이 회전 정렬된 LED 웨이퍼(99)에 OCR CAM 검사 등을 수행할 수 있다.That is, first, a plurality of LED wafers 99 are supplied to the cassette 10. Thereafter, the transfer robot 40 transfers the LED wafer 99 mounted on the cassette 10 to the alignment unit 93. The LED wafers 99 thus supplied are rotationally aligned in the alignment portion 93 so that the flat surface 98 faces in one direction. This is for the LED wafer 99 to be seated on the carrier 30 with the flat surface 98 facing the center of the carrier 30. Thereafter, the rotationally aligned LED wafer 99 may be subjected to OCR CAM inspection.

다음으로, 피커(20)는 얼라인부(93)에 놓여진 LED 웨이퍼(99)를 흡착한다. 그리고, 피커(20)를 고정하고 있는 촬상부(80)가 LED 웨이퍼 탑재로봇(95)에 의해 캐리어(30) 측으로 이동됨으로써, LED 웨이퍼(99)가 캐리어(30) 측으로 이송되게 된다.Next, the picker 20 sucks the LED wafer 99 placed on the alignment portion 93. Then, the image pickup unit 80 holding the picker 20 is moved to the carrier 30 side by the LED wafer mounting robot 95, whereby the LED wafer 99 is transferred to the carrier 30 side.

한편, 저배율 카메라(50)는 캐리어(30)에 형성된 포켓(31)의 위치를 신속하게 파악하고, 고배율 카메라(60)는 포켓(31)의 정확한 위치를 획득한다. 이와 같이, 포켓(31)의 위치가 파악되면 그 위치 정보를 바탕으로 LED 웨이퍼(99)를 포켓(31)의 정확한 위치로 이송하고 피커(20)의 LED 웨이퍼(99) 흡착을 해제하여 LED 웨이퍼(99)가 캐리어(30)에 안착됨으로써 로딩 작업이 완료된다.On the other hand, the low magnification camera 50 quickly grasps the position of the pocket 31 formed in the carrier 30, and the high magnification camera 60 obtains the correct position of the pocket 31. As such, when the position of the pocket 31 is determined, the LED wafer 99 is transferred to the correct position of the pocket 31 based on the position information, and the LED wafer 99 of the picker 20 is released to release the LED wafer. The loading operation is completed by seating 99 on the carrier 30.

이러한 하나의 LED 웨이퍼(99)에 대한 로딩 작업이 완료되면, 캐리어(30)는 비어 있는 다음 포켓(31)에 LED 웨이퍼(99)가 안착될 수 있도록 소정 각도 회전된다. LED 웨이퍼 탑재로봇(95)은 다시 얼라인부(93) 측으로 이동하고, 전술한 이송 작업을 반복하여 캐리어(30)에 형성된 다수의 포켓(31)에 모두 LED 웨이퍼(99)를 로딩할 수 있다.When the loading operation for one such LED wafer 99 is completed, the carrier 30 is rotated by an angle so that the LED wafer 99 can be seated in the next empty pocket 31. The LED wafer mounting robot 95 may move to the alignment unit 93 again, and may repeat the above-described transfer operation to load the LED wafers 99 in the plurality of pockets 31 formed in the carrier 30.

지금까지 본 발명에 따른 LED 웨이퍼의 정밀 탑재 장치 및 방법은 도면에 도시된 실시 예를 참고로 설명되었으나 이는 예시적인 것에 불과하며, 당업자라면 누구든지 이로부터 다양한 변형 및 균등한 다른 실시 예가 가능하다는 점을 이해할 것이다. 따라서, 진정한 기술적 보호 범위는 첨부된 특허청구범위의 기술적 사상에 의하여 정해져야 할 것이다.Until now, the precision mounting apparatus and method of the LED wafer according to the present invention have been described with reference to the embodiment shown in the drawings, but this is merely exemplary, and those skilled in the art can make various modifications and equivalent other embodiments from this. Will understand. Therefore, the true technical protection scope should be defined by the technical spirit of the appended claims.

10 : 카세트 20 : 피커
30 : 캐리어 31 : 포켓
40 : 이송 로봇 50 : 저배율 카메라
60 : 고배율 카메라 80 : 촬상부
93 : 얼라인부 99 : LED 웨이퍼10: cassette 20: picker
30: carrier 31: pocket
40: transfer robot 50: low magnification camera
60: high magnification camera 80: imaging unit
93: alignment portion 99: LED wafer

Claims (4)

다수의 LED 웨이퍼(99)가 탑재되는 카세트(10);
상기 LED 웨이퍼(99)가 안착되기 위한 다수의 포켓(31)이 형성된 캐리어(30);
상기 캐리어(30)로 안착될 상기 LED 웨이퍼(99)를 정렬하는 얼라인부(93);
상기 카세트(10)로부터 상기 얼라인부(93)로 상기 LED 웨이퍼(99)를 이송하는 이송 로봇(40);
상기 얼라인부(93)로 이송된 상기 LED 웨이퍼(99)를 흡착 및 흡착 해제시키는 피커(20);
상기 피커(20)를 고정시키며, 상기 포켓(31)의 위치 정보를 획득하는 촬상부(80); 및
상기 피커(20) 및 상기 촬상부(80)를 상기 얼라인부(93)로부터 상기 캐리어(30)까지 이송시키는 LED 웨이퍼 탑재로봇(95)을 포함하는 것을 특징으로 하는 LED 웨이퍼의 정밀 탑재 장치.A cassette 10 on which a plurality of LED wafers 99 are mounted;
A carrier 30 having a plurality of pockets 31 formed therein for mounting the LED wafer 99;
An alignment unit 93 for aligning the LED wafer 99 to be seated with the carrier 30;
A transfer robot 40 for transferring the LED wafer 99 from the cassette 10 to the alignment unit 93;
A picker 20 for sucking and releasing the LED wafer 99 transferred to the alignment unit 93;
An image pickup unit (80) which fixes the picker (20) and obtains position information of the pocket (31); And
And an LED wafer mounting robot (95) for transferring the picker (20) and the imaging unit (80) from the alignment unit (93) to the carrier (30). 청구항 1에 있어서,
상기 촬상부(80)는:
상기 포켓(31)의 위치를 저배율로 촬상하는 저배율 카메라(50); 및
상기 포켓(31)의 위치를 고배율로 촬상하는 고배율 카메라(60)를 포함하는 것을 특징으로 하는 LED 웨이퍼의 정밀 탑재 장치.The method according to claim 1,
The imaging unit 80 is:
A low magnification camera 50 for capturing the position of the pocket 31 at a low magnification; And
And a high magnification camera (60) for capturing the position of the pocket (31) at high magnification. LED 웨이퍼(99)의 플랫면(98)이 일 방향을 향하도록 상기 LED 웨이퍼(99)를 회전하는 단계;
상기 LED 웨이퍼(99)를 피커(20)가 흡착하는 단계;
LED 웨이퍼 탑재로봇(95)을 이용하여 상기 LED 웨이퍼(99)를 캐리어(30)로 이송하는 단계;
저배율 카메라(50)로 상기 캐리어(30)에 형성된 포켓(31)의 위치를 촬상하는 단계;
고배율 카메라(60)로 상기 캐리어(30)에 형성된 포켓(31)의 위치를 촬상하는 단계; 및
상기 LED 웨이퍼(99)를 상기 포켓(31)에 안착하는 단계를 포함하는 것을 특징으로 하는 LED 웨이퍼의 정밀 탑재 방법.Rotating the LED wafer 99 such that the flat surface 98 of the LED wafer 99 faces one direction;
The picker 20 adsorbs the LED wafer 99;
Transferring the LED wafer (99) to a carrier (30) using an LED wafer mounting robot (95);
Imaging the position of the pocket (31) formed in the carrier (30) with a low magnification camera (50);
Imaging the position of the pocket (31) formed in the carrier (30) with a high magnification camera (60); And
And mounting the LED wafer (99) in the pocket (31). 청구항 3에 있어서,
상기 저배율 카메라(50)는 상기 포켓(31)의 전체를 일 지점에서 촬상하고, 상기 고배율 카메라(60)는 상기 포켓(31)의 가장 자리 일부분을 다수 지점에서 촬상하는 것을 특징으로 하는 LED 웨이퍼의 정밀 탑재 방법.The method according to claim 3,
The low magnification camera 50 captures the entirety of the pocket 31 at one point, and the high magnification camera 60 captures a portion of the edge portion of the pocket 31 at a plurality of points. Precision mounting method.
KR1020100091859A 2010-09-17 2010-09-17 Apparatus and method for precision loading of light emitting diode wafer KR101214970B1 (en)

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US8676375B2 (en) 2012-02-27 2014-03-18 Veeco Instruments Inc. Automated cassette-to-cassette substrate handling system
CN103762192A (en) * 2014-01-25 2014-04-30 江苏艾科瑞思封装自动化设备有限公司 High precision chip mounting machine

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KR101462591B1 (en) * 2013-03-19 2014-11-20 주식회사 에스에프에이 Glass align provision equipment and align method thereof

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DE69529501T2 (en) 1994-04-18 2003-12-11 Micron Technology, Inc. METHOD AND DEVICE FOR AUTOMATICALLY POSITIONING ELECTRONIC CUBES IN COMPONENT PACKAGING
KR100262530B1 (en) 1996-12-28 2000-09-01 김영환 Wafer carriage apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8676375B2 (en) 2012-02-27 2014-03-18 Veeco Instruments Inc. Automated cassette-to-cassette substrate handling system
CN103762192A (en) * 2014-01-25 2014-04-30 江苏艾科瑞思封装自动化设备有限公司 High precision chip mounting machine

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