TW201704006A - 包括混合石墨之放熱材料 - Google Patents

包括混合石墨之放熱材料 Download PDF

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TW201704006A
TW201704006A TW105111720A TW105111720A TW201704006A TW 201704006 A TW201704006 A TW 201704006A TW 105111720 A TW105111720 A TW 105111720A TW 105111720 A TW105111720 A TW 105111720A TW 201704006 A TW201704006 A TW 201704006A
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graphite
mixed
filler
sheet
foamed
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塚本勝朗
中村雄三
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日本瑪泰克斯股份有限公司
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Abstract

本發明提供一種藉由將人造石墨、硼氮化物、研磨瀝青系碳纖構成群組中選取的熱傳導性填料摻混於發泡石墨來增加厚度方向之熱傳導性、更且藉由挾設薄片體來提高面方向之熱傳導性之放熱材料。該放熱材料之特徴係在於：由混合有發泡石墨與填料之混合石墨、以及厚度10~100μm之薄片體所構成；發泡石墨之含量係佔混合石墨全體之70%~95%；由混合石墨與薄片體所積層而成。

Description

包括混合石墨之放熱材料
本發明係關於一種使用混合石墨之放熱材料，尤其關於一種對於藉由使用熱傳導性填料而成的習用之膨脹石墨薄片（由天然石墨製造而得）之低的厚度方向（Z軸方向）熱傳導率，可使之提高的一種放熱材料。
自以往以來，在電視機及個人電腦等之電氣製品之放熱材料中，已使用了一種由利用膨脹石墨薄片而成之放熱材料。
在專利文獻1中已記載了一種放熱器。更詳細地來說，該文獻中已記載了一種放熱材料，其為將具有以金屬箔挾住膨脹石墨薄片的兩面之構造的積層體彎曲加工成波浪(corrugate)狀而成。
在專利文獻2中已記載了一種放熱器及其製造方法。更詳細地來說，該文獻中已記載了一種放熱材料，其為將高分子薄膜予以石墨化而呈現熱傳導性之人造石墨薄片貼附於金屬板上，與金屬板一起彎曲加工成波狀而成。 《先前技術文獻》 《專利文獻》
《專利文獻1》日本特開2015-46557號公報 《專利文獻2》日本專利第3649150號
《發明所欲解決之課題》
使用在專利文獻1及2所記載之習用的膨脹石墨薄片之放熱器，雖然面方向（XY軸方向）之熱傳導性是優異的；然而卻會有在厚度方向（Z軸方向）之熱傳導性是低的問題。 《用以解決課題之手段》
本發明即是為了解決上述之課題而完成者，提供一種藉由將從人造石墨、硼氮化物、研磨瀝青系碳纖構成群組中選取的一種以上之熱傳導性填料、與發泡石墨予以混合具有來增加厚度方向之熱傳導性、更且藉由挾設薄片體來提高面方向之熱傳導性之放熱材料。
請求項1有關之發明係關於一種放熱材料，其特徵在於：由混合有發泡石墨與填料之混合石墨、以及 厚度10～100μm之薄片體所構成； 發泡石墨之含量係佔混合石墨全體之70%～95%； 並由混合石墨與薄片體所積層而成。
請求項2有關之發明，其係關於如請求項1所述之一種放熱材料，其特徵在於：前述薄片體為聚酯薄片。
請求項3有關之發明，其係關於如請求項1所述之一種放熱材料，其特徵在於：前述薄片體為鋁箔。
請求項4有關之發明，其係關於如請求項1所述之一種放熱材料，其特徵在於：前述填料係由人造石墨、硼氮化物、研磨瀝青系碳纖構成群組中選取的一種以上之熱傳導性填料。
請求項5有關之發明係關於一種放熱材料，其特徵在於：由混合有發泡石墨與填料之混合石墨、以及 厚度10～100μm之薄片體所構成； 前述填料係由人造石墨、硼氮化物、研磨瀝青系碳纖構成群組中選取的一種以上之熱傳導性填料； 發泡石墨之含量係佔混合石墨全體之70～95%； 由混合石墨與薄片體所積層而成； 熱傳導率在厚度方向為3～15W/m･K，在面方向為50～250W/m･K。 《發明效果》
請求項1有關之發明係關於一種放熱材料，其特徵在於：由混合有發泡石墨與填料之混合石墨、以及厚度10～100μm之薄片體所構成；前述發泡石墨之含量係佔混合石墨全體之70%～95%；混合石墨係被積層於薄片體；藉由摻混填料而使熱傳導率提高。
根據請求項2有關之發明，挾住前述混合石墨之薄片體係能夠使用聚酯薄片。
根據請求項3有關之發明，挾住前述混合石墨之薄片體係能夠使用鋁箔。
根據請求項4有關之發明，其係一種如請求項1至3中所記載之放熱材料，其特徵在於：前述填料係由人造石墨、硼氮化物、研磨瀝青系碳纖構成群組中選取的一種以上之熱傳導性填料。
根據請求項5有關之發明，其係一種放熱材料，由混合有發泡石墨與填料之混合石墨、以及厚度10～100μm之薄片體所構成；前述填料係由人造石墨、硼氮化物、研磨瀝青系碳纖構成群組中選取的一種以上之熱傳導性填料；發泡石墨之含量係佔混合石墨全體之70%～95%；混合石墨係被積層於薄片體；藉由摻混填料而具有在厚度方向為3～15W/m･K、而面方向為50～250W/m･K之優異的熱傳導率。
本發明之混合石墨係指由發泡石墨與填料混合而成之物。 本發明之混合石墨係藉由具有填料而將習用之膨脹石墨薄片的在厚度方向（Ｚ軸方向）之低熱傳導率予以提高；藉由混合有發泡石墨與填料來達成發泡石墨與填料分子間之連結、並使混合石墨能夠拉伸成薄片狀之一種混合石墨。 面方向係指與薄片之面平行的方向；厚度方向係指與薄片之面垂直的方向。 發泡石墨係指將天然石墨（石墨）粉碎成粒子狀後，再進行硫酸浸漬、中和洗淨，並更進一步地進行高温加熱發泡而成之物。 本發明之填料係指具有高熱傳導率之填充材；舉例來說，例如，其可以是六方氮化硼、碳化合物，雖然舉例來說，可以是例如研磨瀝青系碳纖纖維、硼氮化物、人造石墨，然而並未限定於此等而已。 本發明之人造石墨係包括：以焦碳(coke)與瀝青為原料之物、以及將聚醯亞胺薄膜在惰性氣體中加熱燒成、石墨化而成之物。 混合石墨係例如在將天然石墨如上述地處理而作成之發泡石墨中混合填料所製造而成者。 又，可以在將天然石墨粉碎成粒子狀之後再進行硫酸浸漬、中和洗淨而成之酸處理石墨粉末中，混合填料並進行高温加熱發泡來製造。在填料中使用人造石墨的情況下，在酸處理石墨粉末中混合填料，即使進行高温加熱發泡，人造石墨亦並未發泡。 混合發泡石墨與填料之方法、及混合酸處理石墨粉末與填料之方法，舉例來說，例如，其可以是以攪拌機進行旋轉混合之方法等，然而並未限定於此等而已。 發泡石墨與填料之混合比率較佳為8：2。 又，混合石墨之密度宜為0.8-1.5g/cm3 ，特佳為1.24g/cm3 。
由於發泡石墨本身之強度低，以致將會有石墨粉末在使用的機器之内部中飛散而引起電氣故障損害之虞，所以藉由在2片的薄片之間挾設石墨層來改善該點。 薄片體可以使用聚對酞酸乙二酯（PET）等之樹脂製薄片，金屬箔較佳者為可以使用鋁箔。 薄片體之厚度係在10-100μm以下；特佳者為10-50μm，由於容易順應於柔軟的發泡石墨之表面凹凸，因為是理想的。 在將混合石墨挾設於薄片體之際，可以首先舖設薄片體，再將混合石墨延展於其上並更進一步地貼附在薄片體；又，也可以利用輥將附加有黏著劑的薄片體與混合石墨一起輒延。
（實施例1） 　雖然記載了本件發明的放熱材料之製造方法的一例子；然而，本發明並非限定於此等實施例而已。 1．發泡石墨之製造方法 將天然石墨粉碎成粒子狀之後，再進行硫酸浸漬、中和洗淨並更進一步地進行高温加熱發泡而製造出發泡石墨。 2．混合石墨之製造方法 在發泡石墨中添加2%之日本石墨纖維株式會社製之GRANOC醯胺纖維（HC-600-15M、纖維長150μm）之填料，振動攪拌聚乙烯袋，裝入105mm方形模具中，以7500N（面壓約68kg/cm2 ）之成形壓力而使成形為混合石墨。 3．放熱材料之製造方法 事先設定經接着劑處理的11μm之鋁箔，從其上投入已成形的混合石墨，更進一步地重疊鋁箔以加壓成型而製作成厚度250μm的積層體。
（實施例2） 除了混合5%的日本石墨纖維株式會社製之GRANOC醯胺纖維（HC-600-15M、纖維長150μm）的填料、以及將積層體的厚度設定為200μm以外，皆與實施例1相同。
（實施例3） 除了混合5%的電氣化學工業株式會社製之電荷硼氮化物（GP粒徑8.2μm）的填料、以及將積層體的厚度設定為220μm以外，皆與實施例1相同。
（實施例4） 除了混合10%的電氣化學工業株式會社製之電荷硼氮化物（GP粒徑8.2μm）的填料、以及將積層體之厚度設定為330μm以外，皆與實施例1相同。
（實施例5） 除了混合10%之粒徑20μm的SEC碳株式會社製之SEC精細粉末SGL-25的填料、以及將積層體之厚度設定為250μm以外，皆與實施例1相同。
（實施例6） 除了混合20%之粒徑20μm的SEC碳株式會社製之SEC精細粉末SGL-25的填料、以及將積層體之厚度設定為320μm以外，皆與實施例1相同。
（實施例7） 除了混合10%之粒徑50μm的SEC碳株式會社製之SEC精細粉末SGL-50的填料、以及將積層體之厚度設定為215μm以外，皆與實施例1相同。
（實施例8） 除了混合20%之粒徑50μm的SEC碳株式會社製之SEC精細粉末SGL-50的填料、以及將積層體之厚度設定為410μm，皆與實施例1相同。
（實施例9） 1．混合石墨之製造方法 在由天然石墨粉末以硫酸浸漬、中和洗淨過的酸處理石墨粉末中，混合20%的粒徑50μm的SEC碳株式會社製之SEC精細粉末SGL-50之人造石墨填料，於高温加熱發泡以後，再裝入105mm之方形模具中以7500N（面壓約68kg/cm2）之成形壓力而成形為混合石墨。 2．放熱材料之製造方法 事先設置經接着劑處理過的30μm之PET薄片，從其上投入已成形的混合石墨，更進一步地重疊30μm之PET薄片，藉由壓製成型而製作出厚度1560μm的積層體。
（實施例10） 放熱材料として除了使用50μm之鋁箔、以及將積層體之厚度設定為1600μm以外，皆與實施例9相同。
（比較例） 比較例1係使用由將膨脹石墨積層於PET薄片而成之厚度157μm的積層體。 比較例2係使用由將膨脹石墨積層於PET薄片而成之厚度300μm的積層體。 比較例3係只使用發泡石墨。
將上述實施例1至10、以及比較例1至3分別製作成5mm方形試料，以艾菲斯・莫拜魯1u（株式會社艾菲斯公司製）測定放熱材料的厚度方向之熱擴散率、熱傳導率並進行比較。   表（N＝3之平均値）<TABLE border="1" borderColor="#000000" width="85%"><TBODY><tr><td> 測定資料 </td><td> 熱擴散率 （E-07m<sup>2</sup>/s） </td><td> 熱傳導率 （W/m･K） </td></tr><tr><td> 實施例1 </td><td> 41.8 </td><td> 3.6 </td></tr><tr><td> 實施例2 </td><td> 52.0 </td><td> 4.4 </td></tr><tr><td> 實施例3 </td><td> 35.6 </td><td> 3.0 </td></tr><tr><td> 實施例4 </td><td> 75.4 </td><td> 6.4 </td></tr><tr><td> 實施例5 </td><td> 61.6 </td><td> 5.2 </td></tr><tr><td> 實施例6 </td><td> 98.5 </td><td> 8.4 </td></tr><tr><td> 實施例7 </td><td> 48.5 </td><td> 4.1 </td></tr><tr><td> 實施例8 </td><td> 120.0 </td><td> 10.3 </td></tr><tr><td> 實施例9 </td><td> 128.0 </td><td> 10.9 </td></tr><tr><td> 實施例10 </td><td> 141.7 </td><td> 12.1 </td></tr><tr><td> 比較例1 </td><td> 6.07 </td><td> 0.5 </td></tr><tr><td> 比較例2 </td><td> 14.1 </td><td> 1.0 </td></tr><tr><td> 比較例3 </td><td> 55.8 </td><td> 4.8 </td></tr></TBODY></TABLE>
如表所示，習用之放熱材料的比較例1之熱傳導率為0.5W/m･K；比較例2之熱傳導率為1.0；相對地，實施例1之熱傳導率具為3.6W/m･K、實施例2之熱傳導率為4.4W/m･K之高的結果。 雖然比較例3為熱傳導率是高的，然而由於發泡石墨的粉末為飛散在使用的機器之内部，以致引起電氣故障損害，所以實際上不能使用於放熱材料。 又，實施例1為3.6W/m･K；相對地，實施例2則為4.4W/m･K；因而填料的摻混量愈多時則熱傳導率愈提高。 又，在天然石墨粉末之酸處理石墨粉末混合人造石墨再進行發泡的實施例9、10之熱傳導率分別為10.9W/m･K、12.1W/m･K，顯示出遠遠高於比較例的値。推斷這是因為：由於先混合人造石墨再進行發泡而使得發泡石墨與人造石墨間之密合性提高所致。 又，與習用的放熱材料相比較之下，本發明之放熱材料的熱擴散率係比較高的。 與比較例1之6.07E-07m2/s、比較例2之14.1E-07m2/s相比較之下，實施例1顯示出41.8E-07m2/s、實施例2顯示出52.8E-07m2/s之較高的値。再者，實施例9、10之熱擴散率分別為128.0E-07m2/s、141.7E-07m2/s，亦顯示出遠遠高於比較例的値。   《產業上利用之可能性》
本發明之混合石墨，由於Z軸方向及X-Y軸方向之熱傳導率高，所以不只是適合於所使用的機器之薄度的放熱材料，而且也可以用來做為熱導體使用。 例如，在使用於如電腦之類的具有厚度之機器的情況下，為了將散熱片與CPU重疊而配置在其間，面方向之熱傳導率高的樹脂系薄片體、或者使用以金屬箔所挾設的混合石墨；如薄型電視之類的薄的機器，因為CPU與熱片為並列配置而將它做為連繋熱散熱片使用的觀點來看，可以使用X-Y軸方向之熱傳導率高的金屬箔，特別是可以使用以鋁箔積層的混合石墨。
無

Claims (5)

  1. 一種放熱材料，特徵在於其為由： 混合有發泡石墨與填料而成之混合石墨、以及 厚度為10~100μm的薄片體所構成； 所含的發泡石墨係佔混合石墨全體之70%~95%；並且 由混合石墨與薄片體所積層而成。
  2. 如請求項1所記載之放熱材料，其中前述薄片體為聚酯薄片。
  3. 如請求項1所記載之放熱材料，其中前述薄片體為鋁箔。
  4. 如請求項1至3中任一項所記載之放熱材料，其中前述填料係由人造石墨、硼氮化物、研磨瀝青系碳纖構成群組中所選取的一種以上之熱傳導性填料。
  5. 一種放熱材料，特徵在於其為由： 混合有發泡石墨與填料而成之混合石墨、以及 厚度為10~100μm的薄片體所構成； 前述填料係由人造石墨、硼氮化物、研磨瀝青系碳纖構成群組中選取的一種以上的熱傳導性填料； 其中所含的發泡石墨係佔混合石墨全體之70~95%； 並且由混合石墨與薄片體積層而成； 熱傳導率在厚度方向為3~15W/m･K、而面方向為50~250W/m･K。
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