TW201425854A - Heat dissipating module - Google Patents
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- TW201425854A TW201425854A TW101150659A TW101150659A TW201425854A TW 201425854 A TW201425854 A TW 201425854A TW 101150659 A TW101150659 A TW 101150659A TW 101150659 A TW101150659 A TW 101150659A TW 201425854 A TW201425854 A TW 201425854A
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本發明係關於一種散熱模組，特別是一種用於電子元件的散熱模組。 The invention relates to a heat dissipation module, in particular to a heat dissipation module for an electronic component.
隨著電子產業的快速發展，使電子裝置內部所使用的中央處理器(central processing unit，CPU)、北橋晶片、顯示卡等電子元件的功率大幅提升，電子元件在單位面積的密集度也愈來愈高，相對造成電子元件在運作時所產生的熱量大幅增加，往往造成電子元件本身及其配置的系統內部的溫度升高。同時，隨著熱量的迅速累積，導致電子元件的運作性能下降，並容易造成電腦系統當機，甚至是電子元件過熱燒毀等情形的發生。 With the rapid development of the electronics industry, the power of electronic components such as a central processing unit (CPU), a north bridge chip, and a display card used in an electronic device has been greatly increased, and the density of electronic components in the unit area has also increased. The higher the temperature, the greater the amount of heat generated by the electronic components during operation, the higher the temperature inside the electronic components themselves and their configured systems. At the same time, with the rapid accumulation of heat, the operational performance of electronic components is degraded, and it is easy to cause the computer system to crash, even the electronic components are overheated and burned.
為確保電子元件能維持在其正常的溫度範圍內運作，通常會在電子元件上安裝具有散熱鰭片的散熱器，並且為了提升散熱器的散熱效能，目前市面上另有在散熱器上加裝熱管的模組化散熱裝置，其主要是以熱管的一端連接於散熱器，另一端串接散熱鰭片，並且透過熱管與散熱器貼近或直接連接於電子元件的表面，以藉由熱管的熱超導作用，將電子元件產生的熱量快速地傳導至散熱器的底座以及散熱鰭片，藉以提昇散熱器的散熱效能。 In order to ensure that the electronic components can maintain their normal temperature range, a heat sink with heat sink fins is usually installed on the electronic components, and in order to improve the heat dissipation performance of the heat sink, the heat sink is additionally installed on the market. The modular heat sink of the heat pipe is mainly connected to the heat sink at one end of the heat pipe, and the heat sink fins are connected in series at the other end, and is closely connected to the heat sink through the heat pipe or directly connected to the surface of the electronic component to heat the heat pipe. Superconducting, the heat generated by the electronic components is quickly transmitted to the base of the heat sink and the heat dissipation fins, thereby improving the heat dissipation performance of the heat sink.
在這種散熱模式中，主要是在熱管上間隔設置多個散熱鰭片，並且在多個散熱鰭片之間僅藉由其本身的彎折結構相互連接，或甚至於在多個散熱鰭片之間沒有任何的連接關係。因此，絕大部分的熱量必須藉由熱管傳遞至各個散熱鰭片。然而，隨著 熱管相對於熱源的距離愈遠，其熱量的傳遞能力會大幅度的衰減，如此，往往導致熱量無法有效的傳遞至較遠的散熱鰭片，因此使散熱鰭片所能提供的散熱效能大打折扣，而無法被有效利用，進而降低散熱鰭片與導熱管間的熱傳導效率，並嚴重影響散熱裝置的整體散熱效能。 In this heat dissipation mode, a plurality of heat dissipation fins are mainly disposed on the heat pipe, and the plurality of heat dissipation fins are connected to each other only by their own bent structure, or even a plurality of heat dissipation fins. There is no connection between them. Therefore, most of the heat must be transferred to the heat sink fins by the heat pipe. However, with The farther the heat pipe is from the heat source, the greater the heat transfer capacity will be. Therefore, the heat can not be effectively transmitted to the far-reaching fins, so the heat dissipation performance of the heat sink fins is greatly reduced. It cannot be effectively utilized, thereby reducing the heat transfer efficiency between the heat sink fins and the heat pipe, and seriously affecting the overall heat dissipation performance of the heat sink.
鑒於以上的問題，本發明在於提供一種散熱模組，藉以解決習用具有熱管的散熱模組中，熱傳效率會隨著熱管與熱源的距離愈遠而大幅衰減，進而嚴重影響其散熱效率的問題。 In view of the above problems, the present invention provides a heat dissipation module for solving the problem that the heat transfer efficiency of the heat dissipation module with the heat pipe is greatly attenuated as the distance between the heat pipe and the heat source is farther, thereby seriously affecting the heat dissipation efficiency. .
本發明之散熱模組包括一導熱基座、至少一鰭片組以及多根熱管。鰭片組包括相互並排的多個散熱鰭片，各個散熱鰭片具有多個散熱段及多個導熱段，且多個導熱段間隔連接於多個散熱段之間，其中各個導熱段之厚度大於各個散熱段之厚度，且相鄰的散熱鰭片的導熱段相互接觸。熱管的數量對應於各個散熱鰭片之導熱段的數量，且多個熱管之一端連接於導熱基座，另一端對應串接多個散熱鰭片之多個導熱段。 The heat dissipation module of the present invention comprises a heat conducting base, at least one fin set and a plurality of heat pipes. The fin assembly includes a plurality of heat dissipation fins arranged side by side, each of the heat dissipation fins has a plurality of heat dissipation sections and a plurality of heat conduction sections, and the plurality of heat conduction sections are spaced apart between the plurality of heat dissipation sections, wherein each of the heat conduction sections has a thickness greater than The thickness of each heat dissipation section, and the heat conduction sections of the adjacent heat dissipation fins are in contact with each other. The number of heat pipes corresponds to the number of heat conducting segments of each of the heat dissipating fins, and one end of the plurality of heat pipes is connected to the heat conducting base, and the other end corresponds to a plurality of heat conducting segments of the plurality of heat radiating fins.
本發明之功效在於，鰭片組的多個散熱鰭片是透過彼此之間的導熱段相互結合，並藉由導熱段的厚度大於散熱段的厚度的特性，使多個散熱鰭片的導熱段在鰭片組內形成具有較大載面積的熱傳路徑，其可提供熱管所吸收的熱量從靠近熱源的一端迅速的傳遞至遠離熱源的一端，也就是讓熱量可以快速的傳遞至各個散熱鰭片的散熱段，並透過散熱段與外界空氣進行熱交換，因此可大幅提升散熱作用，同時解決了習知具有熱管的散熱模組所存在 的問題。 The effect of the present invention is that the plurality of heat dissipating fins of the fin group are combined with each other through the heat conducting segments, and the heat conducting segments of the plurality of heat dissipating fins are made by the thickness of the heat conducting portion being greater than the thickness of the heat dissipating portion. Forming a heat transfer path with a larger load area in the fin group, which can provide heat absorbed by the heat pipe from the end close to the heat source to the end away from the heat source, that is, the heat can be quickly transmitted to each heat sink fin The heat dissipating section of the film exchanges heat with the outside air through the heat dissipating section, thereby greatly improving the heat dissipating effect, and simultaneously solving the conventional heat dissipating module having the heat pipe The problem.
有關本發明的特徵、實作與功效，茲配合圖式作最佳實施例詳細說明如下。 The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.
如第1圖和第2圖所示，本發明第一實施例所揭露的散熱模組100包含一導熱基座110、一鰭片組120與多根熱管130。導熱基座110係用以結合於中央處理器(central processing unit，CPU)或圖形處理器(graphic processing unit，GPU)等運作時會產生大量熱量的電子元件上。導熱基座110具有相對的一頂面與一底面，並且於導熱基座110的底面設置有二溝槽111，多根熱管130的一端即對應卡合於溝槽111內，並且以另一端連接於鰭片組120。 As shown in FIG. 1 and FIG. 2 , the heat dissipation module 100 disclosed in the first embodiment of the present invention includes a heat conductive base 110 , a fin set 120 , and a plurality of heat pipes 130 . The heat-conducting base 110 is used to be coupled to an electronic component that generates a large amount of heat when operating, such as a central processing unit (CPU) or a graphics processing unit (GPU). The heat-conducting base 110 has a top surface and a bottom surface, and two grooves 111 are disposed on the bottom surface of the heat-conducting base 110. One ends of the plurality of heat pipes 130 are correspondingly engaged in the groove 111, and are connected at the other end. In the fin group 120.
鰭片組120包含多個散熱鰭片121，每一散熱鰭片121包含多個散熱段1211以及間隔連接於多個散熱段1212之間的多個導熱段1212，在本實施例中，是以散熱鰭片121包含三個散熱段1211與二個導熱段1212作為舉例說明，但其數量並不以此為限，其中導熱段1212的表面積小於散熱段1211的表面積，但其厚度大於散熱段1211的厚度，此外，導熱段1212相對二端的厚度可以是但並不侷限於朝向相連接的散熱段1211的方向遞減。因此，當多個散熱鰭片121以並排的方式相互結合時，相鄰的散熱鰭片121之間可以導熱段1212相互接觸，並且使散熱段1211之間相隔一間距。 The fin assembly 120 includes a plurality of heat dissipation fins 121. Each of the heat dissipation fins 121 includes a plurality of heat dissipation segments 1211 and a plurality of heat conduction segments 1212 spaced apart between the plurality of heat dissipation segments 1212. In this embodiment, The heat dissipating fins 121 include three heat dissipating segments 1211 and two heat conducting segments 1212 as an example, but the number is not limited thereto. The surface area of the heat conducting portion 1212 is smaller than the surface area of the heat dissipating portion 1211, but the thickness thereof is greater than the heat dissipating portion 1211. In addition, the thickness of the thermally conductive section 1212 relative to the two ends may be, but is not limited to, decreasing toward the direction of the connected heat dissipating segments 1211. Therefore, when the plurality of heat dissipation fins 121 are combined with each other in a side by side manner, the heat conduction sections 1212 may be in contact with each other between the adjacent heat dissipation fins 121, and the heat dissipation sections 1211 may be spaced apart from each other by a distance.
多根熱管130可以是但並不侷限於以彎折的形式連接於導熱基座110與鰭片組120之間，使鰭片組120懸置於導熱基座110 的頂面。每一熱管130具有相對的一第一端131與一第二端132，熱管130的第一端131對應卡合於導熱基座110的溝槽111內，熱管130的第二端132對應穿過多個散熱鰭片121上位於同一側的導熱段1212，使多個散熱鰭片121被串接於熱管130上，並且透過導熱段1212緊密地相互貼合。此外，還可以在熱管130上塗覆錫膏，使散熱鰭片121透過錫膏與熱管130緊密結合，以提升兩者間的熱傳速率。 The plurality of heat pipes 130 may be, but are not limited to, connected to the heat conducting base 110 and the fin set 120 in a bent manner, so that the fin sets 120 are suspended from the heat conducting base 110 The top surface. Each of the heat pipes 130 has a first end 131 and a second end 132. The first end 131 of the heat pipe 130 is correspondingly engaged with the groove 111 of the heat-conducting base 110. The heat-dissipating segments 1212 on the same side of the heat-dissipating fins 121 are such that the plurality of heat-dissipating fins 121 are connected in series to the heat pipe 130 and closely adhere to each other through the heat-transfer section 1212. In addition, a solder paste may be coated on the heat pipe 130 so that the heat dissipation fins 121 are tightly coupled to the heat pipe 130 through the solder paste to increase the heat transfer rate therebetween.
基於上述結構，當多個散熱鰭片121串接於熱管130時，可透過導熱段1212的緊密貼合而在熱管130上形成具有較大截面積的導熱塊結構，使熱管130從電子元件上吸收的熱量，可以快速的傳遞至各個導熱段1212，並且透過導熱段1212快速的在各個散熱鰭片121之間傳遞，然後再透過具有較大散熱面積的散熱段1211與外界空氣進行熱交換，如此，可大幅提升鰭片組120的散熱效能。 Based on the above structure, when a plurality of heat dissipating fins 121 are connected in series to the heat pipe 130, a heat conducting block structure having a large cross-sectional area can be formed on the heat pipe 130 through the close fitting of the heat conducting portion 1212, so that the heat pipe 130 is on the electronic component. The absorbed heat can be quickly transferred to the respective heat conducting segments 1212, and quickly transmitted between the heat radiating fins 121 through the heat conducting portion 1212, and then exchanged with the outside air through the heat dissipating portion 1211 having a large heat dissipating area. In this way, the heat dissipation performance of the fin group 120 can be greatly improved.
如第3圖和第4圖所示，本發明第二實施例所揭露的散熱模組200包括一導熱基座210、二鰭片組220與多根熱管230。導熱基座210包含一散熱器212與一導熱板213，散熱器212包含多個相互並排的散熱片214，並且於每一散熱片214的側邊上配置有多個溝槽211，導熱板213即結合於散熱器212上配置有溝槽211的一側。 As shown in FIG. 3 and FIG. 4 , the heat dissipation module 200 disclosed in the second embodiment of the present invention includes a heat conductive base 210 , a second fin set 220 , and a plurality of heat pipes 230 . The heat conducting base 210 includes a heat sink 212 and a heat conducting plate 213. The heat sink 212 includes a plurality of heat sinks 214 arranged side by side, and a plurality of grooves 211 are disposed on the side of each of the heat sinks 214. The heat conducting plate 213 That is, the side of the heat sink 212 on which the trench 211 is disposed is coupled.
鰭片組220包含相互並排的多個散熱鰭片221，每一散熱鰭片221包含多個散熱段2211以及數量少於散熱段2211的多個導熱段2212，且多個導熱段2212間隔連接於多個散熱段2211之間， 其中每一導熱段2212的厚度大於每一散熱段2211的厚度，使相鄰的散熱鰭片221之間以導熱段2212相互接觸，並且使散熱段2211之間相隔一間距。此外，於每一散熱鰭片的導熱段2212上形成有一穿孔2213，用以供熱管230穿設其中。 The fin assembly 220 includes a plurality of heat dissipation fins 221 arranged side by side, each of the heat dissipation fins 221 includes a plurality of heat dissipation segments 2211 and a plurality of heat conduction segments 2212 that are smaller than the heat dissipation segments 2211, and the plurality of heat conduction segments 2212 are spaced apart from each other. Between the plurality of heat dissipation sections 2211, The thickness of each of the heat-dissipating segments 2212 is greater than the thickness of each of the heat-dissipating segments 2211, so that the heat-dissipating segments 2212 are in contact with each other between the adjacent heat-dissipating fins 221, and the heat-dissipating segments 2211 are separated by a distance. In addition, a through hole 2213 is formed in the heat conducting portion 2212 of each heat dissipating fin for the heat pipe 230 to pass through.
熱管230的數量可以是但並不侷限於少於或等於每一散熱鰭片221的導熱段2212的數量。每一熱管230具有一第一端231、一第二端232與一卡合段233，且卡合段233連接於第一端231與第二端232之間，其中多根熱管230分別以卡合段233對應嵌入導熱基座210的溝槽211內，並且被夾制固定於導熱基座210的散熱器212與導熱板213之間。熱管230的第一端231與第二端232分別於導熱基座210的相對二側連接於二鰭片組220，其中熱管230的第一端231與第二端232分別穿過散熱鰭片221的導熱段2212的穿孔2213，使二鰭片組220的多個散熱鰭片221分別以緊配合的關係串接於熱管230的第一端231與第二端232，並且以導熱段2212相互接觸，進而使多個散熱鰭片221之間的導熱段2212於熱管230上形成具有較大截面積的熱傳路徑。 The number of heat pipes 230 may be, but is not limited to, less than or equal to the number of thermally conductive segments 2212 of each heat sink fin 221. Each of the heat pipes 230 has a first end 231, a second end 232 and an engaging portion 233, and the engaging portion 233 is connected between the first end 231 and the second end 232. The splicing portion 233 is correspondingly embedded in the groove 211 of the heat-conducting base 210 and sandwiched between the heat sink 212 and the heat-conducting plate 213 of the heat-conducting base 210. The first end 231 and the second end 232 of the heat pipe 230 are respectively connected to the two fin sets 220 on opposite sides of the heat conducting base 210. The first end 231 and the second end 232 of the heat pipe 230 pass through the heat radiating fins 221, respectively. The plurality of heat dissipation fins 221 of the second fin group 220 are connected in series to the first end 231 and the second end 232 of the heat pipe 230 in a tight fit relationship, and are in contact with each other by the heat conduction portion 2212. The heat conducting portion 2212 between the plurality of heat dissipating fins 221 forms a heat transfer path having a larger cross-sectional area on the heat pipe 230.
因此，在散熱模組200的應用上，當導熱基座210與熱管230吸收電子元件產生的熱量後，除了可透過導熱基座210本身的散熱片214進行散熱作用外，還可以透過熱管230將熱量傳遞至鰭片組220，再經由導熱段2212在熱管230上形成的熱傳路徑快速地將熱量傳遞至各個散熱鰭片221以及各個散熱鰭片221的散熱段2211，然後再透過散熱段221與外界空氣進行熱交換。 Therefore, in the application of the heat dissipation module 200, after the heat transfer base 210 and the heat pipe 230 absorb the heat generated by the electronic component, in addition to the heat dissipation by the heat sink 214 of the heat conduction base 210 itself, the heat pipe 230 can also transmit heat through the heat pipe 230. The heat is transferred to the fin set 220, and the heat transfer path formed on the heat pipe 230 via the heat conducting section 2212 quickly transfers heat to the heat radiating fins 221 and the heat radiating sections 2211 of the respective heat radiating fins 221, and then passes through the heat radiating section 221. Exchange heat with outside air.
基於上述，本發明的散熱模組可藉由多個散熱鰭片的導熱段 組成具有較大截面積的熱傳路徑，如此將有助於提升熱量的傳遞速率，使熱管與導熱基座吸收的熱量，可以從靠近導熱基座的一端快速的傳遞至遠離導熱基座的一端，以便於透過各個散熱鰭片的散熱段進行散熱作用，因此可有效解決一般具有熱管的散熱模組中，熱傳效率與散熱效率會隨著熱管與熱源的距離愈遠而大幅遞減的問題。 Based on the above, the heat dissipation module of the present invention can be thermally coupled by a plurality of heat dissipation fins Forming a heat transfer path with a large cross-sectional area, which will help to increase the heat transfer rate, so that the heat absorbed by the heat pipe and the heat-conducting base can be quickly transferred from the end close to the heat-conductive base to the end away from the heat-conductive base. In order to dissipate heat through the heat dissipating segments of the respective fins, it can effectively solve the problem that the heat transfer efficiency and the heat dissipating efficiency are greatly reduced as the distance between the heat pipe and the heat source is far lower in the heat dissipating module having the heat pipe.
雖然本發明之實施例揭露如上所述，然並非用以限定本發明，任何熟習相關技藝者，在不脫離本發明之精神和範圍內，舉凡依本發明申請範圍所述之形狀、構造、特徵及數量當可做些許之變更，因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.
100‧‧‧散熱模組 100‧‧‧ Thermal Module
110‧‧‧導熱基座 110‧‧‧thermal base
111‧‧‧溝槽 111‧‧‧ trench
120‧‧‧鰭片組 120‧‧‧Fin set
121‧‧‧散熱鰭片 121‧‧‧heat fins
1211‧‧‧散熱段 1211‧‧‧heating section
1212‧‧‧導熱段 1212‧‧‧thermal section
130‧‧‧熱管 130‧‧‧heat pipe
131‧‧‧第一端 131‧‧‧ first end
132‧‧‧第二端 132‧‧‧ second end
200‧‧‧散熱模組 200‧‧‧ Thermal Module
210‧‧‧導熱基座 210‧‧‧ Thermal base
211‧‧‧溝槽 211‧‧‧ trench
212‧‧‧散熱器 212‧‧‧ radiator
213‧‧‧導熱板 213‧‧‧heat conducting plate
214‧‧‧散熱片 214‧‧‧ Heat sink
220‧‧‧鰭片組 220‧‧‧Fin set
221‧‧‧散熱鰭片 221‧‧‧Heat fins
2211‧‧‧散熱段 2211‧‧‧heating section
2212‧‧‧導熱段 2212‧‧‧ Thermal section
2213‧‧‧穿孔 2213‧‧‧Perforation
230‧‧‧熱管 230‧‧‧heat pipe
231‧‧‧第一端 231‧‧‧ first end
232‧‧‧第二端 232‧‧‧ second end
233‧‧‧卡合段 233‧‧‧ Engagement section
第1圖為本發明之第一實施例的散熱模組的組合示意圖。 FIG. 1 is a schematic view showing the combination of a heat dissipation module according to a first embodiment of the present invention.
第2圖為本發明之第一實施例的散熱模組的俯視示意圖。 2 is a top plan view of a heat dissipation module according to a first embodiment of the present invention.
第3圖為本發明之第二實施例的散熱模組的分解示意圖。 3 is an exploded perspective view of a heat dissipation module according to a second embodiment of the present invention.
第4圖為本發明之第二實施例的散熱模組的組合示意圖。 4 is a schematic view showing the combination of the heat dissipation module of the second embodiment of the present invention.
200‧‧‧散熱模組 200‧‧‧ Thermal Module
210‧‧‧導熱基座 210‧‧‧ Thermal base
220‧‧‧鰭片組 220‧‧‧Fin set
221‧‧‧散熱鰭片 221‧‧‧Heat fins
2211‧‧‧散熱段 2211‧‧‧heating section
2212‧‧‧導熱段 2212‧‧‧ Thermal section
230‧‧‧熱管 230‧‧‧heat pipe
231‧‧‧第一端 231‧‧‧ first end
232‧‧‧第二端 232‧‧‧ second end
Claims (7)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101150659A TWI498519B (en) | 2012-12-27 | 2012-12-27 | Heat dissipating module |
| CN201310072576.4A CN103906413B (en) | 2012-12-27 | 2013-03-07 | Heat radiation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101150659A TWI498519B (en) | 2012-12-27 | 2012-12-27 | Heat dissipating module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201425854A true TW201425854A (en) | 2014-07-01 |
| TWI498519B TWI498519B (en) | 2015-09-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101150659A TWI498519B (en) | 2012-12-27 | 2012-12-27 | Heat dissipating module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103906413B (en) |
| TW (1) | TWI498519B (en) |
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|---|---|---|---|---|
| CN105284715B (en) * | 2014-07-04 | 2018-10-30 | 上海晶海实业有限公司 | Small semiconductor aquarium constant temperature machine |
| CN105627798B (en) * | 2014-12-01 | 2018-12-18 | 青岛海尔特种电冰柜有限公司 | Heat-exchange device and semiconductor refrigerating equipment |
| CN106304768A (en) * | 2015-06-02 | 2017-01-04 | 中兴通讯股份有限公司 | Subrack and plug-in card thereof |
| CN104869794A (en) * | 2015-06-22 | 2015-08-26 | 东莞市澍华五金制品有限公司 | Integrated heat-pipe heat dissipating device |
| CN105899051B (en) * | 2016-06-13 | 2019-01-22 | 海信（山东）空调有限公司 | A kind of transducer air conditioning and its electronic module radiator |
| CN106839852A (en) * | 2017-01-22 | 2017-06-13 | 上海交通大学 | A kind of radiator with high performance and its fin method for arranging |
| CN111261476A (en) * | 2018-11-30 | 2020-06-09 | 曾东荣 | Heat sink for microwave magnetron |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3384066B2 (en) * | 1993-12-21 | 2003-03-10 | 株式会社デンソー | Boiling cooling device |
| JPH08278091A (en) * | 1995-04-04 | 1996-10-22 | Fujikura Ltd | Manufacture of heat pipe type cooling unit |
| CN2699363Y (en) * | 2004-05-13 | 2005-05-11 | 珍通科技股份有限公司 | Radiator |
| TWM278219U (en) * | 2005-05-31 | 2005-10-11 | Guo-Shing Chen | Heat pipe radiator and cooling fins thereof |
| CN2842733Y (en) * | 2005-06-10 | 2006-11-29 | 富准精密工业(深圳)有限公司 | Radiating apparatus |
| JP4357569B2 (en) * | 2008-01-31 | 2009-11-04 | 株式会社東芝 | Electronics |
| TWM342543U (en) * | 2008-05-19 | 2008-10-11 | Scythe Taiwan Co Ltd | Heat sink |
| CN201306694Y (en) * | 2008-09-12 | 2009-09-09 | 奇宏电子(深圳)有限公司 | LED heat dissipation module |
| JP5517728B2 (en) * | 2010-04-27 | 2014-06-11 | サンデン株式会社 | HEAT EXCHANGER AND HEAT EXCHANGER MANUFACTURING METHOD |
| CN102581583A (en) * | 2011-01-14 | 2012-07-18 | 浙江宏天铜业有限公司 | Copper heat tube with high-tooth fins and production technology of copper heat tube |
| CN202025736U (en) * | 2011-02-22 | 2011-11-02 | 李明烈 | Fast heat-conducting radiator |
| CN202259253U (en) * | 2011-08-31 | 2012-05-30 | 双鸿科技股份有限公司 | Heat pipe type heat radiation device capable of increasing the heat conduction efficiency |
-
2012
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Also Published As
| Publication number | Publication date |
|---|---|
| CN103906413B (en) | 2017-04-26 |
| TWI498519B (en) | 2015-09-01 |
| CN103906413A (en) | 2014-07-02 |
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