TW201414980A - Heat sink - Google Patents
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- TW201414980A TW201414980A TW101136976A TW101136976A TW201414980A TW 201414980 A TW201414980 A TW 201414980A TW 101136976 A TW101136976 A TW 101136976A TW 101136976 A TW101136976 A TW 101136976A TW 201414980 A TW201414980 A TW 201414980A
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Abstract
Description
本發明關於一種散熱器，特別是關於一種具有厚度設計之散熱器。 The present invention relates to a heat sink, and more particularly to a heat sink having a thickness design.
由於能量轉換效率無法達到百分之百，電子零組件於運作會產生廢熱，尤其以當前之電子零組件而言，其電路密集度高、運作速度快，因此單位面積產生之廢熱更多，如無搭配適當之散熱設計，便可能因工作溫度過高而失效或損毀。 Since the energy conversion efficiency cannot reach 100%, the electronic components will generate waste heat during operation. Especially in the current electronic components, the circuit density is high and the operation speed is fast, so the waste heat generated per unit area is more, if there is no proper fit. The heat dissipation design may be invalid or damaged due to excessive operating temperature.
目前常見之散熱器包括由多個散熱鰭片間隔組成之散熱器，散熱鰭片多為長矩形薄板，然而此種散熱器存在二個問題：其一為散熱鰭片未根據與熱源距離之遠近做厚度變化設計，亦即未同時考慮距離熱源近時之傳熱效率以及距離熱源遠時之散熱效率等問題；其二為散熱鰭片與熱源間難以緊密接觸，造成傳導效率不佳，進而無法快速散熱。 At present, the conventional heat sink includes a heat sink composed of a plurality of heat radiating fins, and the heat radiating fins are mostly long rectangular thin plates. However, the heat sink has two problems: one is that the heat radiating fins are not according to the distance from the heat source. The thickness variation design is not considered at the same time, the heat transfer efficiency from the heat source and the heat dissipation efficiency from the heat source are not considered at the same time; the second is that the heat sink fin and the heat source are not in close contact, resulting in poor conduction efficiency, and thus cannot Fast heat dissipation.
鑒於上述，本發明目的之一在於提供一種散熱器以解決先前技術之問題。 In view of the above, it is an object of the present invention to provide a heat sink to solve the problems of the prior art.
本發明揭露了一種散熱器，適用於對一熱源進行散熱，而該散熱器包含：複數個散熱鰭片；以及複數個導熱片。各個導熱片緊鄰至少一散熱鰭片，並包含：一導熱部，該導熱部鄰接至少一個前述之散熱鰭片，並接收與傳遞該熱源產生之熱，該導熱部具 有一第一平均厚度；以及一散熱部，由至少一散熱區域所組成，並鄰接該導熱部之至少一邊界，該散熱部接收該導熱部所傳遞的熱，且具有一第二平均厚度，其中該第二平均厚度小於該第一平均厚度，且該散熱部之複數個截面所對應之厚度均不相同。 The invention discloses a heat sink suitable for dissipating heat from a heat source, and the heat sink comprises: a plurality of heat dissipation fins; and a plurality of heat conductive sheets. Each of the heat conducting sheets is adjacent to the at least one heat dissipating fin, and includes: a heat conducting portion that abuts at least one of the foregoing heat dissipating fins, and receives and transmits heat generated by the heat source, the heat conducting portion a first average thickness; and a heat dissipating portion, comprising at least one heat dissipating region adjacent to at least one boundary of the heat conducting portion, the heat dissipating portion receiving the heat transferred by the heat conducting portion and having a second average thickness, wherein The second average thickness is smaller than the first average thickness, and the thicknesses of the plurality of sections of the heat dissipation portion are different.
本發明另揭露了一種散熱器，適用於對一熱源進行散熱，且該散熱器包含：複數個導熱片。每個導熱片包含：一導熱部，用以接收及傳遞該熱，並具有一第一平均厚度；以及一散熱部，由一或複數個獨立之散熱區域所組成，並鄰接該導熱部之一或複數個獨立邊界，以協助該導熱部進行導熱，該散熱部具有一第二平均厚度，且該散熱部之複數個截面所對應之厚度均不相同，其中該第二平均厚度小於該第一平均厚度，且相鄰二該導熱片之導熱部緊靠在一起。 The invention further discloses a heat sink suitable for dissipating heat from a heat source, and the heat sink comprises: a plurality of heat conductive sheets. Each of the thermal conductive sheets includes: a heat conducting portion for receiving and transmitting the heat and having a first average thickness; and a heat dissipating portion composed of one or a plurality of independent heat dissipating regions and adjoining one of the heat conducting portions Or a plurality of independent boundaries to assist the heat conducting portion to conduct heat, the heat dissipating portion has a second average thickness, and the plurality of sections corresponding to the heat dissipating portion have different thicknesses, wherein the second average thickness is smaller than the first The average thickness is adjacent to the heat conducting portions of the two heat conducting sheets.
依據本發明之一較佳實施例，前述散熱部之厚度沿著遠離該導熱部之方向線性遞減。此外，前述導熱部與散熱部係一體成型，且導熱片之形狀為紡錘形、平行四邊形或梯形。 According to a preferred embodiment of the present invention, the thickness of the heat dissipating portion linearly decreases in a direction away from the heat conducting portion. Further, the heat conducting portion and the heat dissipating portion are integrally formed, and the shape of the heat conducting sheet is a spindle shape, a parallelogram shape or a trapezoidal shape.
有關本發明的特徵、實作與功效，茲配合圖式作較佳實施例詳細說明如下。 The features, implementations, and utilities of the present invention are described in detail with reference to the preferred embodiments.
以下說明內容之技術用語係參照本技術領域之習慣用語，如本說明書對部分用語有加以說明或定義，該部分用語之解釋係以本說明書之說明或定義為準。另外，本說明書所提及之介係詞用語「上」、「下」、「於」等，在實施為可能的前提下，涵義可包含 直接或間接地在某物或某參考對象之「上」、「下」，以及直接或間接地「於」某物或某參考對象，所謂「間接」係指其間尚有中間物或物理空間之存在；當提及「鄰近」、「之間」等用語時，在實施為可能的前提下，涵義可包含兩物或兩參考對象間存在其它中間物或空間，以及不存在其它中間物或空間；當提及「連接」、「耦接」等用語時，在實施為可能的前提下，涵義可包含兩物直接或間接地地接合在一起。再者，以下內容係關於散熱裝置，對於該領域所習見的技術或原理，若不涉及本發明之技術特徵，將不予贅述。此外，圖示之所示元件之形狀、尺寸、比例等僅為示意，係供本技術領域具有通常知識者瞭解本發明之用，而非對本發明之實施範圍加以限制。 The technical terms of the following descriptions refer to the idioms in the technical field, and some of the terms are explained or defined in the specification, and the explanation of the terms is based on the description or definition of the specification. In addition, the terms "upper", "lower", "to", etc., as used in this specification, may be included if the implementation is possible. Directly or indirectly on the "up" and "down" of something or a reference object, and directly or indirectly "on" something or a reference object. The so-called "indirect" means that there is still an intermediate or physical space in between. Existence; when referring to terms such as "proximity" and "between", the meaning may include other intermediates or spaces between two objects or two reference objects, and no other intermediates or spaces. When referring to terms such as "connected" or "coupled", the meaning may include two things directly or indirectly joined together, if possible. Furthermore, the following is related to the heat dissipating device, and the technology or principle that is known in the art will not be described unless it relates to the technical features of the present invention. In addition, the shapes, dimensions, proportions, and the like of the elements shown in the drawings are merely illustrative, and are intended to be used by those of ordinary skill in the art to understand the invention and not to limit the scope of the invention.
另外，以下說明內容所述及之任一實施例即使同時揭露了複數個技術特徵，也不意味著利用本發明者必需同時實施該任一實施例中的所有技術特徵。換句話說，只要不影響實施可能性，本技術領域具有通常知識者可依據本發明之揭露內容並視需求或設計理念來選擇性地實施一部分而非全部的技術特徵，藉此增加本發明實施時的彈性。 In addition, any of the embodiments described in the following description, even if a plurality of technical features are simultaneously disclosed, does not mean that all the technical features in any of the embodiments must be simultaneously implemented by the inventors. In other words, as long as the implementation possibilities are not affected, those skilled in the art can selectively implement some, but not all, of the technical features according to the disclosure of the present invention and according to the needs or design concepts, thereby increasing the implementation of the present invention. Time elasticity.
請參閱第1圖，其係本發明之散熱器之一實施例示意圖。如圖所示，本發明之散熱器100包含複數個導熱片110與複數個散熱鰭片120。每個導熱片110包含一導熱部112與一散熱部114，該導熱部112具有一第一平均厚度，且直接或間接地與一熱源(例如一電子零組件或一導熱體，未圖式)接觸，藉此將該熱源所產生之熱傳遞至導熱片110的整體，而散熱部114則由複數個獨立 之散熱區域116所組成，並鄰接該導熱部112之複數個獨立邊界118，以協助該導熱部112進行導熱，該散熱部114具有一小於前述第一平均厚度之第二平均厚度，且散熱部114之複數個截面所對應之厚度均不相同。另外，每個散熱鰭片120緊鄰至少一個導熱片110之導熱部112，用以協助該導熱片110進行散熱。本實施例中，散熱鰭片120與導熱片110係間隔地設置，然而其它設置方式亦在本發明之實施變化範圍內，例如相等或不等數量的散熱鰭片120與導熱片110之隨機或依據一預定方式之搭配，又例如複數個導熱片110與一散熱鰭片120構成散熱器100之一基本組合單位等。再者，第1圖所示之散熱鰭片120與導熱片110之數量僅為示意，並非對本發明之限制，本技術領域具有通常知識者能依據本發明之揭露並視設計需求來決定散熱鰭片120與導熱片110之數量。 Please refer to Fig. 1, which is a schematic view of an embodiment of a heat sink of the present invention. As shown, the heat sink 100 of the present invention includes a plurality of thermally conductive sheets 110 and a plurality of heat dissipation fins 120. Each of the heat conducting sheets 110 includes a heat conducting portion 112 and a heat radiating portion 114 having a first average thickness and directly or indirectly connected to a heat source (for example, an electronic component or a heat conductor, not shown). Contacting, thereby transferring heat generated by the heat source to the entirety of the heat conductive sheet 110, and the heat radiating portion 114 is composed of a plurality of independent The heat dissipating region 116 is formed adjacent to the plurality of independent boundaries 118 of the heat conducting portion 112 to assist the heat conducting portion 112 to conduct heat. The heat dissipating portion 114 has a second average thickness smaller than the first average thickness, and the heat dissipating portion The thickness of the plurality of sections of 114 is different. In addition, each of the heat dissipation fins 120 is adjacent to the heat conducting portion 112 of the at least one heat conducting sheet 110 for assisting the heat conducting sheet 110 to dissipate heat. In this embodiment, the heat dissipation fins 120 are disposed at intervals from the heat conductive fins 110. However, other arrangements are also within the scope of implementation of the present invention, such as random or unequal numbers of heat dissipation fins 120 and heat conductive sheets 110. According to a predetermined manner, for example, a plurality of thermal conductive sheets 110 and a heat dissipation fin 120 constitute a basic combination unit of the heat sink 100. Moreover, the number of the heat dissipating fins 120 and the heat conducting fins 110 shown in FIG. 1 is merely illustrative and is not intended to limit the present invention. Those skilled in the art can determine the heat dissipating fin according to the disclosure of the present invention and depending on the design requirements. The number of sheets 120 and thermally conductive sheets 110.
承上所述，本實施例中，導熱部112之整體厚度均勻相同，亦即導熱部112之複數個截面所對應之厚度均相同。另外，前述散熱部114之厚度會沿著遠離該導熱部112之方向以無階段差的方式遞減(例如線性遞減)，舉例來說，如第2a圖所示，其係本發明之導熱片110厚度變化設計之實施例示意圖，當導熱片110水平放置時，散熱部114之左右二散熱區域116各自之上下二面沿著遠離該導熱部112之方向逐漸靠攏，最終分別接合形成一夾角θ，此時導熱片110左右對稱，並呈現紡錘形，換句話說，散熱區域116會以導熱部112為中心而相對應；又如第2b圖所示，其係本發明之導熱片110厚度變化設計之另一實施例示意圖，當 導熱片110水平放置時，散熱部114之左側散熱區域116之上方面保持與水平面平行，下方面則沿著遠離該導熱部112之方向向水平面靠攏，最終與該上方面結合形成一夾角α，同時散熱部114之右側散熱區域116之下方面保持與水平面平行，上方面沿著遠離該導熱部112之方向向水平面靠攏，最終與該下方面結合形成一夾角β，其中夾角α、β可為相等或不相等，且此時導熱片110係左右不對稱，並呈現平行四邊形或梯形，換句話說，散熱區域116以導熱部112為中心而不相對應。 As described above, in the present embodiment, the overall thickness of the heat conducting portion 112 is uniform, that is, the thickness of the plurality of sections of the heat conducting portion 112 is the same. In addition, the thickness of the heat dissipating portion 114 is decremented (eg, linearly decreasing) in a direction away from the heat conducting portion 112 in a stepless manner. For example, as shown in FIG. 2a, the thermally conductive sheet 110 of the present invention is used. A schematic diagram of the embodiment of the thickness variation design, when the thermal conductive sheet 110 is horizontally placed, the upper and lower surfaces of the left and right heat dissipating regions 116 of the heat dissipating portion 114 gradually close together in a direction away from the heat conducting portion 112, and finally respectively form an angle θ. At this time, the heat conducting sheet 110 is bilaterally symmetrical and presents a spindle shape. In other words, the heat radiating region 116 corresponds to the heat conducting portion 112; and as shown in FIG. 2b, it is designed to change the thickness of the heat conducting sheet 110 of the present invention. A schematic diagram of another embodiment, when When the heat conducting sheet 110 is horizontally placed, the upper side of the heat dissipating portion 114 is parallel to the horizontal plane, and the lower side is closer to the horizontal plane in a direction away from the heat conducting portion 112, and finally forms an angle α with the upper surface. At the same time, the lower side of the heat dissipating portion 116 of the heat dissipating portion 114 is kept parallel to the horizontal plane, and the upper side is closer to the horizontal plane along the direction away from the heat conducting portion 112, and finally forms an angle β with the lower side, wherein the angles α and β may be Equal or unequal, and at this time, the heat conducting sheet 110 is asymmetrical left and right, and exhibits a parallelogram or a trapezoid. In other words, the heat radiating region 116 does not correspond to the heat conducting portion 112.
請注意，上述導熱部112之厚度亦可採階段式變化(例如厚度由中央向周圍呈階段式遞減)或漸進變化(例如厚度由中央向周圍線性遞減)之設計，藉此增加設計或實施上之彈性。另外，散熱部114之厚度變化設計僅係範例，本技術領域具有通常知識者能依本發明之揭露內容在不過度實驗的情況下推衍出其它厚度變化設計，例如散熱部114之左側散熱區域116之上下二面可沿著遠離該導熱部112之方向逐漸靠攏形成夾角θ，同時右側散熱區域116之上方面則可保持與水平面平行，下方面則沿著遠離該導熱部112之方向向水平面靠攏形成一夾角α。簡言之，依據本發明之揭露所能合理推衍之變化設計均在本發明所欲保護之範圍內。本發明之特殊形狀不只加速傳導散熱，更具有導流風扇氣流之功效，使氣流不僅穿越鰭片，更可導流至鄰近之鰭片加速整體散熱。 Please note that the thickness of the above-mentioned heat conducting portion 112 can also be designed in a stepwise manner (for example, the thickness is gradually decreased from the center to the periphery) or a gradual change (for example, the thickness is linearly decreased from the center to the periphery), thereby increasing design or implementation. Flexibility. In addition, the thickness variation design of the heat dissipation portion 114 is merely an example, and those skilled in the art can derive other thickness variation designs, such as the left heat dissipation region of the heat dissipation portion 114, without undue experimentation according to the disclosure of the present invention. The upper and lower sides of the 116 may gradually form an angle θ in a direction away from the heat conducting portion 112, while the upper side of the right heat dissipating region 116 may remain parallel to the horizontal plane, and the lower side may be horizontally away from the heat conducting portion 112. Close together form an angle α. In short, variations that can be reasonably derived from the disclosure of the present invention are intended to be within the scope of the present invention. The special shape of the invention not only accelerates the conduction heat dissipation, but also has the effect of the airflow of the flow guiding fan, so that the airflow not only traverses the fins, but also can be guided to the adjacent fins to accelerate the overall heat dissipation.
另請注意，前述導熱片110之導熱部112與散熱部114係一體成型。本實施例中，導熱片110係以金屬擠壓(例如鋁擠)方 式製成，然而其它方式在實施為可能的情形下亦得為本發明所採用，例如金屬壓鑄(例如鋁壓鑄)或透過將鋁片兩側加壓(例如沖壓、輥壓)以形成導熱片110等方式，由於金屬擠壓及金屬壓鑄等方式屬於習用技術，故其技術細節與本發明之特徵無關者在此不予贅述。此外，雖然於本實施例中，散熱部114係由前述複數個獨立之散熱區域116所組成，並鄰接前述導熱部112之複數個獨立邊界118，然此並非對本發明之限制，本技術領域具有通常知識者可依據本發明之揭露內容在不過度實驗的情形下推導出其它種散熱部114與導熱部112之組成方式，例如導熱部112可為三邊及三邊以上之多邊形或圓形，而散熱部114則配合導熱部112之形狀鄰接於導熱部112之至少一邊界或周圍。當散熱部114僅鄰接導熱部112之一邊界或周圍時，散熱部114可以是具有一個相連的散熱區域116以鄰接於導熱部112之一邊界或周圍，也可以是具有複數個獨立(亦即分隔)之散熱區域116以鄰接於導熱部112之一邊界或周圍；而當散熱部114鄰接導熱部112之複數邊界時，散熱部114可以是具有一個相連的散熱區域116以鄰接於導熱部112之相鄰或不相鄰的複數邊界，也可以是具有複數個獨立的散熱區域116以鄰接於導熱部112之相鄰或不相鄰之複數邊界。 Please also note that the heat conducting portion 112 of the heat conducting sheet 110 is integrally formed with the heat radiating portion 114. In this embodiment, the heat conductive sheet 110 is extruded by metal (for example, aluminum extrusion). Formulated, however, other means may be employed in the present invention, such as metal die casting (for example, aluminum die casting) or by pressing both sides of the aluminum sheet (for example, stamping, rolling) to form a thermally conductive sheet. In the 110 or the like, since metal extrusion and metal die casting are conventional techniques, the technical details thereof are not related to the features of the present invention and will not be described herein. In addition, in the present embodiment, the heat dissipating portion 114 is composed of the plurality of independent heat dissipating regions 116 and is adjacent to the plurality of independent boundaries 118 of the heat conducting portion 112. However, the present invention is not limited to the present invention, and the technical field has A person skilled in the art can deduce the other components of the heat dissipating portion 114 and the heat conducting portion 112 without undue experimentation according to the disclosure of the present invention. For example, the heat conducting portion 112 can be a polygon or a circle of three or more sides. The heat dissipating portion 114 is adjacent to at least one boundary or the periphery of the heat conducting portion 112 in accordance with the shape of the heat conducting portion 112. When the heat dissipating portion 114 is only adjacent to or around a boundary of the heat conducting portion 112, the heat dissipating portion 114 may have an associated heat dissipating region 116 adjacent to or around one of the heat conducting portions 112, or may have a plurality of independent (ie, The heat dissipating region 116 is adjacent to or adjacent to one of the heat conducting portions 112. When the heat dissipating portion 114 abuts the plurality of boundaries of the heat conducting portion 112, the heat dissipating portion 114 may have an associated heat dissipating region 116 adjacent to the heat conducting portion 112. The adjacent or non-adjacent complex boundaries may also have a plurality of independent heat dissipating regions 116 adjacent to adjacent or non-adjacent boundaries of the thermally conductive portion 112.
再請注意，前述散熱鰭片120與導熱部112緊鄰之方式可透過目前已知之固定方式，例如利用膠黏劑(例如導熱膠)將兩者緊密貼合；利用固定元件(例如螺絲螺帽組、螺栓、卡掣件、夾具、彈性套環等)將兩者固定在一起；利用焊接或雷射融接等方 式將兩者接合在一起；經由結構設計使散熱鰭片120與導熱部112之結構相配合以組接固定在一起；或者利用上述固定方式之任意組合來固定散熱鰭片120與導熱部112。此外，導熱部112及散熱鰭片120可分別設有一或複數個開孔(未圖式)以容設該熱源及/或傳播該熱源之熱的一導熱體，同時散熱鰭片120之開孔結構可與導熱部112之開孔結構相搭配以協助兩者組接在一起及/或共同容設該熱源及/或該導熱體，藉此該熱源及/或該導熱體可將熱經由導熱部112、散熱部114及散熱鰭片120發散出去。 Please note that the heat dissipating fins 120 are in close proximity to the heat conducting portion 112 by means of a currently known fixing method, such as using an adhesive (for example, a thermal conductive adhesive) to closely fit the two; using a fixing member (for example, a screw nut group) , bolts, clamps, clamps, elastic collars, etc.) to fix the two together; use welding or laser fusion The two are joined together; the heat dissipating fins 120 are matched with the structure of the heat conducting portion 112 to be fixed together by structural design; or the heat dissipating fins 120 and the heat conducting portion 112 are fixed by any combination of the above fixing methods. In addition, the heat conducting portion 112 and the heat dissipating fins 120 may respectively be provided with one or more openings (not shown) to accommodate the heat source and/or a heat conducting body that transmits the heat of the heat source, and the opening of the heat dissipating fins 120 The structure can be matched with the opening structure of the heat conducting portion 112 to assist the two groups to be combined and/or to jointly accommodate the heat source and/or the heat conductor, whereby the heat source and/or the heat conductor can conduct heat through heat conduction. The portion 112, the heat dissipation portion 114, and the heat dissipation fins 120 are radiated.
請參閱第3圖，其係利用第1圖所示之散熱器100所製成之散熱裝置之一實施例示意圖。如圖所示，該散熱裝置300包含：複數個導熱管310，用來傳導前述熱源之熱；至少一個如第一圖所示之散熱器100，散熱器100之每一導熱片110之導熱部112及每一散熱鰭片120分別具有複數個開孔320，用來容設該複數個導熱管310，進而協助該些導熱管310進行散熱；以及一電力驅動之風扇330，設置於該些散熱器100上，用來協助該些散熱器100散熱。 Please refer to FIG. 3, which is a schematic diagram of an embodiment of a heat sink made by using the heat sink 100 shown in FIG. 1. As shown in the figure, the heat dissipating device 300 includes: a plurality of heat conducting tubes 310 for conducting heat of the heat source; at least one heat sink 100 as shown in the first figure, and a heat conducting portion of each of the heat conducting sheets 110 of the heat sink 100 Each of the heat dissipating fins 120 has a plurality of openings 320 for receiving the plurality of heat pipes 310 to assist the heat pipes 310 to dissipate heat, and an electrically driven fan 330 disposed on the heat sinks The device 100 is used to assist the heat sink 100 to dissipate heat.
承上所述，本實施例雖採用了複數個導熱管310來傳導該熱源的熱，然此並非對本發明之限制，本技術領域具有通常知識者可依據本發明之揭露利用一個或二個以上之導熱管310來實施本發明，此時散熱器100之導熱部112及散熱鰭片120之開孔320之數目應與導熱管310之數目相對應，以容設導熱管310。另外，由於在導熱部112及散熱鰭片120上開孔之技術以及導熱管310本身及風扇330本身均屬本技術領域之通常知識，故與本發明之 技術特徵無關的部分在此予以節略。再者，本發明並未對散熱鰭片120之形狀構造予以限制，散熱鰭片120之形狀可以為傳統長矩形，亦可如本發明之導熱片110般為紡錘形、平行四邊形或梯形，更進一步地說，本發明對於導熱片110之厚度設計以及製造方法均可用於散熱鰭片120之設計上，亦即導熱片110與散熱鰭片120可以依據本發明而有相同或類似設計，尺寸亦可相同或不同。 As described above, although a plurality of heat pipes 310 are used to conduct the heat of the heat source, the present invention is not limited to the present invention, and those skilled in the art may utilize one or two or more according to the disclosure of the present invention. The heat pipe 310 is used to implement the present invention. At this time, the number of the heat conducting portions 112 of the heat sink 100 and the openings 320 of the heat radiating fins 120 should correspond to the number of the heat conducting tubes 310 to accommodate the heat conducting tubes 310. In addition, since the technique of opening holes in the heat conducting portion 112 and the heat dissipating fins 120 and the heat pipe 310 itself and the fan 330 are generally known in the art, the present invention The technically unrelated parts are abbreviated here. Furthermore, the present invention does not limit the shape of the heat dissipation fins 120. The shape of the heat dissipation fins 120 may be a conventional long rectangle, or may be a spindle shape, a parallelogram shape or a trapezoid shape as the heat conduction sheet 110 of the present invention. The thickness design and manufacturing method of the heat conductive sheet 110 can be used for the design of the heat dissipation fins 120, that is, the heat conductive sheet 110 and the heat dissipation fins 120 can have the same or similar design according to the present invention, and the size can also be Same or different.
請再參閱第4圖，其係本發明之散熱器之另一實施例示意圖。如第4圖所示，散熱器400包含複數個導熱片110，每個導熱片110包含導熱部112與散熱部114，且每個導熱部112緊鄰另一個導熱部112，藉此傳熱暨散熱。本實施例與第1圖所示之實施例主要差異在於本實施例利用導熱片110之散熱部114來取代散熱鰭片120之散熱功能，故可省略散熱鰭片120。在此實施例中，導熱片110之導熱部112及散熱部114之尺寸可視設計需求來加以變化，例如透過加大導熱部112之厚度來增加傳熱效率及/或透過加大散熱部114之面積來提升散熱效果。至於導熱片110之厚度設計與變化以及製造方式如前所述，於此不再重覆說明。 Please refer to FIG. 4 again, which is a schematic view of another embodiment of the heat sink of the present invention. As shown in FIG. 4, the heat sink 400 includes a plurality of heat conducting sheets 110, each of which includes a heat conducting portion 112 and a heat radiating portion 114, and each heat conducting portion 112 is adjacent to the other heat conducting portion 112, thereby transferring heat and cooling . The main difference between the embodiment and the embodiment shown in FIG. 1 is that the heat dissipation portion 114 of the heat conduction sheet 110 is used in place of the heat dissipation function of the heat dissipation fins 120, so that the heat dissipation fins 120 can be omitted. In this embodiment, the size of the heat conducting portion 112 and the heat dissipating portion 114 of the heat conducting sheet 110 may be changed according to design requirements, for example, by increasing the thickness of the heat conducting portion 112 to increase heat transfer efficiency and/or by increasing the heat sink portion 114. Area to improve heat dissipation. As for the thickness design and variation of the thermal conductive sheet 110 and the manufacturing method as described above, the description will not be repeated here.
請注意，第4圖所示之二導熱片110的鄰接方式可透過目前已知之固定方式，例如利用膠黏劑(例如導熱膠)將兩者緊密貼合；利用固定元件(例如螺絲螺帽組、螺栓、卡掣件、夾具、彈性套環等)將兩者固定在一起；利用焊接或雷射融接等方式將兩者接合在一起；經由結構設計使二導熱片110之結構相配合以組接固定在一起；或者利用上述固定方式之任意組合來固定二導熱 片110。此外，每該導熱片110可設有一或複數個開孔(未圖式)以容設該熱源及/或傳播該熱源之熱的一導熱體，同時二相鄰導熱片110之開孔結構可相搭配以協助兩者組接在一起及/或共同容設該熱源及/或該導熱體，藉此該熱源及/或該導熱體可將熱經由該些導熱片110之導熱部112及散熱部114發散出去。 Please note that the two adjacent heat conducting sheets 110 shown in FIG. 4 can be closely attached by a currently known fixing method, for example, using an adhesive (for example, a thermal conductive adhesive); and using a fixing member (for example, a screw nut group) , bolts, clamps, clamps, elastic collars, etc.) are fixed together; the two are joined together by means of welding or laser fusion; the structure of the two thermal conductive sheets 110 is matched by the structural design Grouping and fixing together; or fixing any two heat conduction by any combination of the above fixing methods Slice 110. In addition, each of the heat conducting sheets 110 may be provided with one or more openings (not shown) to accommodate the heat source and/or a heat conducting body that transmits the heat of the heat source, and the opening structure of the two adjacent heat conducting sheets 110 may be The heat source and/or the heat conductor can heat the heat transfer portion 112 and the heat dissipation portion of the heat conductive sheet 110 to dissipate the heat source and/or the heat conductor. Department 114 dissipated.
請參閱第5圖，其係利用第4圖所示之散熱器400所製成之散熱裝置之一實施例示意圖。如圖所示，散熱裝置500包含：複數個導熱管510，用來傳導前述熱源之熱；至少一個如第4圖所示之散熱器400，其中每一導熱片110之導熱部112具有複數個開孔520，用來容設該複數個導熱管510，進而協助該些導熱管510進行散熱；以及一電力驅動之風扇530，設置於散熱器400上，用來協助該些導熱片110散熱。 Please refer to FIG. 5, which is a schematic diagram of an embodiment of a heat sink made by using the heat sink 400 shown in FIG. As shown, the heat sink 500 includes a plurality of heat pipes 510 for conducting heat of the heat source, and at least one heat sink 400 as shown in FIG. 4, wherein the heat conducting portion 112 of each of the heat conducting sheets 110 has a plurality of heat conducting portions 112. The opening 520 is configured to receive the plurality of heat pipes 510 to assist the heat pipes 510 to dissipate heat, and an electrically driven fan 530 is disposed on the heat sink 400 for assisting heat dissipation of the heat conducting sheets 110.
如上所述，儘管本實施例採用了複數個導熱管510來傳導該熱源的熱，然此並非對本發明之限制，本技術領域具有通常知識者可依本發明之揭露利用單一或二個以上之導熱管510來實施本發明，此時導熱片110之導熱部112之開孔520之數目應與導熱管510之數目相對應，藉以容設導熱管510。同樣地，由於導熱管510及風扇520個別而言均屬本技術領域之通常知識，故與本發明之技術特徵無關的部分將予以節略。 As described above, although the present embodiment employs a plurality of heat pipes 510 to conduct heat of the heat source, this is not a limitation of the present invention, and those skilled in the art may utilize single or more than one according to the disclosure of the present invention. The heat pipe 510 is used to implement the present invention. At this time, the number of the openings 520 of the heat conducting portion 112 of the heat conducting sheet 110 should correspond to the number of the heat conducting tubes 510, thereby accommodating the heat conducting tubes 510. Similarly, since the heat pipe 510 and the fan 520 are individually known in the art, the portions irrelevant to the technical features of the present invention will be abbreviated.
雖然本發明之實施例揭露如上所述，然並非用以限定本發明，任何熟習相關技藝者，在不脫離本發明之精神和範圍內，舉凡依本發明申請範圍所述之形狀、構造、特徵及數量當可做些許之變更，因此本發明之專利保護範圍須視本說明書所附之申請專 利範圍所界定者為準。 Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the quantity can be changed a little, so the scope of patent protection of the present invention is subject to the application attached to this specification. The scope defined by the scope of interest is subject to change.
100‧‧‧散熱器 100‧‧‧heatsink
110‧‧‧導熱片 110‧‧‧thermal sheet
112‧‧‧導熱部 112‧‧‧Transfer Department
114‧‧‧散熱部 114‧‧‧ Department of heat dissipation
116‧‧‧散熱區域 116‧‧‧heating area
118‧‧‧邊界 118‧‧‧ border
120‧‧‧散熱鰭片 120‧‧‧Heat fins
300‧‧‧散熱裝置 300‧‧‧heating device
310‧‧‧導熱管 310‧‧‧Heat pipe
320‧‧‧開口 320‧‧‧ openings
330‧‧‧風扇 330‧‧‧fan
400‧‧‧散熱器 400‧‧‧heatsink
500‧‧‧散熱裝置 500‧‧‧heat sink
510‧‧‧導熱管 510‧‧‧Heat pipe
520‧‧‧開口 520‧‧‧ openings
530‧‧‧風扇 530‧‧‧Fan
θ‧‧‧夾角 Θ‧‧‧ angle
α‧‧‧夾角 ‧‧‧‧ angle
β‧‧‧夾角 ‧‧‧‧角角
第1圖為本發明之散熱器之一實施例示意圖。 Figure 1 is a schematic view of one embodiment of a heat sink of the present invention.
第2a圖為本發明之導熱片厚度變化設計之一實施例示意圖。 Fig. 2a is a schematic view showing an embodiment of the thickness variation design of the thermal conductive sheet of the present invention.
第2b圖為本發明之導熱片厚度變化設計之另一實施例示意圖。 Fig. 2b is a schematic view showing another embodiment of the thickness variation design of the thermal conductive sheet of the present invention.
第3圖為利用第1圖所示之散熱器所製成之散熱裝置之一實施例示意圖。 Fig. 3 is a view showing an embodiment of a heat sink made by using the heat sink shown in Fig. 1.
第4圖為利用本發明之導熱片所製成之散熱器之一實施例示意圖。 Fig. 4 is a view showing an embodiment of a heat sink made by using the thermally conductive sheet of the present invention.
第5圖為利用第4圖所示之散熱器所製成之散熱裝置之一實施例示意圖。 Fig. 5 is a view showing an embodiment of a heat sink manufactured by using the heat sink shown in Fig. 4.
100‧‧‧散熱器 100‧‧‧heatsink
110‧‧‧導熱片 110‧‧‧thermal sheet
112‧‧‧導熱部 112‧‧‧Transfer Department
114‧‧‧散熱部 114‧‧‧ Department of heat dissipation
116‧‧‧散熱區域 116‧‧‧heating area
118‧‧‧邊界 118‧‧‧ border
120‧‧‧散熱鰭片 120‧‧‧Heat fins
Claims (10)
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| TW101136976A TW201414980A (en) | 2012-10-05 | 2012-10-05 | Heat sink |
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| TW101136976A TW201414980A (en) | 2012-10-05 | 2012-10-05 | Heat sink |
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| TW201414980A true TW201414980A (en) | 2014-04-16 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107293526A (en) * | 2016-04-01 | 2017-10-24 | 双鸿科技股份有限公司 | Heat sink device |
| TWI608335B (en) * | 2016-04-01 | 2017-12-11 | 雙鴻科技股份有限公司 | A heat dissipating device |
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2012
- 2012-10-05 TW TW101136976A patent/TW201414980A/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107293526A (en) * | 2016-04-01 | 2017-10-24 | 双鸿科技股份有限公司 | Heat sink device |
| TWI608335B (en) * | 2016-04-01 | 2017-12-11 | 雙鴻科技股份有限公司 | A heat dissipating device |
| CN107293526B (en) * | 2016-04-01 | 2019-09-17 | 双鸿科技股份有限公司 | Heat sink device |
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