WO2020062253A1 - Circuit board, computing device and cooling case - Google Patents

Circuit board, computing device and cooling case Download PDF

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Publication number
WO2020062253A1
WO2020062253A1 PCT/CN2018/109118 CN2018109118W WO2020062253A1 WO 2020062253 A1 WO2020062253 A1 WO 2020062253A1 CN 2018109118 W CN2018109118 W CN 2018109118W WO 2020062253 A1 WO2020062253 A1 WO 2020062253A1
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WO
WIPO (PCT)
Prior art keywords
substrate
circuit board
heat sink
chip
chips
Prior art date
Application number
PCT/CN2018/109118
Other languages
French (fr)
Chinese (zh)
Inventor
王国辉
邹桐
张磊
曾洪波
廖世震
修洪雨
赵宇淳
Original Assignee
北京比特大陆科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京比特大陆科技有限公司 filed Critical 北京比特大陆科技有限公司
Priority to PCT/CN2018/109118 priority Critical patent/WO2020062253A1/en
Priority to CN201880001930.5A priority patent/CN109417862A/en
Publication of WO2020062253A1 publication Critical patent/WO2020062253A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans

Definitions

  • the present application relates to the technical field of circuit boards, for example, to a circuit board, a computing device, and a cooling case.
  • the circuit board is installed in the air duct.
  • a plurality of heat sinks are evenly arranged on the circuit board. The heat generated by the chip is transferred to the heat sink and introduced from one end of the air duct The cold wind will take away the heat of the radiator to cool down the chip.
  • the radiators are uniformly arranged on the circuit board, and cold air is introduced from one side of the circuit board.
  • the chip located downstream of the air duct is affected by the heat of the upstream chip, resulting in the chip located between the air inlet and air outlet chips of the circuit board. There is a temperature difference, which reduces the computing performance of the supercomputing server device.
  • An embodiment of the present disclosure provides a circuit board, including: a substrate, a plurality of chips, and a plurality of first heat sinks; the plurality of chips are disposed on a same surface of the substrate and along an air inlet end of the substrate; To the direction of the air outlet, the arrangement density of the plurality of chips on the substrate gradually decreases; the plurality of first heat sinks and the plurality of chips are connected one-to-one correspondingly, and the first heat sink and the The chip is located on the same side of the substrate; the orthographic projection area of each of the first heat sinks arranged along the direction from the air inlet end to the air outlet end of the substrate gradually increases on the substrate.
  • the plurality of chips are arranged in an array on the substrate.
  • the plurality of chips are divided into a plurality of rows of chip sets, and a column pitch between two adjacent rows of chip sets is gradually increased in a direction from an air inlet end to an outlet end of the substrate.
  • the orthographic projection of the first heat sink with respect to the substrate covers the orthographic projection of the chip with respect to the substrate.
  • the center of the orthographic projection of the first heat sink with respect to the substrate coincides with the center of the orthographic projection of the chip with respect to the substrate.
  • an interval between any two of the first heat sinks is equal.
  • the circuit board further includes a plurality of second heat sinks; the second heat sink is installed opposite to the first heat sink, and the first heat sink and the second heat sink are located on two sides of the substrate. side.
  • first heat sink and the second heat sink corresponding to the same chip are the same.
  • first mounting boss is provided at the bottom of the first heat sink
  • second mounting boss is provided at the bottom of the second heat sink; the first heat sink is passed through the first mounting boss.
  • the second heat sink is bonded to the chip, and the second heat sink is soldered to the substrate through the second mounting boss.
  • An embodiment of the present disclosure further provides a computing device including at least one of the circuit boards.
  • An embodiment of the present disclosure further provides a heat dissipation chassis, which includes a casing, a fan, and at least one of the circuit boards; the casing is provided with an air inlet and an air outlet, and the fan is installed at the air inlet ,
  • the housing is provided with at least one set of mounting slots, the circuit board is inserted in the mounting slot, and the air inlet end of the circuit board faces the air inlet, and the air outlet end of the circuit board faces The air outlet.
  • the air outlet is provided with an exhaust fan.
  • the heat dissipation case further includes a temperature sensor and a control board; the control board is connected to the temperature sensor, the exhaust fan, and the fan, respectively, and the temperature sensor is installed at the air outlet of the circuit board.
  • the chip at the end; the control board controls the rotation speed of the exhaust fan and the fan according to the chip temperature collected by the temperature sensor.
  • a plurality of chips are disposed on the same surface of the substrate, and the plurality of chips are arranged on the substrate in a direction from the air inlet end to the air outlet end of the substrate.
  • the cloth density gradually decreases, and a plurality of the first heat sinks are connected to the chips in a one-to-one correspondence, and each of the first heat sinks arranged along the direction from the air inlet end to the air outlet end of the substrate is gradually projected on the substrate.
  • FIG. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure
  • FIG. 2 is a schematic diagram of an arrangement of a first heat sink on a substrate provided by an embodiment of the present disclosure
  • FIG. 3 is a schematic diagram of mounting a first heat sink and a second heat sink with respect to a substrate according to an embodiment of the present disclosure
  • FIG. 4 is a schematic structural diagram of a first heat sink provided by an embodiment of the present disclosure.
  • FIG. 6 is a schematic diagram of non-uniformly distributed chip temperatures on a circuit board according to an embodiment of the present disclosure.
  • Embodiments of the present disclosure provide a circuit board, a computing device, and a heat dissipation chassis, which can reduce the temperature difference between the chip at the air inlet end and the air outlet end of the circuit board, and improve the computing performance of the supercomputing server device.
  • An embodiment of the present disclosure provides a circuit board having a structure as shown in FIGS. 1 and 2.
  • the circuit board includes: a substrate 10, a plurality of chips 20, and a plurality of first heat sinks 30; the plurality of chips 20 are disposed on the substrate. 10 on the same side of the substrate 10, and along the direction from the air inlet end to the air outlet end of the substrate 10, the arrangement density of the chips 20 on the substrate 10 gradually decreases; the plurality of first heat sinks 30 and the plurality of chips 20 are connected one by one, The first heat sink 30 and the chip 20 are located on the same side of the substrate 10; the orthographic projection area of each first heat sink 30 arranged along the direction from the air inlet end to the air outlet end of the substrate 10 on the substrate 10 gradually increases.
  • the shape of the substrate 10 is generally rectangular.
  • the substrate 10 is provided with a plurality of chip mounting regions and a circuit connecting the chip mounting regions.
  • the air inlet end of the substrate 10 refers to the end of the substrate 10 facing the air inlet of the air duct when the substrate 10 is installed in the air duct of the computing device; the air outlet end of the substrate 10 refers to the substrate 10 when the substrate 10 is placed in the air duct of the computing device.
  • the end facing the air outlet of the air duct is generally rectangular.
  • the substrate 10 is provided with a plurality of chip mounting regions and a circuit connecting the chip mounting regions.
  • the air inlet end of the substrate 10 refers to the end of the substrate 10 facing the air inlet of the air duct when the substrate 10 is installed in the air duct of the computing device; the air outlet end of the substrate 10 refers to the substrate 10 when the substrate 10 is placed in the air duct of the computing device.
  • the end facing the air outlet of the air duct is configured to the end facing the air outlet of
  • the multiple chips 20 are mounted on the multiple chip mounting areas one by one.
  • the chips 20 may be fixedly connected to the substrate 10 by means of bonding or welding.
  • the number of chips 20 disposed in a region near the air inlet end of the substrate 10 is greater than the number of chips 20 disposed in a region near the air outlet end of the substrate 10, that is, in a direction from the air inlet end to the air outlet end of the substrate 10, the chips 20 are disposed on the substrate.
  • the number of distributions on 10 gradually decreases. Since the heat generated by each chip 20 is almost the same, the number of chips 20 provided in the region of the substrate 10 near the air inlet end is larger, and the corresponding heat generated on the air inlet end of the substrate 10 is higher.
  • the multiple chips 20 may be distributed in an array on the front surface of the substrate 10, that is, the multiple chips 20 may be distributed in several rows and columns on the substrate 10.
  • the chips 20 on the substrate 10 can be divided into multiple rows of chip sets, each of which includes a plurality of chips 10, and along the direction from the air inlet end to the air outlet end of the substrate 10, the column spacing between two adjacent chip sets Gradually increasing, therefore, the arrangement density of the chip 20 near the air inlet end of the substrate 10 is greater than the chip arrangement density of the substrate 10 near the air outlet end, and the heat of the area of the substrate 10 near the air inlet end is greater than that of the substrate 10 near the air outlet end.
  • the number of the first heat sinks 30 arranged on the substrate 10 is equal to the number of the chips 20 arranged on the front surface of the substrate 10, and each chip 20 is provided with a corresponding one of the first heat sinks 30.
  • the first heat sink 30 can be an aluminum extruded heat sink.
  • the so-called aluminum extruded heat sink is a heat sink made of an aluminum material using an extrusion process.
  • the first heat sink 30 includes a plurality of evenly arranged heat dissipation fins, and any two heat dissipation The same heat dissipation cavity formed between the fins; the heat generated by the chip 20 is transferred to the first heat sink 30, and the cold wind introduced from the air inlet end of the substrate 10 flows through the heat dissipation cavity of the first heat sink 30 to dissipate the first heat The heat of the heater 30 is taken away, and the heat is transferred to the air outlet end of the substrate 10 with the flow of the cold wind.
  • the orthographic projection area of each first heat sink 30 arranged along the direction from the air inlet end to the air outlet end of the substrate 10 gradually increases; it can be understood that, because the first heat sink 30 is relatively disposed on the substrate 10 And when the widths of the first heat sinks 30 are the same, the length of each first heat sink 30 arranged along the direction from the air inlet end to the air outlet end of the substrate 10 is gradually increased, so that the air inlet end along the substrate 10 can be increased.
  • the orthographic projection area of each of the first heat sinks 30 arranged in the direction toward the air outlet end gradually increases.
  • the first radiators arranged along the air inlet end to the air outlet end of the substrate 10 are gradually increased.
  • the length of the first heat sink 30 provided in this embodiment is equal to the ambient temperature of the first heat sink 30 around the mounting position of the substrate 10, the power consumption of the chip 20 here, The temperature difference of the chip 20 at the air inlet side of the substrate is related.
  • the required thermal resistance of the first radiator 30 is determined according to the above parameters.
  • the length of the first radiator is selected based on the thermal resistance of the first radiator, that is, the first radiator 30 and the cold air are selected. Heat exchange area.
  • the number of chips 20 arranged along the direction from the air inlet end to the air outlet end of the substrate 10 is gradually smaller, and the heat to be diffused on the substrate 10 is correspondingly gradually reduced along the flow direction of the cold air.
  • the heat radiation area in the direction of the cold air flow also gradually increases, and the heat dissipation capacity of the first heat sink 30 is gradually increased. Therefore, the temperature of the chip on the air outlet side of the substrate 10 is reduced by the heat of the chip on the air inlet side of the substrate 10, and the temperature of the chip located on the substrate 10 is further reduced.
  • the difference between the temperature of the chip 20 at the wind end and the temperature of the chip 20 at the basic air output end is reduced, improving the computing performance of the supercomputing server device.
  • the orthographic projection of the first heat sink 30 with respect to the substrate 10 covers the orthographic projection of the chip 20 with respect to the substrate 10.
  • the first heat sink 30 is mounted on the side of the chip 20 away from the substrate 10.
  • the first heat sink 30 is orthographically projected from the substrate 10 to face the chip 20
  • the front projection coverage of the substrate 10, that is, the heat dissipation area of the first heat sink 30 is larger than the surface area of the chip 20, can increase the heat transfer efficiency between the first heat sink 30 and the chip 20.
  • the heat generated by the chip 20 can be quickly transferred to the first heat sink 30.
  • center of the orthographic projection of the first heat sink 30 with respect to the substrate 10 coincides with the center of the orthographic projection of the chip 20 with respect to the substrate 10.
  • the chip 20 is aligned with the first heat sink 30, and the center of the orthographic projection of the chip 20 relative to the substrate 10 coincides with the center of the orthographic projection of the first heat sink 30, and the heat generated by the chip 20 is diffused and diffused into the surrounding space.
  • the heat to the space around the chip 20 can be evenly diffused to the first heat sink 30 and discharged with the cold wind through the first heat sink 30 to accelerate the heat transfer between the first heat sink 30 and the chip 20.
  • the interval between any two first heat sinks 30 is equal.
  • a plurality of first radiators 30 are arranged in a direction from the air inlet end to the air outlet end of the substrate 10, and the interval between any two first radiators 30 is equal, that is, the left and right intervals between any two first radiators 30 are equal.
  • the left-right interval of any two first heat sinks in this embodiment may be 2-5 mm, and preferably 2 mm.
  • the interval between any two first heat sinks 30 is the same, which ensures that the length of the first heat sink 30 is increased along with the interval between adjacent chips. The increase further reduces the temperature difference between the chips 20 at different positions on the substrate 10.
  • the circuit board further includes a plurality of second heat sinks.
  • the second heat sink is installed opposite the first heat sink 30, and the first heat sink 30 and the second heat sink are located on both sides of the substrate 10.
  • the substrate 10 includes a front surface and a back surface.
  • the chip 20 may be disposed on the front surface of the substrate 10, and the first heat sink 30 may be adhered to the chip 20.
  • a plurality of second heat sinks are provided on the back surface of the substrate 10, and the second heat sinks are installed at the back surface of the substrate 10 corresponding to the chip 20, and each chip 20 has a second heat sink correspondingly installed on the back surface of the substrate, thereby realizing the second The radiator and the first radiator 30 are oppositely mounted.
  • the substrate 10 uses the first heat sink 30 and the second heat sink to reduce the temperature of the chip 20 at the same time, thereby improving the cooling efficiency of the chip 20.
  • the second heat sink can also be fixed on the back surface of the substrate 10 by bonding or welding.
  • the substrate 10 is provided with a plurality of heat transfer holes, and the plurality of heat transfer holes can be evenly arranged around the chip 20, and the heat generated by the chip 20 is passed through the heat transfer
  • the holes diffuse to the back surface of the substrate 10, and the heat diffused to the back surface of the substrate 10 is transmitted to the second heat sink.
  • Cold air flows through the second heat sink and transfers the heat on the second heat sink to the air outlet end of the substrate 10.
  • the shape and size of the second heat sink are not limited.
  • the orthographic projection of the second heat sink with respect to the substrate 10 may be greater than the orthographic projection of the chip 20 with respect to the substrate 10, and the The orthographic projection may not be greater than the orthographic projection of the chip 20 relative to the substrate 10, and is not repeated here.
  • the first heat sink 30 and the second heat sink corresponding to the same chip 20 have the same shape and size, which further reduces the temperature of the chip 20 on the substrate 10 and reduces the temperature difference between the chips on the substrate 10 and improves Supercomputing the computing performance of server devices.
  • a first mounting boss 31 is provided at the bottom of the first heat sink 30 and a second mounting boss is provided at the bottom of the second heat sink; the first heat sink 30 is adhered by the first mounting boss 31 It is connected to the chip 20, and the second heat sink is soldered to the substrate 10 through the second mounting boss.
  • Both the first heat sink 30 and the second heat sink include a heat sink film and heat sink fins mounted on the heat sink film at equal intervals.
  • the radiating fins can be rectangular plates.
  • the radiating fins are vertically mounted on the radiating fins, and a radiating cavity is formed between adjacent radiating fins.
  • the radiating cavity is arranged along the direction of the cold air flow.
  • the heat of the first heat sink 30 and the second heat sink is taken away; the heat sink film is made of an arc plate, which can increase the space between the heat sink film and the substrate.
  • the heat sink film of the first heat sink 30 is provided with a first mounting boss 31.
  • the shape of the first mounting boss 31 is the same as that of the chip 20.
  • the material of the first mounting boss 31 may be the same as that of the first heat sink 30. Usually it is a metal material with good thermal conductivity, such as aluminum.
  • the first mounting boss 31 may be designed as a rectangular block. One side of the first mounting boss 31 is arranged along the center line of the arc-shaped plate. The other side of the first mounting boss 31 is bonded to the side of the chip 20 away from the substrate 10. The first mounting boss 31 after bonding is overlapped with the chip 20.
  • the first heat sink 30 is connected to the chip 20 through the first mounting boss 31, which can increase the heat transfer efficiency between the first heat sink 30 and the chip 20, and also enhance the connection between the first heat sink 30 and the chip 20. Strength, the first heat sink 30 is firmly connected to the chip 20.
  • the bonding manner between the first mounting boss 31 and the chip 20 there is no limitation on the bonding manner between the first mounting boss 31 and the chip 20, and it is preferable to use a thermally conductive adhesive for fixing between the first mounting boss 31 and the chip 20.
  • the glue has a smaller contact thermal resistance, which is beneficial to the heat transfer between the first mounting boss 31 and the chip 20.
  • a second mounting boss is provided at the bottom of the second radiator.
  • the second mounting boss is designed as a rectangular block, and one side of the second mounting boss is arranged along the center line of the arc plate; the second mounting boss can pass through It is fixed on the substrate 10 by bonding or welding.
  • the second mounting boss is preferably fixed to the substrate 10 by soldering.
  • Exposed copper may be provided at the position corresponding to the chip 20 on the back of the substrate 10, and the size of the exposed copper is similar to the installation of the second mounting boss.
  • the surface has the same size, and the second mounting boss is welded to the exposed copper position.
  • first mounting boss 31 provided by the first heat sink 30 and the second mounting boss provided by the second heat sink can effectively increase the space between the substrate 10 and the heat sink, and can meet the mounting requirements of other components on the substrate 10, The function of the substrate 10 is expanded.
  • An embodiment of the present disclosure further provides a computing device including at least one circuit board, where a plurality of chips 20 and a first heat sink 30 and a second heat sink are provided; the chips 20 are non-uniformly arranged on the substrate 10, That is, along the direction from the air inlet end to the air outlet end of the substrate 10, the number of chips 20 on the substrate 10 gradually decreases; and each of the first heat sinks 30 and the second array arranged along the direction from the air inlet end to the air outlet end of the substrate 10 The length of the heat sink is gradually increased; therefore, the computing device provided by the embodiment of the present disclosure reduces the influence of the chip located downstream of the air duct on the heat of the upstream chip, and reduces the temperature of the circuit board, and also reduces the circuit board inlet. The temperature difference between the chip on the wind side and the chip on the wind side improves the computing performance of the computing device.
  • An embodiment of the present disclosure further provides a heat dissipation chassis, which includes a housing, a fan, and at least one circuit board; the housing is provided with an air inlet and an air outlet, the fan is installed at the air inlet, and at least one In the mounting slot, the circuit board is inserted into the mounting slot, and the air inlet end of the circuit board faces the air inlet, and the air outlet end of the circuit board faces the air outlet.
  • a heat dissipation chassis which includes a housing, a fan, and at least one circuit board; the housing is provided with an air inlet and an air outlet, the fan is installed at the air inlet, and at least one In the mounting slot, the circuit board is inserted into the mounting slot, and the air inlet end of the circuit board faces the air inlet, and the air outlet end of the circuit board faces the air outlet.
  • the heat dissipating case includes a case.
  • the case may be a rectangular structure surrounded by four rectangular panels. Both ends of the case are provided with an air inlet and an air outlet.
  • a fan is installed at the air inlet of the casing. The fan introduces the cold air from the outside of the cooling case into the casing, and the cold air flows in the direction from the air inlet to the air outlet to form an air duct.
  • the housing is provided with at least one set of mounting slots, and at least one set of circuit boards as shown in Figs.
  • This embodiment does not limit the connection between the circuit board and the cooling case; for example, a dovetail slot may be provided in the air duct, the circuit board is provided with a mounting edge that cooperates with the dovetail slot, and the circuit board is removed from the dovetail slot by the mounting edge. One end is slid into the dovetail slot for quick installation of the circuit board in the housing.
  • an exhaust fan is provided at an air outlet of the heat dissipation case, and the exhaust fan is used to guide the hot air in the heat dissipation case out of the heat dissipation case.
  • a fan and an exhaust fan are respectively provided at the air inlet and the air outlet of the casing, which can accelerate the flow speed of the cold air in the heat dissipation case and take away the heat on the circuit board in time to improve the heat dissipation of the circuit board in the heat dissipation case. effect.
  • the heat dissipation case further includes a temperature sensor and a control board, and the control board is connected to the temperature sensor, the exhaust fan, and the fan, respectively, and the temperature sensor is installed on the chip 20 at the air outlet end of the circuit board; The speed of the exhaust fan and the fan is controlled according to the chip temperature collected by the temperature sensor.
  • a control board is installed on a surface of a panel of the heat dissipation chassis, and a temperature sensor is installed on the chip 20 at a position of the road board near the air outlet of the chassis.
  • the input end of the control board is connected to the temperature sensor signal, and the output end of the control board is connected to the exhaust fan and the fan signal respectively.
  • the temperature sensor collects the temperature of the chip 20 near the air outlet of the chassis, and transmits the temperature data to the control board.
  • the control board controls the rotation speed of the exhaust fan and the fan according to the temperature data collected by the temperature sensor, so that the chip 20 near the air outlet of the chassis Constant temperature helps reduce the power consumption and noise of supercomputing server equipment.
  • a plurality of circuit boards are installed in the air duct, and the circuit board is provided with a plurality of chips 20 and a first heat sink 30 and a second heat sink; the chips 20 are unevenly arranged on the substrate 10 That is, along the direction from the air inlet end to the air outlet end of the substrate 10, the number of chips 20 distributed on the substrate 10 gradually decreases.
  • the first radiator 30 and the second radiator are non-uniformly arranged on both sides of the substrate 10.
  • the first heat sink 30 changes the heat resistance of the heat sink.
  • the heat resistance of the heat sink selected by the chip is inversely proportional to the local ambient temperature at the location, which reduces the influence of the chip located downstream of the air duct on the heat of the upstream chip. While reducing the temperature of the circuit board, the temperature difference between the chip at the air inlet and the air outlet of the circuit board is also reduced, and the computing performance of the supercomputing server device is improved.
  • FIG. 5 and FIG. 6 show that the circuit board and the heat dissipation case provided by the embodiment of the present disclosure reduce the minimum temperature of the chip 20 at the air outlet end of the circuit board from 88.6 to 84.4.
  • the temperature is reduced by 4.2 °C, the temperature of the circuit board is reduced, and the service life and performance of the chip 20 are improved.
  • the temperature difference between the chip 20 located at the air outlet of the circuit board and the chip 20 located at the air inlet of the circuit board is reduced from the previous 19 °C To 5.6 °C; continue to optimize the chip so that the temperature difference between the chip 20 on the circuit board's air-out side and the chip 20 on the circuit's air-in side is controlled within 3 ° C.
  • the chip The temperature of the chip 20 at the wind end and the chip 20 at the air intake end of the circuit board tend to be the same; and in the embodiment of the present disclosure, since the temperature of the high-temperature chip is reduced, the rotation speed of the cooling fan can be appropriately reduced to reduce the overall power consumption.
  • the heat resistance of the heat sink is changed by designing different heat dissipation areas of the heat sink, and the heat resistance of the heat sink selected by the chip It is inversely proportional to the local ambient temperature at this location; the temperature and thermal resistance matching achieves the effect of uniform temperature of the entire board, which improves the service life and performance of the chip, thereby improving the computing performance of the supercomputing server device.
  • the chip and heat sink layout method of the present disclosure can reduce the influence of the chips located downstream of the air duct on the heat of the chips located upstream and reduce the temperature of the circuit board while reducing the temperature of the circuit board. The temperature difference between the air-end and air-end chips; and, because the temperature of the high-temperature chip is reduced, the fan speed can be appropriately reduced to reduce the overall power consumption.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Provided are a circuit board, a computing device and a cooling case. The circuit board comprises a base board, multiple chips and multiple first heat sinks. The multiple chips are arranged on the same surface of the base board, and the arrangement density of the multiple chips on the base board gradually decreases in the direction from an air inlet end of the base board to an air outlet end thereof. The multiple first heat sinks are correspondingly connected to the multiple chips on a one-to-one basis, and the first heat sinks and the chips are located on the same side of the base board. The orthographic projection area of the first heat sinks, arranged in the direction from the air inlet end of the base board to the air outlet end thereof, on the base board gradually increases. According to the circuit board, the computing device and the cooling case provided in the present application, the heat influence of chips located on the upper reaches of an air duct on chips located on the lower reaches of the air duct is reduced, and while the circuit board cools, the temperature difference between the chips located at an air inlet end of the circuit board and the chips located at an air outlet end of the circuit board is also reduced, thereby improving the computation performance of a super-computing server device.

Description

电路板、计算设备及散热机箱Circuit board, computing equipment and cooling case 技术领域Technical field
本申请涉及电路板技术领域，例如涉及一种电路板、计算设备及散热机箱。The present application relates to the technical field of circuit boards, for example, to a circuit board, a computing device, and a cooling case.
背景技术Background technique
目前大部分超算服务器设备为提升其计算性能，在其电路板上设置有多个芯片，多个芯片产生大量的热量会影响芯片的运算能力，因此需要对芯片进行降温。At present, in order to improve the computing performance of most supercomputing server equipment, multiple chips are arranged on its circuit board. The large amount of heat generated by multiple chips will affect the computing capacity of the chip, so the chip needs to be cooled.
现有的大部分超算服务器设备都采用风冷散热，将电路板安装在风道内，电路板上均布设置有多个散热器，芯片产生的热量传递至散热器，并由风道一端引入的冷风将散热器的热量带走，实现对芯片进行降温。Most of the existing supercomputing server equipment adopts air cooling to dissipate heat. The circuit board is installed in the air duct. A plurality of heat sinks are evenly arranged on the circuit board. The heat generated by the chip is transferred to the heat sink and introduced from one end of the air duct The cold wind will take away the heat of the radiator to cool down the chip.
但目前散热器都均匀布置在电路板上，且冷风从电路板的一侧引入，位于风道下游的芯片受到位于上游芯片的热量影响，导致位于电路板进风端和出风端芯片之间存在温度差异，从而使超算服务器设备的计算性能下降。However, at present, the radiators are uniformly arranged on the circuit board, and cold air is introduced from one side of the circuit board. The chip located downstream of the air duct is affected by the heat of the upstream chip, resulting in the chip located between the air inlet and air outlet chips of the circuit board. There is a temperature difference, which reduces the computing performance of the supercomputing server device.
上述背景技术内容仅用于帮助理解本申请，而并不代表承认或认可所提及的任何内容属于相对于本申请的公知常识的一部分。The above background art content is only used to help understand this application, and does not represent an acknowledgement or approval that any of the content mentioned is part of the common general knowledge relative to this application.
发明内容Summary of the Invention
本公开实施例提供了一种电路板，包括：基板、多个芯片及多个第一散热器；所述多个芯片设置在所述基板的同一面上，且沿所述基板的进风端至出风端的方向，所述多个芯片在所述基板上的排布密度逐渐降低；所述多个第一散热器与所述多个芯片一一对应连接，且所述第一散热器与所述芯片位于所述基板的同侧；沿所述基板的进风端至出风端的方向排列的各所述第一散热器在所述基板上的正投影面积逐渐增大。An embodiment of the present disclosure provides a circuit board, including: a substrate, a plurality of chips, and a plurality of first heat sinks; the plurality of chips are disposed on a same surface of the substrate and along an air inlet end of the substrate; To the direction of the air outlet, the arrangement density of the plurality of chips on the substrate gradually decreases; the plurality of first heat sinks and the plurality of chips are connected one-to-one correspondingly, and the first heat sink and the The chip is located on the same side of the substrate; the orthographic projection area of each of the first heat sinks arranged along the direction from the air inlet end to the air outlet end of the substrate gradually increases on the substrate.
进一步的，所述多个芯片在所述基板上呈阵列排布。Further, the plurality of chips are arranged in an array on the substrate.
进一步的，所述多个芯片分为多列芯片组，且沿所述基板的进风端至出口端 的方向，相邻两列芯片组之间的列间距逐渐增大。Further, the plurality of chips are divided into a plurality of rows of chip sets, and a column pitch between two adjacent rows of chip sets is gradually increased in a direction from an air inlet end to an outlet end of the substrate.
进一步的，所述第一散热器相对所述基板的正投影覆盖所述芯片相对所述基板的正投影。Further, the orthographic projection of the first heat sink with respect to the substrate covers the orthographic projection of the chip with respect to the substrate.
进一步的，所述第一散热器相对于所述基板的正投影的中心与所述芯片相对所述基板的正投影的中心重合。Further, the center of the orthographic projection of the first heat sink with respect to the substrate coincides with the center of the orthographic projection of the chip with respect to the substrate.
进一步的，沿所述基板的进风端至出风端的方向排列的各所述第一散热器中，任意的两个所述第一散热器的间隔相等。Further, in each of the first heat sinks arranged in a direction from an air inlet end to an air outlet end of the substrate, an interval between any two of the first heat sinks is equal.
进一步的，所述电路板还包括多个第二散热器；所述第二散热器与所述第一散热器相对安装，且所述第一散热器和第二散热器位于所述基板的两侧。Further, the circuit board further includes a plurality of second heat sinks; the second heat sink is installed opposite to the first heat sink, and the first heat sink and the second heat sink are located on two sides of the substrate. side.
进一步的，同一所述芯片相对应的第一散热器和第二散热器的形状和大小相同。Further, the shapes and sizes of the first heat sink and the second heat sink corresponding to the same chip are the same.
进一步的，所述第一散热器的底部设置有第一安装凸台，所述第二散热器的底部设置有第二安装凸台；通过所述第一安装凸台将所述第一散热器粘接在所述芯片上，通过所述第二安装凸台将所述第二散热器焊接在所述基板上。Further, a first mounting boss is provided at the bottom of the first heat sink, and a second mounting boss is provided at the bottom of the second heat sink; the first heat sink is passed through the first mounting boss. The second heat sink is bonded to the chip, and the second heat sink is soldered to the substrate through the second mounting boss.
本公开实施例还提供了一种计算设备，包括至少一个所述电路板。An embodiment of the present disclosure further provides a computing device including at least one of the circuit boards.
本公开实施例还提供了一种散热机箱，包括：壳体、送风扇和至少一个所述电路板；所述壳体设置有进风口和出风口，所述送风扇安装在所述进风口处，所述壳体内设置有至少一组安装槽，所述电路板插接在所述安装槽内，且所述电路板的进风端朝向所述进风口，所述电路板的出风端朝向所述出风口。An embodiment of the present disclosure further provides a heat dissipation chassis, which includes a casing, a fan, and at least one of the circuit boards; the casing is provided with an air inlet and an air outlet, and the fan is installed at the air inlet , The housing is provided with at least one set of mounting slots, the circuit board is inserted in the mounting slot, and the air inlet end of the circuit board faces the air inlet, and the air outlet end of the circuit board faces The air outlet.
进一步的，所述出风口设置有排风扇。Further, the air outlet is provided with an exhaust fan.
进一步的，所述散热机箱还包括温度传感器及控制板；所述控制板分别与所述温度传感器、所述排风扇及所述送风扇进行信号连接；所述温度传感器安装在位于电路板的出风端的芯片上；所述控制板根据所述温度传感器采集的芯片温度控制所述排风扇及所述送风扇的转速。Further, the heat dissipation case further includes a temperature sensor and a control board; the control board is connected to the temperature sensor, the exhaust fan, and the fan, respectively, and the temperature sensor is installed at the air outlet of the circuit board. The chip at the end; the control board controls the rotation speed of the exhaust fan and the fan according to the chip temperature collected by the temperature sensor.
本公开的实施例提供的电路板、计算设备及散热机箱，多个芯片设置在基板的同一面上，且沿基板的进风端至出风端的方向，多个芯片在所述基板上的排布密度逐渐降低，多个所述第一散热器与多个芯片一一对应连接，且沿基板 的进风端至出风端的方向排列的各第一散热器在所述基板的正投影面积逐渐增大；减小了位于风道下游的芯片受到位于上游芯片的热量影响，在对电路板进行降温的同时，也减小了电路板进风端和出风端的芯片之间的温度差异，提升超算服务器设备的计算性能。In the circuit board, the computing device, and the heat dissipation case provided in the embodiments of the present disclosure, a plurality of chips are disposed on the same surface of the substrate, and the plurality of chips are arranged on the substrate in a direction from the air inlet end to the air outlet end of the substrate. The cloth density gradually decreases, and a plurality of the first heat sinks are connected to the chips in a one-to-one correspondence, and each of the first heat sinks arranged along the direction from the air inlet end to the air outlet end of the substrate is gradually projected on the substrate. Increase; reduce the temperature of the chip located downstream of the air duct by the heat of the upstream chip, while reducing the temperature of the circuit board, also reduce the temperature difference between the chip on the air inlet side and the air outlet side Supercomputing the computing performance of server devices.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
一个或多个实施例通过与之对应的附图进行示例性说明，这些示例性说明和附图并不构成对实施例的限定，附图中具有相同参考数字标号的元件表示为类似的元件，附图不构成比例限制，并且其中：One or more embodiments are exemplarily described by corresponding drawings. These exemplary descriptions and drawings do not limit the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. The drawings do not constitute a scale limitation, and among them:
图1为本公开实施例提供的电路板的结构示意图；1 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure;
图2为本公开实施例提供的第一散热器在基板上的布置示意图；2 is a schematic diagram of an arrangement of a first heat sink on a substrate provided by an embodiment of the present disclosure;
图3为本公开实施例提供的第一散热器、第二散热器相对于基板的安装示意图；3 is a schematic diagram of mounting a first heat sink and a second heat sink with respect to a substrate according to an embodiment of the present disclosure;
图4为本公开实施例提供的第一散热器的结构示意图；4 is a schematic structural diagram of a first heat sink provided by an embodiment of the present disclosure;
图5为现有技术电路板上均布的芯片温度示意图；5 is a schematic diagram of chip temperatures evenly distributed on a prior art circuit board;
图6为本公开实施例提供的电路板上非均布的芯片温度示意图。FIG. 6 is a schematic diagram of non-uniformly distributed chip temperatures on a circuit board according to an embodiment of the present disclosure.
附图标记说明：Reference sign description:
10-基板，10-substrate,
20-芯片，20-chip,
30-第一散热器，30-first radiator,
31-第一安装凸台。31-First mounting boss.
具体实施方式detailed description
为了能够更加详尽地了解本公开实施例的特点与技术内容，下面结合附图对本公开实施例的实现进行详细阐述，所附附图仅供参考说明之用，并非用来 限定本公开实施例。在以下的技术描述中，为方便解释起见，通过多个细节以提供对所披露实施例的充分理解。然而，在没有这些细节的情况下，一个或多个实施例仍然可以实施。在其它情况下，为简化附图，熟知的结构和装置可以简化展示。In order to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The attached drawings are for reference only and are not intended to limit the embodiments of the present disclosure. In the following technical description, for convenience of explanation, various details are provided to provide a full understanding of the disclosed embodiments. However, without these details, one or more embodiments can still be implemented. In other cases, to simplify the drawings, well-known structures and devices may simplify the display.
正如背景技术中所记载，目前大部分超算服务器设备都采用堆叠芯片的方法提升性能，而随着算力的不断提升，芯片功耗也大幅增加。而且，目前的大部分超算服务器都采用风冷散热，通过增加散热器的方法增加热源散热面积，然后靠风扇送来的冷却风带走热量。但是，目前散热器在电路板上都采用均匀布置，散热器大小也完全相同，这就导致了风道下游芯片受到上游芯片热量影响，进而导致位于电路板进风端和出风端芯片之间存在温度差异，从而使超算服务器设备的计算性能下降。As documented in the background art, most supercomputing server devices currently use stacked chips to improve performance, and as computing power continues to increase, chip power consumption also increases significantly. Moreover, most current supercomputing servers use air cooling to increase heat dissipation area by adding heat sinks, and then use the cooling air from the fans to take away the heat. However, at present, the heat sinks are uniformly arranged on the circuit board, and the sizes of the heat sinks are also the same. This has caused the downstream chips of the air duct to be affected by the heat of the upstream chips, which in turn caused the chips located between the air inlet and air outlet chips of the circuit board. There is a temperature difference, which reduces the computing performance of the supercomputing server device.
本公开实施例提供一种电路板、计算设备及散热机箱，能够降低位于电路板进风端和出风端芯片之间存在温度差异，提升超算服务器设备的计算性能。Embodiments of the present disclosure provide a circuit board, a computing device, and a heat dissipation chassis, which can reduce the temperature difference between the chip at the air inlet end and the air outlet end of the circuit board, and improve the computing performance of the supercomputing server device.
下面结合附图详细介绍本公开实施例提供的电路板、计算设备及散热机箱的具体实施方式。The specific implementations of the circuit board, the computing device, and the heat dissipation chassis provided by the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.
本公开实施例提供了一种电路板，其结构如图1和图2所示，该电路板包括：基板10、多个芯片20及多个第一散热器30；多个芯片20设置在基板10的同一面上，且沿基板10的进风端至出风端的方向，芯片20在基板10上的排布密度逐渐降低；多个第一散热器30与多个芯片20一一对应连接，且第一散热器30与芯片20位于基板10的同侧；沿基板10的进风端至出风端的方向排列的各第一散热器30在基板10上的正投影面积逐渐增大。An embodiment of the present disclosure provides a circuit board having a structure as shown in FIGS. 1 and 2. The circuit board includes: a substrate 10, a plurality of chips 20, and a plurality of first heat sinks 30; the plurality of chips 20 are disposed on the substrate. 10 on the same side of the substrate 10, and along the direction from the air inlet end to the air outlet end of the substrate 10, the arrangement density of the chips 20 on the substrate 10 gradually decreases; the plurality of first heat sinks 30 and the plurality of chips 20 are connected one by one, The first heat sink 30 and the chip 20 are located on the same side of the substrate 10; the orthographic projection area of each first heat sink 30 arranged along the direction from the air inlet end to the air outlet end of the substrate 10 on the substrate 10 gradually increases.
示例性的，基板10的形状一般为矩形，基板10上设置有多个芯片安装区以及连接各芯片安装区的电路。基板10的进风端是指基板10安装在计算设备的风道中时，基板10朝向风道进风口的一端；基板10的出风端是指基板10放置在计算设备的风道中时，基板10朝向风道出风口的一端。Exemplarily, the shape of the substrate 10 is generally rectangular. The substrate 10 is provided with a plurality of chip mounting regions and a circuit connecting the chip mounting regions. The air inlet end of the substrate 10 refers to the end of the substrate 10 facing the air inlet of the air duct when the substrate 10 is installed in the air duct of the computing device; the air outlet end of the substrate 10 refers to the substrate 10 when the substrate 10 is placed in the air duct of the computing device. The end facing the air outlet of the air duct.
多个芯片20一一对应安装在多个芯片安装区，具体的，芯片20可通过粘接或焊接等方式与基板10固定连接。靠近基板10的进风端的区域设置的芯片20数量大于在靠近基板10的出风端的区域设置的芯片20数量，也就是说，沿 基板10的进风端至出风端的方向，芯片20在基板10上的分布数量逐渐减少，由于每个芯片20产生的热量几乎相同，基板10靠近进风端的区域设置的芯片20的数量多，相应的在基板10的进风端产生的热量就越高，基板10靠近出风端的区域设置的芯片20的数量少，相应的在基板10的出风端产生的热量就越少，因此沿基板10的进风端至出风端的方向，基板10上需冷风带走的热量逐渐减少。The multiple chips 20 are mounted on the multiple chip mounting areas one by one. Specifically, the chips 20 may be fixedly connected to the substrate 10 by means of bonding or welding. The number of chips 20 disposed in a region near the air inlet end of the substrate 10 is greater than the number of chips 20 disposed in a region near the air outlet end of the substrate 10, that is, in a direction from the air inlet end to the air outlet end of the substrate 10, the chips 20 are disposed on the substrate. The number of distributions on 10 gradually decreases. Since the heat generated by each chip 20 is almost the same, the number of chips 20 provided in the region of the substrate 10 near the air inlet end is larger, and the corresponding heat generated on the air inlet end of the substrate 10 is higher. The smaller the number of chips 20 in the area of the substrate 10 near the air outlet end, the less heat is generated at the air outlet end of the substrate 10, so along the direction from the air inlet end to the air outlet end of the substrate 10, cold air is required on the substrate 10 The heat taken away gradually decreases.
可以理解的是，多个芯片20可呈阵列分布在基板10的正面上，即多个芯片20在基板10上可以呈数行数列分布。基板10上的芯片20可分为多列芯片组，其每列芯片组包括多个芯片10，且沿基板10的进风端至出风端方向，相邻两例芯片组之间的列间隔逐渐增大，因此基板10靠近进风端的芯片20的排布密度大于基板10靠近出风端的芯片排布密度，进而基板10靠近进风端的区域的热量大于基板10靠近出风端的区域的热量。It can be understood that the multiple chips 20 may be distributed in an array on the front surface of the substrate 10, that is, the multiple chips 20 may be distributed in several rows and columns on the substrate 10. The chips 20 on the substrate 10 can be divided into multiple rows of chip sets, each of which includes a plurality of chips 10, and along the direction from the air inlet end to the air outlet end of the substrate 10, the column spacing between two adjacent chip sets Gradually increasing, therefore, the arrangement density of the chip 20 near the air inlet end of the substrate 10 is greater than the chip arrangement density of the substrate 10 near the air outlet end, and the heat of the area of the substrate 10 near the air inlet end is greater than that of the substrate 10 near the air outlet end.
基板10上布置的第一散热器30的数量与基板10正面布置的芯片20数量相等，每一个芯片20上单独对应设置有一个第一散热器30。第一散热器30可采用铝挤散热器，所谓铝挤散热器即铝材利用挤压工艺制成的散热器，第一散热器30包括多个均布排列的散热翅片，任意两个散热翅片之间形成的相同的散热腔；芯片20产生的热量传递至第一散热器30上，从基板10的进风端引入的冷风流经第一散热器30的散热腔，将第一散热器30的热量带走，并且热量随着冷风的流动传递至基板10的出风端。The number of the first heat sinks 30 arranged on the substrate 10 is equal to the number of the chips 20 arranged on the front surface of the substrate 10, and each chip 20 is provided with a corresponding one of the first heat sinks 30. The first heat sink 30 can be an aluminum extruded heat sink. The so-called aluminum extruded heat sink is a heat sink made of an aluminum material using an extrusion process. The first heat sink 30 includes a plurality of evenly arranged heat dissipation fins, and any two heat dissipation The same heat dissipation cavity formed between the fins; the heat generated by the chip 20 is transferred to the first heat sink 30, and the cold wind introduced from the air inlet end of the substrate 10 flows through the heat dissipation cavity of the first heat sink 30 to dissipate the first heat The heat of the heater 30 is taken away, and the heat is transferred to the air outlet end of the substrate 10 with the flow of the cold wind.
本实施例中，沿基板10的进风端至出风端方向排列的各第一散热器30的正投影面积逐渐增大；可以理解的是，由于第一散热器30相对设置在基板10上且在各第一散热器30的宽度相同的情况下，沿基板10的进风端至出风端方向排列的各第一散热器30的长度逐渐增大，可使沿基板10的进风端至出风端方向排列的各第一散热器30的正投影面积逐渐增大。随着沿基板10的进风端至出风端方向排列的各第一散热器30的正投影面积逐渐增大，也就使沿基板10的进风端至出风端方向排列的各第一散热器30与冷风的接触面积就越大，提升了第一散热器30与冷风的热交换效率，因此沿基板10的进风端至出风端方向排列的各第一散热器30的散热能力逐渐提高。In this embodiment, the orthographic projection area of each first heat sink 30 arranged along the direction from the air inlet end to the air outlet end of the substrate 10 gradually increases; it can be understood that, because the first heat sink 30 is relatively disposed on the substrate 10 And when the widths of the first heat sinks 30 are the same, the length of each first heat sink 30 arranged along the direction from the air inlet end to the air outlet end of the substrate 10 is gradually increased, so that the air inlet end along the substrate 10 can be increased. The orthographic projection area of each of the first heat sinks 30 arranged in the direction toward the air outlet end gradually increases. As the orthographic projection area of the first radiators 30 arranged along the direction from the air inlet end to the air outlet end of the substrate 10 gradually increases, the first radiators arranged along the air inlet end to the air outlet end of the substrate 10 are gradually increased. The larger the contact area between the radiator 30 and the cold wind is, the higher the heat exchange efficiency between the first radiator 30 and the cold wind is. Therefore, the heat dissipation capability of each first radiator 30 arranged along the direction from the air inlet end to the air outlet end of the substrate 10 is improved. Gradually improve.
可以理解的是，本实施例提供的第一散热器30，其长度与第一散热器30在 基板10安装位置处周围的环境温度、此处芯片20的功耗以及位于基板出风端和位于基板进风端的芯片20的温差相关，根据以上参数确定所需第一散热器30的热阻，通过第一散热器的热阻选择第一散热器的长度，即选择第一散热器30与冷风的热交换面积。It can be understood that the length of the first heat sink 30 provided in this embodiment is equal to the ambient temperature of the first heat sink 30 around the mounting position of the substrate 10, the power consumption of the chip 20 here, The temperature difference of the chip 20 at the air inlet side of the substrate is related. The required thermal resistance of the first radiator 30 is determined according to the above parameters. The length of the first radiator is selected based on the thermal resistance of the first radiator, that is, the first radiator 30 and the cold air are selected. Heat exchange area.
本实施例中，沿基板10进风端至出风端方向布置的芯片20数量逐渐较少，基板10上需扩散的热量沿冷风流动方向相应的逐渐较少，再者第一散热器30在冷风流动方向的散热面积也逐渐增大，第一散热器30的散热能力逐渐提高，因此基板10出风端的芯片的温度受到基板10进风端的芯片的热量影响减小，进而使位于基板10进风端的芯片20温度和位于基本出风端芯片20的温度差异减小，提升超算服务器设备的计算性能。In this embodiment, the number of chips 20 arranged along the direction from the air inlet end to the air outlet end of the substrate 10 is gradually smaller, and the heat to be diffused on the substrate 10 is correspondingly gradually reduced along the flow direction of the cold air. The heat radiation area in the direction of the cold air flow also gradually increases, and the heat dissipation capacity of the first heat sink 30 is gradually increased. Therefore, the temperature of the chip on the air outlet side of the substrate 10 is reduced by the heat of the chip on the air inlet side of the substrate 10, and the temperature of the chip located on the substrate 10 is further reduced. The difference between the temperature of the chip 20 at the wind end and the temperature of the chip 20 at the basic air output end is reduced, improving the computing performance of the supercomputing server device.
本实施例中，第一散热器30相对基板10的正投影覆盖芯片20相对基板10的正投影。In this embodiment, the orthographic projection of the first heat sink 30 with respect to the substrate 10 covers the orthographic projection of the chip 20 with respect to the substrate 10.
具体的，第一散热器30安装在芯片20远离基板10的一侧，为将芯片20产生的热量快速传递至第一散热器30，第一散热器30相对基板10正投影能够将芯片20相对于基板10的正投影覆盖，即第一散热器30的散热面积大于芯片20的表面积，可增大第一散热器30和芯片20之间的热量传递效率。相比第一散热器30的散热面积小于芯片20的面积，芯片20产生的热量可快速传递至第一散热器30上。Specifically, the first heat sink 30 is mounted on the side of the chip 20 away from the substrate 10. In order to quickly transfer the heat generated by the chip 20 to the first heat sink 30, the first heat sink 30 is orthographically projected from the substrate 10 to face the chip 20 The front projection coverage of the substrate 10, that is, the heat dissipation area of the first heat sink 30 is larger than the surface area of the chip 20, can increase the heat transfer efficiency between the first heat sink 30 and the chip 20. Compared with the area of the heat sink of the first heat sink 30 being smaller than the area of the chip 20, the heat generated by the chip 20 can be quickly transferred to the first heat sink 30.
进一步的，第一散热器30相对于基板10的正投影的中心与芯片20相对基板10的正投影的中心重合。Further, the center of the orthographic projection of the first heat sink 30 with respect to the substrate 10 coincides with the center of the orthographic projection of the chip 20 with respect to the substrate 10.
具体的，芯片20与第一散热器30对中设置，芯片20相对基板10的正投影的中心与第一散热器30正投影的中心重合，芯片20产生的热量向其周围的空间扩散，扩散至芯片20周围空间的热量可均匀扩散至第一散热器30上，并经由第一散热器30随冷风排出，加快第一散热器30和芯片20之间的热量传输。Specifically, the chip 20 is aligned with the first heat sink 30, and the center of the orthographic projection of the chip 20 relative to the substrate 10 coincides with the center of the orthographic projection of the first heat sink 30, and the heat generated by the chip 20 is diffused and diffused into the surrounding space. The heat to the space around the chip 20 can be evenly diffused to the first heat sink 30 and discharged with the cold wind through the first heat sink 30 to accelerate the heat transfer between the first heat sink 30 and the chip 20.
在上述实施例的基础上，沿基板10的进风端至出风端的方向排列的各第一散热器30中，任意的两个第一散热器30的间隔相等。On the basis of the above embodiment, among the first heat sinks 30 arranged in the direction from the air inlet end to the air outlet end of the substrate 10, the interval between any two first heat sinks 30 is equal.
具体的，沿基板10的进风端至出风端的方向排列有多个第一散热器30，任意两个第一散热器30的间隔相等，即任意两个第一散热器30的左右间隔相等。 可以理解的是，本实施例中任意两个第一散热器的左右间隔可为2-5mm，优选为2mm。Specifically, a plurality of first radiators 30 are arranged in a direction from the air inlet end to the air outlet end of the substrate 10, and the interval between any two first radiators 30 is equal, that is, the left and right intervals between any two first radiators 30 are equal. . It can be understood that the left-right interval of any two first heat sinks in this embodiment may be 2-5 mm, and preferably 2 mm.
本实施例中任意两个第一散热30的间隔相等，保证了沿基板10的进风端至出风端的方向，第一散热器30的长度随着相邻芯片之间的间隔增大比例而增长，进一步减小基板10上不同位置的芯片20之间的温度差异。In this embodiment, the interval between any two first heat sinks 30 is the same, which ensures that the length of the first heat sink 30 is increased along with the interval between adjacent chips. The increase further reduces the temperature difference between the chips 20 at different positions on the substrate 10.
如图3所示，电路板还包括多个第二散热器，第二散热器与第一散热器30相对安装，且第一散热器30和第二散热器位于基板10的两侧。As shown in FIG. 3, the circuit board further includes a plurality of second heat sinks. The second heat sink is installed opposite the first heat sink 30, and the first heat sink 30 and the second heat sink are located on both sides of the substrate 10.
示例性的，基板10包括正面和背面，芯片20可设置在基板10的正面上，第一散热器30可粘接在芯片20上。在基板10的背面设置有多个第二散热器，第二散热器安装在芯片20对应的基板10背面处，且每个芯片20在基板的背面对应安装一个第二散热器，进而实现第二散热器和第一散热器30相对安装。基板10利用第一散热器30和第二散热器同时对芯片20进行降温，提高了对芯片20的降温效率。可以理解的是，第二散热器同样可采用粘接或者焊接的方式固定在基板10的背面。Exemplarily, the substrate 10 includes a front surface and a back surface. The chip 20 may be disposed on the front surface of the substrate 10, and the first heat sink 30 may be adhered to the chip 20. A plurality of second heat sinks are provided on the back surface of the substrate 10, and the second heat sinks are installed at the back surface of the substrate 10 corresponding to the chip 20, and each chip 20 has a second heat sink correspondingly installed on the back surface of the substrate, thereby realizing the second The radiator and the first radiator 30 are oppositely mounted. The substrate 10 uses the first heat sink 30 and the second heat sink to reduce the temperature of the chip 20 at the same time, thereby improving the cooling efficiency of the chip 20. It can be understood that the second heat sink can also be fixed on the back surface of the substrate 10 by bonding or welding.
可以理解的是，为将芯片20产生的热量快速扩散至基板10的背面，基板10设置有多个传热孔，多个传热孔可环绕芯片20均匀布置，芯片20产生的热量通过传热孔扩散至基板10的背面，扩散至基板10背面的热量传输至第二散热器上，冷风流经第二散热器并将第二散热器上的热量移送到基板10的出风端外。It can be understood that, in order to quickly diffuse the heat generated by the chip 20 to the back surface of the substrate 10, the substrate 10 is provided with a plurality of heat transfer holes, and the plurality of heat transfer holes can be evenly arranged around the chip 20, and the heat generated by the chip 20 is passed through the heat transfer The holes diffuse to the back surface of the substrate 10, and the heat diffused to the back surface of the substrate 10 is transmitted to the second heat sink. Cold air flows through the second heat sink and transfers the heat on the second heat sink to the air outlet end of the substrate 10.
本实施例中，对于第二散热器的形状和大小不加以限制，第二散热器相对于基板10的正投影可以大于芯片20相对于基板10的正投影，第二散热器相对于基板10的正投影也可以不大于芯片20相对于基板10的正投影，此处不再赘述。优选为，同一芯片20相对应的第一散热器30和第二散热器的形状和大小相同，进一步降低了基板10上芯片20的温度，并减小了基板10上芯片的温度差异，提升了超算服务器设备的计算性能。In this embodiment, the shape and size of the second heat sink are not limited. The orthographic projection of the second heat sink with respect to the substrate 10 may be greater than the orthographic projection of the chip 20 with respect to the substrate 10, and the The orthographic projection may not be greater than the orthographic projection of the chip 20 relative to the substrate 10, and is not repeated here. Preferably, the first heat sink 30 and the second heat sink corresponding to the same chip 20 have the same shape and size, which further reduces the temperature of the chip 20 on the substrate 10 and reduces the temperature difference between the chips on the substrate 10 and improves Supercomputing the computing performance of server devices.
如图4所示，第一散热器30的底部设置有第一安装凸台31，第二散热器的底部设置有第二安装凸台；通过第一安装凸台31将第一散热器30粘接在芯片20上，通过第二安装凸台将第二散热器焊接在基板10上。As shown in FIG. 4, a first mounting boss 31 is provided at the bottom of the first heat sink 30 and a second mounting boss is provided at the bottom of the second heat sink; the first heat sink 30 is adhered by the first mounting boss 31 It is connected to the chip 20, and the second heat sink is soldered to the substrate 10 through the second mounting boss.
具体的，第一散热器30和第二散热器的形状及大小相同，第一散热器30和第二散热器均包括散热底片及等间隔安装在散热底片上的散热翅片，散热底片具有一定弧度的弧形板，散热翅片可为矩形板，散热翅片垂直安装在散热底片上，且相邻散热翅片之间形成散热腔，散热腔沿冷风流动方向设置，冷风穿过散热腔将第一散热器30及第二散热器的热量带走；散热底片采用弧形板制作，可增大散热底片与基板之间的空间。Specifically, the shape and size of the first heat sink 30 and the second heat sink are the same. Both the first heat sink 30 and the second heat sink include a heat sink film and heat sink fins mounted on the heat sink film at equal intervals. An arc-shaped plate. The radiating fins can be rectangular plates. The radiating fins are vertically mounted on the radiating fins, and a radiating cavity is formed between adjacent radiating fins. The radiating cavity is arranged along the direction of the cold air flow. The heat of the first heat sink 30 and the second heat sink is taken away; the heat sink film is made of an arc plate, which can increase the space between the heat sink film and the substrate.
第一散热器30的散热底片设置有第一安装凸台31，第一安装凸台31形状与芯片20的形状相同，第一安装凸台31的材料可与第一散热器30的材料相同，通常为热传导性比较好的金属材料，如铝材。第一安装凸台31可设计成矩形块，第一安装凸台31的一侧沿弧形板的中心线布置；第一安装凸台31另一侧粘接在芯片20远离基板10的侧面上，粘接后的第一安装凸台31与芯片20重合。第一散热器30通过第一安装凸台31与芯片20连接，可增大第一散热器30和芯片20之间的传热效率，同时也增强第一散热器30与芯片20之间的连接强度，将第一散热器30稳固连接在芯片20上。The heat sink film of the first heat sink 30 is provided with a first mounting boss 31. The shape of the first mounting boss 31 is the same as that of the chip 20. The material of the first mounting boss 31 may be the same as that of the first heat sink 30. Usually it is a metal material with good thermal conductivity, such as aluminum. The first mounting boss 31 may be designed as a rectangular block. One side of the first mounting boss 31 is arranged along the center line of the arc-shaped plate. The other side of the first mounting boss 31 is bonded to the side of the chip 20 away from the substrate 10. The first mounting boss 31 after bonding is overlapped with the chip 20. The first heat sink 30 is connected to the chip 20 through the first mounting boss 31, which can increase the heat transfer efficiency between the first heat sink 30 and the chip 20, and also enhance the connection between the first heat sink 30 and the chip 20. Strength, the first heat sink 30 is firmly connected to the chip 20.
本实施例对于第一安装凸台31和芯片20的粘接方式不加以限制，可优选在第一安装凸台31和芯片20之间采用导热胶固定，导热胶不仅起到固定作用，此外导热胶作为界面材料具有较小的接触热阻，有利于第一安装凸台31和芯片20之间的热传递。In this embodiment, there is no limitation on the bonding manner between the first mounting boss 31 and the chip 20, and it is preferable to use a thermally conductive adhesive for fixing between the first mounting boss 31 and the chip 20. As an interface material, the glue has a smaller contact thermal resistance, which is beneficial to the heat transfer between the first mounting boss 31 and the chip 20.
第二散热器的底部设置有第二安装凸台，同样的，第二安装凸台设计成矩形块，第二安装凸台一侧沿弧形板的中心线布置；第二安装凸台可通过粘接或者焊接的方式固定在基板10上。A second mounting boss is provided at the bottom of the second radiator. Similarly, the second mounting boss is designed as a rectangular block, and one side of the second mounting boss is arranged along the center line of the arc plate; the second mounting boss can pass through It is fixed on the substrate 10 by bonding or welding.
本实施例中，优选的将第二安装凸台以焊锡的方式固定在基板10上，可在基板10背面对应芯片20的位置设置有露铜，露铜的尺寸与第二安装凸台的安装面的尺寸相同，将第二安装凸台焊接在露铜位置。In this embodiment, the second mounting boss is preferably fixed to the substrate 10 by soldering. Exposed copper may be provided at the position corresponding to the chip 20 on the back of the substrate 10, and the size of the exposed copper is similar to the installation of the second mounting boss. The surface has the same size, and the second mounting boss is welded to the exposed copper position.
另外，第一散热器30设置的第一安装凸台31和第二散热器设置的第二安装凸台，可有效增加基板10与散热器之间空间，可满足基板10上其他元件安装需求，扩展了基板10的功能。In addition, the first mounting boss 31 provided by the first heat sink 30 and the second mounting boss provided by the second heat sink can effectively increase the space between the substrate 10 and the heat sink, and can meet the mounting requirements of other components on the substrate 10, The function of the substrate 10 is expanded.
本公开实施例还提供了一种计算设备，包括至少一个电路板，电路板上设 置有多个芯片20和第一散热器30和第二散热器；在基板10上非均匀布置有芯片20，即沿基板10的进风端至出风端的方向，芯片20在基板10上的分布数量逐渐减少；且沿基板10的进风端至出风端的方向排列的各第一散热器30和第二散热器的长度逐渐增大；因此本公开实施例提供的计算设备减小了位于风道下游的芯片受到位于上游芯片的热量影响，在对电路板进行降温的同时，也减小了电路板进风端和出风端的芯片之间的温度差异，提升计算设备的计算性能。An embodiment of the present disclosure further provides a computing device including at least one circuit board, where a plurality of chips 20 and a first heat sink 30 and a second heat sink are provided; the chips 20 are non-uniformly arranged on the substrate 10, That is, along the direction from the air inlet end to the air outlet end of the substrate 10, the number of chips 20 on the substrate 10 gradually decreases; and each of the first heat sinks 30 and the second array arranged along the direction from the air inlet end to the air outlet end of the substrate 10 The length of the heat sink is gradually increased; therefore, the computing device provided by the embodiment of the present disclosure reduces the influence of the chip located downstream of the air duct on the heat of the upstream chip, and reduces the temperature of the circuit board, and also reduces the circuit board inlet. The temperature difference between the chip on the wind side and the chip on the wind side improves the computing performance of the computing device.
本公开实施例还提供了一种散热机箱，其包括：壳体、送风扇和至少一个电路板；壳体设置有进风口和出风口，送风扇安装在进风口处，壳体内设置有至少一组安装槽，电路板插接在安装槽内，且电路板的进风端朝向进风口，电路板的出风端朝向出风口。An embodiment of the present disclosure further provides a heat dissipation chassis, which includes a housing, a fan, and at least one circuit board; the housing is provided with an air inlet and an air outlet, the fan is installed at the air inlet, and at least one In the mounting slot, the circuit board is inserted into the mounting slot, and the air inlet end of the circuit board faces the air inlet, and the air outlet end of the circuit board faces the air outlet.
具体的，散热机箱包括壳体，壳体可以为采用四个矩形面板围成的矩形结构，壳体的两端设置有进风口及出风口，在壳体的进风口处安装有送风扇，送风扇将散热机箱外部的冷风引入壳体内，冷风沿进风口至出风口的方向流动，形成风道。壳体内设置有至少一组安装槽，且至少一组如图1至图5所示的电路板插接在安装槽内，实现了电路板可拆卸安装在散热机箱内；其中电路板的进风端朝向进风口，电路板的出风端朝向出风口，使电路板处于冷风流动的方向上，电路板上的热量经过冷风排至散热机箱外。本实施例对电路板与散热机箱之间的连接方式不加以限制；例如，可在风道内设置有燕尾槽，电路板设置有与燕尾槽相配合的安装边，电路板通过安装边从燕尾槽的一端滑入安装在燕尾槽内，可实现将电路板快速安装在壳体内。Specifically, the heat dissipating case includes a case. The case may be a rectangular structure surrounded by four rectangular panels. Both ends of the case are provided with an air inlet and an air outlet. A fan is installed at the air inlet of the casing. The fan introduces the cold air from the outside of the cooling case into the casing, and the cold air flows in the direction from the air inlet to the air outlet to form an air duct. The housing is provided with at least one set of mounting slots, and at least one set of circuit boards as shown in Figs. 1 to 5 is inserted into the mounting slots, so that the circuit board can be detachably installed in the cooling case; The end faces the air inlet, and the air outlet end of the circuit board faces the air outlet, so that the circuit board is in the direction of the cold air flow, and the heat on the circuit board is discharged to the outside of the heat dissipation case through the cold air. This embodiment does not limit the connection between the circuit board and the cooling case; for example, a dovetail slot may be provided in the air duct, the circuit board is provided with a mounting edge that cooperates with the dovetail slot, and the circuit board is removed from the dovetail slot by the mounting edge. One end is slid into the dovetail slot for quick installation of the circuit board in the housing.
本公开实施例中，散热机箱的出风口设置有排风扇，排风扇用于将散热机箱内的热风引出散热机箱。本实施例中，在壳体的进风口和出风口分别设置有送风扇和排风扇，可加快散热机箱内冷风的流动速度并及时将电路板上的热量带走，提升散热机箱内电路板的散热效果。In the embodiment of the present disclosure, an exhaust fan is provided at an air outlet of the heat dissipation case, and the exhaust fan is used to guide the hot air in the heat dissipation case out of the heat dissipation case. In this embodiment, a fan and an exhaust fan are respectively provided at the air inlet and the air outlet of the casing, which can accelerate the flow speed of the cold air in the heat dissipation case and take away the heat on the circuit board in time to improve the heat dissipation of the circuit board in the heat dissipation case. effect.
在上述实施例的基础上，散热机箱还包括温度传感器及控制板，控制板分别与温度传感器、排风扇及送风扇进行信号连接，温度传感器安装在位于电路板的出风端的芯片20上；控制板根据温度传感器采集的芯片温度控制排风扇及送风扇的转速。Based on the above embodiment, the heat dissipation case further includes a temperature sensor and a control board, and the control board is connected to the temperature sensor, the exhaust fan, and the fan, respectively, and the temperature sensor is installed on the chip 20 at the air outlet end of the circuit board; The speed of the exhaust fan and the fan is controlled according to the chip temperature collected by the temperature sensor.
具体的，在散热机箱的一面板的表面安装有控制板，在路板靠近机箱出风 口位置处的芯片20上安装有温度传感器。控制板的输入端与温度传感器信号连接，控制板的输出端分别与排风扇及送风扇信号连接。温度传感器采集靠近机箱出风口位置的芯片20温度，并将此温度数据传输给控制板，控制板根据温度传感器采集的温度数据控制排风扇和送风扇的转速，以使靠近机箱出风口位置的芯片20温度恒定，有利于降低超算服务器设备的功耗及噪音。Specifically, a control board is installed on a surface of a panel of the heat dissipation chassis, and a temperature sensor is installed on the chip 20 at a position of the road board near the air outlet of the chassis. The input end of the control board is connected to the temperature sensor signal, and the output end of the control board is connected to the exhaust fan and the fan signal respectively. The temperature sensor collects the temperature of the chip 20 near the air outlet of the chassis, and transmits the temperature data to the control board. The control board controls the rotation speed of the exhaust fan and the fan according to the temperature data collected by the temperature sensor, so that the chip 20 near the air outlet of the chassis Constant temperature helps reduce the power consumption and noise of supercomputing server equipment.
本公开实施例提供的散热机箱，在风道内安装有多个电路板，电路板上设置有多个芯片20和第一散热器30和第二散热器；在基板10上非均匀布置有芯片20，即沿基板10的进风端至出风端的方向，芯片20在基板10上的分布数量逐渐减少。基板10的两侧非均匀布置有第一散热器30和第二散热器，通过改变不同位置的第一散热器30和第二散热器的长度，即沿基板10的进风端至出风端的方向排列的各第一散热器30和第二散热器的长度逐渐增大；因此本公开实施例提供的散热机箱，在不改变散热机箱内部布置空间的前提下，在基板10上设置有不同长度的第一散热器30，改变了散热器的热阻，芯片选用的散热器热阻与该位置的局部环境温度成反比例关系，减小了位于风道下游的芯片受到位于上游芯片的热量影响，在对电路板进行降温的同时，也减小了电路板进风端和出风端的芯片之间的温度差异，提升超算服务器设备的计算性能。In the heat dissipation case provided in the embodiment of the present disclosure, a plurality of circuit boards are installed in the air duct, and the circuit board is provided with a plurality of chips 20 and a first heat sink 30 and a second heat sink; the chips 20 are unevenly arranged on the substrate 10 That is, along the direction from the air inlet end to the air outlet end of the substrate 10, the number of chips 20 distributed on the substrate 10 gradually decreases. The first radiator 30 and the second radiator are non-uniformly arranged on both sides of the substrate 10. By changing the lengths of the first radiator 30 and the second radiator at different positions, that is, from the air inlet end to the air outlet end of the substrate 10 The lengths of the first heat sink 30 and the second heat sink arranged in the direction are gradually increased; therefore, the heat dissipation case provided by the embodiment of the present disclosure is provided with different lengths on the substrate 10 without changing the internal layout space of the heat dissipation case. The first heat sink 30 changes the heat resistance of the heat sink. The heat resistance of the heat sink selected by the chip is inversely proportional to the local ambient temperature at the location, which reduces the influence of the chip located downstream of the air duct on the heat of the upstream chip. While reducing the temperature of the circuit board, the temperature difference between the chip at the air inlet and the air outlet of the circuit board is also reduced, and the computing performance of the supercomputing server device is improved.
请参阅附图5和附图6，通过附图5和附图6对比表明：本公开的实施例提供的电路板及散热机箱，使位于电路板出风端的芯片20最低温度由88.6降低到84.4，降低了4.2℃，降低了电路板的温度，提高了芯片20使用寿命和性能，同时位于电路板出风端的芯片20和位于电路板进风端的芯片20之间的温差由之前的19℃降低到5.6℃；可继续对芯片进行优化，使位于电路板出风端的芯片20和位于电路板进风端的芯片20之间的温差控制在3℃以内，在理想状态下，可使位于电路板出风端的芯片20和位于电路板进风端的芯片20的温度趋于一致；并且在本公开实施例中，由于降低了高温芯片的温度，散热风扇的转速可以适当降低以减小整机功耗。Please refer to FIG. 5 and FIG. 6. The comparison between FIG. 5 and FIG. 6 shows that the circuit board and the heat dissipation case provided by the embodiment of the present disclosure reduce the minimum temperature of the chip 20 at the air outlet end of the circuit board from 88.6 to 84.4. The temperature is reduced by 4.2 ℃, the temperature of the circuit board is reduced, and the service life and performance of the chip 20 are improved. At the same time, the temperature difference between the chip 20 located at the air outlet of the circuit board and the chip 20 located at the air inlet of the circuit board is reduced from the previous 19 ℃ To 5.6 ℃; continue to optimize the chip so that the temperature difference between the chip 20 on the circuit board's air-out side and the chip 20 on the circuit's air-in side is controlled within 3 ° C. In an ideal state, the chip The temperature of the chip 20 at the wind end and the chip 20 at the air intake end of the circuit board tend to be the same; and in the embodiment of the present disclosure, since the temperature of the high-temperature chip is reduced, the rotation speed of the cooling fan can be appropriately reduced to reduce the overall power consumption.
上述技术描述可参照附图，这些附图形成了本申请的一部分，并且通过描述在附图中示出了依照所描述的实施例的实施方式。虽然这些实施例描述的足够详细以使本领域技术人员能够实现这些实施例，但这些实施例是非限制性的；这样就可以使用其它的实施例，并且在不脱离所描述的实施例的范围的情况下 还可以做出变化。比如，流程图中所描述的操作顺序是非限制性的，因此在流程图中阐释并且根据流程图描述的两个或两个以上操作的顺序可以根据若干实施例进行改变。作为另一个例子，在若干实施例中，在流程图中阐释并且根据流程图描述的一个或一个以上操作是可选的，或是可删除的。另外，某些步骤或功能可以添加到所公开的实施例中，或两个以上的步骤顺序被置换。所有这些变化被认为包含在所公开的实施例以及权利要求中。The above technical description can be referred to the accompanying drawings, which form a part of the present application, and show in the drawings an implementation according to the described embodiments. Although the embodiments are described in sufficient detail to enable those skilled in the art to implement the embodiments, the embodiments are non-limiting; thus, other embodiments can be used without departing from the scope of the described embodiments. Situations can also make changes. For example, the sequence of operations described in the flowchart is non-limiting, so the sequence of two or more operations explained in the flowchart and described according to the flowchart can be changed according to several embodiments. As another example, in several embodiments, one or more operations explained in the flowchart and described in accordance with the flowchart are optional or deleteable. In addition, certain steps or functions may be added to the disclosed embodiments, or two or more steps may be sequentially replaced. All of these variations are considered to be included in the disclosed embodiments and the claims.
另外，上述技术描述中使用术语以提供所描述的实施例的透彻理解。然而，并不需要过于详细的细节以实现所描述的实施例。因此，实施例的上述描述是为了阐释和描述而呈现的。上述描述中所呈现的实施例以及根据这些实施例所公开的例子是单独提供的，以添加上下文并有助于理解所描述的实施例。上述说明书不用于做到无遗漏或将所描述的实施例限制到本公开的精确形式。根据上述教导，若干修改、选择适用以及变化是可行的。在某些情况下，没有详细描述为人所熟知的处理步骤以避免不必要地影响所描述的实施例。In addition, terminology is used in the foregoing technical description to provide a thorough understanding of the described embodiments. However, too detailed details are not required to implement the described embodiments. Therefore, the foregoing description of the embodiments has been presented for the purposes of illustration and description. The embodiments presented in the above description and the examples disclosed based on these embodiments are provided separately to add context and help to understand the described embodiments. The above description is not intended to be exhaustive or to limit the described embodiments to the precise form of the disclosure. Based on the above teachings, several modifications, alternatives, and variations are possible. In some cases, well-known process steps have not been described in detail to avoid unnecessarily affecting the described embodiments.
工业实用性Industrial applicability
本申请所公开的电路板、计算设备及散热机箱，在布局空间不变的前提下，通过设计散热器的不同的散热面积，对散热器的热阻进行了改变，芯片选用的散热器热阻与该位置的局部环境温度成反比；通过温度、热阻匹配达到整板均温的效果，提高了芯片使用寿命和性能，从而提升超算服务器设备的计算性能。另外，本公开的这种芯片和散热器布局方式，可以减小位于风道下游的芯片受到的位于上游的芯片的热量影响，在对电路板进行降温的同时，也减小了位于电路板进风端和出风端芯片之间的温度差异；并且，由于降低了高温芯片的温度，风扇转速可以适当降低以减小整机功耗。Under the premise that the layout space of the circuit board, computing device and heat dissipation case disclosed in this application is unchanged, the heat resistance of the heat sink is changed by designing different heat dissipation areas of the heat sink, and the heat resistance of the heat sink selected by the chip It is inversely proportional to the local ambient temperature at this location; the temperature and thermal resistance matching achieves the effect of uniform temperature of the entire board, which improves the service life and performance of the chip, thereby improving the computing performance of the supercomputing server device. In addition, the chip and heat sink layout method of the present disclosure can reduce the influence of the chips located downstream of the air duct on the heat of the chips located upstream and reduce the temperature of the circuit board while reducing the temperature of the circuit board. The temperature difference between the air-end and air-end chips; and, because the temperature of the high-temperature chip is reduced, the fan speed can be appropriately reduced to reduce the overall power consumption.

Claims (13)

  1. 一种电路板，其特征在于，包括基板、多个芯片及多个第一散热器；A circuit board characterized by comprising a substrate, a plurality of chips and a plurality of first heat sinks;
    所述多个芯片设置在所述基板的同一面上，且沿所述基板的进风端至出风端的方向，所述多个芯片在所述基板上的排布密度逐渐降低；The plurality of chips are arranged on the same surface of the substrate, and the arrangement density of the plurality of chips on the substrate gradually decreases along the direction from the air inlet end to the air outlet end of the substrate;
    所述多个第一散热器与所述多个芯片一一对应连接，且所述第一散热器与所述芯片位于所述基板的同侧；The plurality of first heat sinks are in one-to-one correspondence with the plurality of chips, and the first heat sink and the chip are located on the same side of the substrate;
    沿所述基板的进风端至出风端的方向排列的各所述第一散热器在所述基板上的正投影面积逐渐增大。The orthographic projection area of each of the first heat sinks arranged along the direction from the air inlet end to the air outlet end of the substrate gradually increases on the substrate.
  2. 根据权利要求1所述的电路板，其特征在于，所述多个芯片在所述基板上呈阵列排布。The circuit board according to claim 1, wherein the plurality of chips are arranged in an array on the substrate.
  3. 根据权利要求2所述的电路板，其特征在于，所述多个芯片分为多列芯片组，且沿所述基板的进风端至出口端的方向，相邻两列芯片组之间的列间距逐渐增大。The circuit board according to claim 2, wherein the plurality of chips are divided into a plurality of rows of chip sets, and in a direction from the air inlet end to the outlet end of the substrate, a row between two adjacent rows of chip sets The pitch gradually increases.
  4. 根据权利要求1所述的电路板，其特征在于，所述第一散热器相对所述基板的正投影覆盖所述芯片相对所述基板的正投影。The circuit board according to claim 1, wherein the orthographic projection of the first heat sink with respect to the substrate covers the orthographic projection of the chip with respect to the substrate.
  5. 根据权利要求4所述的电路板，其特征在于，所述第一散热器相对于所述基板的正投影的中心与所述芯片相对所述基板的正投影的中心重合。The circuit board according to claim 4, wherein the center of the orthographic projection of the first heat sink with respect to the substrate coincides with the center of the orthographic projection of the chip with respect to the substrate.
  6. 根据权利要求5所述的电路板，其特征在于，沿所述基板的进风端至出风端的方向排列的各所述第一散热器中，任意的两个所述第一散热器的间隔相等。The circuit board according to claim 5, wherein an interval between any two of the first heat sinks in each of the first heat sinks arranged in a direction from an air inlet end to an air outlet end of the substrate equal.
  7. 根据权利要求1所述的电路板，其特征在于，所述电路板还包括多个第二散热器；The circuit board according to claim 1, wherein the circuit board further comprises a plurality of second heat sinks;
    所述第二散热器与所述第一散热器相对安装，且所述第一散热器和第二散热器位于所述基板的两侧。The second heat sink is installed opposite to the first heat sink, and the first heat sink and the second heat sink are located on both sides of the substrate.
  8. 根据权利要求7所述的电路板，其特征在于，同一所述芯片相对应的第一散热器和第二散热器的形状和大小相同。The circuit board according to claim 7, wherein the shape and size of the first heat sink and the second heat sink corresponding to the same chip are the same.
  9. 根据权利要求8所述的电路板，其特征在于，所述第一散热器的底部设置有第一安装凸台，所述第二散热器的底部设置有第二安装凸台；The circuit board according to claim 8, wherein a bottom of the first heat sink is provided with a first mounting boss, and a bottom of the second heat sink is provided with a second mounting boss;
    通过所述第一安装凸台将所述第一散热器粘接在所述芯片上，通过所述第二安装凸台将所述第二散热器焊接在所述基板上。The first heat sink is bonded to the chip through the first mounting boss, and the second heat sink is soldered to the substrate through the second mounting boss.
  10. 一种计算设备，其特征在于，包括至少一个如权利要求1-9任一项所述的电路板。A computing device, comprising at least one circuit board according to any one of claims 1-9.
  11. 一种散热机箱，其特征在于，包括壳体、送风扇和至少一个如权利要求1至9任一项所述电路板；A cooling case, comprising a housing, a fan, and at least one circuit board according to any one of claims 1 to 9;
    所述壳体设置有进风口和出风口，所述送风扇安装在所述进风口处，所述壳体内设置有至少一组安装槽，所述电路板插接在所述安装槽内，且所述电路板的进风端朝向所述进风口，所述电路板的出风端朝向所述出风口。The casing is provided with an air inlet and an air outlet, the fan is installed at the air inlet, and at least one set of mounting grooves is provided in the casing, and the circuit board is inserted in the mounting groove, and The air inlet end of the circuit board faces the air inlet, and the air outlet end of the circuit board faces the air outlet.
  12. 根据权利要求11所述的散热机箱，其特征在于，所述出风口设置有排风扇。The cooling case according to claim 11, wherein the air outlet is provided with an exhaust fan.
  13. 根据权利要求12所述的散热机箱，其特征在于，所述散热机箱还包括温度传感器及控制板；The cooling case according to claim 12, wherein the cooling case further comprises a temperature sensor and a control board;
    所述控制板分别与所述温度传感器、所述排风扇及所述送风扇进行信号连接；The control board is signal-connected to the temperature sensor, the exhaust fan, and the fan;
    所述温度传感器安装在位于电路板的出风端的芯片上；The temperature sensor is mounted on a chip located at the air outlet end of the circuit board;
    所述控制板根据所述温度传感器采集的芯片温度控制所述排风扇及所述送风扇的转速。The control board controls the rotation speed of the exhaust fan and the fan according to the chip temperature collected by the temperature sensor.
PCT/CN2018/109118 2018-09-30 2018-09-30 Circuit board, computing device and cooling case WO2020062253A1 (en)

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