CN103906413A - Heat radiation module - Google Patents
Heat radiation module Download PDFInfo
- Publication number
- CN103906413A CN103906413A CN201310072576.4A CN201310072576A CN103906413A CN 103906413 A CN103906413 A CN 103906413A CN 201310072576 A CN201310072576 A CN 201310072576A CN 103906413 A CN103906413 A CN 103906413A
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- Prior art keywords
- heat
- radiating
- heat conduction
- fin
- fins
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Links
- 230000005855 radiation Effects 0.000 title abstract description 9
- 230000007423 decrease Effects 0.000 claims description 5
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 239000011469 building brick Substances 0.000 description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001149 thermolysis Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a heat radiation module, which comprises a heat conduction base, at least one fin group and a plurality of heat pipes, wherein the fin group comprises a plurality of heat radiation fins, each heat radiation fin is provided with a plurality of heat radiation sections and a plurality of heat conduction sections which are connected among the plurality of heat radiation sections at intervals, and the thickness of each heat conduction section is larger than that of each heat radiation section. One end of each heat pipe is connected with the heat conduction base, and the other end of each heat pipe is correspondingly connected with the heat conduction sections of the heat dissipation fins in series, so that the heat conduction sections of the adjacent heat dissipation fins are in contact with each other, and heat is uniformly transferred to each heat dissipation section.
Description
[technical field]
The present invention relates to a kind of radiating module, particularly relate to a kind of radiating module for electronic building brick.
[background technology]
Along with the fast development of electronic industry, central processing unit (the central processing unit that electronic installation inside is used, CPU), the power of the electronic building brick such as north bridge chips, display card significantly promotes, electronic building brick is also more and more high in the closeness of unit are, the heat that relatively causes electronic building brick to produce in the time of running significantly increases, and often causes the temperature of the internal system of electronic building brick itself and configuration thereof to raise.Meanwhile, along with the rapid accumulation of heat, cause the operation performance of electronic building brick to decline, and easily cause computer system crash, or even the overheated generation of the situation such as burning of electronic building brick.
Operate for guaranteeing that electronic building brick can maintain in its normal temperature range, the radiator with radiating fin can be installed conventionally on electronic building brick, and for the heat dissipation of heat radiation device, separately there is on the market at present the modularized radiating device that installs heat pipe on radiator additional, it is to be mainly connected in radiator with one end of heat pipe, other end serial connection radiating fin, and press close to or be directly connected in the surface of electronic building brick by heat pipe and radiator, to pass through the hot superconduction effect of heat pipe, the heat that electronic building brick is produced conducts to base and the radiating fin of radiator rapidly, thereby the heat dissipation of heat radiation device.
In this radiating mode, be mainly that interval arranges multiple radiating fins on heat pipe, and between multiple radiating fins only the bending structure by itself interconnect, or even between multiple radiating fins without any annexation.Therefore, the heat of the overwhelming majority must be passed to each radiating fin by heat pipe.But, along with heat pipe is far away with respect to the distance of thermal source, the transmission capacity of its heat can significantly be decayed, so, often cause heat cannot effectively be passed to radiating fin far away, the heat dissipation that therefore makes radiating fin provide is had a greatly reduced quality, and cannot be used effectively, and then reduce the heat conduction efficiency between radiating fin and heat pipe, and have a strong impact on the integral heat sink usefulness of heat abstractor.
[summary of the invention]
In view of above problem, in view of above problem, the invention reside in a kind of radiating module is provided, commonly use in the radiating module with heat pipe thereby solve, hot transfer efficiency can far and significantly be decayed along with the distance of heat pipe and thermal source, and then has a strong impact on the problem of its radiating efficiency.
Radiating module of the present invention comprises a heat conducting base, at least one fins group and many heat pipes.Fins group comprises mutual multiple radiating fins side by side, each radiating fin has multiple radiating segments and multiple heat conduction section, and multiple heat conduction spacer segments are connected between multiple radiating segments, wherein the thickness of each heat conduction section is greater than the thickness of each radiating segment, and the heat conduction section of adjacent radiating fin is in contact with one another.The quantity of heat pipe is corresponding to the quantity of the heat conduction section of each radiating fin, and one end of multiple heat pipes is connected in heat conducting base, multiple heat conduction sections of the multiple radiating fins of the corresponding serial connection of the other end.
The radiating module of the invention described above, wherein the thickness of relative two ends of each heat conduction section successively decreases towards the radiating segment being connected respectively.
The radiating module of the invention described above, wherein the quantity of multiple heat conduction sections of each radiating fin is less than the quantity of multiple radiating segments.
The radiating module of the invention described above, wherein heat conducting base has multiple grooves, and one end correspondence of multiple heat pipes is placed in multiple grooves.
The radiating module of the invention described above, comprise two fins group, and each heat pipe there is a relative first end and one second end and be connected in first end and the second end between the section of engaging, engaging section is connected in heat conducting base, first end and the second end are connected in series respectively multiple radiating fins of two fins group.
The radiating module of the invention described above, wherein heat conducting base comprises a heat-conducting plate and a radiator, and multiple heat pipe clippings are fixed between heat-conducting plate and radiator, and radiator comprises multiple fin, and multiple fin are spaced on heat-conducting plate.
The radiating module of the invention described above, wherein the heat conduction section of adjacent radiating fin is bonded to each other.
Effect of the present invention is, multiple radiating fins of fins group are to mutually combine by heat conduction section each other, and be greater than the characteristic of the thickness of radiating segment by the thickness of heat conduction section, the heat conduction section of multiple radiating fins is formed in fins group there is the heat long-pending compared with big carrying surface to pass path, it can provide heat that heat pipe absorbs from be passed to rapidly one end of stow away from heat near one end of thermal source, namely allow heat can be passed to fast the radiating segment of each radiating fin, and carry out heat exchange by radiating segment and outside air, therefore significantly heat radiation effect, solved the known existing problem of radiating module with heat pipe simultaneously.
[accompanying drawing explanation]
Below in conjunction with drawings and embodiments, the present invention is further detailed explanation.
Fig. 1 is the combination schematic diagram of the radiating module of the first embodiment of the present invention.
Fig. 2 is the schematic top plan view of the radiating module of the first embodiment of the present invention.
Fig. 3 is the decomposing schematic representation of the radiating module of the second embodiment of the present invention.
Fig. 4 is the combination schematic diagram of the radiating module of the second embodiment of the present invention.
Primary clustering symbol description:
100 radiating module 132 second ends
110 heat conducting base 200 radiating modules
111 groove 210 heat conducting bases
120 fins group 211 grooves
121 radiating fin 212 radiators
1211 radiating segment 213 heat-conducting plates
1212 heat conduction section 214 fin
130 heat pipe 220 fins group
131 first end 221 radiating fins
2211 radiating segment 231 first ends
2212 heat conduction section 232 second ends
2213 perforation 233 engaging sections
230 heat pipes
[embodiment]
Please refer to shown in Fig. 1,
As depicted in figs. 1 and 2, the disclosed radiating module 100 of first embodiment of the invention comprises a heat conducting base 110, a fins group 120 and many heat pipes 130.Heat conducting base 110 is can produce on the electronic building brick of amount of heat while being incorporated into the running such as central processing unit (central processing unit, CPU) or graphic process unit (graphic processing unit, GPU).Heat conducting base 110 has a relative end face and a bottom surface, and is provided with two grooves 111 in the bottom surface of heat conducting base 110, and one end of many heat pipes 130 is that correspondence is sticked in groove 111, and is connected in fins group 120 with the other end.
Fins group 120 comprises multiple radiating fins 121, each radiating fin 121 comprises multiple radiating segments 1211 and interval is connected in the multiple heat conduction sections 1212 between multiple radiating segments 1212, in the present embodiment, to comprise three radiating segments 1211 and two heat conduction sections 1212 as an example with radiating fin 121, but its quantity is not as limit, the surface area of wherein heat conduction section 1212 is less than the surface area of radiating segment 1211, but its thickness is greater than the thickness of radiating segment 1211, in addition, the thickness of relative two ends of heat conduction section 1212 can be but be not limited to towards the direction of the radiating segment 1211 being connected and successively decrease.Therefore, in the time that multiple radiating fins 121 mutually combine in mode side by side, between adjacent radiating fin 121, can heat conduction section 1212 be in contact with one another, and the spacing that makes to be separated by between radiating segment 1211.
Based on said structure, in the time that multiple radiating fins 121 are serially connected with heat pipe 130, can on heat pipe 130, form by fitting tightly of heat conduction section 1212 the heat-conducting block structure with larger sectional area, the heat that heat pipe 130 is absorbed from electronic building brick, can be passed to fast each heat conduction section 1212, and between each radiating fin 121, transmit fast by heat conduction section 1212, and then carry out heat exchange by the radiating segment 1211 with larger area of dissipation with outside air, so, can significantly promote the heat dissipation of fins group 120.
As shown in Figure 3 and Figure 4, the disclosed radiating module 200 of second embodiment of the invention comprises a heat conducting base 210, two fins group 220 and many heat pipes 230.Heat conducting base 210 comprises a radiator 212 and a heat-conducting plate 213, radiator 212 comprises multiple mutual fin 214 side by side, and on the side of each fin 214, dispose multiple grooves 211, heat-conducting plate 213 is incorporated into a side that disposes groove 211 on radiator 212.
Fins group 220 comprises mutual multiple radiating fins 221 side by side, each radiating fin 221 comprises multiple heat conduction sections 2212 that multiple radiating segments 2211 and quantity are less than radiating segment 2211, and multiple heat conduction sections 2212 intervals are connected between multiple radiating segments 2211, wherein the thickness of each heat conduction section 2212 is greater than the thickness of each radiating segment 2211, make to be in contact with one another with heat conduction section 2212 between adjacent radiating fin 221, and the spacing that makes to be separated by between radiating segment 2211.In addition, in the heat conduction section 2212 of each radiating fin, be formed with a perforation 2213, wear wherein in order to heating tube 230.
The quantity of heat pipe 230 can be but be not limited to the quantity that is less than or equals the heat conduction section 2212 of each radiating fin 221.Each heat pipe 230 has a first end 231, one second end 232 and a section of engaging 233, and engaging section 233 is connected between first end 231 and the second end 232, wherein many heat pipes 230 embed in the groove 211 of heat conducting base 210 with engaging section 233 correspondences respectively, and are fixed on by clipping between the radiator 212 and heat-conducting plate 213 of heat conducting base 210.The first end 231 of heat pipe 230 is connected in two fins group 220 with the second end 232 respectively at relative two sides of heat conducting base 210, wherein the first end 231 of heat pipe 230 and the second end 232 pass respectively the perforation 2213 of the heat conduction section 2212 of radiating fin 221, make multiple radiating fins 221 of two fins group 220 be serially connected with respectively first end 231 and second end 232 of heat pipe 230 with friction tight relation, and be in contact with one another with heat conduction section 2212, and then make the heat conduction section 2212 between multiple radiating fins 221 on heat pipe 230, form the heat biography path with larger sectional area.
Therefore, in the application of radiating module 200, when heat conducting base 210 and heat pipe 230 absorb after the heat of electronic building brick generation, except being undertaken thermolysis by heat conducting base 210 fin 214 own, can also heat be passed to fins group 220 by heat pipe 230, the heat forming on heat pipe 230 via heat conduction section 2212 again passes path and rapidly heat is passed to the radiating segment 2211 of each radiating fin 221 and each radiating fin 221, and then carries out heat exchange by radiating segment 221 and outside air.
Based on above-mentioned, radiating module of the present invention can have by the heat conduction section composition of multiple radiating fins the heat biography path of larger sectional area, so the transfer rate of heat will be contributed to promote, the heat that heat pipe and heat conducting base are absorbed, can be passed to fast the one end away from heat conducting base from the one end near heat conducting base, so that carry out thermolysis by the radiating segment of each radiating fin, therefore can effectively solve in the radiating module generally with heat pipe the problem that hot transfer efficiency and radiating efficiency can far and significantly successively decrease along with the distance of heat pipe and thermal source.
Although embodiments of the present invention disclose as mentioned above; so not in order to limit the present invention; anyly have the knack of related art techniques person; without departing from the spirit and scope of the present invention; such as work as and can do a little change according to shape, structure, feature and quantity described in the present patent application scope, therefore scope of patent protection of the present invention must be as the criterion depending on the appended claim person of defining of this specification.
Claims (7)
1. a radiating module, is characterized in that, described radiating module comprises:
One heat conducting base;
At least one fins group, comprise mutual multiple radiating fins side by side, described in each, radiating fin has multiple radiating segments and multiple heat conduction section, described multiple heat conduction spacer segment is connected between described multiple radiating segment, wherein described in each, the thickness of heat conduction section is greater than the thickness of radiating segment described in each, and the described heat conduction section of adjacent described radiating fin is in contact with one another; And
Many heat pipes, the quantity of described many heat pipes is corresponding to the quantity of described multiple heat conduction sections of radiating fin described in each, and one end of described many heat pipes is connected in described heat conducting base, the corresponding described multiple heat conduction sections of the other end described multiple radiating fins of corresponding serial connection.
2. radiating module according to claim 1, is characterized in that, described in each, the thickness of relative two ends of heat conduction section successively decreases towards the described radiating segment being connected respectively.
3. radiating module according to claim 1, is characterized in that, described in each, the quantity of described multiple heat conduction sections of radiating fin is less than the quantity of described multiple radiating segments.
4. radiating module according to claim 1, is characterized in that, described heat conducting base has multiple grooves, and one end of described many heat pipes is placed in described groove.
5. radiating module according to claim 1, fins group described in comprising two, and described in each heat pipe there is a relative first end and one second end and be connected in described first end and described the second end between the section of engaging, described engaging section is connected in described heat conducting base, and described first end and described the second end are connected in series respectively described multiple radiating fins of fins group described in two.
6. radiating module according to claim 1, it is characterized in that, described heat conducting base comprises a heat-conducting plate and a radiator, described multiple heat pipe clipping is fixed between described heat-conducting plate and described radiator, and described radiator comprises multiple fin, described multiple fin are spaced on described heat-conducting plate.
7. radiating module according to claim 1, is characterized in that, the described heat conduction section of adjacent described radiating fin is bonded to each other.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101150659 | 2012-12-27 | ||
| TW101150659A TWI498519B (en) | 2012-12-27 | 2012-12-27 | Heat dissipating module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103906413A true CN103906413A (en) | 2014-07-02 |
| CN103906413B CN103906413B (en) | 2017-04-26 |
Family
ID=50997490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310072576.4A Active CN103906413B (en) | 2012-12-27 | 2013-03-07 | Heat radiation module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103906413B (en) |
| TW (1) | TWI498519B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104869794A (en) * | 2015-06-22 | 2015-08-26 | 东莞市澍华五金制品有限公司 | Integrated heat-pipe heat dissipating device |
| CN105284715A (en) * | 2014-07-04 | 2016-02-03 | 上海晶海实业有限公司 | Thermostat unit for small-sized aquarium by utilizing semiconductors |
| CN105627798A (en) * | 2014-12-01 | 2016-06-01 | 青岛海尔特种电冰柜有限公司 | Heat exchange device and semiconductor refrigeration equipment |
| CN105899051A (en) * | 2016-06-13 | 2016-08-24 | 海信（山东）空调有限公司 | Variable frequency air conditioner and electronic module radiator thereof |
| CN106304768A (en) * | 2015-06-02 | 2017-01-04 | 中兴通讯股份有限公司 | Subrack and plug-in card thereof |
| CN106839852A (en) * | 2017-01-22 | 2017-06-13 | 上海交通大学 | A kind of radiator with high performance and its fin method for arranging |
| CN111261476A (en) * | 2018-11-30 | 2020-06-09 | 曾东荣 | Heat sink for microwave magnetron |
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| CN202259253U (en) * | 2011-08-31 | 2012-05-30 | 双鸿科技股份有限公司 | Heat pipe type heat radiation device capable of increasing the heat conduction efficiency |
| CN102581583A (en) * | 2011-01-14 | 2012-07-18 | 浙江宏天铜业有限公司 | Copper heat tube with high-tooth fins and production technology of copper heat tube |
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2013
- 2013-03-07 CN CN201310072576.4A patent/CN103906413B/en active Active
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| JPH07176662A (en) * | 1993-12-21 | 1995-07-14 | Nippondenso Co Ltd | Boiling/cooling unit |
| JPH08278091A (en) * | 1995-04-04 | 1996-10-22 | Fujikura Ltd | Manufacture of heat pipe type cooling unit |
| CN2699363Y (en) * | 2004-05-13 | 2005-05-11 | 珍通科技股份有限公司 | Radiator |
| TWM278219U (en) * | 2005-05-31 | 2005-10-11 | Guo-Shing Chen | Heat pipe radiator and cooling fins thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105284715A (en) * | 2014-07-04 | 2016-02-03 | 上海晶海实业有限公司 | Thermostat unit for small-sized aquarium by utilizing semiconductors |
| CN105284715B (en) * | 2014-07-04 | 2018-10-30 | 上海晶海实业有限公司 | Small semiconductor aquarium constant temperature machine |
| CN105627798A (en) * | 2014-12-01 | 2016-06-01 | 青岛海尔特种电冰柜有限公司 | Heat exchange device and semiconductor refrigeration equipment |
| CN106304768A (en) * | 2015-06-02 | 2017-01-04 | 中兴通讯股份有限公司 | Subrack and plug-in card thereof |
| CN104869794A (en) * | 2015-06-22 | 2015-08-26 | 东莞市澍华五金制品有限公司 | Integrated heat-pipe heat dissipating device |
| CN105899051A (en) * | 2016-06-13 | 2016-08-24 | 海信（山东）空调有限公司 | Variable frequency air conditioner and electronic module radiator thereof |
| CN106839852A (en) * | 2017-01-22 | 2017-06-13 | 上海交通大学 | A kind of radiator with high performance and its fin method for arranging |
| CN111261476A (en) * | 2018-11-30 | 2020-06-09 | 曾东荣 | Heat sink for microwave magnetron |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103906413B (en) | 2017-04-26 |
| TW201425854A (en) | 2014-07-01 |
| TWI498519B (en) | 2015-09-01 |
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