WO2021027454A1 - Heat dissipation device, and base station - Google Patents

Heat dissipation device, and base station Download PDF

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Publication number
WO2021027454A1
WO2021027454A1 PCT/CN2020/101151 CN2020101151W WO2021027454A1 WO 2021027454 A1 WO2021027454 A1 WO 2021027454A1 CN 2020101151 W CN2020101151 W CN 2020101151W WO 2021027454 A1 WO2021027454 A1 WO 2021027454A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
heat
thermally conductive
conducting substrate
substrate
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PCT/CN2020/101151
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French (fr)
Chinese (zh)
Inventor
李姣枫
刘志勇
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大唐移动通信设备有限公司
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Publication of WO2021027454A1 publication Critical patent/WO2021027454A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
    • H04W88/08—Access point devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Definitions

  • the present disclosure relates to the field of heat dissipation technology, and in particular to a heat dissipation device and a base station.
  • the thermal design of communication base station products is directly related to the cost, reliability, volume and weight of the product. If the thermal design is not good, the volume and weight of the equipment will be increased to meet the environmental requirements required for equipment operation; otherwise, the environmental temperature will rise too high, and long-term operation under high temperature conditions will reduce the reliability and service life of electronic equipment , And even burn the device in severe cases. How to effectively dissipate heat in a limited space has become a key issue in the design of current communication products.
  • This design is applied to a natural convection heat dissipation module, and its general form is that a certain number of heat dissipation fins are connected to a first thermally conductive substrate, and the heat dissipation fins exchange heat with the air to achieve heat dissipation and cooling of the entire device.
  • Figure 1 shows the structure of a traditional heat dissipation module, in which 1 is a substrate and 2 is a heat dissipation tooth.
  • the traditional heat dissipating tooth structure mainly obtains better heat dissipation effect by changing the geometric parameters.
  • the height, length, thickness, and pitch of the heat dissipating tooth fins are optimized to a certain degree, the heat dissipation capacity of the heat dissipating tooth will not be affected due to the marginal effect. Significantly improved again.
  • the present disclosure provides a heat dissipation device and a base station to improve the heat dissipation effect.
  • a heat dissipation device in a first aspect, includes: a first thermally conductive substrate, and a second thermally conductive substrate spaced apart from the first thermally conductive substrate; wherein, the first thermally conductive substrate and the second thermally conductive substrate A plurality of first heat dissipation fins are arranged between the thermally conductive substrates, and each of the first heat dissipation fins is thermally connected to the first thermally conductive substrate and the second thermally conductive substrate; The gap between the first thermally conductive substrate and the second thermally conductive substrate is divided into a plurality of ventilation channels;
  • a plurality of second heat dissipation fins are provided on the side of the second heat conducting substrate facing away from the first heat conducting substrate.
  • the natural convection and heat exchange ability of the air in the ventilation channel increases the heat dissipation effect.
  • the length direction of the first heat dissipation fin and the length direction of the second heat dissipation fin form a set angle.
  • the length direction of the first heat dissipation fin is the same as the length direction of the first heat conducting substrate
  • the length direction of the second heat dissipation fin is inclined with respect to the length direction of the first heat conducting substrate. Improve the heat dissipation effect.
  • the vertical projection of the second thermally conductive substrate on the first thermally conductive substrate is located in the first thermally conductive substrate.
  • a plurality of third heat dissipation fins are provided on the part of the first heat-conducting substrate outside the vertical projection of the second heat-conducting substrate.
  • the third heat dissipation fin is parallel to the first heat dissipation fin.
  • first heat dissipation fin and the second heat dissipation fin are an integral structure
  • the second heat-conducting substrate includes a plurality of connecting plates connecting the adjacent first heat dissipation fins.
  • the first thermally conductive substrate and the second thermally conductive substrate are the same size.
  • first heat dissipation fin and the second heat dissipation fin are arranged alternately.
  • a plurality of hollow structures are provided on the second thermally conductive substrate, and each hollow structure is in communication with the ventilation channel. Increase the ventilation effect.
  • a base station in a second aspect, includes a device, and the heat dissipation device according to any one of the above items arranged on the device.
  • the heat dissipation device according to any one of the above items arranged on the device.
  • Figure 1 is a schematic diagram of the structure of a heat sink in the prior art
  • FIG. 2 is a schematic structural diagram of a first heat dissipation device provided by an embodiment of the disclosure
  • FIG. 3 is a schematic diagram of an end surface of a first heat dissipation device provided by an embodiment of the disclosure
  • FIG. 4 is a schematic structural diagram of a second heat dissipation device provided by an embodiment of the disclosure.
  • FIG. 5 is a schematic view of an end face of a second heat dissipation device provided by an embodiment of the disclosure.
  • FIG. 6 is a schematic structural diagram of a third heat dissipation device provided by an embodiment of the disclosure.
  • FIG. 7 is a schematic diagram of an end surface of a third heat dissipation device provided by an embodiment of the disclosure.
  • the heat dissipation device provided by the embodiments of the present disclosure is applied to a communication base station and is used to dissipate heat for the base station.
  • the heat dissipation device is fixed on the base station, and the heat generated by the base station is transferred to the heat dissipation device, and the heat is dissipated through the heat dissipation device.
  • FIG. 2 shows a specific heat dissipation device
  • FIG. 3 shows a schematic cross-sectional view of the heat dissipation device.
  • the heat dissipation device includes a first heat-conducting substrate 10, which is used for fixed connection with the base station, and the heat generated by the base station is first transferred to the first heat-conducting substrate 10.
  • the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is a rectangular substrate, but it should be understood that the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is not limited to the rectangular shape shown in FIG.
  • the substrate which can use other shapes of substrates, such as elliptical, square, or diamond-shaped substrates of different shapes, only needs to match the area where the base station needs to dissipate heat.
  • common thermally conductive metals such as copper and aluminum can be selected, which is not limited herein.
  • the heat dissipation device provided by the embodiment of the present disclosure further includes a second thermally conductive substrate 30.
  • the second thermally conductive substrate 30 has exactly the same shape and size as the first thermally conductive substrate 10, but the embodiment of the present disclosure does not The specific shape and size of the second thermally conductive substrate 30 are defined.
  • the second thermally conductive substrate 30 is specifically set, there is a gap between the second thermally conductive substrate 30 and the first thermally conductive substrate 10, and the first thermally conductive substrate 10 and the second thermally conductive substrate 30 pass through a plurality of first heat dissipation
  • the fins 20 are fixedly connected.
  • each first heat dissipation fin 20 is fixedly connected to the first heat-conducting substrate 10, and the other side is fixedly connected to the second heat-conducting substrate 30.
  • the specific fixing method can be welding or threaded connectors (bolts or Screw) for connection; and during connection, the first heat dissipation fin 20 is thermally connected to the first thermally conductive substrate 10 and the second thermally conductive substrate 30.
  • the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat conducting substrate 10 and the second heat conducting substrate 30 into a plurality of ventilation channels. The two ends of the ventilation channel are open.
  • One of the openings is the air inlet and the other is the air outlet.
  • the arrow shows a specific air flow direction.
  • the cold air flows from below. Enter into the ventilation channel, and then flow out from the upper air outlet. Of course, cold air can also enter the ventilation channel from above, and then flow out from the air outlet below.
  • the first heat-conducting substrate 10, the second heat-conducting substrate 30 and the first heat dissipation fins 20 are used to enclose a ventilation channel, which is named the first ventilation channel 50 for the convenience of description.
  • the cold air in the first ventilation passage 50 has the natural convection heat exchange capacity, which increases the heat dissipation effect.
  • the first ventilation passage 50 is a cylindrical structure, the cold air will become a high-temperature low-pressure gas after absorbing heat.
  • a siphon effect is formed in a ventilation channel 50 to improve the fluidity of the air, thereby improving the heat dissipation effect.
  • the second heat-conducting substrate 30 provided in the embodiments of the present disclosure may adopt an integral plate structure, or it may adopt a plurality of hollow structures on the second heat-conducting substrate, and each hollow structure is connected to the first ventilation channel.
  • each first ventilation channel corresponds to a plurality of hollow structures, and the plurality of hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, the external cold air can be supplemented into the first ventilation channel through the hollow structure, which improves the heat dissipation effect.
  • a plurality of second heat dissipation fins 40 are provided on the side of the second heat conduction substrate 30 facing away from the first heat conduction substrate 10. Moreover, the plurality of second heat dissipation fins 40 are arranged at intervals, and the gap between the second heat dissipation fins 40 forms another ventilation channel.
  • FIG. 1 In FIG. 1
  • the first heat dissipation fin 20 and the second heat dissipation fin 40 are both straight heat dissipation fins, and the length direction of the second heat dissipation fin 40 is inclined relative to the length direction of the first heat conducting substrate 10, that is, the The length direction of one heat dissipation fin 20 and the length direction of the second heat dissipation fin 40 form a set angle.
  • the included angle between the longitudinal direction of the first heat dissipation fin 20 and the second heat dissipation fin 40 is 45°, so that the flow direction of the air flowing between the first heat dissipation fins 20 is different from that of the first heat dissipation fin 20.
  • the two heat dissipation fins 40 have different air flow directions.
  • the second heat-conducting substrate 30 then transfers heat to the second heat-radiating fin 40.
  • the air circulates in the first ventilation channel 50 and the second ventilation channel 60 respectively, and is connected to the first heat-conducting substrate 10,
  • the second heat conducting substrate 30, the first heat dissipation fin 20 and the second heat dissipation fin 40 are in contact, thereby increasing the contact area between the air and the heat dissipation device, thereby improving the heat dissipation effect.
  • the second heat-conducting substrate 30 and the second heat-dissipating fins 40 are added to form the upper and lower layers of ventilation effect, which strengthens the convective heat exchange capacity of the heat sink and improves the heat dissipation efficiency of the heat sink.
  • first heat dissipation fin 20 and the second heat dissipation fin 40 shown in FIG. 2 is only a specific example.
  • the included angle of the fins 40 is not limited to the specific mode shown in FIG. 2, and other included angles can be used.
  • the included angles of the first heat dissipation fin 20 and the second heat dissipation fin 40 are different from 30° to 60°. Angle. Both can achieve improved heat dissipation effect.
  • FIG. 4 shows a second heat dissipation device provided by an embodiment of the present disclosure
  • FIG. 5 shows an end view of the second heat dissipation device.
  • the heat dissipating device shown in FIG. 4 the heat dissipating device includes a first heat conducting substrate 10, the first heat conducting substrate 10 is used for fixed connection with the base station, and the heat generated by the base station is first transferred to the first heat conducting substrate 10.
  • the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is a rectangular substrate, but it should be understood that the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is not limited to the rectangular shape shown in FIG.
  • the substrate which can use other shapes of substrates, such as elliptical, square, or diamond-shaped substrates of different shapes, only needs to match the area where the base station needs to dissipate heat.
  • common thermally conductive metals such as copper and aluminum can be selected, which is not limited herein.
  • the heat dissipation device provided by the embodiment of the present disclosure further includes a second thermally conductive substrate 30.
  • the second thermally conductive substrate 30 has the same shape as the first thermally conductive substrate 10 but has a smaller size than the first thermally conductive substrate 10. And when set up, the second thermally conductive substrate 30 is flush with one end of the first thermally conductive substrate 10. As shown in FIG. 5, the vertical projection of the second thermally conductive substrate 30 on the first thermally conductive substrate 10 is located in the first thermally conductive substrate 10.
  • each first heat dissipation fin 20 is fixedly connected to the first heat-conducting substrate 10, and the other side is fixedly connected to the second heat-conducting substrate 30.
  • the specific fixing method can be welding or threaded connectors (bolts or Screw) for connection; and during connection, the first heat dissipation fin 20 is thermally connected to the first thermally conductive substrate 10 and the second thermally conductive substrate 30.
  • the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat-conducting substrate 10 and the second heat-conducting substrate 30 into a plurality of ventilation channels.
  • the two ends of the ventilation channel are open.
  • One of the openings is the air inlet and the other is the air outlet.
  • the arrow shows a specific air flow direction. The cold air flows from below. Enter into the ventilation channel, and then flow out from the upper air outlet. Of course, cold air can also enter the ventilation channel from above, and then flow out from the air outlet below.
  • the first heat-conducting substrate 10, the second heat-conducting substrate 30 and the first heat dissipation fins 20 are used to enclose a ventilation channel, which is named the first ventilation channel 50 for the convenience of description.
  • the cold air in the first ventilation passage 50 has the natural convection heat exchange capacity, which increases the heat dissipation effect.
  • the first ventilation passage 50 is a cylindrical structure, the cold air will become a high-temperature low-pressure gas after absorbing heat.
  • a siphon effect is formed in a ventilation channel 50 to improve the fluidity of the air, thereby improving the heat dissipation effect.
  • the second heat-conducting substrate 30 provided in the embodiment of the present disclosure may adopt an integral plate-like structure, or it may adopt a plurality of hollow structures on the second heat-conducting substrate, and each hollow structure is connected to the first ventilation channel.
  • each first ventilation channel corresponds to a plurality of hollow structures, and the plurality of hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, the external cold air can be supplemented into the first ventilation channel through the hollow structure, which improves the heat dissipation effect.
  • a plurality of second heat dissipation fins 40 are provided on the side of the second heat conduction substrate 30 facing away from the first heat conduction substrate 10. Moreover, the plurality of second heat dissipation fins 40 are arranged at intervals, and the gap between the second heat dissipation fins 40 forms another ventilation channel.
  • the first heat dissipation fin 20 and the second heat dissipation fin 40 are both straight heat dissipation fins, and the length direction of the first heat dissipation fin 20 is the same as the length direction of the first heat conducting substrate 10.
  • the second heat-conducting substrate 30 then transfers heat to the second heat-radiating fin 40.
  • the air circulates in the first ventilation channel 50 and the second ventilation channel 60 respectively, and is connected to the first heat-conducting substrate 10,
  • the second heat conducting substrate 30, the first heat dissipation fin 20 and the second heat dissipation fin 40 are in contact, thereby increasing the contact area between the air and the heat dissipation device, thereby improving the heat dissipation effect.
  • the second heat-conducting substrate 30 and the second heat-dissipating fins 40 are added to form the upper and lower layers of ventilation effect, which strengthens the convective heat exchange capacity of the heat sink and improves the heat dissipation efficiency of the heat sink.
  • a plurality of third heat dissipation fins 70 are provided on the portion of the first heat conduction substrate 10 outside the vertical projection of the second heat conduction substrate 30.
  • a first heat dissipation fin 20 and a third heat dissipation fin 70 are provided on the first heat conducting substrate 10, and the first heat dissipation fin 20 and the third heat dissipation fin 70 are arranged in parallel.
  • the first heat dissipation fin 20 and the second heat dissipation fin 40 are an integral structure.
  • the second heat conducting substrate 30 can be regarded as a plurality of connecting plates connecting adjacent first heat dissipation fins 20. In the specific connection, the connecting plate and the heat dissipation fin can be fixedly connected by welding.
  • Fig. 6 shows a third heat dissipation device provided by an embodiment of the present disclosure
  • Fig. 7 shows a schematic end view of the third heat dissipation device.
  • the heat dissipation device includes a first heat-conducting substrate 10, which is used to be fixedly connected to the base station, and the heat generated by the base station is first transferred to the first heat-conducting substrate 10.
  • the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is a rectangular substrate, but it should be understood that the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is not limited to the rectangular shape shown in FIG.
  • the substrate which can use other shapes of substrates, such as elliptical, square, or diamond-shaped substrates of different shapes, only needs to match the area where the base station needs to dissipate heat.
  • common thermally conductive metals such as copper and aluminum can be selected, which is not limited herein.
  • the heat dissipation device provided by the embodiment of the present disclosure further includes a second thermally conductive substrate 30.
  • the second thermally conductive substrate 30 has exactly the same shape and size as the first thermally conductive substrate 10, but the embodiment of the present disclosure does not The specific shape and size of the second thermally conductive substrate 30 are defined.
  • the second thermally conductive substrate 30 is specifically set, there is a gap between the second thermally conductive substrate 30 and the first thermally conductive substrate 10, and the first thermally conductive substrate 10 and the second thermally conductive substrate 30 pass through a plurality of first heat dissipation
  • the fins 20 are fixedly connected.
  • each first heat dissipation fin 20 is fixedly connected to the first heat-conducting substrate 10, and the other side is fixedly connected to the second heat-conducting substrate 30.
  • the specific fixing method can be welding or threaded connectors (bolts or Screw) for connection; and during connection, the first heat dissipation fin 20 is thermally connected to the first thermally conductive substrate 10 and the second thermally conductive substrate 30.
  • the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat-conducting substrate 10 and the second heat-conducting substrate 30 into a plurality of ventilation channels. The two ends of the ventilation channel are open.
  • One of the openings is the air inlet and the other is the air outlet.
  • the arrow shows a specific air flow direction.
  • the cold air flows from below. Enter into the ventilation channel, and then flow out from the upper air outlet. Of course, cold air can also enter the ventilation channel from above, and then flow out from the air outlet below.
  • the first heat-conducting substrate 10, the second heat-conducting substrate 30 and the first heat dissipation fins 20 are used to enclose a ventilation channel, which is named the first ventilation channel 50 for the convenience of description.
  • the cold air in the first ventilation passage 50 has the natural convection heat exchange capacity, which increases the heat dissipation effect.
  • the first ventilation passage 50 is a cylindrical structure, the cold air will become a high-temperature low-pressure gas after absorbing heat.
  • a siphon effect is formed in a ventilation channel 50 to improve the fluidity of the air, thereby improving the heat dissipation effect.
  • the second heat-conducting substrate 30 provided in the embodiment of the present disclosure may adopt an integral plate-like structure, or it may adopt a plurality of hollow structures on the second heat-conducting substrate, and each hollow structure is connected to the first ventilation channel.
  • each first ventilation channel corresponds to a plurality of hollow structures, and the plurality of hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, the external cold air can be supplemented into the first ventilation channel through the hollow structure, which improves the heat dissipation effect.
  • a plurality of second heat dissipation fins 40 are provided on the side of the second heat conducting substrate 30 facing away from the first heat conducting substrate 10. Moreover, the plurality of second heat dissipation fins 40 are arranged at intervals, and the gap between the second heat dissipation fins 40 forms another ventilation channel.
  • the first heat dissipation fin 20 and the second heat dissipation fin 40 are both straight heat dissipation fins, and the length direction of the second heat dissipation fin 40 is the same as the length direction of the first heat conducting substrate 10, and When the first heat dissipation fins 20 and the second heat dissipation fins 40 are specifically arranged, as shown in FIG.
  • the first heat dissipation fins 20 and the second heat dissipation fins 40 are arranged alternately.
  • the second heat-conducting substrate 30 then transfers heat to the second heat-radiating fin 40.
  • the air When the air is circulating, the air circulates in the first ventilation channel 50 and the second ventilation channel 60 respectively, and is connected to the first heat-conducting substrate 10,
  • the second heat conducting substrate 30, the first heat dissipation fin 20 and the second heat dissipation fin 40 are in contact, thereby increasing the contact area between the air and the heat dissipation device, thereby improving the heat dissipation effect.
  • the second heat-conducting substrate 30 and the second heat-dissipating fins 40 are added to form the upper and lower layers of ventilation effect, which strengthens the convective heat exchange capacity of the heat sink and improves the heat dissipation efficiency of the heat sink.
  • the first heat dissipation fins 20 and the second heat dissipation fins 40 are arranged alternately, the effect of heat transfer can be increased.
  • the embodiment of the present disclosure also provides a base station, which includes a device and any one of the above-mentioned heat dissipation devices provided on the device.
  • a base station which includes a device and any one of the above-mentioned heat dissipation devices provided on the device.
  • the air in the ventilation channel has a natural convection heat exchange capacity, which increases the heat dissipation effect.
  • the first heat-conducting substrate 10 may be a housing of a device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present application provides a heat dissipation device and a base station. The heat dissipation device comprises: a first thermally conductive base board, and a second thermally conductive base board disposed at an interval from the first thermally conductive base board, wherein multiple first heat dissipation fins are disposed between the first thermally conductive base board and the second thermally conductive base board, each of the first heat dissipation fins is separately connected to the first thermally conductive base board and the second thermally conductive base board, the multiple first heat dissipation fins divide a gap between the first thermally conductive base board and the second thermally conductive base board into multiple ventilation channels, and multiple second heat dissipation fins are disposed on a surface of the second thermally conductive base board away from the first thermally conductive base board. The above technical solution uses the first thermally conductive base board, the second thermally conductive base board, and the first heat dissipation fins to form the ventilation channels, and a heat dissipation capability from natural convection of air in the ventilation channels improves heat dissipation performance.

Description

一种散热装置及基站Heat dissipation device and base station
相关申请的交叉引用Cross references to related applications
本公开要求在2019年08月15日提交中国专利局、申请号为201910753399.3、申请名称为“一种散热装置及基站”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。The present disclosure claims the priority of a Chinese patent application filed with the Chinese Patent Office with an application number of 201910753399.3 and an application title of "a heat sink and base station" on August 15, 2019, the entire content of which is incorporated into this disclosure by reference.
技术领域Technical field
本公开涉及到散热技术领域，尤其涉及到一种散热装置及基站。The present disclosure relates to the field of heat dissipation technology, and in particular to a heat dissipation device and a base station.
背景技术Background technique
通信基站产品热设计的好坏直接关系到产品的成本、可靠性以及体积和重量。如果热设计不好，就会增加设备的体积和重量以满足设备运行所需的环境要求；否则，就会出现环境温升偏高，长期在高温条件下工作会降低电子设备可靠性和使用寿命，严重时甚至会烧毁器件。如何在有限的空间内进行有效散热，成为目前通信产品设计的关键问题。此项设计应用于自然对流散热模块，其一般形式为在一块第一导热基板上连接有一定数量的散热齿片，散热齿片与空气对流换热实现对设备整体的散热降温。The thermal design of communication base station products is directly related to the cost, reliability, volume and weight of the product. If the thermal design is not good, the volume and weight of the equipment will be increased to meet the environmental requirements required for equipment operation; otherwise, the environmental temperature will rise too high, and long-term operation under high temperature conditions will reduce the reliability and service life of electronic equipment , And even burn the device in severe cases. How to effectively dissipate heat in a limited space has become a key issue in the design of current communication products. This design is applied to a natural convection heat dissipation module, and its general form is that a certain number of heat dissipation fins are connected to a first thermally conductive substrate, and the heat dissipation fins exchange heat with the air to achieve heat dissipation and cooling of the entire device.
图1为传统散热模块结构形态，其中1为基板，2为散热齿。传统散热齿结构主要通过改变几何参数获得更好的散热效果，但是当散热齿片的高度、长度、厚度、齿片间距等参数达到优化一定程度后，由于边际效应散热齿的散热能力并不会再显著提高。Figure 1 shows the structure of a traditional heat dissipation module, in which 1 is a substrate and 2 is a heat dissipation tooth. The traditional heat dissipating tooth structure mainly obtains better heat dissipation effect by changing the geometric parameters. However, when the height, length, thickness, and pitch of the heat dissipating tooth fins are optimized to a certain degree, the heat dissipation capacity of the heat dissipating tooth will not be affected due to the marginal effect. Significantly improved again.
发明内容Summary of the invention
本公开提供了一种散热装置及基站，用以提高散热效果。The present disclosure provides a heat dissipation device and a base station to improve the heat dissipation effect.
第一方面，提供了一种散热装置，该散热装置包括：第一导热基板，以及与所述第一导热基板间隔设置的第二导热基板；其中，所述第一导热基板 及所述第二导热基板之间设置有多个第一散热翅片，且每个第一散热翅片分别与所述第一导热基板及所述第二导热基板导热连接；所述多个第一散热翅片将所述第一导热基板与所述第二导热基板之间的间隙分割成多个通风通道；In a first aspect, a heat dissipation device is provided. The heat dissipation device includes: a first thermally conductive substrate, and a second thermally conductive substrate spaced apart from the first thermally conductive substrate; wherein, the first thermally conductive substrate and the second thermally conductive substrate A plurality of first heat dissipation fins are arranged between the thermally conductive substrates, and each of the first heat dissipation fins is thermally connected to the first thermally conductive substrate and the second thermally conductive substrate; The gap between the first thermally conductive substrate and the second thermally conductive substrate is divided into a plurality of ventilation channels;
所述第二导热基板背离所述第一导热基板的一面设置有多个第二散热翅片。A plurality of second heat dissipation fins are provided on the side of the second heat conducting substrate facing away from the first heat conducting substrate.
在上述技术方案中，通过采用第一导热基板、第二导热基板以及第一散热翅片围成通风通道，在通风通道内空气自然对流换热能力，增加了散热效果。In the above technical solution, by using the first heat-conducting substrate, the second heat-conducting substrate and the first heat dissipation fins to enclose the ventilation channel, the natural convection and heat exchange ability of the air in the ventilation channel increases the heat dissipation effect.
在一个具体的可实施方案中，所述第一散热翅片的长度方向与所述第二散热翅片的长度方向呈设定夹角。通过设置不同角度的散热翅片，提高了散热效果。In a specific implementation, the length direction of the first heat dissipation fin and the length direction of the second heat dissipation fin form a set angle. By arranging different angles of heat dissipation fins, the heat dissipation effect is improved.
在一个具体的可实施方案中，所述第一散热翅片的长度方向与所述第一导热基板的长度方向相同；In a specific implementation, the length direction of the first heat dissipation fin is the same as the length direction of the first heat conducting substrate;
所述第二散热翅片的长度方向相对所述第一导热基板的长度方向倾斜。提高了散热效果。The length direction of the second heat dissipation fin is inclined with respect to the length direction of the first heat conducting substrate. Improve the heat dissipation effect.
在一个具体的可实施方案中，所述第二导热基板在所述第一导热基板上的垂直投影位于所述第一导热基板内。In a specific implementation, the vertical projection of the second thermally conductive substrate on the first thermally conductive substrate is located in the first thermally conductive substrate.
在一个具体的可实施方案中，所述第一导热基板上位于所述第二导热基板的垂直投影外的部分设置有多个第三散热翅片。In a specific implementation, a plurality of third heat dissipation fins are provided on the part of the first heat-conducting substrate outside the vertical projection of the second heat-conducting substrate.
在一个具体的可实施方案中，所述第三散热翅片与所述第一散热翅片平行。In a specific implementation, the third heat dissipation fin is parallel to the first heat dissipation fin.
在一个具体的可实施方案中，所述第一散热翅片与所述第二散热翅片为一体结构；In a specific implementation, the first heat dissipation fin and the second heat dissipation fin are an integral structure;
所述第二导热基板包括多个连接相邻的所述第一散热翅片的连接板。The second heat-conducting substrate includes a plurality of connecting plates connecting the adjacent first heat dissipation fins.
在一个具体的可实施方案中，所述第一导热基板与所述第二导热基板等大。In a specific implementation, the first thermally conductive substrate and the second thermally conductive substrate are the same size.
在一个具体的可实施方案中，所述第一散热翅片与所述第二散热翅片交 错设置。In a specific implementation, the first heat dissipation fin and the second heat dissipation fin are arranged alternately.
在一个具体的可实施方案中，所述第二导热基板上设置有多个镂空结构，且每个镂空结构与所述通风通道连通。增加通风效果。In a specific implementation, a plurality of hollow structures are provided on the second thermally conductive substrate, and each hollow structure is in communication with the ventilation channel. Increase the ventilation effect.
第二方面，提供了一种基站，该基站包括设备，以及设置在所述设备上的上述任一项所述的散热装置。在上述技术方案中，通过采用第一导热基板、第二导热基板以及第一散热翅片围成通风通道，在通风通道内空气自然对流换热能力，增加了散热效果。In a second aspect, a base station is provided. The base station includes a device, and the heat dissipation device according to any one of the above items arranged on the device. In the above technical solution, by using the first heat-conducting substrate, the second heat-conducting substrate and the first heat dissipation fins to enclose the ventilation channel, the natural convection and heat exchange ability of the air in the ventilation channel increases the heat dissipation effect.
附图说明Description of the drawings
图1为现有技术中散热装置的结构示意图；Figure 1 is a schematic diagram of the structure of a heat sink in the prior art;
图2为本公开实施例提供的第一种散热装置的结构示意图；2 is a schematic structural diagram of a first heat dissipation device provided by an embodiment of the disclosure;
图3为本公开实施例提供的第一种散热装置的端面示意图；FIG. 3 is a schematic diagram of an end surface of a first heat dissipation device provided by an embodiment of the disclosure;
图4为本公开实施例提供的第二种散热装置的结构示意图；4 is a schematic structural diagram of a second heat dissipation device provided by an embodiment of the disclosure;
图5为本公开实施例提供的第二种散热装置的端面示意图；FIG. 5 is a schematic view of an end face of a second heat dissipation device provided by an embodiment of the disclosure;
图6为本公开实施例提供的第三种散热装置的结构示意图；6 is a schematic structural diagram of a third heat dissipation device provided by an embodiment of the disclosure;
图7为本公开实施例提供的第三种散热装置的端面示意图。FIG. 7 is a schematic diagram of an end surface of a third heat dissipation device provided by an embodiment of the disclosure.
具体实施方式detailed description
为了方便理解本公开实施例提供的散热装置，下面首先说明一下本公开实施例提供的散热装置的应用场景，本公开实施例提供的散热装置应用于通信基站，并用于给基站进行散热。在使用时，将散热装置固定在基站上，基站产生的热量传递到散热装置上，并通过散热装置将热量散发出去，但是现有技术中的散热装置的散热效果比较低，因此本公开实施例提供了一种散热装置。为了使本公开的目的、技术方案和优点更加清楚，下面将结合附图对本公开作进一步地详细描述。In order to facilitate the understanding of the heat dissipation device provided by the embodiments of the present disclosure, the following first describes the application scenarios of the heat dissipation device provided by the embodiments of the present disclosure. The heat dissipation device provided by the embodiments of the present disclosure is applied to a communication base station and is used to dissipate heat for the base station. When in use, the heat dissipation device is fixed on the base station, and the heat generated by the base station is transferred to the heat dissipation device, and the heat is dissipated through the heat dissipation device. However, the heat dissipation effect of the heat dissipation device in the prior art is relatively low, so the embodiments of the present disclosure A heat dissipation device is provided. In order to make the objectives, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below with reference to the accompanying drawings.
首先参考图2及图3，图2示出了一种具体的散热装置，图3示出了散热装置的断面示意图。该散热装置包括一个第一导热基板10，该第一导热基板 10用于与基站固定连接，且基站产生的热量首先传递到第一导热基板10上。继续参考图2，在图2中，本公开实施例提供的第一导热基板10为矩形基板，但是应当理解的是本公开实施例提供的第一导热基板10不仅限于图2中所示的矩形基板，其可以采用其他形状的基板，如椭圆形、正方形或者菱形等不同形状的基板，只需要跟基站需要散热的区域匹配即可。对于本公开实施例提供的第一导热基板10的材质可以选择铜、铝等常见的导热金属，在此不做限定。First, refer to FIGS. 2 and 3. FIG. 2 shows a specific heat dissipation device, and FIG. 3 shows a schematic cross-sectional view of the heat dissipation device. The heat dissipation device includes a first heat-conducting substrate 10, which is used for fixed connection with the base station, and the heat generated by the base station is first transferred to the first heat-conducting substrate 10. Continuing to refer to FIG. 2, in FIG. 2, the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is a rectangular substrate, but it should be understood that the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is not limited to the rectangular shape shown in FIG. The substrate, which can use other shapes of substrates, such as elliptical, square, or diamond-shaped substrates of different shapes, only needs to match the area where the base station needs to dissipate heat. For the material of the first thermally conductive substrate 10 provided by the embodiments of the present disclosure, common thermally conductive metals such as copper and aluminum can be selected, which is not limited herein.
继续参考图2，本公开实施例提供的散热装置还包括第二导热基板30，在图2中，第二导热基板30与第一导热基板10形状及尺寸完全相同，但是在本公开实施例不限定第二导热基板30的具体形状尺寸。在具体设置第二导热基板30时，第二导热基板30与第一导热基板10之间间隔有一定距离的间隙，且第一导热基板10与第二导热基板30之间通过多个第一散热翅片20固定连接起来。其中，每个第一散热翅片20一侧与第一导热基板10固定连接，另一侧与第二导热基板30固定连接，具体的固定方式可以采用焊接的方式或者通过螺纹连接件(螺栓或螺钉)进行连接；并且在连接时，第一散热翅片20与第一导热基板10及第二导热基板30均导热连接。继续参考图2，多个第一散热翅片20之间间隔排列，且多个第一散热翅片20将第一导热基板10与第二导热基板30之间的间隙分割成多个通风通道。该通风通道的两端开口，其中的一个开口为进风口，另一个开口为出风口，如图2中的箭头所示，该箭头示出了一种具体的空气流动方向，冷的空气从下方进入到通风通道，之后从上方的出风口流出。当然也可以冷的空气从上方进入通风通道，之后从下方的出风口流出。通过采用第一导热基板10、第二导热基板30以及第一散热翅片20围成通风通道，为方便描述将其命名为第一通风通道50。冷空气在第一通风通道50内空气自然对流换热能力，增加了散热效果，且由于第一通风通道50为筒状结构，冷空气在吸热后会相成高温的低压气体，从而在第一通风通道50内形成虹吸效果，提高空气的流动性，进而提高散热效果。Continuing to refer to FIG. 2, the heat dissipation device provided by the embodiment of the present disclosure further includes a second thermally conductive substrate 30. In FIG. 2, the second thermally conductive substrate 30 has exactly the same shape and size as the first thermally conductive substrate 10, but the embodiment of the present disclosure does not The specific shape and size of the second thermally conductive substrate 30 are defined. When the second thermally conductive substrate 30 is specifically set, there is a gap between the second thermally conductive substrate 30 and the first thermally conductive substrate 10, and the first thermally conductive substrate 10 and the second thermally conductive substrate 30 pass through a plurality of first heat dissipation The fins 20 are fixedly connected. Among them, one side of each first heat dissipation fin 20 is fixedly connected to the first heat-conducting substrate 10, and the other side is fixedly connected to the second heat-conducting substrate 30. The specific fixing method can be welding or threaded connectors (bolts or Screw) for connection; and during connection, the first heat dissipation fin 20 is thermally connected to the first thermally conductive substrate 10 and the second thermally conductive substrate 30. Continuing to refer to FIG. 2, the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat conducting substrate 10 and the second heat conducting substrate 30 into a plurality of ventilation channels. The two ends of the ventilation channel are open. One of the openings is the air inlet and the other is the air outlet. As shown by the arrow in Figure 2, the arrow shows a specific air flow direction. The cold air flows from below. Enter into the ventilation channel, and then flow out from the upper air outlet. Of course, cold air can also enter the ventilation channel from above, and then flow out from the air outlet below. The first heat-conducting substrate 10, the second heat-conducting substrate 30 and the first heat dissipation fins 20 are used to enclose a ventilation channel, which is named the first ventilation channel 50 for the convenience of description. The cold air in the first ventilation passage 50 has the natural convection heat exchange capacity, which increases the heat dissipation effect. And because the first ventilation passage 50 is a cylindrical structure, the cold air will become a high-temperature low-pressure gas after absorbing heat. A siphon effect is formed in a ventilation channel 50 to improve the fluidity of the air, thereby improving the heat dissipation effect.
在本公开实施例提供的第二导热基板30可以采用一个整体的板状结构， 也可以采用在第二导热基板上设置多个镂空结构，且每个镂空结构与第一通风通道连通。如每个第一通风通道对应多个镂空结构，且多个镂空结构沿第一通风通道的长度方向排列。由于第一通风通道的虹吸效果，外部的冷空气可以通过镂空结构补充到第一通风通道内，提高了散热效果。The second heat-conducting substrate 30 provided in the embodiments of the present disclosure may adopt an integral plate structure, or it may adopt a plurality of hollow structures on the second heat-conducting substrate, and each hollow structure is connected to the first ventilation channel. For example, each first ventilation channel corresponds to a plurality of hollow structures, and the plurality of hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, the external cold air can be supplemented into the first ventilation channel through the hollow structure, which improves the heat dissipation effect.
继续参考图2及图3，在第二导热基板30背离第一导热基板10的一面设置有多个第二散热翅片40。且多个第二散热翅片40的间隔设置，且第二散热翅片40之间间隔的间隙形成另外的一个通风通道。在图2中，第一散热翅片20及第二散热翅片40均采用平直的散热翅片，且第二散热翅片40的长度方向相对第一导热基板10的长度方向倾斜，即第一散热翅片20的长度方向与第二散热翅片40的长度方向呈设定夹角。在图2中，第一散热翅片20与第二散热翅片40的长度方向的夹角为45°，从而使得流经第一散热翅片20之间的空气的流动方向，与流经第二散热翅片40的空气的流动方向不同。在具体散热时，空气分别流经第一通风通道50及第二通风通道60，从基站上传递过来的热量传递到第一导热基板10，并通过第一散热翅片20传递到第二导热基板30，第二导热基板30再将热量传递到第二散热翅片40，在空气流通时，空气分别在第一通风通道50及第二通风通道60中流通，并分别与第一导热基板10、第二导热基板30、第一散热翅片20及第二散热翅片40接触，从而增大了空气与散热装置的接触面积，进而提高了散热效果。并且通过增加的第二导热基板30及第二散热翅片40，形成上下两层通风效果，加强了散热装置对流换热能力，提高了散热装置的散热效率。Continuing to refer to FIGS. 2 and 3, a plurality of second heat dissipation fins 40 are provided on the side of the second heat conduction substrate 30 facing away from the first heat conduction substrate 10. Moreover, the plurality of second heat dissipation fins 40 are arranged at intervals, and the gap between the second heat dissipation fins 40 forms another ventilation channel. In FIG. 2, the first heat dissipation fin 20 and the second heat dissipation fin 40 are both straight heat dissipation fins, and the length direction of the second heat dissipation fin 40 is inclined relative to the length direction of the first heat conducting substrate 10, that is, the The length direction of one heat dissipation fin 20 and the length direction of the second heat dissipation fin 40 form a set angle. In FIG. 2, the included angle between the longitudinal direction of the first heat dissipation fin 20 and the second heat dissipation fin 40 is 45°, so that the flow direction of the air flowing between the first heat dissipation fins 20 is different from that of the first heat dissipation fin 20. The two heat dissipation fins 40 have different air flow directions. In the specific heat dissipation, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively, and the heat transferred from the base station is transferred to the first thermally conductive substrate 10, and is transferred to the second thermally conductive substrate through the first heat dissipation fins 20 30. The second heat-conducting substrate 30 then transfers heat to the second heat-radiating fin 40. When the air is circulating, the air circulates in the first ventilation channel 50 and the second ventilation channel 60 respectively, and is connected to the first heat-conducting substrate 10, The second heat conducting substrate 30, the first heat dissipation fin 20 and the second heat dissipation fin 40 are in contact, thereby increasing the contact area between the air and the heat dissipation device, thereby improving the heat dissipation effect. In addition, the second heat-conducting substrate 30 and the second heat-dissipating fins 40 are added to form the upper and lower layers of ventilation effect, which strengthens the convective heat exchange capacity of the heat sink and improves the heat dissipation efficiency of the heat sink.
应当理解的是，图2所示的第一散热翅片20与第二散热翅片40的夹角仅仅唯一个具体的示例，本公开实施例提供的第一散热翅片20与第二散热翅片40的夹角不仅限于图2中的一种具体的模式，还可以采用其他的夹角，如第一散热翅片20与第二散热翅片40的夹角为30°、60°等不同的角度。均可以达到提高散热效果。It should be understood that the angle between the first heat dissipation fin 20 and the second heat dissipation fin 40 shown in FIG. 2 is only a specific example. The first heat dissipation fin 20 and the second heat dissipation fin provided by the embodiment of the present disclosure The included angle of the fins 40 is not limited to the specific mode shown in FIG. 2, and other included angles can be used. For example, the included angles of the first heat dissipation fin 20 and the second heat dissipation fin 40 are different from 30° to 60°. Angle. Both can achieve improved heat dissipation effect.
一并参考图4及图5，其中，图4示出了本公开实施例提供的第二种散热装置，图5示出了第二种散热装置的端面视图。在图4所示的散热装置中， 该散热装置包括一个第一导热基板10，该第一导热基板10用于与基站固定连接，且基站产生的热量首先传递到第一导热基板10上。继续参考图4，在图4中，本公开实施例提供的第一导热基板10为矩形基板，但是应当理解的是本公开实施例提供的第一导热基板10不仅限于图4中所示的矩形基板，其可以采用其他形状的基板，如椭圆形、正方形或者菱形等不同形状的基板，只需要跟基站需要散热的区域匹配即可。对于本公开实施例提供的第一导热基板10的材质可以选择铜、铝等常见的导热金属，在此不做限定。Refer to FIGS. 4 and 5 together, wherein FIG. 4 shows a second heat dissipation device provided by an embodiment of the present disclosure, and FIG. 5 shows an end view of the second heat dissipation device. In the heat dissipating device shown in FIG. 4, the heat dissipating device includes a first heat conducting substrate 10, the first heat conducting substrate 10 is used for fixed connection with the base station, and the heat generated by the base station is first transferred to the first heat conducting substrate 10. Continuing to refer to FIG. 4, in FIG. 4, the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is a rectangular substrate, but it should be understood that the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is not limited to the rectangular shape shown in FIG. The substrate, which can use other shapes of substrates, such as elliptical, square, or diamond-shaped substrates of different shapes, only needs to match the area where the base station needs to dissipate heat. For the material of the first thermally conductive substrate 10 provided by the embodiment of the present disclosure, common thermally conductive metals such as copper and aluminum can be selected, which is not limited herein.
继续参考图4，本公开实施例提供的散热装置还包括第二导热基板30，在图4中，第二导热基板30与第一导热基板10形状相同，但是尺寸小于第一导热基板10。且在设置时，第二导热基板30与第一导热基板10一端齐平，如图5所示，第二导热基板30在第一导热基板10上的垂直投影位于第一导热基板10内。在具体设置第二导热基板30时，第二导热基板30与第一导热基板10之间间隔有一定距离的间隙，且第一导热基板10与第二导热基板30之间通过多个第一散热翅片20固定连接起来。其中，每个第一散热翅片20一侧与第一导热基板10固定连接，另一侧与第二导热基板30固定连接，具体的固定方式可以采用焊接的方式或者通过螺纹连接件(螺栓或螺钉)进行连接；并且在连接时，第一散热翅片20与第一导热基板10及第二导热基板30均导热连接。继续参考图4，多个第一散热翅片20之间间隔排列，且多个第一散热翅片20将第一导热基板10与第二导热基板30之间的间隙分割成多个通风通道。该通风通道的两端开口，其中的一个开口为进风口，另一个开口为出风口，如图4中的箭头所示，该箭头示出了一种具体的空气流动方向，冷的空气从下方进入到通风通道，之后从上方的出风口流出。当然也可以冷的空气从上方进入通风通道，之后从下方的出风口流出。通过采用第一导热基板10、第二导热基板30以及第一散热翅片20围成通风通道，为方便描述将其命名为第一通风通道50。冷空气在第一通风通道50内空气自然对流换热能力，增加了散热效果，且由于第一通风通道50为筒状结构，冷空气在吸热后会相成高温的低压气体，从而在第一通风通道50内形成虹吸效果，提高空 气的流动性，进而提高散热效果。Continuing to refer to FIG. 4, the heat dissipation device provided by the embodiment of the present disclosure further includes a second thermally conductive substrate 30. In FIG. 4, the second thermally conductive substrate 30 has the same shape as the first thermally conductive substrate 10 but has a smaller size than the first thermally conductive substrate 10. And when set up, the second thermally conductive substrate 30 is flush with one end of the first thermally conductive substrate 10. As shown in FIG. 5, the vertical projection of the second thermally conductive substrate 30 on the first thermally conductive substrate 10 is located in the first thermally conductive substrate 10. When the second thermally conductive substrate 30 is specifically set, there is a gap between the second thermally conductive substrate 30 and the first thermally conductive substrate 10, and the first thermally conductive substrate 10 and the second thermally conductive substrate 30 pass through a plurality of first heat dissipation The fins 20 are fixedly connected. Among them, one side of each first heat dissipation fin 20 is fixedly connected to the first heat-conducting substrate 10, and the other side is fixedly connected to the second heat-conducting substrate 30. The specific fixing method can be welding or threaded connectors (bolts or Screw) for connection; and during connection, the first heat dissipation fin 20 is thermally connected to the first thermally conductive substrate 10 and the second thermally conductive substrate 30. 4, the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat-conducting substrate 10 and the second heat-conducting substrate 30 into a plurality of ventilation channels. The two ends of the ventilation channel are open. One of the openings is the air inlet and the other is the air outlet. As shown by the arrow in Figure 4, the arrow shows a specific air flow direction. The cold air flows from below. Enter into the ventilation channel, and then flow out from the upper air outlet. Of course, cold air can also enter the ventilation channel from above, and then flow out from the air outlet below. The first heat-conducting substrate 10, the second heat-conducting substrate 30 and the first heat dissipation fins 20 are used to enclose a ventilation channel, which is named the first ventilation channel 50 for the convenience of description. The cold air in the first ventilation passage 50 has the natural convection heat exchange capacity, which increases the heat dissipation effect. And because the first ventilation passage 50 is a cylindrical structure, the cold air will become a high-temperature low-pressure gas after absorbing heat. A siphon effect is formed in a ventilation channel 50 to improve the fluidity of the air, thereby improving the heat dissipation effect.
在本公开实施例提供的第二导热基板30可以采用一个整体的板状结构，也可以采用在第二导热基板上设置多个镂空结构，且每个镂空结构与第一通风通道连通。如每个第一通风通道对应多个镂空结构，且多个镂空结构沿第一通风通道的长度方向排列。由于第一通风通道的虹吸效果，外部的冷空气可以通过镂空结构补充到第一通风通道内，提高了散热效果。The second heat-conducting substrate 30 provided in the embodiment of the present disclosure may adopt an integral plate-like structure, or it may adopt a plurality of hollow structures on the second heat-conducting substrate, and each hollow structure is connected to the first ventilation channel. For example, each first ventilation channel corresponds to a plurality of hollow structures, and the plurality of hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, the external cold air can be supplemented into the first ventilation channel through the hollow structure, which improves the heat dissipation effect.
继续参考图4及图5，在第二导热基板30背离第一导热基板10的一面设置有多个第二散热翅片40。且多个第二散热翅片40的间隔设置，且第二散热翅片40之间间隔的间隙形成另外的一个通风通道。在图4中，第一散热翅片20及第二散热翅片40均采用平直的散热翅片，且第一散热翅片20的长度方向与第一导热基板10的长度方向相同。在具体散热时，空气分别流经第一通风通道50及第二通风通道60，从基站上传递过来的热量传递到第一导热基板10，并通过第一散热翅片20传递到第二导热基板30，第二导热基板30再将热量传递到第二散热翅片40，在空气流通时，空气分别在第一通风通道50及第二通风通道60中流通，并分别与第一导热基板10、第二导热基板30、第一散热翅片20及第二散热翅片40接触，从而增大了空气与散热装置的接触面积，进而提高了散热效果。并且通过增加的第二导热基板30及第二散热翅片40，形成上下两层通风效果，加强了散热装置对流换热能力，提高了散热装置的散热效率。Continuing to refer to FIGS. 4 and 5, a plurality of second heat dissipation fins 40 are provided on the side of the second heat conduction substrate 30 facing away from the first heat conduction substrate 10. Moreover, the plurality of second heat dissipation fins 40 are arranged at intervals, and the gap between the second heat dissipation fins 40 forms another ventilation channel. In FIG. 4, the first heat dissipation fin 20 and the second heat dissipation fin 40 are both straight heat dissipation fins, and the length direction of the first heat dissipation fin 20 is the same as the length direction of the first heat conducting substrate 10. In the specific heat dissipation, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively, and the heat transferred from the base station is transferred to the first thermally conductive substrate 10, and is transferred to the second thermally conductive substrate through the first heat dissipation fins 20 30. The second heat-conducting substrate 30 then transfers heat to the second heat-radiating fin 40. When the air is circulating, the air circulates in the first ventilation channel 50 and the second ventilation channel 60 respectively, and is connected to the first heat-conducting substrate 10, The second heat conducting substrate 30, the first heat dissipation fin 20 and the second heat dissipation fin 40 are in contact, thereby increasing the contact area between the air and the heat dissipation device, thereby improving the heat dissipation effect. In addition, the second heat-conducting substrate 30 and the second heat-dissipating fins 40 are added to form the upper and lower layers of ventilation effect, which strengthens the convective heat exchange capacity of the heat sink and improves the heat dissipation efficiency of the heat sink.
继续参考图4及图5，在本公开实施例提供的散热装置中，第一导热基板10上位于第二导热基板30的垂直投影外的部分设置有多个第三散热翅片70。如图5中所示，在第一导热基板10上设置有第一散热翅片20及第三散热翅片70，且第一散热翅片20及第三散热翅片70平行设置。在具体设置时，第一散热翅片20与第二散热翅片40为一体结构，此时第二导热基板30可以看做是多个连接相邻的第一散热翅片20的连接板。在具体连接时可以采用焊接的方式将连接板与散热翅片固定连接。Continuing to refer to FIGS. 4 and 5, in the heat dissipation device provided by the embodiment of the present disclosure, a plurality of third heat dissipation fins 70 are provided on the portion of the first heat conduction substrate 10 outside the vertical projection of the second heat conduction substrate 30. As shown in FIG. 5, a first heat dissipation fin 20 and a third heat dissipation fin 70 are provided on the first heat conducting substrate 10, and the first heat dissipation fin 20 and the third heat dissipation fin 70 are arranged in parallel. In the specific arrangement, the first heat dissipation fin 20 and the second heat dissipation fin 40 are an integral structure. At this time, the second heat conducting substrate 30 can be regarded as a plurality of connecting plates connecting adjacent first heat dissipation fins 20. In the specific connection, the connecting plate and the heat dissipation fin can be fixedly connected by welding.
如图6及图7所示，图6示出了本公开实施例提供的第三种散热装置， 图7示出了第三种散热装置的端面示意图。As shown in Figs. 6 and 7, Fig. 6 shows a third heat dissipation device provided by an embodiment of the present disclosure, and Fig. 7 shows a schematic end view of the third heat dissipation device.
该散热装置包括一个第一导热基板10，该第一导热基板10用于与基站固定连接，且基站产生的热量首先传递到第一导热基板10上。继续参考图6，在图6中，本公开实施例提供的第一导热基板10为矩形基板，但是应当理解的是本公开实施例提供的第一导热基板10不仅限于图6中所示的矩形基板，其可以采用其他形状的基板，如椭圆形、正方形或者菱形等不同形状的基板，只需要跟基站需要散热的区域匹配即可。对于本公开实施例提供的第一导热基板10的材质可以选择铜、铝等常见的导热金属，在此不做限定。The heat dissipation device includes a first heat-conducting substrate 10, which is used to be fixedly connected to the base station, and the heat generated by the base station is first transferred to the first heat-conducting substrate 10. Continuing to refer to FIG. 6, in FIG. 6, the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is a rectangular substrate, but it should be understood that the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is not limited to the rectangular shape shown in FIG. The substrate, which can use other shapes of substrates, such as elliptical, square, or diamond-shaped substrates of different shapes, only needs to match the area where the base station needs to dissipate heat. For the material of the first thermally conductive substrate 10 provided by the embodiments of the present disclosure, common thermally conductive metals such as copper and aluminum can be selected, which is not limited herein.
继续参考图6，本公开实施例提供的散热装置还包括第二导热基板30，在图6中，第二导热基板30与第一导热基板10形状及尺寸完全相同，但是在本公开实施例不限定第二导热基板30的具体形状尺寸。在具体设置第二导热基板30时，第二导热基板30与第一导热基板10之间间隔有一定距离的间隙，且第一导热基板10与第二导热基板30之间通过多个第一散热翅片20固定连接起来。其中，每个第一散热翅片20一侧与第一导热基板10固定连接，另一侧与第二导热基板30固定连接，具体的固定方式可以采用焊接的方式或者通过螺纹连接件(螺栓或螺钉)进行连接；并且在连接时，第一散热翅片20与第一导热基板10及第二导热基板30均导热连接。继续参考图6，多个第一散热翅片20之间间隔排列，且多个第一散热翅片20将第一导热基板10与第二导热基板30之间的间隙分割成多个通风通道。该通风通道的两端开口，其中的一个开口为进风口，另一个开口为出风口，如图6中的箭头所示，该箭头示出了一种具体的空气流动方向，冷的空气从下方进入到通风通道，之后从上方的出风口流出。当然也可以冷的空气从上方进入通风通道，之后从下方的出风口流出。通过采用第一导热基板10、第二导热基板30以及第一散热翅片20围成通风通道，为方便描述将其命名为第一通风通道50。冷空气在第一通风通道50内空气自然对流换热能力，增加了散热效果，且由于第一通风通道50为筒状结构，冷空气在吸热后会相成高温的低压气体，从而在第一通风通道50内形成虹吸效果，提高空气的流动性，进而提高散热效果。Continuing to refer to FIG. 6, the heat dissipation device provided by the embodiment of the present disclosure further includes a second thermally conductive substrate 30. In FIG. 6, the second thermally conductive substrate 30 has exactly the same shape and size as the first thermally conductive substrate 10, but the embodiment of the present disclosure does not The specific shape and size of the second thermally conductive substrate 30 are defined. When the second thermally conductive substrate 30 is specifically set, there is a gap between the second thermally conductive substrate 30 and the first thermally conductive substrate 10, and the first thermally conductive substrate 10 and the second thermally conductive substrate 30 pass through a plurality of first heat dissipation The fins 20 are fixedly connected. Among them, one side of each first heat dissipation fin 20 is fixedly connected to the first heat-conducting substrate 10, and the other side is fixedly connected to the second heat-conducting substrate 30. The specific fixing method can be welding or threaded connectors (bolts or Screw) for connection; and during connection, the first heat dissipation fin 20 is thermally connected to the first thermally conductive substrate 10 and the second thermally conductive substrate 30. 6, the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat-conducting substrate 10 and the second heat-conducting substrate 30 into a plurality of ventilation channels. The two ends of the ventilation channel are open. One of the openings is the air inlet and the other is the air outlet. As shown by the arrow in Figure 6, the arrow shows a specific air flow direction. The cold air flows from below. Enter into the ventilation channel, and then flow out from the upper air outlet. Of course, cold air can also enter the ventilation channel from above, and then flow out from the air outlet below. The first heat-conducting substrate 10, the second heat-conducting substrate 30 and the first heat dissipation fins 20 are used to enclose a ventilation channel, which is named the first ventilation channel 50 for the convenience of description. The cold air in the first ventilation passage 50 has the natural convection heat exchange capacity, which increases the heat dissipation effect. And because the first ventilation passage 50 is a cylindrical structure, the cold air will become a high-temperature low-pressure gas after absorbing heat. A siphon effect is formed in a ventilation channel 50 to improve the fluidity of the air, thereby improving the heat dissipation effect.
在本公开实施例提供的第二导热基板30可以采用一个整体的板状结构，也可以采用在第二导热基板上设置多个镂空结构，且每个镂空结构与第一通风通道连通。如每个第一通风通道对应多个镂空结构，且多个镂空结构沿第一通风通道的长度方向排列。由于第一通风通道的虹吸效果，外部的冷空气可以通过镂空结构补充到第一通风通道内，提高了散热效果。The second heat-conducting substrate 30 provided in the embodiment of the present disclosure may adopt an integral plate-like structure, or it may adopt a plurality of hollow structures on the second heat-conducting substrate, and each hollow structure is connected to the first ventilation channel. For example, each first ventilation channel corresponds to a plurality of hollow structures, and the plurality of hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, the external cold air can be supplemented into the first ventilation channel through the hollow structure, which improves the heat dissipation effect.
继续参考图6及图7，在第二导热基板30背离第一导热基板10的一面设置有多个第二散热翅片40。且多个第二散热翅片40的间隔设置，且第二散热翅片40之间间隔的间隙形成另外的一个通风通道。在图6中，第一散热翅片20及第二散热翅片40均采用平直的散热翅片，且第二散热翅片40的长度方向相对第一导热基板10的长度方向相同，并且在具体设置第一散热翅片20与第二散热翅片40时，如图7中所示，第一散热翅片20与第二散热翅片40交错设置。在具体散热时，空气分别流经第一通风通道50及第二通风通道60，从基站上传递过来的热量传递到第一导热基板10，并通过第一散热翅片20传递到第二导热基板30，第二导热基板30再将热量传递到第二散热翅片40，在空气流通时，空气分别在第一通风通道50及第二通风通道60中流通，并分别与第一导热基板10、第二导热基板30、第一散热翅片20及第二散热翅片40接触，从而增大了空气与散热装置的接触面积，进而提高了散热效果。并且通过增加的第二导热基板30及第二散热翅片40，形成上下两层通风效果，加强了散热装置对流换热能力，提高了散热装置的散热效率。此外，由于第一散热翅片20与第二散热翅片40之间交错设置，从而可以增大热传递的效果。Continuing to refer to FIGS. 6 and 7, a plurality of second heat dissipation fins 40 are provided on the side of the second heat conducting substrate 30 facing away from the first heat conducting substrate 10. Moreover, the plurality of second heat dissipation fins 40 are arranged at intervals, and the gap between the second heat dissipation fins 40 forms another ventilation channel. In FIG. 6, the first heat dissipation fin 20 and the second heat dissipation fin 40 are both straight heat dissipation fins, and the length direction of the second heat dissipation fin 40 is the same as the length direction of the first heat conducting substrate 10, and When the first heat dissipation fins 20 and the second heat dissipation fins 40 are specifically arranged, as shown in FIG. 7, the first heat dissipation fins 20 and the second heat dissipation fins 40 are arranged alternately. In the specific heat dissipation, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively, and the heat transferred from the base station is transferred to the first thermally conductive substrate 10, and is transferred to the second thermally conductive substrate through the first heat dissipation fins 20 30. The second heat-conducting substrate 30 then transfers heat to the second heat-radiating fin 40. When the air is circulating, the air circulates in the first ventilation channel 50 and the second ventilation channel 60 respectively, and is connected to the first heat-conducting substrate 10, The second heat conducting substrate 30, the first heat dissipation fin 20 and the second heat dissipation fin 40 are in contact, thereby increasing the contact area between the air and the heat dissipation device, thereby improving the heat dissipation effect. In addition, the second heat-conducting substrate 30 and the second heat-dissipating fins 40 are added to form the upper and lower layers of ventilation effect, which strengthens the convective heat exchange capacity of the heat sink and improves the heat dissipation efficiency of the heat sink. In addition, since the first heat dissipation fins 20 and the second heat dissipation fins 40 are arranged alternately, the effect of heat transfer can be increased.
本公开实施例还提供了一种基站，该基站包括设备，以及设置在设备上的上述任一项的散热装置。在上述技术方案中，通过采用第一导热基板10、第二导热基板30以及第一散热翅片20围成通风通道，在通风通道内空气自然对流换热能力，增加了散热效果。在具体设置时，该第一导热基板10可以为设备的壳体。The embodiment of the present disclosure also provides a base station, which includes a device and any one of the above-mentioned heat dissipation devices provided on the device. In the above technical solution, by using the first heat-conducting substrate 10, the second heat-conducting substrate 30, and the first heat dissipation fins 20 to enclose the ventilation channel, the air in the ventilation channel has a natural convection heat exchange capacity, which increases the heat dissipation effect. In a specific setting, the first heat-conducting substrate 10 may be a housing of a device.
以上，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此， 任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以权利要求的保护范围为准。The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art can easily conceive of changes or substitutions within the technical scope disclosed in the present disclosure, which shall cover Within the protection scope of this disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims (11)

  1. 一种散热装置，其中，包括：第一导热基板，以及与所述第一导热基板间隔设置的第二导热基板；其中，所述第一导热基板及所述第二导热基板之间设置有多个第一散热翅片，且每个第一散热翅片分别与所述第一导热基板及所述第二导热基板导热连接；所述多个第一散热翅片将所述第一导热基板与所述第二导热基板之间的间隙分割成多个通风通道；A heat dissipation device, comprising: a first heat-conducting substrate, and a second heat-conducting substrate spaced apart from the first heat-conducting substrate; wherein a plurality of heat-conducting substrates are arranged between the first heat-conducting substrate and the second heat-conducting substrate. First heat dissipation fins, and each first heat dissipation fin is thermally connected to the first heat conducting substrate and the second heat conducting substrate; the plurality of first heat dissipation fins connect the first heat conducting substrate to The gap between the second thermally conductive substrates is divided into a plurality of ventilation channels;
    所述第二导热基板背离所述第一导热基板的一面设置有多个第二散热翅片。A plurality of second heat dissipation fins are provided on the side of the second heat conducting substrate facing away from the first heat conducting substrate.
  2. 根据权利要求1所述的散热装置，其中，所述第一散热翅片的长度方向与所述第二散热翅片的长度方向呈设定夹角。The heat dissipation device according to claim 1, wherein the length direction of the first heat dissipation fin and the length direction of the second heat dissipation fin form a set angle.
  3. 根据权利要求2所述的散热装置，其中，所述第一散热翅片的长度方向与所述第一导热基板的长度方向相同；3. The heat dissipation device according to claim 2, wherein the length direction of the first heat dissipation fin is the same as the length direction of the first heat conducting substrate;
    所述第二散热翅片的长度方向相对所述第一导热基板的长度方向倾斜。The length direction of the second heat dissipation fin is inclined with respect to the length direction of the first heat conducting substrate.
  4. 根据权利要求1所述的散热装置，其中，所述第二导热基板在所述第一导热基板上的垂直投影位于所述第一导热基板内。The heat dissipation device according to claim 1, wherein the vertical projection of the second thermally conductive substrate on the first thermally conductive substrate is located in the first thermally conductive substrate.
  5. 根据权利要求4所述的散热装置，其中，所述第一导热基板上位于所述第二导热基板的垂直投影外的部分设置有多个第三散热翅片。4. The heat dissipation device according to claim 4, wherein a portion of the first heat conduction substrate outside the vertical projection of the second heat conduction substrate is provided with a plurality of third heat dissipation fins.
  6. 根据权利要求4所述的散热装置，其中，所述第三散热翅片与所述第一散热翅片平行。The heat dissipation device of claim 4, wherein the third heat dissipation fin is parallel to the first heat dissipation fin.
  7. 根据权利要求4所述的散热装置，其中，所述第一散热翅片与所述第二散热翅片为一体结构；The heat dissipation device according to claim 4, wherein the first heat dissipation fin and the second heat dissipation fin are an integral structure;
    所述第二导热基板包括多个连接相邻的所述第一散热翅片的连接板。The second heat-conducting substrate includes a plurality of connecting plates connecting the adjacent first heat dissipation fins.
  8. 根据权利要求1所述的散热装置，其中，所述第一导热基板与所述第二导热基板等大。5. The heat dissipation device of claim 1, wherein the first heat-conducting substrate and the second heat-conducting substrate are the same size.
  9. 根据权利要求8所述的散热装置，其中，所述第一散热翅片与所述第二散热翅片交错设置。8. The heat dissipation device according to claim 8, wherein the first heat dissipation fins and the second heat dissipation fins are staggered.
  10. 根据权利要求1～9任一项所述的散热装置，其中，所述第二导热基板上设置有多个镂空结构，且每个镂空结构与所述通风通道连通。The heat dissipation device according to any one of claims 1-9, wherein a plurality of hollow structures are provided on the second heat conducting substrate, and each hollow structure is in communication with the ventilation channel.
  11. 一种基站，其中，包括设备，以及设置在所述设备上的如权利要求1～10任一项所述的散热装置。A base station, which includes equipment, and the heat dissipation device according to any one of claims 1 to 10 arranged on the equipment.
PCT/CN2020/101151 2019-08-15 2020-07-09 Heat dissipation device, and base station WO2021027454A1 (en)

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CN201910753399.3A CN112399771A (en) 2019-08-15 2019-08-15 Heat dissipation device and base station

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104768355A (en) * 2015-03-24 2015-07-08 华为技术有限公司 Cooling device, radio remote unit, base station module, communication base station and system
CN205030024U (en) * 2015-08-12 2016-02-10 中兴通讯股份有限公司 Cooling fin
CN105722379A (en) * 2016-04-29 2016-06-29 华为技术有限公司 Radiating system and communication equipment equipped with same
CN208333161U (en) * 2018-03-23 2019-01-04 中兴通讯股份有限公司 A kind of radiating fin and radiator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104768355A (en) * 2015-03-24 2015-07-08 华为技术有限公司 Cooling device, radio remote unit, base station module, communication base station and system
CN205030024U (en) * 2015-08-12 2016-02-10 中兴通讯股份有限公司 Cooling fin
CN105722379A (en) * 2016-04-29 2016-06-29 华为技术有限公司 Radiating system and communication equipment equipped with same
CN208333161U (en) * 2018-03-23 2019-01-04 中兴通讯股份有限公司 A kind of radiating fin and radiator

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