TW201228503A - Method of manufacturing printed circuit board using photosensitive insulator - Google Patents

Abstract

The present invention relates to a method of manufacturing a printed circuit board, more particularly, to a method of manufacturing a printed circuit board using a photosensitive insulator capable of simply forming a circuit pattern by performing exposure and development processes of a photosensitive insulator through laser direct imaging. The present invention provides a method of manufacturing a printed circuit board including: laminating a second insulator on a first insulator; opening a circuit region by developing the second insulator after exposing the second insulator through laser direct imaging; and plating a conductive material on the opened circuit region.

Description

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TW7885PA 六、發明說明： 【發明所屬之技術領域】 本發明係關於-種用以製造印刷電路板的方法，且特 別是一種使用能形成電路圖形的感光絕緣體 (photosensitive insulator)來製造印刷電路板的方法， 其中電路圖形的形成係透過雷射直接成像（laser direct imaging )來執行感光絕緣體的曝光以及顯影製程。 【先前技術】 請參照第1圖，用以製造印刷電路板的傳統方法包括 下列步驟：在絕緣體（覆銅箔層壓板（c〇pper clad laminate ) 或者軟性覆銅箔層壓板）1中加工一穿孔（thr〇ughh〇ie， PTH) 2 ;將銅la鍍製（plating)於具有穿孔2的絕緣體以 填滿穿孔2 ;在鍍有銅的絕緣體1上層壓乾膜3 ( dry film, DF);在層壓的乾膜3上置放電路構圖底片（artwork film) (未繪示）之後，透過輻照紫外光線執行曝光（exposure) 以形成電路映像（circuit image);透過使用顯影機執行顯 影（development)以移除在曝光步驟中未固化（uncured) 的部分（未受光照的部分）；透過使用蝕刻溶液來執行蝕 刻’以移除在絕緣體上以銅鍍製部分的其中一部分，其中 乾犋3並不會被移除；以及透過剝離液（stripping so〖uti〇n) 來移除乾膜3，乾膜3是在蝕刻步驟中用作保護膜。電路 圖形4係透過這個製程來形成。 也就是說，在習知技藝中，電路圖形形成在絕緣體上 的方式為：絕緣體完全以銅來鍍製，且絕緣體以銅鑛製的 201228503TW7885PA VI. Description of the Invention: [Technical Field] The present invention relates to a method for manufacturing a printed circuit board, and more particularly to a printed circuit board using a photosensitive insulator capable of forming a circuit pattern The method, wherein the formation of the circuit pattern is performed by laser direct imaging to perform exposure and development processes of the photosensitive insulator. [Prior Art] Referring to Fig. 1, a conventional method for manufacturing a printed circuit board includes the following steps: processing an insulator (c〇pper clad laminate or soft copper clad laminate) 1 Perforation (thr〇ughh〇ie, PTH) 2; plating copper la to an insulator having perforations 2 to fill the perforations 2; laminating dry film 3 (dry film, DF) on the copper-plated insulator 1 After placing a circuit pattern art film (not shown) on the laminated dry film 3, exposure is performed by irradiating ultraviolet light to form a circuit image; development is performed by using a developing machine (development) to remove an uncured portion (unexposed portion) in the exposure step; performing etching by using an etching solution to remove a portion of the portion of the insulator that is plated with copper, wherein犋3 is not removed; and the dry film 3 is removed by a stripping so uti〇, which is used as a protective film in the etching step. The circuit pattern 4 is formed by this process. That is to say, in the prior art, the circuit pattern is formed on the insulator in such a manner that the insulator is completely plated with copper and the insulator is made of copper ore 201228503

TW7885PA 部分除了電路圖形要形成的部分之外，其他部分都會被钮 刻’而電路圖形的形成係透過使用乾膜，乾膜係用作為保 護膜。 ，外夕層印刷電路板係透過層壓複數個透過上述習 知技藝印刷的電路板、加熱、以及以真空壓機（μ⑶細 press)擠壓層壓的印刷電路板等等來形成。 然而，這種製造方法的限制在於無法製造精密電路， 且製造加工的能力也因銅鐘層的厚度以及電路、線距（circuit pitch)而受到限制。 【發明内容】 為了克服上述的問題，本發明提供一種印刷電路板的 製造方法，透過可受曝光與顯影的感光絕緣體，能精密地 形成内層電路線距。 進一步地’本發明另提供一種印刷電路板的製造方 法’透過直接地在感光絕緣體上形成電路、執行導電材料 的全板鍍製（Panel Plating)、以及打磨（grinding)鍍製過的 導電材料，能製造精密電路。 依據本發明的其中一方面’提供一種製造印刷電路板 的方法，包括：在第一絕緣體之上層壓第二絕緣體；在 使第二絕緣體曝光之後透過使第二絕緣體顯影來暴露電 路區域，其中第二絕緣體的曝光及顯影係透過雷射直接 成像來進行；以及在暴露的電路區域上鍍製導電材料。 在此，第二絕緣體可以是感光絕緣體。In addition to the portion of the circuit pattern to be formed, the TW7885PA portion is stamped and the circuit pattern is formed by using a dry film, which is used as a protective film. The outer layer printed circuit board is formed by laminating a plurality of circuit boards printed by the above-mentioned conventional techniques, heating, and pressing a laminated printed circuit board by a vacuum press (μ (3) fine press). However, this manufacturing method is limited in that it is impossible to manufacture a precision circuit, and the manufacturing process capability is also limited by the thickness of the copper clock layer and the circuit and circuit pitch. SUMMARY OF THE INVENTION In order to overcome the above problems, the present invention provides a method of manufacturing a printed circuit board capable of precisely forming an inner layer circuit pitch through a photosensitive insulator which can be exposed and developed. Further, the present invention further provides a method of manufacturing a printed circuit board by forming a circuit directly on a photosensitive insulator, performing a plate plating of a conductive material, and polishing a plated conductive material. Can manufacture precision circuits. According to one aspect of the invention, a method of manufacturing a printed circuit board includes: laminating a second insulator over a first insulator; exposing the circuit region by exposing the second insulator after exposing the second insulator, wherein The exposure and development of the two insulators is performed by direct laser imaging; and the conductive material is plated over the exposed circuit areas. Here, the second insulator may be a photosensitive insulator.

S 4 201228503S 4 201228503

TW7885PA 進一步地’用以製造印刷電路板的方法更可包括， 在暴路電路區域之後，執行表面沾污去除（desinearing)將 沾汙從暴露的電路區域移除。 進一步地’用以製造印刷電路板的方法更可包括， 在層壓第二絕緣體之前，在第一絕緣體之中加工製造穿孔 以及將導電材料鍍製於穿孔及第一絕緣體以填滿穿孔；透 過在鐘有導電材料的第一絕緣體上層壓乾膜（dry film)、 轉印（transferring )電路圖形（cjrcuit pattern )的形狀、以 及執行曝光及顯影’以製備電路映像（circuitimage);以 及在製有電路映像的第一絕緣體上透過蝕刻導電材料與移 除乾膜，來製造電路。 進一步地，鍍製在第一絕緣體之上的導電材料係為絕 緣金屬且以薄膜型態鍍製。 進一步地’鍍製在該第一絕緣體之上的該導電材料係 為銅（Cu )。 依據本發明的另一方面’提供一種製造印刷電路板的 方法’包括：在一預先處理過的印刷電路板之表面上設置 (apply)第二絕緣體；透過以雷射加工塗抹於印刷電路板 上的第二絕緣體以形成通孔（viahole);以導電材料鑛製 於通孔以及第三絕緣體以填滿通孔；在第三絕緣體上層壓 第四絕緣體；在使第四絕緣體曝光之後透過使第四絕緣體 顯影暴露電路區域’其中第四絕緣體的曝光及顯影係透過 雷射直接成像來進行；以及在暴露的電路區域上鍍製導電 材料。 201228503The TW7885PA further' method for fabricating a printed circuit board may further include performing surface contamination removal after the blast circuit area to remove contamination from the exposed circuit area. Further, the method for manufacturing a printed circuit board may further include: processing a through hole in the first insulator and plating the conductive material on the through hole and the first insulator to fill the through hole before laminating the second insulator; Laminating a dry film, a shape of a transfer circuit pattern, and performing exposure and development on a first insulator having a conductive material to prepare a circuit image; The first insulator of the circuit image is fabricated by etching the conductive material and removing the dry film. Further, the conductive material plated on the first insulator is an insulating metal and is plated in a film state. Further, the conductive material plated on the first insulator is copper (Cu). According to another aspect of the present invention, [providing a method of manufacturing a printed circuit board" includes: applying a second insulator on a surface of a pre-processed printed circuit board; and applying a laser to a printed circuit board by laser processing a second insulator to form a via hole; a conductive material made of a conductive material in the via hole and a third insulator to fill the via hole; a fourth insulator laminated on the third insulator; and the fourth insulator is exposed after the fourth insulator is exposed The four insulator development exposes the circuit region 'where the exposure and development of the fourth insulator is performed by direct laser imaging; and the conductive material is plated over the exposed circuit regions. 201228503

TW7885PA 在此，製造印刷電路板的方法更可包括：在層壓第四 絕緣體之前，透過在第三絕緣體上層壓乾膜、轉印電路圖 形的形狀、以及執行曝光及顯影’以製備電路映像；以及 透過在帶有電路映像的第三絕緣體上蝕刻導電材料、並移 除乾膜，以額外層壓電路於印刷電路板。 進一步地，第三絕緣體係為熱固阻焊油墨 (thermosetting solder resist ink) ° 進一步地，第四絕緣體係為感光絕緣體。 為了對本發明之上述及其他方面有更佳的暸解，下文 特舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 以下，將參照附圖來詳述本發明的較佳實施例。在描 述本發明之前，本說明書及申請專利範圍所使用的詞語或 字詞不應解譯為受傳統的或字典的意義所限制，而應解譯 為具有本發明所屬技術精神的意義及概念，而其解譯所基 於的法則是發明者可適當地定義詞語的概念來以最好的方 式來描述他/她的發明。 因此，本發明在實施例中所顯示的配置以及圖式是具 代表性實施例的範例，而並不代表本發明所有的技術精 神。因此，可以了解的是，當提交本申請時，替換這些設 置的多種均等設置或更動是可能存在的。 以下’依據本發明一實施例來製造印刷電路板的方法 將參照第2至11圖來描述。 201228503 1 W/δδ^ΚΑ 第2圖係繪示依據本發明實施例之印刷電路板的製造 方法之流程圖，而第3至11圖則繪示依據本發明實施例之 印刷電路板之剖面視圖。請參照第3至11圖，其等係繪示 了第一絕緣體10、穿孔U、第二絕緣體2〇、電路區域21、 導電材料30、乾膜40、第三絕緣體5〇以及通孔51。 首先’製造單一（unit)印刷電路板的方法（S200) 將參照第6至9圖來描述。 首先，在第一絕緣體1〇上層壓第二絕緣體2〇(S2i〇)， 透過使第二絕緣體2〇曝光以及顯影來暴露電路區域 21，其中第二絕緣體的曝光以及顯影係透過雷射直接成 像來進行（S220)，以及在暴露的電路區域21上鍍製導 電材料30 ( S230)。另外’在暴露電路區域21之後，更 可包括將沾汙從暴露的電路區域移除的表面沾污去除步驟 (S230)。進一步地，在鍍製導電材料之後可較佳地透過 打磨導電材料來平坦化導電材料（S240)。 在此，第一絕緣體1〇為用以保護及維持印刷電路板 之電絕緣性、機械強度與剛性（stiffness )以及空間穩定性 的材料。第一絕緣體10可以是覆銅箔層壓板（c〇卯erclad laminate，CCL)或軟性覆鋼荡層壓板（flexiblec〇pperciad laminate, FCCL)、或其他均等物。 又，對第二絕緣體20而言，其係層壓於位在内層的 第-絕緣體1G上且以感光材料製成，並可曝照在光線如雷 射及紫外光線下，而選擇性地被固化（cured)。 進-步地，第二絕緣體2〇包括做為主要樹脂的反應 改性丙烯酸樹脂卜⑽加则峨化咖⑹小作用為 201228503TW7885PA Here, the method of manufacturing a printed circuit board may further include: preparing a circuit image by laminating a dry film on the third insulator, a shape of the transfer circuit pattern, and performing exposure and development before laminating the fourth insulator; And additionally laminating the circuit to the printed circuit board by etching the conductive material on the third insulator with the circuit image and removing the dry film. Further, the third insulating system is a thermosetting solder resist ink. Further, the fourth insulating system is a photosensitive insulator. In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in the accompanying drawings. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Before describing the present invention, the words or words used in the specification and claims should not be interpreted as being limited by the meaning of the conventional or dictionary, but should be interpreted as having the meaning and concept of the technical spirit of the present invention. The algorithm on which the interpretation is based is that the inventor can properly define the concept of the word to describe his/her invention in the best way. Therefore, the configurations and drawings shown in the embodiments of the present invention are examples of representative embodiments, and do not represent all the technical spirits of the present invention. Thus, it will be appreciated that a variety of equal settings or changes to replace these settings may be present when submitting this application. Hereinafter, a method of manufacturing a printed circuit board according to an embodiment of the present invention will be described with reference to Figs. 201228503 1 W/δδ^ΚΑ FIG. 2 is a flow chart showing a method of manufacturing a printed circuit board according to an embodiment of the present invention, and FIGS. 3 to 11 are cross-sectional views showing a printed circuit board according to an embodiment of the present invention. . Referring to Figures 3 through 11, the first insulator 10, the via U, the second insulator 2, the circuit region 21, the conductive material 30, the dry film 40, the third insulator 5, and the via 51 are shown. First, the method of manufacturing a unit printed circuit board (S200) will be described with reference to Figs. 6 to 9. First, a second insulator 2〇 is laminated on the first insulator 1〇, and the circuit region 21 is exposed by exposing and developing the second insulator 2, wherein the exposure and development of the second insulator are directly imaged by laser. The process proceeds to (S220), and the conductive material 30 is plated on the exposed circuit region 21 (S230). Further, after exposing the circuit region 21, a surface contamination removing step of removing the stain from the exposed circuit region may be further included (S230). Further, the conductive material may be planarized by polishing the conductive material after plating the conductive material (S240). Here, the first insulator 1 is a material for protecting and maintaining electrical insulation, mechanical strength and stiffness, and space stability of the printed circuit board. The first insulator 10 may be a copper clad laminate (CCL) or a flexible c〇pperciad laminate (FCCL), or other equivalent. Further, for the second insulator 20, it is laminated on the first insulator 1G of the inner layer and made of a photosensitive material, and can be exposed to light such as laser light and ultraviolet light, and is selectively Cured. Further, the second insulator 2 includes a reaction as a main resin, a modified acrylic resin (10) plus a simmering coffee (6) small effect for 201228503

TW7885PA 固化劑（curing agent)且作為主要成分的環氧樹脂（ep0Xy resin )、以及做為輔助成分丙烯酸單體（acrylic monomer)、 無機填料（inorganic filler)、聚合引發劑（p〇iymerizati〇n initiator)、加速劑（accelerat〇r)、溶劑以及其他添加物。 舉例來說’可使用太陽油墨（Taiyo Ink)股份有限公司製造的 AUS-410系列產品。 於此實施例中，電路區域21係透過在使第二絕緣體 20曝光之後使第二絕緣體2〇顯影而被暴露，其中第二絕 緣體的曝光及顯影係透過雷射直接成像來進行。 又’暴露的電路區域21被導電材料3〇所填滿。在 此實施例中，導電材料3〇可為包括銅的材料，其中鋼係 用作電鍵材料。 另外如第3至5圖所示，本發明可包括在絕緣體 (CCL’FCCL)上形成基礎電路圖形以製造單一印刷電 路板的製冑目為顧慮到加工後的纟面粗M：或需求的开》 狀並沒有被準確地於透過雷射直接成像執行曝光及顯影 製程之時形成，因此雷射直接成像係在一預製程 (pre-process)之後實行，其中預製程係透過減少鍍製 銅的厚度來執行，也就是減少依據傳統方法的電路圖形 之厚度。 第3至5 _描述了在絕緣體上形成電路圖形的 (S100)。在穿孔η (ΡΤΗ)被加工製造於第一絕緣體 10中之後將導電材料30鍍製於穿孔中以及第一絕 10之上以填滿穿孔（S11G)。電路映像係透過下列步驟而 被製備：在第〜絕緣體10之上層壓乾膜40,轉印電路圖TW7885PA curing agent and epoxy resin (ep0Xy resin) as a main component, and as an auxiliary component, acrylic monomer, inorganic filler, polymerization initiator (p〇iymerizati〇n initiator) ), accelerator (accelerat〇r), solvents and other additives. For example, the AUS-410 series manufactured by Taiyo Ink Co., Ltd. can be used. In this embodiment, the circuit region 21 is exposed by developing the second insulator 2 after exposing the second insulator 20, wherein the exposure and development of the second insulator are performed by direct laser imaging. Further, the exposed circuit region 21 is filled with a conductive material 3?. In this embodiment, the conductive material 3A may be a material including copper, wherein the steel is used as a key material. Further, as shown in FIGS. 3 to 5, the present invention may include forming a basic circuit pattern on an insulator (CCL'FCCL) to manufacture a single printed circuit board, in consideration of the processed rough surface M: or required. The open shape is not accurately formed during the exposure and development process by direct laser imaging, so laser direct imaging is performed after a pre-process, in which the pre-process is reduced by copper plating. The thickness is performed, that is, the thickness of the circuit pattern according to the conventional method is reduced. The third to fifth inventions describe the formation of a circuit pattern on the insulator (S100). After the through hole η (ΡΤΗ) is processed into the first insulator 10, the conductive material 30 is plated in the through hole and over the first spacer 10 to fill the through hole (S11G). The circuit image is prepared by laminating a dry film 40 on the first insulator 10, a transfer circuit diagram

S 8 201228503S 8 201228503

TW7885PA 形的形狀，以及執行曝光及顯影，其中導 製於第一絕緣體10 (S120)。透過在製備蕾’係已鍍 ::緣體!。上#刻導電材料30、與移除乾膜：映= γ有電路的第一絕緣體10(S130)。以這 -絕緣體10可用在單一印刷電路板的製造的第 在此’鍍製在第一絕緣體10之上的導带 地為以薄膜型態鐘製的絕緣金屬。導電材料車父佳 ^)。也就是說’印刷電路板的基礎電路細薄膜鋼製 第二種Γ製造多層印刷電路板的方法將參昭 弟及11圖來描述。 ^ 首先，通孔51的形成方式為：在一預 =路板之表面上設置第三絕緣體5〇以及以雷射加工設 俜：ΞΓί板上的第三絕緣體5〇(S31〇)。導電材料3又0 H孔51中以及第三絕緣體5G上以填滿通孔51 。第四絕緣體52係層壓於第三絕緣體5〇上 。電路區域係透過使第四絕緣體曝光及顯影而 Ϊίϊ、’其中第四絕緣體52的曝光及顯影係透過雷射直接 Α進行（S340)。導電材料30係鍍製在暴露的電路區 勹之士（S350)。另外，在暴露電路區域之後，可進一步 t ^ 暴露的電路區域移除沾汙的表面沾汙去除步驟 、4〇) °進一步地’在鍍製導電材料30之後可較佳地透 =打磨導電材料3G來平坦化導電材料3G(S35〇)。在此， =驟S330以及S36〇可透過相同於上述製程之步驟S2i〇 至S240來由j ^ 木執仃’而第二絕緣體以及第四絕緣體52可為相 同的絕緣體且扮演相同角色。 201228503The shape of the TW7885PA shape, as well as performing exposure and development, is guided to the first insulator 10 (S120). Through the preparation of the bud's system has been plated :: edge! The upper conductive material 30 is removed, and the dry film is removed: the first insulator 10 having a circuit of gamma = gamma (S130). In this case, the insulator 10 can be used in the manufacture of a single printed circuit board, and the conductive tape plated on the first insulator 10 is an insulating metal made of a film type. Conductive material car father good ^). That is to say, the basic circuit of the printed circuit board is made of thin film steel. The second method of manufacturing a multilayer printed circuit board will be described by reference to FIG. First, the through hole 51 is formed by providing a third insulator 5 on the surface of the pre-path plate and a third insulator 5 (S31) on the laser plate. The conductive material 3 is further in the 0 hole 51 and the third insulator 5G to fill the through hole 51. The fourth insulator 52 is laminated on the third insulator 5''. The circuit region is subjected to exposure and development of the fourth insulator, and the exposure and development of the fourth insulator 52 are directly performed by laser irradiation (S340). The conductive material 30 is plated in the exposed circuit area (S350). In addition, after exposing the circuit area, the exposed circuit area may be further removed to remove the contaminated surface contamination removal step, 4) further "after plating the conductive material 30, preferably pass through = polishing the conductive material 3G to planarize the conductive material 3G (S35〇). Here, the steps S330 and S36 can be performed by the steps S2i to S240 which are the same as the above process, and the second insulator and the fourth insulator 52 can be the same insulator and play the same role. 201228503

TW7885PA 在此，預先處理過的印刷電路板可為單一印刷電路板 或者多層印刷電路板。也就是說，由於本發明係關於一種 透，=續地在印刷電路板上層壓電路圖形來形成電路圖形 的製造方法，因此所使用的印刷電路板可為單-印刷電路 板或者多層印刷電路板。 第三絕緣體50可為熱固阻焊油墨。一般而言，阻 護印，路板的電路圖形以及維持相鄰電路 接的穩定性。在本發明中，第三絕緣體50例如 相鄰層間的邊界’並作為阻焊劑。然而，在此實 列中，係以阻谭油墨為例來作為層與層之間的邊界。 第四絕緣體52扮演著與上述第二絕緣體 角色’以及層壓於第三絕緣體5〇之 ^ 於:Γ以_製成的第四絕緣體= 透 雷射及U卜紐之曝絲選擇性地固化一 二;=絕二體52包括做為主要樹脂的反應改性丙稀酸 “化劑且作為主要成分的環氧樹脂、以及作 2助=的的丙烯酸單體、無機填料、聚： 連劑、溶劑以及其他添加物。 W加 另外 隹贋Μ第四絕緣體52之前，更可包括 驟：透過在鏡有導電材料的第三絕緣體之 乂 印電路圖形的形狀、以及執行曝光、㈣ ^鵪 像；透過蝕刻在帶有電路映像的第三絕^ 路喊 製造印刷電路板，其中電路传額外、、厂、導電材乘 上，而電路映像係實施於第;在=路板 =步驟S120至S130。本發明可包括在第三 基礎電路圖形以製❹層電路板的步驟。因為考慮到^ 201228503 I w /o〇jr/\ 後的表面粗糙或需求的形狀並沒有被準確地於透過雷射 直接成像執行曝光及顯影製程之時形成，因此雷射直接 成像係在一預製程之後實行，其中預製程係透過減少鍍 銅的厚度來執行，也就是減少依據傳統製造電路圖形方 法的電路圖形之厚度。 透過利用本發明，可提供一種印刷電路板的製造方 法，藉由可受曝光與顯影的感光絕緣體，製造能夠精密地 形成内層電路線距。 進一步地，可提供透過使用一種製造精密電路的方式 來製造印刷電路板的簡單方法，其中製造精密電路的方式 為直接地在感光絕緣體上形成電路，執行導電材料的面板 鍍製，以及打磨鍍製的導電材料。 綜上所述，雖然本發明已以若干較佳實施例揭露與圖 式進行揭露，然其並非用以限定本發明。任何具有通常知 識者，在不脫離本發明之精神和範圍内，當可作各種之更 動與潤飾。因此，本發明之保護範圍當視後附之申請專利 範圍所界定者為準。 【圖式簡單說明】 本發明之一般概念的這些和/或其他之方面及優點將 從下列實施例的描述結合附圖來更加凸顯以及更易於理 解： 第1圖係繪示依據習知技藝來製造印刷電路板的方法 之視圖； 11 201228503TW7885PA Here, the pre-processed printed circuit board can be a single printed circuit board or a multilayer printed circuit board. That is, since the present invention relates to a manufacturing method for forming a circuit pattern by laminating a circuit pattern on a printed circuit board, the printed circuit board used may be a single-printed circuit board or a multilayer printed circuit. board. The third insulator 50 can be a thermoset solder ink. In general, the resist is printed, the circuit pattern of the board is maintained, and the stability of adjacent circuits is maintained. In the present invention, the third insulator 50 is, for example, a boundary between adjacent layers and serves as a solder resist. However, in this embodiment, a tantalum ink is taken as an example to form a boundary between layers. The fourth insulator 52 acts as a second insulator opposite to the above-mentioned second insulator, and a fourth insulator laminated to the third insulator: 第四 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ One or two; = adipose body 52 includes a reaction-modified acrylic acid as a main resin and an epoxy resin as a main component, and an acrylic monomer, an inorganic filler, a poly-linker as a 2 aid = , solvent and other additives. Before adding the fourth insulator 52, the method further includes: cutting the shape of the circuit pattern through the third insulator having the conductive material in the mirror, and performing exposure, (4) Manufacturing a printed circuit board by etching in a third circuit with a circuit image, wherein the circuit transmits an extra, factory, and conductive material, and the circuit image is implemented in the first; in the = board = steps S120 to S130 The present invention may include the step of forming a third circuit pattern to form a germanium circuit board. Because the surface roughness or the required shape after considering ^ 201228503 I w /o〇jr/\ is not accurately transmitted through the laser Direct imaging to perform exposure and display The process is formed at the time of the process, so the laser direct imaging is performed after a pre-process, wherein the pre-process is performed by reducing the thickness of the copper plating, that is, reducing the thickness of the circuit pattern according to the conventional manufacturing circuit pattern method. A method of manufacturing a printed circuit board can be provided, which can precisely form an inner layer circuit pitch by a photosensitive insulator which can be exposed and developed. Further, it is possible to manufacture a printed circuit board by using a method of manufacturing a precision circuit. A simple method in which a precision circuit is fabricated by directly forming a circuit on a photosensitive insulator, performing panel plating of a conductive material, and polishing a plated conductive material. In summary, although the present invention has been implemented in several preferred embodiments The disclosure and the drawings are disclosed, but are not intended to limit the invention. Any one of ordinary skill in the art can make various changes and refinements without departing from the spirit and scope of the invention. It shall be subject to the definition of the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS These and/or other aspects and advantages of the present general inventive concept will be more apparent from the following description of the embodiments in conjunction with the accompanying drawings. FIG. 1 is a diagram showing a printed circuit board according to the prior art. View of the method; 11 201228503

TW7885PA 第2圖係繪示依據本發明一實施例來製造印刷電路板 的方法之流程圖；以及 第3至11圖係繪示依據本發明一實施例來製造印刷 電路板之剖面視圖。 【主要元件符號說明】 1 :絕緣體 la :銅 2 :穿孔 3 :乾膜 4:電路圖形 10 :第一絕緣體 11 :穿孔 20 :第二絕緣體 21 .電路區域 30 :導電材料 40 :乾膜 50 :第三絕緣體 51 :通孔 S100、S110〜S130、S200、S210〜S240、S300、S310〜S360 : 流程步驟TW7885PA Figure 2 is a flow chart showing a method of manufacturing a printed circuit board in accordance with an embodiment of the present invention; and Figures 3 through 11 are cross-sectional views showing the manufacture of a printed circuit board in accordance with an embodiment of the present invention. [Main component symbol description] 1 : Insulator la : Copper 2 : Perforation 3 : Dry film 4 : Circuit pattern 10 : First insulator 11 : Perforation 20 : Second insulator 21 . Circuit region 30 : Conductive material 40 : Dry film 50 : Third insulator 51: through holes S100, S110~S130, S200, S210~S240, S300, S310~S360: process steps

S 12S 12

Claims (1)

201228503 i w /oo^r/\ 七、申請專利範圍： 1. 一種用以製造印刷電路板的方法，包括： 在一第一絕緣體上層壓（laminating) —第二絕緣 體；. 在使該第二絕緣體曝光之後透過使該第二絕緣體 顯影來暴露一電路區域，其中該第二絕緣體的曝光及顯 影係透過雷射直接成像（laser direct imaging)來進行； 以及 在被暴露的該電路區域上鑛製（plating) 一導電材 料。 2. 如專利申請範圍第1項所述之用以製造印刷電路 板的方法，其中該第二絕緣體係為感光絕緣體。 3. 如專利申請範圍第丨項所述之用以製造印刷電路 板的方法’更包括： 在暴露該電路區域之後，執行表面沾污去除 (desmearing)以將沾汙從被暴露的該電路區域移除。 4. 如專利申請範圍第1項所述之用以製造印刷電路 板的方法，其中在層壓該第二絕緣體之前，該方法更包括： 在該第一絕緣體之中加工製造一穿孔（thr〇ugh h〇le， PTH)以及將該導電材料鍍製於該穿孔及該第一絕緣體以 填滿該穿孔； 透過在鍍有該導電材料的該第一絕緣體上層壓一乾膜 (dry fllm )、轉印（transfering ) — 電路圖形（circuit pattern ) c； 13 201228503 IW7885PA 的形狀、及執行曝光及龜旦， ^ ·，、員衫，以製備一電路映像（circuit image);以及 + κ 透k在帶有η玄電路映像的該第一絕緣 材料、並移除該乾膜1於該第—絕緣體上實電 杯二、：申請範圍第4項所述之用以製造印刷電路 一絕緣金屬:以緣體上的該導電材料係為 搞：方圍第5項所述之用以製造印刷電路 中鍍製在該第一絕緣體上的該導電 為 銅（Cu)。 7. —種多層印刷電路板的製造方法，包括： 在一預先處理過的印刷電路板之表面上設 -第三絕緣體； aPP y ) 透過雷射來加工設於該印刷電路板上的該第二 體，以形成一通孔（via h〇ie); 緣 將一導電材料鍍製於該通孔以及該第二 該通孔； 錢體以填滿 在β亥第二絕緣體上層壓一第四絕緣體； 在使該第四絕緣體曝光之後透過使該第四 來暴露一電路區域，其中該第四絕緣體的曝光琢矽 過雷射直接成像來進行；以及 +及顯影係透 在被暴露的s亥電路區域上鑛製該導電材料 8. 如專利申請範圍第7項所述之多；芒’ 製造方法，其中在層壓該第四絕緣體之前\ /刷電路板的 1 °亥方法更包括： 201228503 1 W /δδΟΡΑ 透過在鍵有該導電材料的該第三絕緣體上層壓一乾 膜、轉印一電路圖形的形狀、及執行曝光及顯影，以製備 一電路映像；以及 透過在帶有該電路映像的該第二絕緣體上钱刻該導電 材料、並移除該乾膜，以額外層壓一電路於一印刷電路板。 9. 如專利申請範圍第7項所述之多層印刷電路板的 製造方法，其中該第三絕緣體係為一熱固阻焊油墨 (thermosetting solder resist ink)。 10. 如專利申請範圍第7項所述之多層印刷電路板的 製造方法，其中該第四絕緣體係為一感光絕緣體。 c： 15201228503 iw /oo^r/\ VII. Patent application scope: 1. A method for manufacturing a printed circuit board, comprising: laminating a first insulator - a second insulator; and making the second insulator Exposing a circuit region by exposing the second insulator, wherein exposure and development of the second insulator are performed by laser direct imaging; and mineralizing on the exposed circuit region ( Plating) A conductive material. 2. The method for manufacturing a printed circuit board according to claim 1, wherein the second insulating system is a photosensitive insulator. 3. The method for manufacturing a printed circuit board as described in the scope of the third aspect of the patent application, further comprising: performing surface desmearing after exposing the circuit region to contaminate the exposed circuit region Remove. 4. The method for manufacturing a printed circuit board according to claim 1, wherein before laminating the second insulator, the method further comprises: processing a perforation in the first insulator (thr〇) Hugh h〇le, PTH) and plating the conductive material on the through hole and the first insulator to fill the through hole; by laminating a dry film (dry fllm) on the first insulator plated with the conductive material Transferning — circuit pattern c; 13 201228503 IW7885PA shape, and performing exposure and turtle, ^ ·,, shirt, to prepare a circuit image; and + κ through k The first insulating material having the η 玄 circuit image, and removing the dry film 1 on the first insulator, the solid cup 2, the application of the fourth item of claim 4 for manufacturing a printed circuit, an insulating metal: The electrically conductive material on the body is the copper (Cu) which is plated on the first insulator for manufacturing the printed circuit as described in Item 5 of the square. 7. A method of manufacturing a multilayer printed circuit board, comprising: providing a third insulator on a surface of a pre-processed printed circuit board; aPP y) processing the first portion disposed on the printed circuit board by laser a second body to form a via hole; a hole is plated with a conductive material in the through hole and the second through hole; the body is filled with a fourth insulator laminated on the second insulator After exposing the fourth insulator, exposing a circuit region by exposing the fourth, wherein the exposure of the fourth insulator is directly imaged by laser; and + and the developing system are exposed to the exposed circuit The electrically conductive material is mineralized on the area. 8. The method according to the seventh aspect of the patent application; the manufacturing method, wherein the 1 ° method of the brush circuit board before laminating the fourth insulator further comprises: 201228503 1 W /δδΟΡΑ is prepared by laminating a dry film on the third insulator to which the conductive material is bonded, transferring a shape of a circuit pattern, and performing exposure and development to prepare a circuit image; and transmitting the circuit Like the second insulator on the engraved money conductive material, and removing the dry film laminated to a circuit on an additional printed circuit board. 9. The method of manufacturing a multilayer printed circuit board according to claim 7, wherein the third insulating system is a thermosetting solder resist ink. 10. The method of manufacturing a multilayer printed circuit board according to claim 7, wherein the fourth insulating system is a photosensitive insulator. c: 15