200915912 九、發明說明 【發明所屬之技術領域】 本發明係爲有關有機電激發光顯示器等之有機電激發 光裝置之製造裝置。 【先前技術】 有機電激發光材料係因經由水等或氧而造成化學性地 劣化，而以提案有在遮斷從外部環境氣體之作業室內，進 行經由噴墨印刷之有機電激發光材料之塗佈工程，經由吐 出裝置之密封材料的塗佈工程，更加地，基板的貼合工程 等之工程方法。 對於在進行各工程之前，係將作業室的內部，進行排 氣，及/或於作業室的內部，導入乾燥氣體，由乾燥氣體 置換作業室的內部空間，除去水或氧等之不純物氣體。 但，作業室的內部，或進行乾燥氣體的導入，不純物 氣體係亦附著殘留於作業室的內壁面，故無法完全地去除 者。 未被除去而殘留之不純物氣體係在作業中進行蒸發而 釋放於內部空間，混入於有機材料層。 隨之，在以往之製造裝置中，未使不純物氣體混入而 製造有機電激發光裝置之情況則爲困難 [專利文獻1]日本特開2004-174659號公報 【發明內容】 -4- 200915912 [欲解決發明之課題] 本發明係爲爲了解決上述課題所作爲之構成，其目的 係爲提供未使不純物氣體混入而可製造有機電激發光裝置 之製造裝置者。 [爲了解決課題之手段] 對於爲了延長有機電激發光裝置之壽命，有必要在露 點-76°C (水分濃度lppm)以下的環境，進行作業者。 以室溫的條件，由欲作爲將殘留於作業室內部的水， 與作業室內部之排氣，與乾燥氮氣之供給，同時進行排出 之時（作業室內部係維持爲大氣壓），在60小時後，到達至 露點-75 t，但，之後，露點未下降，而在歷經300小時， 仍維持露點-75 °C，未到達至露點-76 t。 本發明者等乃將加熱器捲附於作業室的外壁，以加熱 氣加熱壁之後，進行作業室內部之排氣，與乾燥氮氣之供 給之時，由作爲日間8小時之加熱，夜間冷卻（及排氣與乾 燥氣體之供給）的情況’在48小時後，到達至露點_76。(：， 在72小時之後，係到達至露點-77.5°C。 如此，比較於未加熱作業室之情況，對於加熱作業室 的情況，係可在短時間降低露點者。 依據有關的見解所作爲之本發明係屬於具有作業室， 和於配置於前述作業室的內部之基板的表面，吐出液體之 噴墨印表機，將前述作業室的內部空間，可與外部環境遮 斷地而構成之有機電激發光裝置之製造裝置，其中，具有 -5- 將 之 ·厂 刖 熱 給 、厂 刖 給 置 具 前 置 內 部 光 置 前 手 裝 200915912 前述作業室，進行加熱之加熱裝置的有 製造裝置。 本發明係屬於有機電激發光裝置之製 述加熱裝置係爲具有安裝於前述作業室 手段，和於前述作業室內，供給加熱氣 裝置之任一方或雙方之有機電激發光裝 本發明係屬於有機電激發光裝置之製 述加熱氣體供給裝置係具有連接於前述 系統，作爲加熱氣體而供給乾燥氣體之 之製造裝置。 本發明係屬於有機電激發光裝置之製 有運送室，和配置於前述運送室內部之 述運送室係氣密地連接於前述作業室之 之製造裝置。 本發明係屬於具有作業室，和於配置 部之基板，配置密封材料之密封材料供 環境遮斷前述作業室的內部空間地所構 裝置之製造裝置，其中，具有加熱前述 的有機電激發光裝置之製造裝置。 本發明係屬於有機電激發光裝置之製 述加熱裝置係具有安裝於前述作業室的 段，和於前述作業室內，供給加熱氣體 置之任一方或雙方之有機電激發光裝置 本發明係屬於有機電激發光裝置之製 機電激發光裝置 造裝置，其中， 的壁之作業室加 體之加熱氣體供 置之製造裝置。 造裝置，其中， 供給室之氣體供 有機電激發光裝 造裝置，其中， 運送機器手臂， 有機電激發光裝 於前述作業室的 給裝置，可從外 成之有機電激發 作業室之加熱裝 造裝置，其中， 壁之作業室加熱 之加熱氣體供給 之製造裝置。 造裝置，其中， -6- 200915912 前述加熱氣體供給裝置係具有連接於前述供 給系統，作爲加熱氣體而供給乾燥氣體之有 置之製造裝置。 本發明係爲具有運送室，和配置於前述 運送機器手臂，前述運送室係氣密地連接於 有機電激發光裝置之製造裝置。 本發明係屬於具有作業室，和貼合裝置 置係具有保持第一之基板的第一之保持手段 之基板的第二之保持手段，和相對地使前述 保持手段移動，使前述第一，第二之基板貼 ，可從外部環境遮斷前述作業室的內部空間 機電激發光裝置之製造裝置，具有加熱前述 裝置的有機電激發光裝置之製造裝置。 本發明係屬於有機電激發光裝置之製造 具有檢測前述第一，第二之基板的相對的位 配合手段，前述移動手段係依據前述位置配 出之位置資訊，使前述第一，第二之保持手 內，相對性地移動之有機電激發光裝置之製 本發明係屬於有機電激發光裝置之製造 前述加熱裝置係具有安裝於前述作業室的壁 手段，和於前述作業室內，供給加熱氣體之 裝置之任一方或雙方之有機電激發光裝置之 本發明係屬於有機電激發光裝置之製造 前述加熱氣體供給裝置係具有連接於前述供 給室之氣體供 機電激發光裝 運送室內部之 前述作業室之 ，前述貼合裝 ，和保持第二 第一，第二之 合之移動手段 地所構成之有 作業室之加熱 裝置，其中， 置資訊之位置 合手段所檢測 段，在水平面 造裝置。 裝置，其中， 之作業室加熱 加熱氣體供給 製造裝置。 裝置，其中， 給室之氣體供 200915912 給系統，作爲加熱氣體而供給乾燥氣體之有機電激發光裝 置之製造裝置。 本發明係屬於有機電激發光裝置之製造裝置，其中， 具有運送室，和配置於前述運送室內部之運送機器手臂， 前述運送室係氣密地連接於前述作業室之有機電激發光裝 置之製造裝置。 然而，在本發明，設置作業室加熱手段之作業室的壁 係指包含所有作業室的頂面，底面及側壁，而作業室加熱 手段係亦可設置於作業室之外壁面，亦可設置於內壁面。 更加地，亦可將作業室加熱手段，埋設於作業室的壁 ，但當考慮作業室加熱手段之維護的簡便性時，期望爲安 裝於內壁面或外壁面者，另外，當考慮不純物氣體脂去除 效率時，期望爲將作業室加熱手段安裝於作業室之內壁面 者。 [發明之效果] 如根據本發明，附著於作業室之壁面的不純物氣體係 因經由加熱所去除，故於作業室，未殘留有不純物氣體， 因在製造工程爲混入有不純物氣體，故有機電激發光裝置 的壽命則變長 【實施方式】 [爲了實施發明之最佳型態] 圖1〜3之符號1〜3係各自表不本發明第一~第二之有機 -8- 200915912 電激發光裝置之製造裝置，而對於第—第三之製造裝置 1〜3之相同構件，係於相同符號，附上添加字a~c而加以 區別。 第 第二之製造裝置1〜3係各自具有運送室31 a~3 lc ，作業室lla〜llc，和匣室36a〜36c。 作業室11a〜uc和匣室36a〜36c係藉由門8a〜8c， 9a〜9c而連接於蓮送室31a〜31c，當開啓門8a〜8c，9a~9c 時’內部空間乃個連接於運送室3丨a〜3丨c之內部空間。 對於I®室3 6a〜36c，係設置有無圖示之運出入口 ·當開 啓運出入口時’成爲可運出入收容有基板之卡匣，當關避 運出入口時，匣室36a〜3 6e的內部空間則從外部所遮斷。 對於運送室3 1 a〜3 1 c之內部，係配置有運送基板之運 迭機器手臂35a〜35c’當開啓門8a~8c，9a~9c時，經由機 器手臂35&〜35〇，成爲可在作業室11&〜11(1與匣室36&〜36(： 之間運送基板地所構成’隨之，基板係未曝露於外部環境 地，通過運送室31 a〜31c而在作業室π a〜lie與匣室 36a〜36c之間，加以運送。 對於作業室1 1 a〜1 1 C，係安裝有加熱裝置i 2a〜丨2c，作 業室1 1 a〜1 1 c係經由加熱裝置1 2 a〜1 2 c所加熱。 加熱裝置l2a~ 12c係具有加熱作業室η a〜llc的壁之 作業室加熱手段1 5 a〜1 5 c ’和於作業室1 1 a~ 1 1 c之內部， 供給加熱氣體之加熱热體供給裝置16a~16c之任一方或雙 方。 作業室加熱手段1 5 a〜1 5 c係密著安裝於作業室 -9- 200915912 1 1 a〜1 1 c 壁。 在此係作業室加熱手段1 5 a〜1 5 c乃在作業室u a〜丨j c 的內側，安裝於作業室1 1 a〜11 c之側壁與頂面，但作業室 加熱手段1 5 a〜1 5 c之安裝場所係無特別限定。 作業室加熱手段15a~15c係在作業室Ua〜llc之頂面 ，底壁，側壁之中，設置於1處以上即可，另外，作業室 加熱手段1 5 a~ 1 5 C係亦可設置於作業室1 1 a〜i〗c之內側（內 壁面）和外側（外壁面）之任一，或雙方者。 作業室加熱手段15a~ 15c係具有加熱器（例如，金屬細 管加熱器）’或溫水循環管，當通電於加熱器，或溫水通 過於溫水循環管時，安裝有作業室11a〜11c的壁之作業室 加熱手段1 5 a〜1 5 c的部分乃被加熱。 作業室1 1 a〜1 1 c的壁係由如金屬的熱傳導物質（例如， 不鏽鋼）所構成’當加熱安裝有作業室1 1 a〜1 1 c之作業室加 熱手段15a〜15c的部分時，以熱傳導，將作業室Hay lc 的壁全體，進行升溫。 當作業室1 1 a〜1 1 c的壁升溫時’附著於作業室 1 la~l lc之內壁面的水或氧則成爲氣體（包含蒸氣），釋放 於作業室1 1 a〜1 1 C之內部空間，對於作業室丨丨a〜i i c，係 連接排氣系統19a〜19c，成爲可從作業室1 ia〜；! lc之內部 空間，排出氣體。 加熱氣體供給裝置16a〜16c係具有氣體供給系統 17a~17c，和氣體加熱手段14a〜14c。 氣體供給系統1 7a〜1 7c係具有配置乾燥氣體（例如，乾 -10- 200915912 燥氮素）之谷器41a〜41c，和一端連接於容器41a~ 一端則氣密地插通於作業室1 la〜1 lc內之配管42 a〜 氣體加熱手段14a〜14c係安裝於容器41a〜41c 42a〜42c之任一方或雙方。 氣體加熱手段14a〜14c係例如爲加熱器，當g 體加熱手段14a〜14c時，配置於氣體加熱手段14a 乾燥氣體係加熱於從容器4 1 a〜4 1 c移動至作業室 內之間，隨之，對於作業室1 1 a〜1 1 c之內部，係俘 熱之乾燥氣體（加熱器體）。 作業室1 1 a〜1 1 c之內壁面係接觸於所加熱之藍 所加熱，附著於作業室1 1 a〜1 1 c之內壁面的水或拿 氣體而釋放。 所釋放之氣體係因經由所加熱的乾燥氣體而制 由排出系統19a〜19c，有效率地排出於作業室Ua 外部。 作業室加熱手段15a〜15c，和加熱氣體供 1 6a〜16c係亦可只使用任一方，但附著於作業室 之內壁面的水或氧的排出效率爲高。 然而，在此係在配管42a〜42c之中，於容器 與作業室1 1 a~ 1 1 c之間的部分，設置有崁入 1 8a〜1 8c，而即使作爲於容器4 1 a~4 1 c，混入微粒子 物氣體，亦可由崁入過濾器18a~18c所去除。 接著，關於使用第一〜第三之製造裝置丨~3，ffi 機電激發光裝置之工程，進行說明。 41c，另 4 2 c 〇 與配管 !電於氣 ~ 1 4c 之 1 1 a 〜1 1 c ^給所加 :燥氣體 :則成爲 ξ出，經 -1 1 c 之 給裝置 11a~1 1 c 41a~4 1 c 過濾器 -或不糸屯 i製造有 -11 - 200915912 在開始有機電激發光裝置之製造之前’從外部環境遮 斷第--第三之製造裝置1〜3之作業室11 a〜lie，並加熱作 業室1 1 a〜1 1 c的壁，使水或氧釋放。 在加熱作業室1 1 a〜1 1 c的壁之同時’供給從加熱氣體 供給裝置1 6a〜1 6c所加熱之乾燥氣體’同時進行經由排氣 系統19a〜19c之排氣，置換作業室11a〜1 lc之內部的氣體 〇 此時，作業室1 1 a〜1 1 c之內部壓力’則較大氣壓僅成 爲陽壓地，如設定排氣系統19a〜19c之排氣速度，和乾燥 氣體的供給量，防止從外部的水分.氧的混入。 但，在作業室Π a〜1 1 c內，處理有毒物質之情況，係 作業室11a〜lie之內部壓力，則較大氣壓僅成爲負壓地， 如設定排氣系統1 9a〜1 9c之排氣速度，和乾燥氣體的供給 量，防止從作業室lla~llc至外部的有毒物質之洩漏。 無論如何，由將作業室1 1 a~ 1 1 c內部，保持爲大氣壓 附近的壓力情況，由經由作業室1 1 a〜1 1 c之氣體（所加熱的 乾燥氣體）的熱傳導’加溫製作業室1 1 a〜1 1 e內部的各角落 ，可促進水分等之不純物的脫離者，進而可極快乾燥作業 室1 la〜1 lc內部的環境。 然而’當作業室11a〜lie之內部成爲真空而進行排氣 時’因只由從作業室加熱手段丨5 a〜丨5 c的熱放射而升溫， 而陰暗的部分未升溫，從此等部分，未脫離不純物，而無 法乾燥作業室1 1 a〜1 1 c之內部。 加熱作業室1 1 a〜1 1 c的壁之加熱時間係均可爲任意， -12- 200915912 但期望1循環的加熱係爲8小時以上者’當加熱時間爲少時 ，則無法升溫製作業室1 la~l lc內的各角落，而無法充分 地使不純物脫離。 在充分地加熱作業室1 1 a〜1 1 c之後，使作業室加熱手 段15a~15c與氣體加熱手段14a〜14c停止’結束作業室 11a〜11c的壁之加熱和乾燥氣體之加熱。 由未使乾燥氣體加熱而供給置作業室1 1 a〜1 1 C之同時 ，持續作業室1 la〜1 lc之排氣，作業室1 la~l 1 c的壁之溫 度下降之情況，可乾燥作業室1 1 a〜1 1 c內部之環境者（氣體 置換工程）。 作業室1 la〜1 lc內部之環境，未到達至露點-76 t (水 分濃度1 ppm)，或作業者所期望位準之情況，係重覆2次以 上加熱工程與氣體置換工程而乾燥環境。 將於表面，形成有電極或電晶體等之基板，收容於卡 匣，將該卡匣，配置於第一之製造裝置1之匣室36a的內 部。 對於第一之製造裝置1之作業室11a內部，係配置載 置台21，和噴墨印表機20。 噴墨印表機2 0係具有印刷頭2 5，印刷頭2 5係經由保持 手段2 6 ’在載置台2】之上方，從載置台2 ：ι間隔配置。 在排氣作業室1丨a內的同時，未加熱乾燥氣體而進行 供給’維持所乾燥之作業環境，在維持該作業環境的同時 ’從匣室36a，運入基板至作業室1 ia內部，配置該基板 於載置台21上，關閉門9&而從運送室31a，遮斷作業室 -13- 200915912 1 1 a之內部空間。 圖1係表示於載置台2 1上，配置有基板7a之狀態。 印刷頭25係連接於有機材料供給系統28，從有機材料 供給系統2 8，將包含有機材料（發光材料，電荷輸送材料 ，電子輸送材料，色素等）之原料液，供給至印刷頭2 5。 印刷頭2 5與載置台2 1之任一方或雙方係安裝於無圖示 之移動手段。 使印刷頭25與載置台21之任一方或雙方移動，相對地 使載置台2 1上之基板7 a，和印刷頭2 5移動，印刷頭2 5之噴 嘴孔則由位置於基板7 a表面之特定位置上時，從噴嘴孔 吐出原料液，彈著於基板7a表面，形成有機材料層。 形成有機材料層之間，於作業室1 1 a〜1 1 c之內部，如 維持上述之作業環境，對於有機材料層，係未混入存在水 分或氧等，而膜室則爲產生劣化。 重覆移動與吐出’於基板7a之特定位置，形成結束 有機材料層之後，將基板7a，從作業室113，返回至匣室 36a，收容於卡匣，將新的基板7a，從匣室36a運送至作 業室1 la，交換基板7a。 重覆有機材料層的形成，基板7a之交換，於特定片 數之基板7a，形成有機材料層之後，從匣室36a取出卡匣 α 將其卡匣，直接從第一之製造裝置丨，運送至第二之 製造裝置2之匣室36b，或從第一之製造裝置1，運送至其 他的裝置，於各基板7a進行處理之後，運送至第二之製 -14 - 200915912 造裝置2之匣室36b’而將卡匣，運送至匣室36b後係從外 部環境遮斷該匣室36b。 對於第二之製造裝置2之作業室lib內部，係配置載 置台3 8，和密封材料供給裝置4 0。 在將作業室1 1 b進行排氣的同時，未加熱乾燥氣體而 進fr供給’形成所乾燥之作業環境，保持維持該作業環境 ，將形成有有機材料層之基板7a，從匣室36b運送至作業 室lib，配置於載置台38上。 密封材料係爲糊狀或固體狀，在此，密封材料係爲糊 狀’密封材料供給裝置4 0係具有分配器4 5，分配器4 5係連 接於密封材料供給系統4 1，供給糊狀之密封材料。 分配器45’和載置台38之任一方或雙方係連接於無圖 示之移動手段。 使分配器4 5與載置台3 8之任一方或雙方移動，相對地 使載置台38上之基板7a ’和分配器45移動的同時，從分配 器45之噴嘴孔’擠出密封材料，塗佈於基板7&表面，呈 圍繞形成有基板7a表面之各有機材料層的範圍（發光範圍） 地’形成環狀之密封材料層。 形成密封材料層之間’如維持上述之作業環境，形成 於基板7a表面之有機材料層則未產生劣化。 而岔4材料爲固體之情況（例如’棒狀），密封材 料供給裝置40係在較發光範圍爲外側，沿著發光範圍的邊 緣，於基板7a表面，配置密封材料，形成圍繞發光範圍 之密封材料層。 -15- 200915912 將形成密封材料層之狀態的基板7a，與新的基板7a 進行交換’重覆密封材料層的形成，基板7a之交換，於 特定片數之基板7a’形成有機材料層時，取出卡匣。 第三之製造裝置3的匣室3 6c之內部，配置收容形成 有密封材料層之基板7a之卡匣，和收容貼合對象之基板 的卡匣之後，從外部環境遮斷匣室36c。 $將作業室Uc內進行排氣的同時，未加熱乾燥氣體 進行供給’形成所乾燥之作業環境，保持維持該作業環 境’將形成有密封材料層之基板7a，和貼合對象之基板， 從匣室36c運送至作業室內部。 對於第三之製造裝置3的作業室丨1 c內部，係配置貼 合裝置50，貼合裝置5〇係具有第一，第二之保持手段51， 5 2 ’和位置配合手段5 6，和移動手段5 5。 使形成有密封材料層之基板7 a，和貼合對象之基板， 在形成有密封材料層側的面，和所貼合側的面，呈對向地 面對狀態’保持爲第一，第二之保持手段5 1，52。 圖3係表示保持基板7a，7b於第一，第二之保持手段 5 1，5 2之狀態。 其狀態之基板7a，7b之方向或配置係無特別限定， 但對於密封材料層與基板7a之黏接性爲低之情況，將配 置有密封材料層側的面，朝向上側而略平面配置基板7a， 於其基板7 a上，將貼合對象之基板7 b ’令所貼合側的面 朝下側而配置。 位置配合手段5 6係例如，爲C C D照相機等，觀察保 200915912 持於第一，第二之保持手段5 1，5 2之基板7 a，7b，檢測出 其位置資訊。 移動手段5 5，和位置配合手段5 6係連接於控制裝置5 9 ，位置配合手段5 6所檢測出之位置資訊係被傳達至控制裝 置5 9。 移動手段55係可將第一，第二之保持手段51 ’ 52之任 一方或雙方，在水平面內移動及旋轉地所構成，保持於第 一，第二之保持手段51，52之基板7a，7b係因與第一， 第二之保持手段51，52—起移動，固基板7a，7b係在水 平面內，相對地移動或旋轉。 控制裝置5 9係依據所傳達之位置資訊，使移動手段5 5 動作，使基板7a，7b，在水平面內旋轉及/或移動，將基 板7 a，7 b，作爲位置配合。 移動手段5 5係加上於水平方向之移動與旋轉，將第一 ，第二之保持手段51，52之任一方或雙方，對於上下方向 ，亦可相對性地移動地所構成。 控制裝置59係在配置配合基板7a，7b之狀態，使第 一，第一之保持手段5 1，5 2，於上下相對性地移動，將基 板7a，7b接近，使密封材料層，密著於貼合對象之基板 7b，將基板，7b，夾持密封材料層而貼合。 封於第二之製造裝置3的作業室Uc內部，係配置有 無圖示之硬化手段。 硬化手段係密封材料層含有紫外線硬化型樹脂的情況 ，於密封材料層’照射紫外線，含有熱硬化性樹脂之情況 -17- 200915912 係加熱密封材料層，使密封材料層中的樹脂重合而硬化。 另外，密封材料層，含有玻璃或熱可塑性樹脂等之溶 融材料之情況，硬化手段係使密封材料層加熱熔融，提升 與基板7a，7b之密著性之後，冷卻密封材料層（包含自然 冷卻）而使其固化。 隨之，基板7a，7b係經由硬化或固化之密封材料層 而相互加以固定。 將固定基板7a，7b之狀態的有機電激發光裝置，從 作業室1 lc，運出於匣室36c，將新的基板7a，7b，運送至 作業室1 1 c。 重覆貼合基板7a，7b而固定之工程，和有機電激發 光裝置之運出’和新的基板7a，7b之運入，貼合特定片 數之基板7a’ 7b而作成有機電激發光裝置之後，如從匣 室3 6c取出卡匣’有機電激發光裝置則被取出於外部。 由貼合基板7a，7b而固定之工程，和有機電激發光 裝置之運出’和新的基板7a，7b之運入等之所有工程， 如維持上述之作業環境，形成於基板7a之有機材料層則 未產生劣化。 如上述’密封材料層係因形成爲圍繞形成有有機材料 層之發光範圍的環狀，故有機材料層係由基板7a，7b，和 硬化或固化之密封材料層所圍繞，隨之，有機材料層係從 外部環境所遮斷’水分或氧則未進入。 並且’如上述，形成有機材料層之工程，和形成密封 材料層之工程’和貼合基板7a，7b而固定之工程係因在 -18- 200915912 預先去除水等之不純物氣體之作業室1 1 a〜1 1 C內部所進行 ’故在製造工程’於有機材料層，未混入有不純物氣體。 隨之’未引起經由不純物氣體之有機材料層的劣化， 而有機電激發光裝置的壽命則變長。 當持續有機電激發光裝置之製造時，例如，有必要印 刷頭2 5或分配器4 5之洗淨或交換，對於有機材料供給系統 2 8的原料液之塡充等’作業室1 1 a〜1 1 c內部之維護，而對 於進行作業室1 1 a〜1 1 c內部之維護時，係運出基板7a，7b ，暫時停止有機電激發光裝置之製造。 對於進行維護作業時，通常，因將作業室1 1 a~ 1 1 c之 內部空間，連接於外部環境，故大氣則進入至作業室 1 1 a〜1 1 c之內部，大氣中的水或氧等不純物氣體則附著於 作業室11a〜11c之內壁面。 維護結束後，至少在將基板7 a，7 b，運送至作業室 1 la〜1 lc作業室1 la〜1 lc之前，如上述，作業室丨la~l lc內 部之環境，到達至露點-7 6 °c (水分濃度1 p p m )，或作業者 所期望位準爲止，加熱作業室11 a〜11c之同時，置換氣體 ，形成作業環境。 然而，亦可從維護結束’至開始作業室lla~llc的壁 之加熱爲止之間，或開始作業室1 1 1 1 c的壁之加熱之後 ，以特定時間，未供給乾燥氣體而將作業室Π a〜1 1 c內部 進行排氣。 此情況，可在最初的1次之氣體置換，置換進入至作 業室1 1 a〜1 1 C內部的大氣之大部分，並效率爲佳，但’之 -19- 200915912 後係如上述，加熱作業室1 1 a〜1 1 C的壁之同時，進行排氣 ’和乾燥氣體的供給’將作業室11a〜11c內部的氣體，置 換爲乾燥氣體之情況則爲期望。 亦可以作業室加熱手段1 5 a〜1 S c加熱作業室1 1 a〜1 1 c 的壁之同時，未加熱乾燥氣體而進行供給，更加地，亦可 由未以作業室加熱手段1 5 a~ 1 5 c加熱，而供給加熱之乾燥 氣體之情況，加熱作業室。 任何之情況’均在作業室1 1 a ~ 1 1 c加熱結束後，將作 業室11a〜11c，進行排氣之同時，未加熱乾燥氣體而進行 供給，形成作業環境。 在形成該作業環境之後，運入基板7a，7b，再開始有 機材料層之形成，密封材料層之形成，及基板7 a，7 b之 貼合。 然而，對於印刷頭2 5和有機材料供給系統2 8，及分配 器45和密封材料供給系統41之間，係各設置有閥29，49。 將作業室11 a~ 11c，呈較大氣壓爲低之減壓環境（包含 真空環境）地進行排氣之情況，關閉閥29，49，供給乾燥 氣體’作業室1 1 a〜1 1 c之內部空間則上升至特定壓力以上 之後’開啓閥2 9，4 9，於印刷頭2 5或分配器4 5，如供給原 料液或密封材料，在排氣中，未噴出原料液或密封材料於 作業室1 la〜1 lc之內部空間。 乾燥氣體係未限定於乾燥氮氣，而如爲不會將有機材 料造成化學性劣化之氣體，可使用Ar氣體等各種氣體者 ，例如，對於氧的存在，未成爲問題之情況，亦可使用含 -20- 200915912 氧之乾燥氣體（例如，乾燥空氣）者，此等乾燥氣體係亦可 只將1種，供給至作業室1 1 a〜1 1 C，而亦可將2種以上，供 給至作業室1 la〜1 lc。 另外，亦可以在加熱作業室1 1 a〜1 1 c時而供給之加熱 氣體，和在加熱結束後，形成作業環境時而供給之作業用 氣體，改變乾燥氣體的種類，亦可作爲相同。 作業室11a〜11c的壁係期望爲由熱傳導性高之物質而 構成者，但亦可於至少一部分，崁入玻璃等之透明板，作 爲監視窗。 作業室11a〜11c之加熱係期望爲壁溫度成爲60°C以上 80°C以下地進行加熱情況，在未達60°C之中，未充分進行 水分除去，而當超過8 0 °C時，對於安全性產生問題。 作業室1 la〜1 lc的加熱係不只在將基板7a，7b，運送 至作業室1 1 a〜1 1 c之前，在將基板，配置於作業室 1 la~l lc之狀態，亦可進行，但，對於於基板7a，7b，形 成有機電激發光層等耐熱性低的膜之情況，係有必要在運 送基板7a’ 7b之前，使加熱結束，使作業室lla〜 lie之內 部溫度’下降至特定溫度（例如，未分解構成有機電激發 光層之有機材料的溫度）。 更加地，將第一〜第三之製造裝置1〜3，連接於無圖示 之運送室’藉由該運送室，未將基板7a，7b，曝露於大氣 ，而亦可在第一〜第三之製造裝置1〜3間進行運送。 以上係在形成有機材料層之後，關於於基板7 a，形成 密封材料層之情況，已做過說明，但，本發明並不限定於 -21 - 200915912 此等之構成，而亦可在第二之製造裝置2，形成密封材料 層之後，在第一之製造裝置1，形成有機材料層。 另外，亦可於形成有機材料層之基板7a，未設置密封 材料層，而於貼合對向之基板7b，配置密封材料層，貼合 基板7a，7b之間，亦可於形成有機材料層之基板7a，和 貼合對向之基板7b的雙方，配置密封材料層之後，貼合 基板7 a，7 b之間。 基板7a ’ 7b之材質亦無特別限定，而可使用玻璃基 板，塑料基板，陶瓷基板等者。 在作業室11 a〜11c內部，處理基板7 a〜7c時之壓力係 無特別限定，但對於形成有機材料層時，係呈印刷頭2 5之 噴嘴的機構不混亂地，作爲大氣壓之情況則爲理想，對於 貼合基板7a ’ 7c時’係期望爲以較大氣壓爲低之壓力的 作業環境而進行者。 以上係關於在個別的作業室丨丨a〜丨i c內部，進行有機 材料層之形成’密封材料層之形成，和基板7a，7b之貼 合及固定之情況’已做過說明，但本發明係並非限定於此 之構成。 噴墨印表機20 ’和密封材料供給裝置40，和貼合裝置 5 0之中’至少將2個以上的裝置，配置於相同作業室內部 ，有機材料層之形成，密封材料層之形成，和基板7a，7b 之貼合及固定之中’亦可在同樣作業室內部，進行2個以 上的工程。 特別是如密封材料供給裝置4 〇與貼合裝置5 〇，如將使 -22- 200915912 用於連續進行之工程的裝置，配置於同樣作業室內部’不 只縮短對於基板7a，7b之運出入所需之時間’因基板7a ，7b則曝露於外部環境之危險性變低，故更爲期望。 此情況，亦可於作業室內部’設置運出基板7a ’ 7b 之運出機器手臂，作爲在作業室內部，運送基板。 更加地，亦可加熱作業室1 1 a~ 1 1 C的壁同時’將作業 室1 1 a〜1 1 C，進行連續排氣，未供給乾燥氣體而加熱作業 室1 1 a〜1 1 b，但，如前述，此情況係不純物之除去效率降 低。 另外，亦可將供給乾燥氣體之氣體供給系統，和排氣 系統’連接於運送室31a~31c，和匣室36a~36c之任一方 或雙方。 如在將基板7a，7b，運入於作業室1 la〜1 lc之前，將 運送室31a~31c與匣室36a〜36c之內部，進行排氣之同時 ’供給乾燥氣體’在將基板7 a，7 b，運入至作業室1 1時， 從運送室31 a〜31c或匣室36 a~ 36c進入之不純物氣體的量 變少。 【圖式簡單說明】 [圖1 ]係爲說明第一之製造裝置的模式性剖面圖。 [圖2 ]係爲g兌明弟一之製造裝置的模式性剖面圖。 [圖3 ]係爲說明第三之製造裝置的模式性剖面圖。 【主要元件符號說明】 -23- 200915912 1〜3:製造裝置（第一〜第三之製造裝置） 7 a，7 b :基板 12 a〜12c :加熱裝置 15a〜15c :作業室加熱手段 16a〜16c :加熱氣體供給裝置 17a〜17c :氣體供給系統 2 0 :噴墨印表機 40 :密封材料供給裝置 5 0 :貼合裝置 5 1 :第一之保持手段 52 :第二之保持手段 5 5 :移動手段 5 6 :位置配合手段 -24-[Technical Field] The present invention relates to a manufacturing apparatus of an organic electroluminescence device for an organic electroluminescence display or the like. [Prior Art] The organic electroluminescent material is chemically degraded by water or the like, and it is proposed to perform organic electroluminescent material by inkjet printing in a working chamber in which the external ambient gas is blocked. The coating process, the coating process of the sealing material by the discharge device, and the engineering method of the bonding work of the substrate. Before the work is carried out, the inside of the work chamber is exhausted, and/or the inside of the work chamber is introduced with dry gas, and the internal space of the work chamber is replaced with dry gas to remove impurities such as water or oxygen. However, in the inside of the working chamber or the introduction of the dry gas, the impure gas system adheres to the inner wall surface of the working chamber, so that it cannot be completely removed. The impure gas system remaining without being removed is evaporated during work and released into the internal space, and mixed into the organic material layer. In the case of the conventional manufacturing apparatus, it is difficult to produce an organic electroluminescence device without mixing the impurity gas. [Patent Document 1] JP-A-2004-174659 [Abstract] -4-200915912 Solution to the Invention The present invention has been made to solve the above problems, and an object of the invention is to provide a manufacturing apparatus capable of manufacturing an organic electroluminescence device without mixing an impurity gas. [Means to solve the problem] In order to extend the life of the organic electroluminescent device, it is necessary to carry out the operation in an environment with a dew point of -76 ° C (water concentration of 1 ppm). At room temperature, when the water remaining in the inside of the working chamber is supplied to the inside of the working chamber and the supply of dry nitrogen to the same time (the inside of the working chamber is maintained at atmospheric pressure), the temperature is 60 hours. After reaching the dew point -75 t, however, after that, the dew point did not drop, and after 300 hours, the dew point was maintained at -75 °C and did not reach the dew point -76 t. The inventors of the present invention attached the heater to the outer wall of the working chamber, heated the wall by heating the gas, and then exhausted the inside of the working chamber, and when it was supplied with dry nitrogen, it was heated for 8 hours during the day and cooled at night ( And the case of the supply of exhaust gas and dry gas" reached the dew point _76 after 48 hours. (:, after 72 hours, it reaches the dew point of -77.5 ° C. Thus, compared to the case of the unheated work room, the case of heating the work room can reduce the dew point in a short time. According to the relevant insights The present invention relates to an ink jet printer having a working chamber and a surface of a substrate disposed inside the working chamber, and discharging the liquid, and the internal space of the working chamber can be blocked from the external environment. A manufacturing apparatus for an organic electroluminescence device, which has a manufacturing device for heating a heating device, which has a heat supply to the factory, a factory interior, and a pre-installation device. The present invention relates to a heating device for an organic electroluminescent device, comprising: an apparatus for mounting in the working chamber, and an organic electroluminescent device for supplying either or both of the heating device in the working chamber. The heating gas supply device of the organic electroluminescence device has a system connected to the above system and supplies a dry gas as a heating gas. The present invention relates to a manufacturing apparatus in which a transport chamber is provided in an organic electroluminescence device, and a transport chamber disposed in the transport chamber is airtightly connected to the work chamber. A manufacturing apparatus for a device for arranging a sealing material of a sealing material to block an internal space of the working chamber, and a manufacturing device for heating the organic electroluminescent device described above. The heating device according to the organic electroluminescent device has a section mounted in the working chamber, and an organic electroluminescent device that supplies either or both of the heating gas in the working chamber. The invention belongs to organic electro-excitation. A device for manufacturing an electromechanical excitation device for an optical device, wherein: a manufacturing device for heating a gas supply in a working chamber of a wall, wherein the gas in the supply chamber is supplied to an organic electroluminescence device, wherein The robot arm, the organic electric excitation light is installed in the working device of the aforementioned working room, and the organic electric excitation can be formed from the outside. A heating device for manufacturing a working chamber, wherein the heating device supplies a heating gas supply device, wherein the heating gas supply device is connected to the supply system as a heating gas. The present invention relates to a manufacturing apparatus that supplies a drying gas. The present invention has a transport chamber and a manufacturing device that is disposed in the transport robot, and the transport chamber is airtightly connected to the organic electroluminescence device. And a second holding means for holding the substrate holding the first holding means of the first substrate, and the holding means moving relative to the first and second substrates A manufacturing apparatus for an electromechanical excitation device that blocks an internal space of the working chamber from an external environment, and a manufacturing apparatus of an organic electroluminescence device that heats the device. The invention belongs to the manufacture of an organic electroluminescent device, and has a relative position matching means for detecting the first and second substrates. The moving means is to maintain the first and second positions according to the position information allocated by the position. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the manufacture of an organic electroluminescent device. The heating device has a wall means attached to the working chamber, and a device for supplying a heating gas in the working chamber. The invention of the organic electroluminescent device of either or both of the inventions belongs to the manufacture of the organic electroluminescent device. The heating gas supply device has a gas connected to the supply chamber for the working chamber of the electromechanical excitation light carrying chamber. The above-mentioned bonding device and a heating device for holding a working chamber in which the second first and second moving means are held, wherein the information is detected by the position of the information and the device is formed in the horizontal plane. In the apparatus, the working chamber heats the heating gas supply manufacturing device. The apparatus, wherein the gas supplied to the chamber is supplied to the system as a manufacturing apparatus for the organic electroluminescence device that supplies the dry gas as a heating gas. The present invention relates to a manufacturing apparatus of an organic electroluminescence device, comprising: a transport chamber; and a transport robot disposed in the transport chamber, wherein the transport chamber is airtightly connected to the organic electroluminescent device of the work chamber Manufacturing equipment. However, in the present invention, the wall of the work chamber in which the work chamber heating means is provided refers to the top surface, the bottom surface and the side walls of all the work chambers, and the work chamber heating means may be disposed on the outer wall surface of the work chamber, or may be disposed on the wall surface of the work chamber. Inner wall surface. Further, the working room heating means may be embedded in the wall of the working room. However, when considering the simplicity of the maintenance of the working room heating means, it is desirable to be attached to the inner wall surface or the outer wall surface, and in addition, when considering the impurity gas grease When the efficiency is removed, it is desirable to attach the work chamber heating means to the inner wall surface of the work chamber. [Effects of the Invention] According to the present invention, since the impurity gas system adhered to the wall surface of the working chamber is removed by heating, the impurity gas does not remain in the working chamber, and since the manufacturing process is mixed with the impurity gas, the organic electricity The lifetime of the excitation light device is lengthened. [Embodiment] [In order to carry out the best mode of the invention] The symbols 1 to 3 of Figs. 1 to 3 respectively indicate that the first to second organic -8-200915912 of the present invention is electrically excited. The manufacturing means of the optical device, the same components of the first to third manufacturing devices 1 to 3 are denoted by the same reference numerals, and the added words a to c are attached and distinguished. The second manufacturing apparatuses 1 to 3 each have a transport chamber 31a to 3lc, work chambers 11a to 11c, and chambers 36a to 36c. The working chambers 11a to uc and the chambers 36a to 36c are connected to the lotus chambers 31a to 31c by the doors 8a to 8c, 9a to 9c, and when the doors 8a to 8c, 9a to 9c are opened, the internal space is connected to The internal space of the transport room 3丨a~3丨c. For the I® chambers 3 6a to 36c, there is a transport port (not shown). When the transport port is opened, it becomes a cassette that can be transported into the substrate, and when the port is closed, the inside of the chambers 36a to 36e The space is interrupted from the outside. In the interior of the transport chambers 3 1 a to 3 1 c, the transport robots 35a to 35c' in which the transport substrates are placed are provided, and when the doors 8a to 8c, 9a to 9c are opened, the robot arms 35 & In the workrooms 11 & -11 (1 and the chambers 36 & 〜 36 (the structure is transported between the substrates), the substrate is not exposed to the external environment, and is transported through the transport chambers 31a to 31c in the workroom π A to lie is transported between the chambers 36a and 36c. The working chambers 1 1 a to 1 1 C are equipped with heating devices i 2a to 2c, and the working chambers 1 1 a to 1 1 c are connected via heating devices. 1 2 a~1 2 c is heated. The heating devices 12a to 12c are working chamber heating means 1 5 a~1 5 c ' with walls for heating the working chambers n a to 11c and the working chamber 1 1 a~ 1 1 c In the inside, one or both of the heating medium supply devices 16a to 16c for supplying the heating gas are provided. The working chamber heating means 1 5 a to 1 5 c are attached to the working chamber -9- 200915912 1 1 a~1 1 c Here, the working chamber heating means 1 5 a to 1 5 c are installed on the inner side of the working chambers ua to 丨jc, and are attached to the side walls and the top surface of the working chambers 1 1 a to 11 c, but The installation place of the room heating means 1 5 a to 1 5 c is not particularly limited. The work room heating means 15a to 15c are provided on the top surface of the work chambers Ua to 11c, and the bottom wall and the side walls are provided in one or more places. In addition, the working room heating means 1 5 a to 1 5 C may be provided on either the inner side (inner wall surface) and the outer side (outer wall surface) of the working chamber 1 1 a to i c, or both. The chamber heating means 15a to 15c have a heater (for example, a metal thin tube heater)' or a warm water circulation pipe, and when the heater is energized or the warm water passes through the warm water circulation pipe, the walls of the work chambers 11a to 11c are mounted. The part of the working room heating means 1 5 a to 1 5 c is heated. The wall of the working chamber 1 1 a 1 1 1 c is composed of a heat conductive substance such as metal (for example, stainless steel) 'When the heating work room 1 is installed When the portions of the working chamber heating means 15a to 15c of 1 a to 1 1 c are heated, the entire wall of the working chamber Hay lc is heated. When the walls of the working chambers 1 1 a to 1 1 c are heated, they adhere to The water or oxygen on the inner wall of the working chamber 1 la~l lc becomes a gas (including vapor), and the release In the internal space of the working chambers 1 1 a to 1 1 C, the exhaust systems 19a to 19c are connected to the work chambers 丨丨a to iic, and the gas can be exhausted from the internal space of the work chambers 1a to lc. The heating gas supply devices 16a to 16c have gas supply systems 17a to 17c and gas heating means 14a to 14c. The gas supply systems 1 7a to 1 7c are nets 41a to 41c in which a dry gas (for example, dry-10-200915912 nitrogen) is disposed, and one end is connected to the container 41a~, and is hermetically inserted into the working chamber 1 The pipes 42a to 14a in the la to 1 lc are attached to either or both of the containers 41a to 41c 42a to 42c. The gas heating means 14a to 14c are, for example, heaters, and when the g body heating means 14a to 14c are disposed, the gas heating means 14a is heated by the drying gas system to move from the containers 4 1 a to 4 1 c to the work chamber, and The inside of the working chambers 1 1 a to 1 1 c is a dry gas (heater body) that traps heat. The inner wall surface of the working chambers 1 1 a to 1 1 c is heated in contact with the heated blue, and is released by water adhering to the inner wall surface of the working chambers 1 1 a to 1 1 c or by taking a gas. The released gas system is efficiently discharged to the outside of the work chamber Ua by the discharge systems 19a to 19c via the heated dry gas. The working chamber heating means 15a to 15c and the heating gas supply 16a to 16c may be used alone, but the discharge efficiency of water or oxygen adhering to the inner wall surface of the working chamber is high. However, here, among the pipes 42a to 42c, the portion between the container and the work chambers 1 1 a to 1 1 c is provided with the intrusion 18 8 to 18 c, even as the container 4 1 a to 4 1 c, the particulate matter gas is mixed, and may be removed by the intrusion filters 18a to 18c. Next, the description will be given of the construction of the ffi electromechanical excitation device using the first to third manufacturing devices 丨~3. 41c, another 4 2 c 〇 and piping! Electric gas ~ 1 4c of 1 1 a ~ 1 1 c ^ for the addition: dry gas: then the sputum, after -1 1 c to the device 11a ~ 1 1 c 41a~4 1 c Filter - or not manufactured by -11 - 200915912 Before starting the manufacture of the organic electroluminescent device, the working chamber 11 a of the third to third manufacturing devices 1 to 3 is interrupted from the external environment. ~lie, and heat the wall of the working chamber 1 1 a~1 1 c to release water or oxygen. While heating the walls of the working chambers 1 1 a to 1 1 c, the "drying gas heated from the heating gas supply devices 1 6a to 16c is supplied" while exhausting through the exhaust systems 19a to 19c, and the working chamber 11a is replaced. 11 lc inside the gas 〇 At this time, the internal pressure of the working chamber 1 1 a~1 1 c', the larger air pressure only becomes the positive pressure, such as setting the exhaust speed of the exhaust systems 19a to 19c, and the drying gas The supply amount prevents the incorporation of moisture and oxygen from the outside. However, in the working chambers Π a to 1 1 c, when the toxic substances are handled, the internal pressure of the working chambers 11a to lie is only the negative pressure, and the exhaust system is set to the row of the exhaust systems 1 9a to 1 9c. The gas velocity and the supply amount of the dry gas prevent leakage of toxic substances from the working chambers 11a to 11c to the outside. In any case, the pressure inside the working chambers 1 1 a to 1 1 c is maintained at a pressure near atmospheric pressure, and is heated by the heat conduction of the gas (heated drying gas) passing through the working chambers 1 1 a to 1 1 c. Each corner of the chamber 1 1 a to 1 1 e can promote the detachment of impurities such as moisture, and the environment inside the working chamber 1 la to 1 lc can be quickly dried. However, when the inside of the working chambers 11a to 11e is evacuated and evacuated, the temperature is raised by the heat radiation from the working chamber heating means a5a to 丨5c, and the dark portion is not heated. The inside of the working room 1 1 a to 1 1 c cannot be dried without being separated from the impurities. The heating time of the wall of the heating working chamber 1 1 a to 1 1 c may be any, -12-200915912, but it is desirable that the heating system for one cycle is 8 hours or longer. 'When the heating time is small, the heating operation cannot be performed. The corners in the chamber 1 la~l lc cannot sufficiently remove the impurities. After the work chambers 1 1 a to 1 1 c are sufficiently heated, the work chamber heating means 15a to 15c and the gas heating means 14a to 14c are stopped to terminate the heating of the walls of the working chambers 11a to 11c and the heating of the drying gas. When the working chambers 1 1 a to 1 1 C are supplied without heating the drying gas, the exhaust of the working chambers 1 la to 1 lc is continued, and the temperature of the walls of the working chambers 1 la to l 1 c is lowered. Drying the working environment 1 1 a~1 1 c inside the environment (gas replacement engineering). The environment inside the working room 1 la ~ 1 lc does not reach the dew point -76 t (water concentration 1 ppm), or the operator's desired level, the heating environment and gas replacement project are repeated twice or more and the drying environment . A substrate on which an electrode or a transistor is formed on the surface is housed in a cassette, and the cassette is placed inside the chamber 36a of the first manufacturing apparatus 1. The mounting table 21 and the ink jet printer 20 are disposed inside the work chamber 11a of the first manufacturing apparatus 1. The ink jet printer 20 has a print head 25, and the print heads 25 are placed above the mounting table 2 via the holding means 2 6 ', and are disposed at intervals from the mounting table 2:. While the inside of the exhausting work chamber 1a is not heated, the dry gas is not heated, and the operating environment for maintaining the drying is maintained, and while the working environment is maintained, the substrate is transported from the chamber 36a to the inside of the working chamber 1 ia. The substrate is placed on the mounting table 21, and the door 9& is closed, and the internal space of the working chamber-13-200915912 1 1a is blocked from the transport chamber 31a. Fig. 1 shows a state in which the substrate 7a is placed on the mounting table 21. The print head 25 is connected to the organic material supply system 28, and the raw material liquid containing the organic material (light-emitting material, charge transport material, electron transport material, dye, etc.) is supplied from the organic material supply system 28 to the print head 25. One or both of the print head 25 and the mounting table 2 1 are attached to a moving means (not shown). Moving either or both of the print head 25 and the mounting table 21 relatively moves the substrate 7a on the mounting table 21 and the print head 25, and the nozzle holes of the print head 25 are positioned on the surface of the substrate 7a. At the specific position, the raw material liquid is discharged from the nozzle hole and is bounced on the surface of the substrate 7a to form an organic material layer. Between the layers of the organic material, in the working chambers 1 1 a to 1 1 c, if the above-mentioned working environment is maintained, water or oxygen is not mixed in the organic material layer, and the film chamber is deteriorated. After repeatedly moving and ejecting a specific position on the substrate 7a to form a finished organic material layer, the substrate 7a is returned from the working chamber 113 to the chamber 36a, and is housed in the cassette, and the new substrate 7a is removed from the chamber 36a. It is transported to the work chamber 1 la to exchange the substrate 7a. The formation of the organic material layer is repeated, and the substrate 7a is exchanged. After the substrate 7a of a specific number of sheets is formed, the organic material layer is formed, and the cassette α is taken out from the chamber 36a to be jammed and transported directly from the first manufacturing apparatus. The chamber 36b of the second manufacturing apparatus 2 is transported from the first manufacturing apparatus 1 to another apparatus, and after being processed by each substrate 7a, it is transported to the second system-14 - 200915912. The chamber 36b' conveys the cassette to the chamber 36b and blocks the chamber 36b from the external environment. The mounting table 3 8 and the sealing material supply device 40 are disposed inside the working chamber lib of the second manufacturing apparatus 2. While the working chamber 1 1 b is exhausted, the drying gas is not heated, and fr is supplied to 'form the dried working environment, and the working environment is maintained. The substrate 7a on which the organic material layer is formed is transported from the chamber 36b. The workroom lib is placed on the mounting table 38. The sealing material is in the form of a paste or a solid. Here, the sealing material is in the form of a paste. The sealing material supply device 40 has a distributor 45, and the distributor 4 is connected to the sealing material supply system 4, and supplies a paste. Sealing material. Either or both of the distributor 45' and the mounting table 38 are connected to a moving means (not shown). When either or both of the distributor 45 and the mounting table 38 are moved, the substrate 7a' on the mounting table 38 and the dispenser 45 are relatively moved, and the sealing material is extruded from the nozzle hole ' of the dispenser 45. The surface of the substrate 7& is formed to form an annular sealing material layer in a range (light emitting range) around each of the organic material layers on which the surface of the substrate 7a is formed. The formation of the sealing material layer is not deteriorated as the organic material layer formed on the surface of the substrate 7a is maintained while maintaining the above-described working environment. When the material of the crucible 4 is solid (for example, a rod shape), the sealing material supply device 40 is disposed outside the light-emitting range, and along the edge of the light-emitting range, a sealing material is disposed on the surface of the substrate 7a to form a seal around the light-emitting range. Material layer. -15- 200915912 The substrate 7a in a state in which the sealing material layer is formed is exchanged with the new substrate 7a, the formation of the repetitive sealing material layer, and the exchange of the substrate 7a, when the organic material layer is formed on the specific number of substrates 7a' Remove the cassette. The inside of the chamber 3 6c of the third manufacturing apparatus 3 is provided with a cassette for accommodating the substrate 7a on which the sealing material layer is formed, and a cassette for accommodating the substrate to be bonded, and then the chamber 36c is blocked from the external environment. When the inside of the working chamber Uc is exhausted, the drying gas is not heated and supplied to 'form the drying work environment, and the working environment is maintained'. The substrate 7a on which the sealing material layer is formed and the substrate to be bonded are formed. The chamber 36c is transported to the inside of the work chamber. In the working chamber 丨1 c of the third manufacturing apparatus 3, the bonding apparatus 50 is disposed, and the bonding apparatus 5 has the first and second holding means 51, 5 2 ' and the position matching means 5 6, and Moving means 5 5. The substrate 7 a on which the sealing material layer is formed and the substrate to be bonded are placed on the surface on which the sealing material layer is formed, and the surface on the bonding side is held in the opposite direction to the first state. The second means of maintenance 5 1,52. Fig. 3 shows the state in which the holding substrates 7a, 7b are held by the first and second holding means 5 1, 5 2 . The direction or arrangement of the substrates 7a and 7b in the state of the substrate is not particularly limited. However, when the adhesion between the sealing material layer and the substrate 7a is low, the surface on the side of the sealing material layer is disposed, and the substrate is arranged in a plane on the upper side. 7a, on the substrate 7a, the substrate 7b' to be bonded is placed with the surface on the side to be bonded facing downward. The position matching means 5.6 is, for example, a C C D camera or the like, and observes the substrate 7 a, 7b held by the first and second holding means 5 1, 5 2 of the 200915912, and detects the position information thereof. The moving means 5 5 and the position matching means 56 are connected to the control means 59, and the position information detected by the position matching means 56 is transmitted to the control means 59. The moving means 55 is configured to move and rotate one or both of the first and second holding means 51' 52 in the horizontal plane, and to hold the substrate 7a of the first and second holding means 51, 52, 7b moves with the first and second holding means 51, 52, and the solid substrates 7a, 7b are in the horizontal plane, relatively moved or rotated. The control unit 5.9 operates the moving means 5 5 in accordance with the transmitted position information, and rotates and/or moves the substrates 7a, 7b in the horizontal plane to match the substrates 7a, 7b as positions. The moving means 5 5 is added to the horizontal direction of movement and rotation, and either or both of the first and second holding means 51, 52 are configured to be relatively movable in the vertical direction. In the state where the mating substrates 7a and 7b are disposed, the control device 59 moves the first and first holding means 5 1, 5 2 in the vertical direction, and approaches the substrates 7a and 7b so that the sealing material layer is adhered. The substrate 7b to be bonded is bonded to the substrate 7b by sandwiching the sealing material layer. Inside the work chamber Uc of the second manufacturing apparatus 3, a curing means (not shown) is disposed. In the case where the sealing material layer contains an ultraviolet curable resin, the sealing material layer 'is irradiated with ultraviolet rays and contains a thermosetting resin. -17-200915912 A heat sealing material layer is formed so that the resin in the sealing material layer is superposed and hardened. Further, the sealing material layer contains a molten material such as glass or a thermoplastic resin, and the curing means heats and melts the sealing material layer to improve the adhesion to the substrates 7a and 7b, and then cools the sealing material layer (including natural cooling). And make it cure. Accordingly, the substrates 7a, 7b are fixed to each other via the hardened or cured sealing material layer. The organic electroluminescence device that fixes the substrates 7a, 7b is transported from the work chamber 1 lc to the chamber 36c, and the new substrates 7a, 7b are transported to the work chamber 1 1 c. The process of repeating the bonding of the substrates 7a, 7b and the transfer of the organic electroluminescent device and the transfer of the new substrates 7a, 7b, bonding a specific number of substrates 7a' 7b to form an organic electroluminescence After the device, the cartridge's organic electroluminescent device is taken out from the chamber 3 6c and taken out. All the works such as the process of fixing the bonded substrates 7a, 7b, and the shipment of the organic electroluminescent device and the transfer of the new substrates 7a, 7b, etc., such as maintaining the above-described working environment, are organic on the substrate 7a. The material layer did not deteriorate. As described above, the 'sealing material layer is formed in a ring shape around the light-emitting range in which the organic material layer is formed, so the organic material layer is surrounded by the substrate 7a, 7b, and the hardened or solidified sealing material layer, and then, the organic material The layer is blocked from the external environment. 'Moisture or oxygen does not enter. And, as described above, the process of forming the organic material layer, and the process of forming the sealing material layer and the bonding substrate 7a, 7b are fixed by the working chamber 1 1 in which the impurity gas such as water is removed in advance from -18 to 200915912. a ~1 1 C is carried out inside the "manufacturing project" in the organic material layer, and no impurity gas is mixed. Accordingly, the deterioration of the organic material layer via the impurity gas is not caused, and the life of the organic electroluminescent device becomes long. When the manufacture of the organic electroluminescent device is continued, for example, it is necessary to clean or exchange the printing head 25 or the dispenser 45, and to fill the raw material liquid of the organic material supply system 28, etc. 'Workroom 1 1 a 〜1 1 c internal maintenance, and for the maintenance of the interior of the workroom 1 1 a to 1 1 c, the substrates 7a, 7b are transported out, and the manufacture of the organic electroluminescent device is temporarily stopped. When performing maintenance work, usually, the internal space of the working room 1 1 a to 1 1 c is connected to the external environment, so the atmosphere enters the inside of the working room 1 1 a to 1 1 c, or the water in the atmosphere or Impurity gas such as oxygen adheres to the inner wall surfaces of the working chambers 11a to 11c. After the maintenance is completed, at least before the substrates 7 a, 7 b are transported to the work chambers 1 la 1 1 lc work chambers 1 la 1 1 lc, as described above, the environment inside the work chamber 丨la~l lc reaches the dew point - 7 6 °c (water concentration: 1 ppm), or the operator's desired level, while heating the working chambers 11a to 11c, the gas is replaced to form an operating environment. However, it is also possible to supply the working chamber from the end of the maintenance to the start of heating of the walls of the working chambers 11a to 11c or after the heating of the walls of the working chambers 1 1 1 1 c is started, and the drying gas is not supplied for a specific period of time. Π a~1 1 c Internal exhaust. In this case, it is possible to replace the majority of the atmosphere inside the working chamber 1 1 a to 1 1 C in the first gas replacement, and the efficiency is good, but after -19-200915912 is as described above, heating It is desirable that the gas in the working chambers 11a to 11c is replaced with a dry gas when the walls of the working chambers 1 1 a to 1 1 C are simultaneously supplied with the exhaust gas and the supply of the dry gas. Alternatively, the working room heating means 1 5 a to 1 S c heats the wall of the working chamber 1 1 a to 1 1 c while supplying the drying gas without heating, or more preferably, the working room heating means 1 5 a ~ 1 5 c is heated, and the heated drying gas is supplied to heat the working chamber. In any case, after the heating of the working chambers 1 1 a to 1 1 c is completed, the working chambers 11a to 11c are exhausted, and the drying gas is not heated and supplied to form an operating environment. After the working environment is formed, the substrates 7a, 7b are transported, and the formation of the organic material layer, the formation of the sealing material layer, and the bonding of the substrates 7a, 7b are resumed. However, for the print head 25 and the organic material supply system 2, and between the dispenser 45 and the sealing material supply system 41, valves 29, 49 are provided. When the working chambers 11a to 11c are exhausted in a reduced pressure environment (including a vacuum environment) having a relatively large atmospheric pressure, the valves 29 and 49 are closed, and the inside of the working chamber 1 1 a to 1 1 c is supplied. After the space rises above a certain pressure, the valve 2, 4, 9 is opened on the printing head 25 or the distributor 45, such as the raw material liquid or the sealing material, and the raw material liquid or the sealing material is not sprayed in the exhaust gas. The interior space of the room 1 la~1 lc. The dry gas system is not limited to dry nitrogen, and various gases such as Ar gas may be used as the gas which does not cause chemical deterioration of the organic material. For example, the presence of oxygen may not be a problem, and may be used. -20- 200915912 For dry gas of oxygen (for example, dry air), only one of these drying gas systems may be supplied to the working chamber 1 1 a to 1 1 C, or two or more types may be supplied to Workroom 1 la~1 lc. Further, the heating gas supplied while heating the working chambers 1 1 a to 1 1 c and the working gas supplied when the working environment is formed after the completion of heating may be changed to the same type. The walls of the working chambers 11a to 11c are desirably made of a material having high thermal conductivity, but at least a part thereof may be inserted into a transparent plate such as glass to serve as a monitoring window. The heating of the working chambers 11a to 11c is desirably performed when the wall temperature is 60° C. or more and 80° C. or less, and when the temperature is less than 60° C., the water is not sufficiently removed, and when it exceeds 80° C., There is a problem with security. The heating of the working chambers 1 la to 1 lc may be performed not only before the substrates 7 a and 7 b are transported to the work chambers 1 1 a to 1 1 c but also when the substrates are placed in the work chambers 1 la to l lc . However, in the case where a film having low heat resistance such as an organic electroluminescence layer is formed on the substrates 7a and 7b, it is necessary to terminate the heating before the substrate 7a' 7b is transported, and the internal temperature of the working chambers 11a to lie' Drop to a specific temperature (for example, the temperature of the organic material that does not decompose the organic electroluminescent layer). Further, the first to third manufacturing apparatuses 1 to 3 are connected to a transport chamber (not shown). By the transport chamber, the substrates 7a and 7b are not exposed to the atmosphere, and may be in the first to the first The three manufacturing apparatuses are transported between 1 and 3. Although the above description has been made regarding the formation of the sealing material layer on the substrate 7 a after the formation of the organic material layer, the present invention is not limited to the constitution of 21 - 200915912, but may be in the second After the manufacturing apparatus 2 forms the sealing material layer, the organic material layer is formed in the first manufacturing apparatus 1. Further, the substrate 7a on which the organic material layer is formed may be provided with a sealing material layer, and the sealing material layer may be disposed on the bonded substrate 7b, and the organic material layer may be formed between the bonding substrates 7a and 7b. After the sealing material layer is disposed on both the substrate 7a and the bonded substrate 7b, the substrates 7a and 7b are bonded to each other. The material of the substrate 7a''7b is not particularly limited, and a glass substrate, a plastic substrate, a ceramic substrate or the like can be used. In the working chambers 11a to 11c, the pressure at the time of processing the substrates 7a to 7c is not particularly limited. However, when the organic material layer is formed, the mechanism of the nozzles of the printing heads 25 is not disturbed, and when it is atmospheric pressure, It is desirable that the bonding of the substrates 7a to 7c is performed in an operating environment in which the pressure is low. In the above, the formation of the organic material layer in the individual working chambers 丨a to 丨ic, the formation of the sealing material layer, and the bonding and fixing of the substrates 7a and 7b have been described, but the present invention has been described. The system is not limited to this. In the inkjet printer 20' and the sealing material supply device 40, and at least two or more devices in the bonding device 50 are disposed in the same working chamber, the organic material layer is formed, and the sealing material layer is formed. In the case of bonding and fixing to the substrates 7a and 7b, it is also possible to perform two or more projects in the same working chamber. In particular, if the sealing material supply device 4 〇 and the bonding device 5 〇, such as the device that uses -22-200915912 for continuous engineering, the inside of the same working chamber is not only shortened to the loading and unloading of the substrates 7a, 7b. The time required is more desirable because the risk of exposure of the substrates 7a and 7b to the external environment is low. In this case, the machine arm that carries the substrate 7a' 7b can be transported inside the work chamber, and the substrate can be transported inside the work chamber. Further, the working chambers 1 1 a to 1 1 C can be heated while the working chambers 1 1 a to 1 1 C are simultaneously exhausted, and the working chambers 1 1 a to 1 1 b are heated without supplying dry gas. However, as described above, this is a case where the removal efficiency of impurities is lowered. Further, the gas supply system for supplying the dry gas and the exhaust system ' may be connected to the transfer chambers 31a to 31c and either or both of the chambers 36a to 36c. Before the substrates 7a, 7b are carried into the work chambers 1 la to 1 lc, the inside of the transport chambers 31a to 31c and the chambers 36a to 36c are exhausted while supplying "dry gas" to the substrate 7a. When 7b is transported to the workroom 11, the amount of the impurity gas entering from the transport chambers 31a to 31c or the chambers 36a to 36c is small. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] is a schematic cross-sectional view illustrating a first manufacturing apparatus. [Fig. 2] is a schematic cross-sectional view of a manufacturing apparatus of G. Fig. 3 is a schematic cross-sectional view showing the third manufacturing apparatus. [Description of main component symbols] -23- 200915912 1 to 3: manufacturing apparatus (first to third manufacturing apparatuses) 7 a, 7 b : substrates 12 a to 12 c : heating devices 15a to 15c : working chamber heating means 16a ~ 16c: heating gas supply devices 17a to 17c: gas supply system 20: inkjet printer 40: sealing material supply device 50: bonding device 5: first holding means 52: second holding means 5 5 : Moving means 5 6 : Position matching means -24-