TWI416986B - Manufacturing apparatus for organic el devices - Google Patents
Manufacturing apparatus for organic el devices Download PDFInfo
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- TWI416986B TWI416986B TW097117636A TW97117636A TWI416986B TW I416986 B TWI416986 B TW I416986B TW 097117636 A TW097117636 A TW 097117636A TW 97117636 A TW97117636 A TW 97117636A TW I416986 B TWI416986 B TW I416986B
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- organic electroluminescence
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 113
- 238000010438 heat treatment Methods 0.000 claims abstract description 104
- 239000003566 sealing material Substances 0.000 claims abstract description 53
- 238000005401 electroluminescence Methods 0.000 claims description 41
- 239000007788 liquid Substances 0.000 claims description 7
- 239000007789 gas Substances 0.000 abstract description 105
- 239000011368 organic material Substances 0.000 abstract description 34
- 239000012535 impurity Substances 0.000 abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 17
- 238000001035 drying Methods 0.000 description 17
- 230000015572 biosynthetic process Effects 0.000 description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 7
- 239000002994 raw material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
- 239000003440 toxic substance Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 206010013554 Diverticulum Diseases 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000012407 engineering method Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/811—Controlling the atmosphere during processing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
本發明係為有關有機電激發光顯示器等之有機電激發光裝置之製造裝置。The present invention relates to a manufacturing apparatus of an organic electroluminescence device for an organic electroluminescence display or the like.
有機電激發光材料係因經由水等或氧而造成化學性地劣化，而以提案有在遮斷從外部環境氣體之作業室內，進行經由噴墨印刷之有機電激發光材料之塗佈工程，經由吐出裝置之密封材料的塗佈工程，更加地，基板的貼合工程等之工程方法。The organic electroluminescent material is chemically degraded by water or the like, and it is proposed to coat the organic electroluminescent material by inkjet printing in a working chamber that blocks the external ambient gas. An engineering method such as a coating process of a sealing material by a discharge device, and a bonding work of a substrate.
對於在進行各工程之前，係將作業室的內部，進行排氣，及/或於作業室的內部，導入乾燥氣體，由乾燥氣體置換作業室的內部空間，除去水或氧等之不純物氣體。Before the work is performed, the inside of the work chamber is exhausted, and/or the dry gas is introduced into the work chamber, and the internal space of the work chamber is replaced by the dry gas to remove impurities such as water or oxygen.
但，進行作業室的內部之排氣，或乾燥氣體的導入，不純物氣體係亦附著殘留於作業室的內壁面，故無法完全地去除者。However, the exhaust gas inside the working chamber or the introduction of the dry gas causes the impure material gas system to adhere to the inner wall surface of the working chamber, so that it cannot be completely removed.
未被除去而殘留之不純物氣體係在作業中進行蒸發而釋放於內部空間，混入於有機材料層。The impure gas system remaining without being removed is evaporated during operation and released into the internal space, and mixed into the organic material layer.
隨之，在以往之製造裝置中，未使不純物氣體混入而製造有機電激發光裝置之情況則為困難Accordingly, in the conventional manufacturing apparatus, it is difficult to manufacture an organic electroluminescence device without mixing an impurity gas.
[專利文獻1]日本特開2004-174659號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-174659
本發明係為為了解決上述課題所作為之構成，其目的係為提供未使不純物氣體混入而可製造有機電激發光裝置之製造裝置者。The present invention has been made to solve the above problems, and an object thereof is to provide a manufacturing apparatus capable of manufacturing an organic electroluminescence device without mixing an impurity gas.
對於為了延長有機電激發光裝置之壽命，有必要在露點-76℃(水分濃度1ppm)以下的環境，進行作業者。In order to extend the life of the organic electroluminescent device, it is necessary to carry out the operation in an environment having a dew point of -76 ° C (water concentration of 1 ppm) or less.
以室溫的條件，由欲作為將殘留於作業室內部的水，與作業室內部之排氣，與乾燥氮氣之供給，同時進行排出之時(作業室內部係維持為大氣壓)，在60小時後，到達至露點-75℃，但，之後，露點未下降，而在歷經300小時，仍維持露點-75℃，未到達至露點-76℃。At room temperature, when the water remaining in the inside of the work chamber is supplied to the inside of the work chamber and the supply of dry nitrogen is simultaneously discharged (the inside of the work chamber is maintained at atmospheric pressure) for 60 hours. After that, it reached a dew point of -75 ° C, but after that, the dew point did not fall, and after 300 hours, the dew point was maintained at -75 ° C, and did not reach the dew point -76 ° C.
本發明者等乃將加熱器捲附於作業室的外壁，以加熱氣加熱壁之後，進行作業室內部之排氣，與乾燥氮氣之供給之時，由作為日間8小時之加熱，夜間冷卻(及排氣與乾燥氣體之供給)的情況，在48小時後，到達至露點-76℃，在72小時之後，係到達至露點-77.5℃。The inventors of the present invention attached the heater to the outer wall of the working chamber, heated the wall by heating the gas, and then exhausted the inside of the working chamber, and when it was supplied with dry nitrogen, it was heated for 8 hours during the day and cooled at night ( In the case of the supply of exhaust gas and dry gas, after 48 hours, it reached a dew point of -76 ° C, and after 72 hours, it reached a dew point of -77.5 ° C.
如此，比較於未加熱作業室之情況，對於加熱作業室的情況，係可在短時間降低露點者。In this way, in comparison with the case where the working chamber is not heated, in the case of heating the working chamber, the dew point can be lowered in a short time.
依據有關的見解所作為之本發明係屬於具有作業室，和於配置於前述作業室的內部之基板的表面，吐出液體之噴墨印表機，將前述作業室的內部空間，可與外部環境遮斷地而構成之有機電激發光裝置之製造裝置，其中，具有將前述作業室，連接於外部氣氛保養終了之後，於將前 述基板搬入至前述作業室之前進行加熱之加熱裝置的有機電激發光裝置之製造裝置。According to the related findings, the present invention pertains to an ink jet printer having a working chamber and a surface of a substrate disposed inside the working chamber, and discharging the liquid, and the internal space of the working chamber can be externally A manufacturing apparatus of an organic electroluminescence device configured to block the ground, wherein the operation room is connected to the external atmosphere and the maintenance is completed. A manufacturing apparatus of an organic electroluminescence device for heating a heating device before the substrate is loaded into the working chamber.
本發明係屬於有機電激發光裝置之製造裝置，其中，前述加熱裝置係為具有安裝於前述作業室的壁之作業室加熱手段，和於前述作業室內，供給加熱氣體之加熱氣體供給裝置之任一方或雙方之有機電激發光裝置之製造裝置。The present invention relates to a manufacturing apparatus of an organic electroluminescence device, wherein the heating device is a working chamber heating means having a wall attached to the working chamber, and a heating gas supply device for supplying a heating gas in the working chamber. A manufacturing device for one or both of the organic electroluminescent devices.
本發明係屬於有機電激發光裝置之製造裝置，其中，前述加熱氣體供給裝置係具有連接於前述作業室之氣體供給系統，作為加熱氣體而供給乾燥氣體之有機電激發光裝置之製造裝置。The present invention relates to a manufacturing apparatus of an organic electroluminescence device, which is provided with a gas supply system connected to the working chamber, and a manufacturing device of an organic electroluminescence device that supplies a drying gas as a heating gas.
本發明係屬於有機電激發光裝置之製造裝置，其中，具有運送室，和配置於前述運送室內部之運送機器手臂，前述運送室係氣密地連接於前述作業室之有機電激發光裝置之製造裝置。The present invention relates to a manufacturing apparatus of an organic electroluminescence device, comprising: a transport chamber; and a transport robot disposed in the transport chamber; the transport chamber is airtightly connected to the organic electroluminescent device of the work chamber Manufacturing equipment.
本發明係屬於具有作業室，和於配置於前述作業室的內部之基板，配置密封材料之密封材料供給裝置，可從外部環境遮斷前述作業室的內部空間地所構成之有機電激發光裝置之製造裝置，其中，具有將前述作業室，連接於外部氣氛保養終了之後，於將前述基板搬入至前述作業室之前加熱前述作業室之加熱裝置的有機電激發光裝置之製造裝置。The present invention relates to an organic electroluminescence device comprising a working chamber and a sealing material supply device in which a sealing material is disposed on a substrate disposed inside the working chamber, and an internal space of the working chamber can be blocked from an external environment. The manufacturing apparatus includes a manufacturing apparatus of an organic electroluminescence device that heats the heating device of the working chamber before the substrate is transported to the working chamber after the working chamber is connected to the external atmosphere.
本發明係屬於有機電激發光裝置之製造裝置，其中，前述加熱裝置係具有安裝於前述作業室的壁之作業室加熱手段，和於前述作業室內，供給加熱氣體之加熱氣體供給 裝置之任一方或雙方之有機電激發光裝置之製造裝置。The present invention relates to a manufacturing apparatus of an organic electroluminescence device, wherein the heating device has a working chamber heating means attached to a wall of the working chamber, and a heating gas supply for supplying a heating gas in the working chamber. A manufacturing device for an organic electroluminescent device of either or both of the devices.
本發明係屬於有機電激發光裝置之製造裝置，其中，前述加熱氣體供給裝置係具有連接於前述作業室之氣體供給系統，作為加熱氣體而供給乾燥氣體之有機電激發光裝置之製造裝置。The present invention relates to a manufacturing apparatus of an organic electroluminescence device, which is provided with a gas supply system connected to the working chamber, and a manufacturing device of an organic electroluminescence device that supplies a drying gas as a heating gas.
本發明係為具有運送室，和配置於前述運送室內部之運送機器手臂，前述運送室係氣密地連接於前述作業室之有機電激發光裝置之製造裝置。The present invention relates to a manufacturing apparatus including a transport chamber and a transport robot disposed in the transport chamber, and the transport chamber is an organic electroluminescence device that is airtightly connected to the work chamber.
本發明係屬於具有作業室，和貼合裝置，前述貼合裝置係具有保持第一之基板的第一之保持手段，和保持第二之基板的第二之保持手段，和相對地使前述第一，第二之保持手段移動，使前述第一，第二之基板貼合之移動手段，可從外部環境遮斷前述作業室的內部空間地所構成之有機電激發光裝置之製造裝置，具有將前述作業室，連接於外部氣氛保養終了之後，於將前述基板搬入至前述作業室之前加熱前述作業室之加熱裝置的有機電激發光裝置之製造裝置。The present invention relates to a working chamber having a first retaining means for holding a first substrate, and a second retaining means for holding a second substrate, and the foregoing First, the second holding means moves, and the moving means for bonding the first and second substrates can block the manufacturing device of the organic electroluminescent device formed by the internal space of the working chamber from the external environment. After the operation chamber is connected to the external atmosphere, the manufacturing apparatus of the organic electroluminescence device for heating the heating device of the working chamber is heated before the substrate is carried into the working chamber.
本發明係屬於有機電激發光裝置之製造裝置，其中，具有檢測前述第一，第二之基板的相對的位置資訊之位置配合手段，前述移動手段係依據前述位置配合手段所檢測出之位置資訊，使前述第一，第二之保持手段，在水平面內，相對性地移動之有機電激發光裝置之製造裝置。The present invention relates to a manufacturing apparatus for an organic electroluminescent device, wherein the device has a position matching means for detecting relative position information of the first and second substrates, and the moving means is position information detected by the position matching means. The first and second holding means are means for manufacturing the organic electroluminescent device which are relatively moved in a horizontal plane.
本發明係屬於有機電激發光裝置之製造裝置，其中，前述加熱裝置係具有安裝於前述作業室的壁之作業室加熱 手段，和於前述作業室內，供給加熱氣體之加熱氣體供給裝置之任一方或雙方之有機電激發光裝置之製造裝置。The present invention relates to a manufacturing apparatus of an organic electroluminescent device, wherein the heating device has a working chamber heated to be mounted on a wall of the working chamber And a manufacturing apparatus of the organic electroluminescence device that supplies either or both of the heating gas supply devices that heat the gas in the work chamber.
本發明係屬於有機電激發光裝置之製造裝置，其中，前述加熱氣體供給裝置係具有連接於前述作業室之氣體供給系統，作為加熱氣體而供給乾燥氣體之有機電激發光裝置之製造裝置。The present invention relates to a manufacturing apparatus of an organic electroluminescence device, which is provided with a gas supply system connected to the working chamber, and a manufacturing device of an organic electroluminescence device that supplies a drying gas as a heating gas.
本發明係屬於有機電激發光裝置之製造裝置，其中，具有運送室，和配置於前述運送室內部之運送機器手臂，前述運送室係氣密地連接於前述作業室之有機電激發光裝置之製造裝置。The present invention relates to a manufacturing apparatus of an organic electroluminescence device, comprising: a transport chamber; and a transport robot disposed in the transport chamber; the transport chamber is airtightly connected to the organic electroluminescent device of the work chamber Manufacturing equipment.
然而，在本發明，設置作業室加熱手段之作業室的壁係指包含所有作業室的頂面，底面及側壁，而作業室加熱手段係亦可設置於作業室之外壁面，亦可設置於內壁面。However, in the present invention, the wall of the work chamber in which the work chamber heating means is provided refers to the top surface, the bottom surface and the side walls of all the work chambers, and the work chamber heating means may be disposed on the outer wall surface of the work chamber, or may be disposed on the wall surface of the work chamber. Inner wall surface.
更加地，亦可將作業室加熱手段，埋設於作業室的壁，但當考慮作業室加熱手段之維護的簡便性時，期望為安裝於內壁面或外壁面者，另外，當考慮不純物氣體脂去除效率時，期望為將作業室加熱手段安裝於作業室之內壁面者。Further, the working room heating means may be embedded in the wall of the working room. However, when considering the simplicity of the maintenance of the working room heating means, it is desirable to be attached to the inner wall surface or the outer wall surface, and in addition, when considering the impurity gas grease When the efficiency is removed, it is desirable to attach the work chamber heating means to the inner wall surface of the work chamber.
如根據本發明，附著於作業室之壁面的不純物氣體係因經由加熱所去除，故於作業室，未殘留有不純物氣體，因在製造工程為混入有不純物氣體，故有機電激發光裝置的壽命則變長According to the present invention, the impurity gas system attached to the wall surface of the working chamber is removed by heating, so that no impurity gas remains in the working chamber, and since the manufacturing process is mixed with the impurity gas, the life of the organic electroluminescent device is Then grow longer
圖1~3之符號1~3係各自表示本發明第一~第三之有機電激發光裝置之製造裝置，而對於第一~第三之製造裝置1~3之相同構件，係於相同符號，附上添加字a~c而加以區別。Symbols 1 to 3 of FIGS. 1 to 3 each denote a manufacturing apparatus of the first to third organic electroluminescent devices of the present invention, and the same components of the first to third manufacturing apparatuses 1 to 3 are denoted by the same symbols. , add the words a ~ c and distinguish them.
第一~第三之製造裝置1~3係各自具有運送室31a~31c，作業室11a~11c，和匣室36a~36c。The first to third manufacturing apparatuses 1 to 3 each have transport chambers 31a to 31c, work chambers 11a to 11c, and chambers 36a to 36c.
作業室11a~11c和匣室36a~36c係藉由門8a~8c，9a~9c而連接於運送室31a~31c，當開啟門8a~8c，9a~9c時，內部空間乃個連接於運送室31a~31c之內部空間。The working chambers 11a to 11c and the chambers 36a to 36c are connected to the transport chambers 31a to 31c by the doors 8a to 8c, 9a to 9c, and when the doors 8a to 8c, 9a to 9c are opened, the internal space is connected to the transport. The internal space of the chambers 31a to 31c.
對於匣室36a~36c，係設置有無圖示之運出入口.當開啟運出入口時，成為可運出入收容有基板之卡匣，當關避運出入口時，匣室36a~36c的內部空間則從外部所遮斷。For the diverticulum chambers 36a to 36c, there is an unillustrated transport port. When the transport port is opened, the cassette can be transported into and out of the substrate, and when the port is closed, the inner spaces of the chambers 36a to 36c are The outside is blocked.
對於運送室31a~31c之內部，係配置有運送基板之運送機器手臂35a~35c，當開啟門8a~8c，9a~9c時，經由機器手臂35a~35c，成為可在作業室11a~11c與匣室36a~36c之間運送基板地所構成，隨之，基板係未曝露於外部環境地，通過運送室31a~31c而在作業室11a~11c與匣室36a~36c之間，加以運送。In the inside of the transport chambers 31a to 31c, the transport robots 35a to 35c for transporting the substrates are disposed, and when the doors 8a to 8c, 9a to 9c are opened, the robots 35a to 35c are provided in the work chambers 11a to 11c. The substrate is transported between the chambers 36a to 36c, and the substrate is not exposed to the external environment, and is transported between the working chambers 11a to 11c and the chambers 36a to 36c by the transport chambers 31a to 31c.
對於作業室11a~11c，係安裝有加熱裝置12a~12c，作業室11a~11c係經由加熱裝置12a~12c所加熱。The work chambers 11a to 11c are provided with heating devices 12a to 12c, and the work chambers 11a to 11c are heated by the heating devices 12a to 12c.
加熱裝置12a~12c係具有加熱作業室11a~11c的壁之 作業室加熱手段15a~15c，和於作業室11a~11c之內部，供給加熱氣體之加熱氣體供給裝置16a~16c之任一方或雙方。The heating devices 12a to 12c have walls that heat the work chambers 11a to 11c. The working chamber heating means 15a to 15c and one or both of the heating gas supply devices 16a to 16c for heating the gas are supplied to the inside of the working chambers 11a to 11c.
作業室加熱手段15a~15c係密著安裝於作業室11a~11c壁。The work chamber heating means 15a to 15c are attached to the walls of the work chambers 11a to 11c in close contact.
在此係作業室加熱手段15a~15c乃在作業室11a~11c的內側，安裝於作業室11a~11c之側壁與頂面，但作業室加熱手段15a~15c之安裝場所係無特別限定。Here, the work chamber heating means 15a to 15c are attached to the side walls and the top surface of the work chambers 11a to 11c inside the work chambers 11a to 11c, but the installation places of the work chamber heating means 15a to 15c are not particularly limited.
作業室加熱手段15a~15c係在作業室11a~11c之頂面，底壁，側壁之中，設置於1處以上即可，另外，作業室加熱手段15a~15c係亦可設置於作業室11a~11c之內側(內壁面)和外側(外壁面)之任一，或雙方者。The work chamber heating means 15a to 15c may be provided on one of the top surfaces of the work chambers 11a to 11c, the bottom wall, and the side walls, and the work chamber heating means 15a to 15c may be provided in the work chamber 11a. Any of the inner side (inner wall surface) and the outer side (outer wall surface) of ~11c, or both.
作業室加熱手段15a~15c係具有加熱器(例如，金屬細管加熱器)，或溫水循環管，當通電於加熱器，或溫水通過於溫水循環管時，安裝有作業室11a~11c的壁之作業室加熱手段15a~15c的部分乃被加熱。The work chamber heating means 15a to 15c have a heater (for example, a metal thin tube heater) or a warm water circulation pipe, and when the heater is energized or the warm water passes through the warm water circulation pipe, the walls of the work chambers 11a to 11c are installed. The portions of the work chamber heating means 15a to 15c are heated.
作業室11a~11c的壁係由如金屬的熱傳導物質(例如，不鏽鋼)所構成，當加熱安裝有作業室11a~11c之作業室加熱手段15a~15c的部分時，以熱傳導，將作業室11a~11c的壁全體，進行升溫。The walls of the work chambers 11a to 11c are made of a thermally conductive material such as metal (for example, stainless steel). When the portions of the work chamber heating means 15a to 15c of the work chambers 11a to 11c are heated and heated, the work chamber 11a is thermally conducted. The entire wall of ~11c is heated.
當作業室11a~11c的壁升溫時，附著於作業室11a~11c之內壁面的水或氧則成為氣體(包含蒸氣)，釋放於作業室11a~11c之內部空間，對於作業室11a~11c，係連接排氣系統19a~19c，成為可從作業室11a~11c之內部 空間，排出氣體。When the walls of the work chambers 11a to 11c are heated, the water or oxygen adhering to the inner wall surfaces of the work chambers 11a to 11c becomes gas (including steam) and is released into the internal spaces of the work chambers 11a to 11c, and the work chambers 11a to 11c are closed. Connected to the exhaust systems 19a to 19c to be internal from the work chambers 11a to 11c Space, exhaust gas.
加熱氣體供給裝置16a~16c係具有氣體供給系統17a~17c，和氣體加熱手段14a~14c。The heating gas supply devices 16a to 16c have gas supply systems 17a to 17c and gas heating means 14a to 14c.
氣體供給系統17a~17c係具有配置乾燥氣體(例如，乾燥氮素)之容器41a~41c，和一端連接於容器41a~41c，另一端則氣密地插通於作業室11a~11c內之配管42a~42c。The gas supply systems 17a to 17c have containers 41a to 41c in which a dry gas (for example, dry nitrogen) is disposed, and a pipe whose one end is connected to the containers 41a to 41c and whose other end is airtightly inserted into the work chambers 11a to 11c. 42a~42c.
氣體加熱手段14a~14c係安裝於容器41a~41c與配管42a~42c之任一方或雙方。The gas heating means 14a to 14c are attached to either or both of the containers 41a to 41c and the pipes 42a to 42c.
氣體加熱手段14a~14c係例如為加熱器，當通電於氣體加熱手段14a~14c時，配置於氣體加熱手段14a~14c之乾燥氣體係加熱於從容器41a~41c移動至作業室11a~11c內之間，隨之，對於作業室11a~11c之內部，係供給所加熱之乾燥氣體(加熱器體)。The gas heating means 14a to 14c are, for example, heaters, and when energized by the gas heating means 14a to 14c, the drying gas system disposed in the gas heating means 14a to 14c is heated to be moved from the containers 41a to 41c to the working chambers 11a to 11c. Accordingly, the heated dry gas (heater body) is supplied to the inside of the working chambers 11a to 11c.
作業室11a~11c之內壁面係接觸於所加熱之乾燥氣體所加熱，附著於作業室11a~11c之內壁面的水或氧則成為氣體而釋放。The inner wall surfaces of the working chambers 11a to 11c are heated by contact with the heated drying gas, and water or oxygen adhering to the inner wall surfaces of the working chambers 11a to 11c is released as a gas.
所釋放之氣體係因經由所加熱的乾燥氣體而排出，經由排出系統19a~19c，有效率地排出於作業室11a~11c之外部。The released gas system is discharged through the heated dry gas, and is efficiently discharged outside the work chambers 11a to 11c via the discharge systems 19a to 19c.
作業室加熱手段15a~15c，和加熱氣體供給裝置16a~16c係亦可只使用任一方，但附著於作業室11a~11c之內壁面的水或氧的排出效率為高。The working chamber heating means 15a to 15c and the heating gas supply devices 16a to 16c may be used alone, but the discharge efficiency of water or oxygen adhering to the inner wall surfaces of the working chambers 11a to 11c is high.
然而，在此係在配管42a~42c之中，於容器41a~41c與作業室11a~11c之間的部分，設置有崁入過濾器 18a~18c，而即使作為於容器41a~41c，混入微粒子或不純物氣體，亦可由崁入過濾器18a~18c所去除。However, here, among the pipes 42a to 42c, a portion between the containers 41a to 41c and the work chambers 11a to 11c is provided with an intrusion filter. 18a to 18c, even if the particles 41 or 41c are mixed with fine particles or impurities, they can be removed by the intrusion filters 18a to 18c.
接著，關於使用第一~第三之製造裝置1~3，而製造有機電激發光裝置之工程，進行說明。Next, a description will be given of a process for manufacturing an organic electroluminescence device using the first to third manufacturing apparatuses 1 to 3.
在開始有機電激發光裝置之製造之前，從外部環境遮斷第一~第三之製造裝置1~3之作業室11a~11c，並加熱作業室11a~11c的壁，使水或氧釋放。Before starting the manufacture of the organic electroluminescent device, the working chambers 11a to 11c of the first to third manufacturing apparatuses 1 to 3 are blocked from the external environment, and the walls of the working chambers 11a to 11c are heated to release water or oxygen.
在加熱作業室11a~11c的壁之同時，供給從加熱氣體供給裝置16a~16c所加熱之乾燥氣體，同時進行經由排氣系統19a~19c之排氣，置換作業室11a~11c之內部的氣體。The heating gas heated by the heating gas supply devices 16a to 16c is supplied while the walls of the working chambers 11a to 11c are heated, and the exhaust gas is exhausted through the exhaust systems 19a to 19c to replace the gas inside the working chambers 11a to 11c. .
此時，作業室11a~11c之內部壓力，則較大氣壓僅成為陽壓地，如設定排氣系統19a~19c之排氣速度，和乾燥氣體的供給量，防止從外部的水分.氧的混入。At this time, the internal pressure of the working chambers 11a to 11c is only a positive pressure, and the exhaust gas velocity of the exhaust systems 19a to 19c and the supply amount of the dry gas are set to prevent the incorporation of moisture and oxygen from the outside. .
但，在作業室11a~11c內，處理有毒物質之情況，係作業室11a~11c之內部壓力，則較大氣壓僅成為負壓地，如設定排氣系統19a~19c之排氣速度，和乾燥氣體的供給量，防止從作業室11a~11c至外部的有毒物質之洩漏。However, in the working chambers 11a to 11c, when the toxic substances are handled, and the internal pressures of the working chambers 11a to 11c are, the large air pressure is only the negative pressure, and the exhaust speeds of the exhaust systems 19a to 19c are set, and drying is performed. The supply amount of the gas prevents leakage of toxic substances from the working chambers 11a to 11c to the outside.
無論如何，由將作業室11a~11c內部，保持為大氣壓附近的壓力情況，由經由作業室11a~11c之氣體(所加熱的乾燥氣體)的熱傳導，加溫製作業室11a~11c內部的各角落，可促進水分等之不純物的脫離者，進而可極快乾燥作業室11a~11c內部的環境。In any case, by holding the inside of the working chambers 11a to 11c at a pressure in the vicinity of the atmospheric pressure, each of the inside of the working chambers 11a to 11c is heated by heat conduction of the gas (heated drying gas) passing through the working chambers 11a to 11c. The corners can promote the detachment of impurities such as moisture, and the environment inside the working chambers 11a to 11c can be quickly dried.
然而，當作業室11a~11c之內部成為真空而進行排氣 時，因只由從作業室加熱手段15a~15c的熱放射而升溫，而陰暗的部分未升溫，從此等部分，未脫離不純物，而無法乾燥作業室11a~11c之內部。However, when the inside of the work chambers 11a to 11c is evacuated, the exhaust is performed. At this time, the temperature is raised only by the heat radiation from the working chamber heating means 15a to 15c, and the dark portion is not heated. From these portions, the impurities are not removed, and the inside of the working chambers 11a to 11c cannot be dried.
加熱作業室11a~11c的壁之加熱時間係均可為任意，但期望1循環的加熱係為8小時以上者，當加熱時間為少時，則無法升溫製作業室11a~11c內的各角落，而無法充分地使不純物脫離。The heating time of the walls of the heating working chambers 11a to 11c may be any. However, it is desirable that the heating system for one cycle is 8 hours or longer. When the heating time is small, the heating chambers 11a to 11c cannot be heated. It is not enough to completely remove the impurities.
在充分地加熱作業室11a~11c之後，使作業室加熱手段15a~15c與氣體加熱手段14a~14c停止，結束作業室11a~11c的壁之加熱和乾燥氣體之加熱。After the work chambers 11a to 11c are sufficiently heated, the work chamber heating means 15a to 15c and the gas heating means 14a to 14c are stopped, and the heating of the walls of the work chambers 11a to 11c and the heating of the dry gas are completed.
由未使乾燥氣體加熱而供給置作業室11a~11c之同時，持續作業室11a~11c之排氣，作業室11a~11c的壁之溫度下降之情況，可乾燥作業室11a~11c內部之環境者(氣體置換工程)。When the working chambers 11a to 11c are not heated by heating the drying gas, the exhaust of the working chambers 11a to 11c is continued, and the temperature of the walls of the working chambers 11a to 11c is lowered, whereby the environment inside the working chambers 11a to 11c can be dried. (gas replacement engineering).
作業室11a~11c內部之環境，未到達至露點-76℃(水分濃度1ppm)，或作業者所期望位準之情況，係重覆2次以上加熱工程與氣體置換工程而乾燥環境。The environment inside the working chambers 11a to 11c does not reach the dew point of -76 ° C (water concentration: 1 ppm), or the operator's desired level, and the heating environment and the gas replacement project are repeated twice or more to dry the environment.
將於表面，形成有電極或電晶體等之基板，收容於卡匣，將該卡匣，配置於第一之製造裝置1之匣室36a的內部。A substrate on which an electrode or a transistor is formed on the surface is housed in a cassette, and the cassette is placed inside the chamber 36a of the first manufacturing apparatus 1.
對於第一之製造裝置1之作業室11a內部，係配置載置台21，和噴墨印表機20。The mounting table 21 and the inkjet printer 20 are disposed inside the work chamber 11a of the first manufacturing apparatus 1.
噴墨印表機20係具有印刷頭25，印刷頭25係經由保持手段26，在載置台21之上方，從載置台21間隔配置。The inkjet printer 20 has a print head 25, and the print head 25 is disposed above the mounting table 21 via the holding means 26, and is spaced apart from the mounting table 21.
在排氣作業室11a內的同時，未加熱乾燥氣體而進行供給，維持所乾燥之作業環境，在維持該作業環境的同時，從匣室36a，運入基板至作業室11a內部，配置該基板於載置台21上，關閉門9a而從運送室31a，遮斷作業室11a之內部空間。While the inside of the exhaust chamber 11a is being supplied, the dry gas is not heated and supplied, and the dried working environment is maintained, and the substrate is transported from the chamber 36a to the inside of the working chamber 11a while the working environment is maintained, and the substrate is placed. On the mounting table 21, the door 9a is closed, and the internal space of the working chamber 11a is blocked from the transport chamber 31a.
圖1係表示於載置台21上，配置有基板7a之狀態。FIG. 1 shows a state in which the substrate 7a is placed on the mounting table 21.
印刷頭25係連接於有機材料供給系統28，從有機材料供給系統28，將包含有機材料(發光材料，電荷輸送材料，電子輸送材料，色素等)之原料液，供給至印刷頭25。The print head 25 is connected to the organic material supply system 28, and supplies a raw material liquid containing an organic material (a light-emitting material, a charge transport material, an electron transport material, a dye, etc.) from the organic material supply system 28 to the print head 25.
印刷頭25與載置台21之任一方或雙方係安裝於無圖示之移動手段。One or both of the print head 25 and the mounting table 21 are attached to a moving means (not shown).
使印刷頭25與載置台21之任一方或雙方移動，相對地使載置台21上之基板7a，和印刷頭25移動，印刷頭25之噴嘴孔則由位置於基板7a表面之特定位置上時，從噴嘴孔吐出原料液，彈著於基板7a表面，形成有機材料層。When either or both of the print head 25 and the mounting table 21 are moved, the substrate 7a on the mounting table 21 and the print head 25 are relatively moved, and the nozzle holes of the print head 25 are positioned at a specific position on the surface of the substrate 7a. The raw material liquid is discharged from the nozzle hole and is bounced on the surface of the substrate 7a to form an organic material layer.
形成有機材料層之間，於作業室11a~11c之內部，如維持上述之作業環境，對於有機材料層，係未混入存在水分或氧等，而膜質則為產生劣化。Between the formation of the organic material layers, in the working chambers 11a to 11c, if the above-described working environment is maintained, the organic material layer is not mixed with moisture or oxygen, and the film quality is deteriorated.
重覆移動與吐出，於基板7a之特定位置，形成結束有機材料層之後，將基板7a，從作業室11a，返回至匣室36a，收容於卡匣，將新的基板7a，從匣室36a運送至作業室11a，交換基板7a。After repeating the movement and ejection, after the end of the organic material layer is formed at a specific position of the substrate 7a, the substrate 7a is returned from the working chamber 11a to the chamber 36a, and is accommodated in the cassette, and the new substrate 7a is removed from the chamber 36a. It is transported to the workroom 11a, and the substrate 7a is exchanged.
重覆有機材料層的形成，基板7a之交換，於特定片數之基板7a，形成有機材料層之後，從匣室36a取出卡匣 。The formation of the organic material layer is repeated, and the substrate 7a is exchanged. After the specific number of substrates 7a are formed, the organic material layer is formed, and the cassette is taken out from the chamber 36a. .
將其卡匣，直接從第一之製造裝置1，運送至第二之製造裝置2之匣室36b，或從第一之製造裝置1，運送至其他的裝置，於各基板7a進行處理之後，運送至第二之製造裝置2之匣室36b，而將卡匣，運送至匣室36b後係從外部環境遮斷該匣室36b。The cassette is transported directly from the first manufacturing apparatus 1 to the chamber 36b of the second manufacturing apparatus 2, or from the first manufacturing apparatus 1 to another apparatus, and after being processed by each substrate 7a, The cassette 36b is transported to the chamber 36b of the second manufacturing apparatus 2, and the cassette 36b is transported to the chamber 36b to block the chamber 36b from the external environment.
對於第二之製造裝置2之作業室11b內部，係配置載置台38，和密封材料供給裝置40。The mounting table 38 and the sealing material supply device 40 are disposed inside the working chamber 11b of the second manufacturing apparatus 2.
在將作業室11b進行排氣的同時，未加熱乾燥氣體而進行供給，形成所乾燥之作業環境，保持維持該作業環境，將形成有有機材料層之基板7a，從匣室36b運送至作業室11b，配置於載置台38上。While the working chamber 11b is exhausted, the drying gas is not heated and supplied to form a dry working environment, and the working environment is maintained, and the substrate 7a on which the organic material layer is formed is transported from the chamber 36b to the working chamber. 11b is disposed on the mounting table 38.
密封材料係為糊狀或固體狀，在此，密封材料係為糊狀，密封材料供給裝置40係具有分配器45，分配器45係連接於密封材料供給系統41，供給糊狀之密封材料。The sealing material is in the form of a paste or a solid. Here, the sealing material is in a paste form, and the sealing material supply device 40 has a dispenser 45 which is connected to the sealing material supply system 41 and supplies a paste-like sealing material.
分配器45，和載置台38之任一方或雙方係連接於無圖示之移動手段。One or both of the distributor 45 and the mounting table 38 are connected to a moving means (not shown).
使分配器45與載置台38之任一方或雙方移動，相對地使載置台38上之基板7a，和分配器45移動的同時，從分配器45之噴嘴孔，擠出密封材料，塗佈於基板7a表面，呈圍繞形成有基板7a表面之各有機材料層的範圍(發光範圍)地，形成環狀之密封材料層。When either or both of the dispenser 45 and the mounting table 38 are moved, the substrate 7a on the mounting table 38 and the dispenser 45 are relatively moved, and the sealing material is extruded from the nozzle hole of the dispenser 45 and applied to the nozzle. The surface of the substrate 7a is formed in a ring-shaped sealing material layer around a range (light-emitting range) of each of the organic material layers on which the surface of the substrate 7a is formed.
形成密封材料層之間，如維持上述之作業環境，形成於基板7a表面之有機材料層則未產生劣化。Between the formation of the sealing material layers, if the above-described working environment is maintained, the organic material layer formed on the surface of the substrate 7a is not deteriorated.
然而，密封材料為固體之情況(例如，棒狀)，密封材料供給裝置40係在較發光範圍為外側，沿著發光範圍的邊緣，於基板7a表面，配置密封材料，形成圍繞發光範圍之密封材料層。However, when the sealing material is solid (for example, a rod shape), the sealing material supply device 40 is disposed outside the light-emitting range, along the edge of the light-emitting range, and a sealing material is disposed on the surface of the substrate 7a to form a seal around the light-emitting range. Material layer.
將形成密封材料層之狀態的基板7a，與新的基板7a進行交換，重覆密封材料層的形成，基板7a之交換，於特定片數之基板7a，形成有機材料層時，取出卡匣。The substrate 7a in a state in which the sealing material layer is formed is exchanged with the new substrate 7a, and the formation of the sealing material layer is repeated, and the substrate 7a is exchanged. When the organic material layer is formed on the substrate 7a having a specific number of sheets, the cassette is taken out.
第三之製造裝置3的匣室36c之內部，配置收容形成有密封材料層之基板7a之卡匣，和收容貼合對象之基板的卡匣之後，從外部環境遮斷匣室36c。The inside of the chamber 36c of the third manufacturing apparatus 3 is provided with a cassette for accommodating the substrate 7a on which the sealing material layer is formed, and a cassette for accommodating the substrate to be bonded, and then the chamber 36c is blocked from the external environment.
在將作業室11c內進行排氣的同時，未加熱乾燥氣體而進行供給，形成所乾燥之作業環境，保持維持該作業環境，將形成有密封材料層之基板7a，和貼合對象之基板，從匣室36c運送至作業室11c內部。While the inside of the working chamber 11c is exhausted, the drying gas is not heated and supplied to form a dry working environment, and the substrate 7a on which the sealing material layer is formed and the substrate to be bonded are maintained while maintaining the working environment. It is transported from the chamber 36c to the inside of the working chamber 11c.
對於第三之製造裝置3的作業室11c內部，係配置貼合裝置50，貼合裝置50係具有第一，第二之保持手段51，52，和位置配合手段56，和移動手段55。The bonding apparatus 50 is disposed inside the working chamber 11c of the third manufacturing apparatus 3, and the bonding apparatus 50 has the first and second holding means 51, 52, the position matching means 56, and the moving means 55.
使形成有密封材料層之基板7a，和貼合對象之基板，在形成有密封材料層側的面，和所貼合側的面，呈對向地面對狀態，保持為第一，第二之保持手段51，52。The substrate 7a on which the sealing material layer is formed and the substrate to be bonded are placed on the surface on which the sealing material layer is formed, and the surface on the side of the bonding surface is opposed to the ground, and is held first and second. The means of holding 51, 52.
圖3係表示保持基板7a，7b於第一，第二之保持手段51，52之狀態。Fig. 3 shows the state in which the holding substrates 7a, 7b are held by the first and second holding means 51, 52.
其狀態之基板7a，7b之方向或配置係無特別限定，但對於密封材料層與基板7a之黏接性為低之情況，將配 置有密封材料層側的面，朝向上側而略平面配置基板7a，於其基板7a上，將貼合對象之基板7b，令所貼合側的面朝下側而配置。The direction or arrangement of the substrates 7a and 7b in the state is not particularly limited, but the adhesion between the sealing material layer and the substrate 7a is low. The surface on the side of the sealing material layer is placed on the upper side, and the substrate 7a is arranged in a plane. The substrate 7b to be bonded is placed on the substrate 7a so that the surface on the bonding side faces downward.
位置配合手段56係例如，為CCD照相機等，觀察保持於第一，第二之保持手段51，52之基板7a，7b，檢測出其位置資訊。The position matching means 56 is, for example, a CCD camera or the like, and observes the position information of the substrates 7a, 7b held by the first and second holding means 51, 52.
移動手段55，和位置配合手段56係連接於控制裝置59，位置配合手段56所檢測出之位置資訊係被傳達至控制裝置59。The moving means 55 and the position matching means 56 are connected to the control means 59, and the position information detected by the position matching means 56 is transmitted to the control means 59.
移動手段55係可將第一，第二之保持手段51，52之任一方或雙方，在水平面內移動及旋轉地所構成，保持於第一，第二之保持手段51，52之基板7a，7b係因與第一，第二之保持手段51，52一起移動，固基板7a，7b係在水平面內，相對地移動或旋轉。The moving means 55 is configured to move and rotate one or both of the first and second holding means 51, 52 in the horizontal plane, and to hold the substrate 7a of the first and second holding means 51, 52, 7b is moved together with the first and second holding means 51, 52, and the solid substrates 7a, 7b are in the horizontal plane, relatively moved or rotated.
控制裝置59係依據所傳達之位置資訊，使移動手段55動作，使基板7a，7b，在水平面內旋轉及/或移動，將基板7a，7b，作為位置配合。The control device 59 operates the moving means 55 based on the transmitted position information, and rotates and/or moves the substrates 7a, 7b in the horizontal plane to match the substrates 7a, 7b as positions.
移動手段55係加上於水平方向之移動與旋轉，將第一，第二之保持手段51，52之任一方或雙方，對於上下方向，亦可相對性地移動地所構成。The moving means 55 is added to the horizontal direction of movement and rotation, and either or both of the first and second holding means 51, 52 are configured to be relatively movable in the vertical direction.
控制裝置59係在配置配合基板7a，7b之狀態，使第一，第二之保持手段51，52，於上下相對性地移動，將基板7a，7b接近，使密封材料層，密著於貼合對象之基板7b，將基板7a，7b，夾持密封材料層而貼合。The control device 59 moves the first and second holding means 51, 52 in a state of being placed up and down in a state in which the mating substrates 7a, 7b are disposed, and the substrates 7a, 7b are brought close to each other, and the sealing material layer is adhered to the paste. The substrate 7b to be bonded is bonded to the substrates 7a and 7b by sandwiching the sealing material layer.
對於第三之製造裝置3的作業室11c內部，係配置有無圖示之硬化手段。In the working chamber 11c of the third manufacturing apparatus 3, a curing means (not shown) is disposed.
硬化手段係密封材料層含有紫外線硬化型樹脂的情況，於密封材料層，照射紫外線，含有熱硬化性樹脂之情況係加熱密封材料層，使密封材料層中的樹脂重合而硬化。In the case where the sealing material layer contains an ultraviolet curable resin, the sealing material layer is irradiated with ultraviolet rays, and when the thermosetting resin is contained, the sealing material layer is heated, and the resin in the sealing material layer is superposed and cured.
另外，密封材料層，含有玻璃或熱可塑性樹脂等之溶融材料之情況，硬化手段係使密封材料層加熱熔融，提升與基板7a，7b之密著性之後，冷卻密封材料層(包含自然冷卻)而使其固化。Further, the sealing material layer contains a molten material such as glass or a thermoplastic resin, and the curing means heats and melts the sealing material layer to improve the adhesion to the substrates 7a and 7b, and then cools the sealing material layer (including natural cooling). And make it cure.
隨之，基板7a，7b係經由硬化或固化之密封材料層而相互加以固定。Accordingly, the substrates 7a, 7b are fixed to each other via the hardened or cured sealing material layer.
將固定基板7a，7b之狀態的有機電激發光裝置，從作業室11c，運出於匣室36c，將新的基板7a，7b，運送至作業室11c。The organic electroluminescence device that fixes the substrates 7a, 7b is transported from the work chamber 11c to the chamber 36c, and the new substrates 7a, 7b are transported to the work chamber 11c.
重覆貼合基板7a，7b而固定之工程，和有機電激發光裝置之運出，和新的基板7a，7b之運入，貼合特定片數之基板7a，7b而作成有機電激發光裝置之後，如從匣室36c取出卡匣，有機電激發光裝置則被取出於外部。The process of repeating the bonding of the substrates 7a, 7b and the operation of the organic electroluminescent device, and the transport of the new substrates 7a, 7b, bonding the specific number of substrates 7a, 7b to produce organic electroluminescence After the device, if the cassette is taken out from the chamber 36c, the organic electroluminescent device is taken out.
由貼合基板7a，7b而固定之工程，和有機電激發光裝置之運出，和新的基板7a，7b之運入等之所有工程，如維持上述之作業環境，形成於基板7a之有機材料層則未產生劣化。All the works such as the fixing of the bonded substrates 7a, 7b, the transport of the organic electroluminescent device, and the transport of the new substrates 7a, 7b, etc., such as maintaining the above-described working environment, are organic on the substrate 7a. The material layer did not deteriorate.
如上述，密封材料層係因形成為圍繞形成有有機材料層之發光範圍的環狀，故有機材料層係由基板7a，7b，和 硬化或固化之密封材料層所圍繞，隨之，有機材料層係從外部環境所遮斷，水分或氧則未進入。As described above, since the sealing material layer is formed in a ring shape surrounding the light-emitting range in which the organic material layer is formed, the organic material layer is composed of the substrates 7a, 7b, and The layer of hardened or cured sealing material is surrounded, with the organic material layer being interrupted from the external environment and moisture or oxygen not entering.
並且，如上述，形成有機材料層之工程，和形成密封材料層之工程，和貼合基板7a，7b而固定之工程係因在預先去除水等之不純物氣體之作業室11a~11c內部所進行，故在製造工程，於有機材料層，未混入有不純物氣體。Further, as described above, the process of forming the organic material layer, the process of forming the sealing material layer, and the engineering in which the substrates 7a, 7b are bonded and fixed are performed inside the working chambers 11a to 11c in which the impurity gas such as water is removed in advance. Therefore, in the manufacturing process, the organic material layer is not mixed with the impurity gas.
隨之，未引起經由不純物氣體之有機材料層的劣化，而有機電激發光裝置的壽命則變長。Accordingly, deterioration of the organic material layer via the impurity gas is not caused, and the life of the organic electroluminescent device becomes long.
當持續有機電激發光裝置之製造時，例如，有必要印刷頭25或分配器45之洗淨或交換，對於有機材料供給系統28的原料液之填充等，作業室11a~11c內部之維護，而對於進行作業室11a~11c內部之維護時，係運出基板7a，7b，暫時停止有機電激發光裝置之製造。When the manufacture of the organic electroluminescence device is continued, for example, it is necessary to clean or exchange the print head 25 or the dispenser 45, the filling of the raw material liquid of the organic material supply system 28, and the like, and the maintenance of the inside of the work chambers 11a to 11c, When the maintenance inside the work chambers 11a to 11c is performed, the substrates 7a and 7b are transported, and the manufacture of the organic electroluminescence device is temporarily stopped.
對於進行維護作業時，通常，因將作業室11a~11c之內部空間，連接於外部環境，故大氣則進入至作業室11a~11c之內部，大氣中的水或氧等不純物氣體則附著於作業室11a~11c之內壁面。In the maintenance work, the internal space of the work chambers 11a to 11c is normally connected to the external environment, so that the atmosphere enters the inside of the work chambers 11a to 11c, and impurities such as water or oxygen in the atmosphere adhere to the work. The inner wall surfaces of the chambers 11a to 11c.
維護結束後，至少在將基板7a，7b，運送至作業室11a~11c作業室11a~11c之前，如上述，作業室11a~11c內部之環境，到達至露點-76℃(水分濃度1ppm)，或作業者所期望位準為止，加熱作業室11a~11c之同時，置換氣體，形成作業環境。After the maintenance is completed, at least before the substrates 7a, 7b are transported to the work chambers 11a to 11c in the work chambers 11a to 11c, as described above, the environment inside the work chambers 11a to 11c reaches the dew point of -76 ° C (water concentration: 1 ppm). At the same time as the operator desires the level, the working chambers 11a to 11c are heated, and the gas is replaced to form an operating environment.
然而，亦可從維護結束，至開始作業室11a~11c的壁之加熱為止之間，或開始作業室11a~11c的壁之加熱之後 ，以特定時間，未供給乾燥氣體而將作業室11a~11c內部進行排氣。However, it is also possible from the end of maintenance until the heating of the walls of the working chambers 11a to 11c is started, or after the heating of the walls of the working chambers 11a to 11c is started. The inside of the working chambers 11a to 11c is exhausted without supplying dry gas for a specific period of time.
此情況，可在最初的1次之氣體置換，置換進入至作業室11a~11c內部的大氣之大部分，並效率為佳，但，之後係如上述，加熱作業室11a~11c的壁之同時，進行排氣，和乾燥氣體的供給，將作業室11a~11c內部的氣體，置換為乾燥氣體之情況則為期望。In this case, it is possible to replace most of the atmosphere entering the inside of the working chambers 11a to 11c with the gas replacement in the first time, and it is preferable that the efficiency is good, but after heating the walls of the working chambers 11a to 11c as described above, It is desirable to perform the exhaust gas and the supply of the dry gas to replace the gas inside the working chambers 11a to 11c with the dry gas.
亦可以作業室加熱手段15a~15c加熱作業室11a~11c的壁之同時，未加熱乾燥氣體而進行供給，更加地，亦可由未以作業室加熱手段15a~15c加熱，而供給加熱之乾燥氣體之情況，加熱作業室。The working chamber heating means 15a to 15c may heat the working chambers 11a to 11c while supplying the drying gas without heating the drying chambers, or may supply the heated drying gas without heating the working chamber heating means 15a to 15c. In this case, heat the work room.
任何之情況，均在作業室11a~11c加熱結束後，將作業室11a~11c，進行排氣之同時，未加熱乾燥氣體而進行供給，形成作業環境。In any case, after the heating of the working chambers 11a to 11c is completed, the working chambers 11a to 11c are exhausted, and the drying gas is not heated and supplied to form an operating environment.
在形成該作業環境之後，運入基板7a，7b，再開始有機材料層之形成，密封材料層之形成，及基板7a，7b之貼合。After the working environment is formed, the substrates 7a, 7b are transported, the formation of the organic material layer is started, the formation of the sealing material layer, and the bonding of the substrates 7a, 7b are performed.
然而，對於印刷頭25和有機材料供給系統28，及分配器45和密封材料供給系統41之間，係各設置有閥29，49。However, for the print head 25 and the organic material supply system 28, and between the dispenser 45 and the sealing material supply system 41, valves 29, 49 are provided.
將作業室11a~11c，呈較大氣壓為低之減壓環境(包含真空環境)地進行排氣之情況，關閉閥29，49，供給乾燥氣體，作業室11a~11c之內部空間則上升至特定壓力以上之後，開啟閥29，49，於印刷頭25或分配器45，如供給原料液或密封材料，在排氣中，未噴出原料液或密封材料於 作業室11a~11c之內部空間。When the working chambers 11a to 11c are exhausted in a reduced pressure environment (including a vacuum environment) having a large atmospheric pressure, the valves 29 and 49 are closed, and the dry gas is supplied, and the internal spaces of the working chambers 11a to 11c are raised to specific temperatures. After the pressure is above, the valves 29, 49 are opened to the print head 25 or the distributor 45, such as the raw material liquid or the sealing material, and the raw material liquid or the sealing material is not sprayed in the exhaust gas. The internal space of the workrooms 11a to 11c.
乾燥氣體係未限定於乾燥氮氣，而如為不會將有機材料造成化學性劣化之氣體，可使用Ar氣體等各種氣體者，例如，對於氧的存在，未成為問題之情況，亦可使用含氧之乾燥氣體(例如，乾燥空氣)者，此等乾燥氣體係亦可只將1種，供給至作業室11a~11c，而亦可將2種以上，供給至作業室11a~11c。The dry gas system is not limited to dry nitrogen, and various gases such as Ar gas may be used as the gas which does not cause chemical deterioration of the organic material. For example, the presence of oxygen may not be a problem, and may be used. In the case of the drying gas of oxygen (for example, dry air), only one of these drying gas systems may be supplied to the working chambers 11a to 11c, or two or more of them may be supplied to the working chambers 11a to 11c.
另外，亦可以在加熱作業室11a~11c時而供給之加熱氣體，和在加熱結束後，形成作業環境時而供給之作業用氣體，改變乾燥氣體的種類，亦可作為相同。In addition, the heating gas supplied when the working chambers 11a to 11c are heated and the working gas supplied when the working environment is formed after the completion of the heating may be changed to the same type.
作業室11a~11c的壁係期望為由熱傳導性高之物質而構成者，但亦可於至少一部分，崁入玻璃等之透明板，作為監視窗。The walls of the working chambers 11a to 11c are desirably composed of a material having high thermal conductivity, but at least a part thereof may be inserted into a transparent plate such as glass to serve as a monitoring window.
作業室11a~11c之加熱係期望為壁溫度成為60℃以上80℃以下地進行加熱情況，在未達60℃之中，未充分進行水分除去，而當超過80℃時，對於安全性產生問題。The heating of the working chambers 11a to 11c is desirably performed when the wall temperature is 60° C. or more and 80° C. or less, and the water is not sufficiently removed in the case of less than 60° C., and when it exceeds 80° C., there is a problem in safety. .
作業室11a~11c的加熱係不只在將基板7a，7b，運送至作業室11a~11c之前，在將基板，配置於作業室11a~11c之狀態，亦可進行，但，對於於基板7a，7b，形成有機電激發光層等耐熱性低的膜之情況，係有必要在運送基板7a，7b之前，使加熱結束，使作業室11a~11c之內部溫度，下降至特定溫度(例如，未分解構成有機電激發光層之有機材料的溫度)。The heating of the work chambers 11a to 11c may be performed not only before the substrates 7a and 7b are transported to the work chambers 11a to 11c but also when the substrates are placed in the work chambers 11a to 11c. However, for the substrate 7a, 7b, in the case of forming a film having low heat resistance such as an organic electroluminescence layer, it is necessary to terminate the heating before the substrates 7a and 7b are transported, and to lower the internal temperature of the working chambers 11a to 11c to a specific temperature (for example, The temperature of the organic material constituting the organic electroluminescent layer is decomposed).
更加地，將第一~第三之製造裝置1~3，連接於無圖示 之運送室，藉由該運送室，未將基板7a，7b，曝露於大氣，而亦可在第一~第三之製造裝置1~3間進行運送。Further, the first to third manufacturing apparatuses 1 to 3 are connected to the non-illustrated In the transport chamber, the substrates 7a and 7b are not exposed to the atmosphere by the transport chamber, and the first to third manufacturing apparatuses 1 to 3 can be transported.
以上係在形成有機材料層之後，關於於基板7a，形成密封材料層之情況，已做過說明，但，本發明並不限定於此等之構成，而亦可在第二之製造裝置2，形成密封材料層之後，在第一之製造裝置1，形成有機材料層。Although the above description has been made on the formation of the sealing material layer on the substrate 7a after the formation of the organic material layer, the present invention is not limited to the constitution, and the second manufacturing apparatus 2 may be used. After the formation of the sealing material layer, in the first manufacturing apparatus 1, an organic material layer is formed.
另外，亦可於形成有機材料層之基板7a，未設置密封材料層，而於貼合對向之基板7b，配置密封材料層，貼合基板7a，7b之間，亦可於形成有機材料層之基板7a，和貼合對向之基板7b的雙方，配置密封材料層之後，貼合基板7a，7b之間。Further, the substrate 7a on which the organic material layer is formed may be provided with a sealing material layer, and the sealing material layer may be disposed on the bonded substrate 7b, and the organic material layer may be formed between the bonding substrates 7a and 7b. After the sealing material layer is disposed on both the substrate 7a and the bonded substrate 7b, the substrates 7a and 7b are bonded to each other.
基板7a，7b之材質亦無特別限定，而可使用玻璃基板，塑料基板，陶瓷基板等者。The material of the substrates 7a and 7b is not particularly limited, and a glass substrate, a plastic substrate, a ceramic substrate or the like can be used.
在作業室11a~11c內部，處理基板7a~7c時之壓力係無特別限定，但對於形成有機材料層時，係呈印刷頭25之噴嘴的機構不混亂地，作為大氣壓之情況則為理想，對於貼合基板7a，7c時，係期望為以較大氣壓為低之壓力的作業環境而進行者。In the working chambers 11a to 11c, the pressure at the time of processing the substrates 7a to 7c is not particularly limited. However, when the organic material layer is formed, the mechanism of the nozzles of the printing head 25 is not disturbed, and it is preferable as the atmospheric pressure. When the substrates 7a and 7c are bonded together, it is desirable to carry out the work environment with a pressure lower than a large air pressure.
以上係關於在個別的作業室11a~11c內部，進行有機材料層之形成，密封材料層之形成，和基板7a，7b之貼合及固定之情況，已做過說明，但本發明係並非限定於此之構成。The above description has been made on the formation of the organic material layer in the individual working chambers 11a to 11c, the formation of the sealing material layer, and the bonding and fixing of the substrates 7a and 7b. However, the present invention is not limited thereto. The composition here.
噴墨印表機20，和密封材料供給裝置40，和貼合裝置50之中，至少將2個以上的裝置，配置於相同作業室內部 ，有機材料層之形成，密封材料層之形成，和基板7a，7b之貼合及固定之中，亦可在同樣作業室內部，進行2個以上的工程。In the inkjet printer 20, the sealing material supply device 40, and the bonding device 50, at least two or more devices are disposed in the same working chamber. The formation of the organic material layer, the formation of the sealing material layer, and the bonding and fixing of the substrates 7a and 7b may be performed in two or more projects in the same working chamber.
特別是如密封材料供給裝置40與貼合裝置50，如將使用於連續進行之工程的裝置，配置於同樣作業室內部，不只縮短對於基板7a，7b之運出入所需之時間，因基板7a，7b則曝露於外部環境之危險性變低，故更為期望。In particular, if the sealing material supply device 40 and the bonding device 50 are disposed in the same working chamber, the apparatus for continuous operation is not only shortened the time required for the substrates 7a, 7b to be transported in and out, because the substrate 7a , 7b is more likely to be exposed to the external environment, so the risk is lower.
此情況，亦可於作業室內部，設置運出基板7a，7b之運出機器手臂，作為在作業室內部，運送基板。In this case, it is also possible to provide the transporting of the substrate 7a, 7b to the robot inside the work chamber, and to transport the substrate inside the work chamber.
更加地，亦可加熱作業室11a~11c的壁同時，將作業室11a~11c，進行連續排氣，未供給乾燥氣體而加熱作業室11a~11b，但，如前述，此情況係不純物之除去效率降低。Further, the working chambers 11a to 11c may be continuously exhausted while the walls of the working chambers 11a to 11c are heated, and the working chambers 11a to 11b are heated without supplying the drying gas. However, as described above, the impurities are removed. Reduced efficiency.
另外，亦可將供給乾燥氣體之氣體供給系統，和排氣系統，連接於運送室31a~31c，和匣室36a~36c之任一方或雙方。Further, the gas supply system for supplying the dry gas and the exhaust system may be connected to the transfer chambers 31a to 31c and either or both of the chambers 36a to 36c.
如在將基板7a，7b，運入於作業室11a~11c之前，將運送室31a~31c與匣室36a~36c之內部，進行排氣之同時，供給乾燥氣體，在將基板7a，7b，運入至作業室11時，從運送室31a~31c或匣室36a~36c進入之不純物氣體的量變少。Before the substrates 7a, 7b are carried into the work chambers 11a to 11c, the inside of the transfer chambers 31a to 31c and the chambers 36a to 36c are exhausted, and the dry gas is supplied, and the substrates 7a and 7b are placed. When transported to the workroom 11, the amount of the impurity gas entering from the transport chambers 31a to 31c or the chambers 36a to 36c is small.
1~3‧‧‧製造裝置(第一~第三之製造裝置)1~3‧‧‧Manufactured devices (first to third manufacturing devices)
7a，7b‧‧‧基板7a, 7b‧‧‧ substrate
12a~12c‧‧‧加熱裝置12a~12c‧‧‧heating device
15a~15c‧‧‧作業室加熱手段15a~15c‧‧‧Working room heating means
16a~16c‧‧‧加熱氣體供給裝置16a~16c‧‧‧heating gas supply device
17a~17c‧‧‧氣體供給系統17a~17c‧‧‧ gas supply system
20‧‧‧噴墨印表機20‧‧‧Inkjet printer
40‧‧‧密封材料供給裝置40‧‧‧Sealing material supply device
50‧‧‧貼合裝置50‧‧‧Fitting device
51‧‧‧第一之保持手段51‧‧‧First means of retention
52‧‧‧第二之保持手段52‧‧‧Second means of retention
55‧‧‧移動手段55‧‧‧Mobile means
56‧‧‧位置配合手段56‧‧‧Location cooperation
[圖1]係為說明第一之製造裝置的模式性剖面圖。Fig. 1 is a schematic cross-sectional view showing the first manufacturing apparatus.
[圖2]係為說明第二之製造裝置的模式性剖面圖。Fig. 2 is a schematic cross-sectional view showing the second manufacturing apparatus.
[圖3]係為說明第三之製造裝置的模式性剖面圖。Fig. 3 is a schematic cross-sectional view showing a third manufacturing apparatus.
1~3‧‧‧製造裝置(第一~第三之製造裝置)1~3‧‧‧Manufactured devices (first to third manufacturing devices)
7a‧‧‧基板7a‧‧‧Substrate
12a‧‧‧加熱裝置12a‧‧‧heating device
14a‧‧‧氣體加熱手段14a‧‧‧ Gas heating means
15a‧‧‧作業室加熱手段15a‧‧‧Working room heating
16a‧‧‧加熱氣體供給裝置16a‧‧‧heating gas supply
17a‧‧‧氣體供給系統17a‧‧‧Gas supply system
18a‧‧‧崁入過濾器18a‧‧‧Into filter
19a‧‧‧排氣系統19a‧‧‧Exhaust system
20‧‧‧噴墨印表機20‧‧‧Inkjet printer
21‧‧‧載置台21‧‧‧ mounting table
25‧‧‧印刷頭25‧‧‧Print head
26‧‧‧保持手段26‧‧‧Retention means
28‧‧‧有機材料供給系統28‧‧‧Organic material supply system
29‧‧‧閥29‧‧‧Valves
31a‧‧‧運送室31a‧‧‧Transportation room
35a‧‧‧運送機器手臂35a‧‧‧Transport robotic arm
36a‧‧‧匣室36a‧‧‧匣室
41a‧‧‧容器41a‧‧‧ Container
42a‧‧‧配管42a‧‧‧Pipe
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| US12018857B2 (en) | 2008-06-13 | 2024-06-25 | Kateeva, Inc. | Gas enclosure assembly and system |
| US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
| JP2012043689A (en) * | 2010-08-20 | 2012-03-01 | Toshiba Tec Corp | Organic el device manufacturing method |
| US9093667B2 (en) * | 2011-02-02 | 2015-07-28 | Joled Inc. | Method for producing electroluminescence device |
| KR20220124282A (en) * | 2012-11-30 | 2022-09-13 | 카티바, 인크. | A method for maintenance of an industrial printing system |
| JP6349382B2 (en) * | 2013-03-13 | 2018-06-27 | カティーバ， インコーポレイテッド | Gas enclosure system and method utilizing an auxiliary enclosure |
| KR102163521B1 (en) | 2013-05-15 | 2020-10-12 | 삼성디스플레이 주식회사 | Manufaturing device of organic light emitting diode display and method for manufacturing organic light emitting diode display using the same |
| TW202410511A (en) * | 2013-06-10 | 2024-03-01 | 美商凱特伊夫公司 | Low-particle gas enclosure systems and methods |
| KR101878084B1 (en) | 2013-12-26 | 2018-07-12 | 카티바, 인크. | Apparatus and techniques for thermal treatment of electronic devices |
| KR102458181B1 (en) | 2014-01-21 | 2022-10-21 | 카티바, 인크. | Apparatus and techniques for electronic device encapsulation |
| EP3138123B1 (en) | 2014-04-30 | 2021-06-02 | Kateeva, Inc. | Gas cushion apparatus and techniques for substrate coating |
| JP6757363B2 (en) * | 2017-10-06 | 2020-09-16 | 株式会社Ｊｏｌｅｄ | Manufacturing method of organic EL display panel and sealing layer forming device |
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| TW200302678A (en) * | 2002-01-23 | 2003-08-01 | Seiko Epson Corporatoin | Manufacturing method of organic EL device, organic EL device, electronic machine and liquid drop spraying device |
| TWI233317B (en) * | 2002-02-12 | 2005-05-21 | Seiko Epson Corp | Method for making electrooptic device and apparatus thereof, electrooptic apparatus, electronic instrument |
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| CN101682954A (en) | 2010-03-24 |
| JPWO2008142966A1 (en) | 2010-08-05 |
| WO2008142966A1 (en) | 2008-11-27 |
| TW200915912A (en) | 2009-04-01 |
| JP4926246B2 (en) | 2012-05-09 |
| KR101139737B1 (en) | 2012-04-26 |
| KR20090130245A (en) | 2009-12-21 |
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