TW200818561A - Transfer tape strap process - Google Patents
Transfer tape strap process Download PDFInfo
- Publication number
- TW200818561A TW200818561A TW096112302A TW96112302A TW200818561A TW 200818561 A TW200818561 A TW 200818561A TW 096112302 A TW096112302 A TW 096112302A TW 96112302 A TW96112302 A TW 96112302A TW 200818561 A TW200818561 A TW 200818561A
- Authority
- TW
- Taiwan
- Prior art keywords
- strip
- strips
- conductive
- die
- thin
- Prior art date
Links
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
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- Automation & Control Theory (AREA)
- Electromagnetism (AREA)
- Computer Security & Cryptography (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Details Of Aerials (AREA)
- Burglar Alarm Systems (AREA)
- Combinations Of Printed Boards (AREA)
Description
200818561 九、發明說明: c發明所屬之技術領域3 發明領域 本發明是有關於保全標籤,且更特別的是,其揭示一 5種施加一電容條帶或晶粒條帶於一天線以形成一 EAS或 RFID保全標籤之方法。 L先前技術3 發明背景 電子物品監測(EAS)安全標籤,基本上包含一共振 10電路,其利用至少一線圈且至少一電容以使得在EAS標籤 曝露於一預定之電磁場(例如,8.2百萬赫茲)時能操作以產 生共振。僅舉例來說,該線圈及該電容被蝕刻於一基板上, 以此一多圈導電引線(由此形成該線圈)終止於一導電引 線接墊而形成電容之一極板。在基板之反面上另一導電引 15線接塾被餘刻而形成電谷之苐二極板,同時一電性連接就 從此第一極板牙過基板至基板另一面上之線圈端點上而被 製得;接著該非導電性基板就如同一位於兩導電引線接墊 間之一介電負而形成該電容。因此形成一共振電路。許多 不同的共振標籤產品是可購買到的且被描述於已核發之專 2〇 利,例如’美國專利證號 5,172,461 ; 5,108,822;4,835,524; 4,658,264;及4,567,473均有描述並揭示電子偵測標籤結 構。然而,這種產品利用,且的確需要,使用具有導電材 質之有圖案面於基板之兩面以作適當操作。特殊之導電結 構及製造技術必須被用於基板兩面以生產這種共振標戴產 5 200818561 品。目前可買到的EAS標籤結構具有許多缺點。例如,由 於特殊的圖案結構及蝕刻技術必須被用於這種可買到的標 籤兩面以製作適當之電路,每單位處理時間及成本均會增 加。再者,用於生產之製造機械裝置複雜度亦增加。經常 5地,複雜的光學蝕刻處理方法必須被用以形成該電路結 構。可被領會的是,兩面的光學蝕刻通常較費時並且需要 將兩面之圖案精確對準。為了形成兩面之圖案,附加的材 7亦是必需的,因此會增加每單位之材料成本。美國專利 第5’781,110號(Habeger等人)揭示了 一種介電油墨材料於 1〇 一螺旋感應元件上之應用以形成一電容性元件。 特別注意的是射頻識別(RFID)標籤,rfID標籤包含 積體電路(1C),其|馬合於如前所提之共振電路或麵合於一 天線(例如,一電偶極),其會發射資訊信號以響應於預定之 電磁場(例如,13.56百萬赫茲)。最近,藉由電性耦合傳 15 導性突緣(electricaly-coupling conductive flanges)至個別 的1c接點,1C之附著已被實現而形成一,,晶粒條帶”。接著 §亥晶粒條帶被電性耦合於該共振電路或天線。參見範例如 美國專利第6,940,408號(Ferguson等人);第6,665,193號 (Chung 等人);第6,181,287 號(Beigel);及第 6,1〇〇,8〇4號 20 (Brady等人)。 再者,已被確定的是,該EAS電路或RFID電路之電容 性元件之形成已實質地控制該EAS共振電路或該RFID電路 之調整,以適當地響應於所欲之電磁場。本申請案之受讓 人’名為Checkpoint System,Inc.已於西元2005年10月25日 6 200818561 提出名為”電容條帶”,美國專利申請號為60/730,053之申請 案,其揭示一種可被施加於一天線電路以形成EAS保全標 籤之一可撓性之電容條帶。 然而,仍然存在一需求,其能大量地施加數個晶粒條 5 帶或電容條帶且能很有效率。本發明之方法提為此問題提 供了一個解決方案。 於此所詳述之全部内容以參考資料併入本說明書中。 【發明内容3 發明概要 10 一種薄板條其包含數個條帶部件,該等條帶部件被可 釋放開地固定於該薄板條之襯墊部份但與相鄰之條帶部件 分開,且於其中每一條帶部件包含一薄的,且通常為平面 構件,其包含一第一電性傳導平面元件,一第二電性傳導 平面元件及一被電性連接於該等傳導元件個別端點之一積 15 體電路,其中該第一電性傳導性平面元件及該第二電性傳 導平面元件被固定於一非傳導層之第一面,且其中該非傳 導層之第二面被可釋放開地固定(例如,一低黏度可移除 之黏著物)於該襯墊部份。 一種薄板條其包含數個條帶部件,該條帶部件被可釋 20 放開地固定於該薄板條之襯墊部份但與相鄰之條帶部件分 開,且於其中每一條帶部件包含一薄的,且通常為平面構 件,其包含一第一電性傳導平面元件,一第二電性傳導平 面元件及一被配置於該第一及第二電性傳導平面元件之至 少一部份間之一平面介電層,於其上該條帶部件有一所欲 7 200818561 之電容’其中該第-電性傳導平面元件及第二電性傳導平 @元件_找-_導層ϋ ’且於其中該非傳導 層之第二面被可釋放開地固定(例如,— — 瓜黏度可移除之 黏著物)於該襯墊部份。 μ 一種用以形成數個EAS或RFID標籤或鑲箝之方去直 二=包含:提供一第一薄板條其包含二 10 15 20 ▼或.各條帶於一第一襯墊上,該晶粒條帶或該電容條帶 之每—個被可釋放開地固定(例如,—低黏度之黏著物) 於該第-槻墊,且其中該晶粒條帶或電容條帶之每一個, ^相鄰ί條帶分開;提供-第二薄板條其包含數個天線或 、、、圈於弟二襯墊上’索引該第一及第二薄板條以使得該等 晶粒條帶之-個或電容條帶之一個可以對準該數個天線之 =或該數個線圈之-個;且施加所選擇之熱或壓力於該 專曰曰粒條帶或該等電容條帶之每一個以將該晶粒條帶或兮 ^條帶從該第—襯墊釋放開,同時電性連接該晶粒條帶 或《容條帶於數個天線相對應之—個或數個線圈相對庫 之一個以形成一 EAS或RFID標籤或鑲箝。 、一種用以形成數個RFID標籤或鑲箝之方法,其中該方 ,3提供一第一薄板條,其包含數個尺㈣晶粒條帶於 ϋ塾上’該等晶粒條帶之每—個被可釋放開地固定 (例如’―低黏度之黏著物)於該第一櫬墊且其中該晶教 “之每-個與相鄰之晶粒條帶分開;提供一第二薄板條 其包含數個電容條帶於第二襯墊上,該等電容條帶之每 個被可釋放_狀㈣第二轉, 8 200818561 每一個與相鄰之電容 數個天線或_々第1、^提供—第三薄板條其包含 以使得每-個日:塾上’㈣該第—及第三薄板條 個或數個線圈被對準於數個天線相對應之-晶粒條帶之每—個^施加所選擇之熱及壓力於該 個線圈相對應之—;:=:個,應之-個或數 4_二衫三薄板條以使得每 . 11 3^雜準純個天紅-個紐個線圈之 10 施加所選擇之熱及壓力於該等電容條帶之每一個 以將該電容條帶從該第二襯塾釋放開,且同時電性搞合該 電今W於相對應之數個天線或數個線U而形成一 RFID標籤或鑲箝。 圖式簡單說明 第1A圖為一晶粒條帶之放大橫截面圖; 第1B圖為一電容條帶之放大橫截面圖; 第1C圖為一結合的晶粒條帶及電容條帶之放大橫截面 圖; 第2圖為一本發明之該晶粒條帶之放大橫截面圖; 第3圖顯示具有數個本發明之晶粒條帶之該薄板條之 部份上平面圖; 第4圖顯示具有數個本發明之晶粒條帶之該薄板條之 放大側面圖; 第5圖顯示本發明之一被反轉之晶粒條帶當其被施加 9 200818561 於一線圈或天線; 第6A圖描述一示範性之HF(高頻)保全標籤,其為藉由 使用一晶粒條帶於本發明之製程中所產生; 第6B圖描述一放大圖,其顯示被耦合於第6A圖中之該 5 HF保全標籤之該線圈之該晶粒條帶; 第6C圖描述另一示範性HF保全標籤,其為藉由使用一 晶粒條帶及一電容帶於本發明之製程中所產生; 第6D圖為第6A-6C圖之一等效電路; 第7A圖描述一示範性UHF(超高頻)保全標籤,其為藉由 10 使用一晶粒條帶於本發明之製程中所產生; 第7B圖描述本發明之一等效電路; 第8圖提供一處理過程圖,其用於本發明之該膠帶式轉 移條帶之處理方法。 第9圖提供一示範性貼紙處理方法圖,其顯示該EAS或 15 RFID標籤或鑲箝如何接著被形成一已可被客戶使用之貼 紙。 I:實施方式3 較佳實施例之詳細說明 20 如同先前所述,本發明所揭示之方法被指引至電容條 帶或晶粒條帶至一天線或線圈之應用。雖然大多數的圖示 描述晶粒條帶至一天線之附著,應可被了解的是它們正可 以很容易地用以描述電容條帶之附著。第1A圖描述一示範 性晶粒條帶2,第1B圖描述一示範性電容條帶4且第1C圖描 10 200818561 述一典型結合的晶粒條帶及電容條帶6,其詳細内容被揭示 於美國專利申請號第60/730,053號且其全部揭示之内容被 以參考資料合併於本說明書中。因此,該方法不僅限定於 附著曰曰粒條帶。被使用於整個說明書内之,,條帶,,用語包括 5任何⑨些可撓性晶粒條帶,電容條帶,結合的晶粒條帶/電 容條帶。 為了幫助數個條帶附著於數個天線或線圈(該參考數 字1〇思指一天線或一線圈)以形成一EAS或RFID保全標籤 或鑲箝’敘述於第1A-1C圖中之條帶結構僅以晶粒條帶為例 10 ”、、員示於弟2圖中。本發明之該條帶2〇包含一 rfid積體電路 (1C)例如由phiHpS Semiconductor,Texas Instruments, Impinj,STMicroelectronics等所製造的那些,但可簡化地為 如先别所提之一電容條帶或結合的晶粒條帶/電容條帶。特 別的疋,該1C電性耦合(例如,金屬線接合)於具有一厚 15度之個別的傳導(例如,鋁)元件22A及22B,僅舉例來說, 在約5〜60微米之範圍。這些傳導元件22八及228被固定於 (例如’經由一黏著物23,諸如熱焊接,水性聚合物,聚 氨基甲酸乙酯等等)一非傳導層或基板24 (例如,一聚合 物)。使用一可移除之黏著物28將一襯墊26附著於基板24之 20另一面;該可移除之黏著物是低黏度的且類似於被以 POST-IT商標販售且用在靜止便籤上的黏著物,該黏著物之 例有Rafsec RR27可移除之壓克力塗料,或Fass〇n UIU, R10,R195等等。另一黏著物30A/30B (例如,一傳導性黏 著物,漿糊,膠帶等等,諸如從Delo Adhesive # 163,National 11 200818561
Strach,Dopont,Locktite,Acheson等等而來之各向異性之 導電膠)被施加於傳導元件22A及22B之上表面32A。 應该被注意的是,當該條帶為一晶粒條帶時在黏著物 30A/30B之施加上的變化,其為在晶粒條帶形成期間施加黏 5著物30A及30B於該對應之傳導元件22A及22B,亦即,在該 1C被電性連接於該傳導元件22A及22B前。有該黏著物3〇A 及30B覆蓋於整個該傳導元件22A/22B之上表面,當該ic被 壓下且電性連接於個別的傳導元件時,該黏著物30A及30B 會從該1C之下被壓縮及施力且覆蓋於IC的末端之上,因此 10為該晶粒至傳導元件22A及22B提供了額外的保護。 如同將在後面被詳細討論的,數個晶粒條帶2〇將被提 供在形成該襯墊26之單一薄板條上。如同清楚地被顯示於 第3-4圖中,每一個條帶2〇被從相鄰之條帶切斷(見切口 C),而每一個條帶2〇透過可移除之黏著層28被可釋放開地 15固定於該襯墊26上。為了施加一個別之條帶20至一天線或 線圈,該條帶20被如同第5圖所顯示地被反轉且每一個傳導 兀件22A及22B被放置於相對應之天線或線圈之連接點上 (第5圖)以使得該黏著物3〇能接觸於該天線或線圈之連接 點CP1/CP2。特別的是,如同將在後面被詳細討論的,在該 20製私中,每一個條帶20被索引以被緊鄰地放置於一相對應 之天線或線圈。僅舉例來說,一被提供於一線圈薄板條4〇 (其一部伤被顯不於第5圖)上之線圈連接點Cpl/Cp2被顯 示於第5圖。该線圈薄板條4〇包含數個線圈,該等線圈亦藉 由一可移除之黏著物42 (例如,類似於先前討論的黏著物 12 200818561 23,其包含熱焊接,水性聚合物,聚氨基甲酸乙酷等等) 被可移除地固定於一襯墊44。因此,如同也會在後面討論 的,一旦該條帶20被電性連接於該線圈(或天線),每一個 被完成的EAS (或RHD)標籤或鑲箝可接著被從襯墊44移 5除並且被施加於一使用該黏著物42之物品上。應該被了解 的是,該薄板條40亦可代表一天線薄板條而不是數個被可 釋放開地固定於其上之線圈,可被提供之該數個天線其被 可釋放開地固定於其上。 為了將條帶20電性連接於線圈(或天線),接著熱及壓 1〇力被選擇性地施加(使用加熱元件l〇6A及106B)在對準相 對應之黏著物30A及30B位置之襯墊26上。這使得黏著物 30A/30B將傳導元件22A及22B接合於天線之連接點。此熱 的選擇性施加同時使得可移除之黏著物28失去其黏性,藉 此使該襯墊26隨著黏著物28一起被移除。在這些位置之壓 15力及束缚(33及35 )形成一良好之電性連結;例如,該束 缚動作之外殼及鋒利邊緣產生一良好之電性連結。最終的 結果是條帶2G被電性連接至天線或線圈。應該被了解的 是,在本發明之最寬範圍内包含了用於形成條帶2〇與天線 或線圈間連接之化學物質之使用;在那種情形下,需要施 2〇 加壓力但不須束缚。 應該被進一步注意的是該黏著物3〇A/3〇B可一開始就 被放置在線圈或天線上而非該條帶2〇本身。 黏著物23 (例如,水性形成薄片黏著物)包含一“圖案化 應該被注意的是被使用在形成晶粒條帶/電容條帶之 13 200818561 的黏著物’’。根據美國專利第6,988,666號(Appalucci等人), 名為保全標籤及其製作之方法,,及申請於2〇〇4年^月29 曰美國專利申請序號10/998,496名為“-種將電容極板對 準於保全標籤内之方法及一藉此形成之一電容,,,且其所 5有被揭示之内容以參考資料合併於本說明書中,藉由施加 一層傳導性材料(例如,鋁)於一使用圖案化的黏著物23 而形成一壓層板之非傳導基板24 (例如,聚合物)上而形 成該傳導元件22A/22B。該黏著物23形成與傳導元件 22A/22B相同之形狀。因此,當一切割工具(以傳導元件 10 22A/22B所欲之形狀)被施加在傳導層上時,只有被黏著物 固定在基板24上的部份成為傳導元件22A/22B;剩餘之傳導 層部份被移除且回收使用。再者,與此相同之處理方法(例 如,使用圖案化的黏著物)也可被使用在晶粒條帶/電容條 帶附著其上之線圈202或天線302A/302B(參見第5圖中的線 15圈或天線薄板條40)之形成。 僅舉例來說’弟6A-6D圖描述一使用本發明之方法所製 知之HF保全標籤200且第7A-7B圖描述一使用本發明之方 法所製得之UHF保全標籤300。特別的是,第6A圖說明一多 圈線圈其有一本發明之晶粒條帶2〇固定於其上。應該被注 20意到的是在耦合該晶粒條帶20至該線圈202時,該黏著層 30A/30B亦形同一絕緣體以避免傳導構件22A/22B和除了 電性耦合於晶粒條帶2〇之兩路徑外的線圈路徑發生短路。 第6B圖為一耦合於線圈2〇2之晶粒條帶2〇之放大圖。第6c 圖說明一使用本發明之方法之另一HF保全標籤2〇〇A,但除 200818561 了有晶粒條帶2 0外,另有一電容條帶2 〇 A亦電性耦合於該線 圈202 ;僅舉例來說,該HF保全標籤2〇〇a需要一額外之電 谷(因此,有電容條帶20 A )外加於由ic所提供之内部電容。 第6D圖為第6A-6C圖之該保全標籤之一等效電路。第7A圖 5描述一 U H F保全標籤3 0 0,其中一晶粒條帶2 〇被耦合於天線 元件302Α與302Β之間。第7Β圖為UHF保全標籤300之一等 效電路圖。如同先前所述,該多圈線圈2〇2及該天線元件 302Α/302Β可以揭示於美國專利第6,988,666號(Appaiucd 等人)’名為“保全標籤及其製作之方法,,及申請於2〇〇4年 1〇 U月29日,美國申請號1〇/998,496名為“一種將電容極板對 準於保全標籤内之方法及一藉此形成之一電容,,中的方法 製得。 再者,對於操作在UHF範圍之天線,一種用以形成這 種天線於天線薄板條(類似於顯示於第5圖中之薄板條4〇) 15上之方法被揭示於美國申請號11/400,893,名為“製作使用 在EAS及RFID之UHF天線之方法及由此製得之天線,,其全 部内容以參考資料合併於本說明書中。後者之製程使用了 一種產生一非常薄、可撓性UHF天線,該UHF天線提供一 具有一層電性傳導材料(例如,鋁)且有一上表面及下表面之 2〇 一導體薄片,其中該導體薄片具有一大約在5至60微米範圍 之厚度;一具有一上表面之襯墊薄片(類似於第5圖中之襯 墊44);該導體薄片被配置於襯墊薄片之上表面其藉由一可 釋放開之固疋黏著物(類似於第5圖中之黏著物42)且該黏著 物能與該導體薄片作同等延展;接著藉由將一具有想要的 15 200818561 形狀之切割晶粒石切入該導體薄片以使該導體薄片形成一適 口於天線之形狀’於其上該晶粒穿過導體薄片但不穿過襯 塾薄片,藉此產生~具有適合之形狀且固定於襯墊薄片之 日日粒切。j天線。形成在該製程中且位於相鄰天線間之廢棄 5材料被移除(因此留下_如第5圖所顯示的空間46)及一天線 薄板條(參見第5圖中之薄板條4〇,以及第_中的參考號碼 104)。可替代地,甚至可使用具有更小厚度(例如,小於 25微米)且有電性傳導材料之導體薄片,該導體薄片首先 被固定於-強化薄片上(例如,諸如黏合板,橡皮板,硬 1〇化牛皮紙,或任何具有支撑該導體之紙板,或一起形成一 支撐合成材質,以及有一約50微米之厚度之合成材質,或 其本身有6至15微米之厚度)且該強化薄片之下表面被釋放 開地固定於襯墊薄片之上表面;當施加切割晶粒時,該晶 粒會切穿導體薄片及強化薄片。 15 為了產生數個使用這些條帶20的保全標籤,第8圖描述 了该方法100。特別的是,一條帶捲帶1〇2及一天線/線圈捲 帶104 (其包含該線圈或天線網板4〇)被相對應地索引並被 饋給於炫加熱元件106與滾筒(或阽台)ι〇8之間。如同可 於第8圖所見’該天線/線圈捲帶1〇4會被指向定位使得該天 20線302或線圈202會面朝上且該條帶20會面朝下(雖然這些 相對位置僅是舉例來說;該天線可面朝下且該條帶可面朝 上等等)。依照所被形成之保全標籤,必須使用該索引以確 保一條帶20可以在耦合時能被適當地放置在該線圈或天線 之接觸點CP1/CP2上。特別的是,在捲帶1〇4上相鄰線圈202/ 200818561 天線302間之距離基本上和位於條帶捲帶1〇2上之相鄰條帶 之間隔不同。因此,當相對應之線圈2〇2或天線3〇2在加熱 元件106/滾筒1〇8運作前被適當地對準,從條帶捲帶1〇2上 之條帶分配會被暫停。一旦該加熱元件1〇6/滾筒1〇8開始動 s 作,襯墊26會被拾起捲軸110取起。在條帶2〇被適當地施加 於線圈202或天線元件302上時,機械焊接(例如,束缚) 會被施加於區域112,如同先前對第5圖之解釋,藉此形成 一特殊之保全標籤或鑲箝。被用於本說明書全文之字“鑲 箝意指完整的標籤(例如,EAS或RFID保全標籤),它們 1〇的任一個可能形成一貼紙之一部份或被耦合於一被使用之 貼條,或其它隨著一項商品之使用。該標籤/鑲箝被聚集 於一保全標籤或鑲箝捲帶114上。 在這點上,該標籤/鑲箝捲帶114包含數個被陳列之標 籤/鑲箝。應該被瞭解的是,有許多不同的方法可以完成該 15標籤/鑲箝以形成可被用於一商品上之“貼條,,,其在本發 明最廣的範圍内。僅舉例來說,第9圖描述了在這些示範的 貼條製程之一種,其中捲軸114之標籤/鑲箝被製成貼條。 特別的是,一可印刷紙116之捲軸被饋給通過一印刷區128 (包括一滾筒或阽台130)以提供所欲之貼條印刷於該紙 〇上。如果捲軸116上之該紙是被黏著地固定於襯墊117上, 接著該襯墊會被一拾起捲軸119取起;另一方面,如果沒有 襯墊117,一黏著物121 (例如,諸如一 STd壓克力,或橡 膠性熱熔黏著物)會被施加於該紙上。該紙接著會被施加 來自於位於區域123之捲軸114之數個標籤/鑲箝頂部以形 17 200818561 成一貼條矩陣125。接下來,該貼條矩陣125會被送至一切 割器124及一滾筒(或阽台)126。一拾起捲軸127會移除來自 於該貼條矩陣125之廢屑,因而產生可以被應用於不同商品 之貼條產品150。 5 可替代地,在線圈/天線薄板條40被形成處使用一圖案 化的黏著物,該線圈/天線薄板條40需要施加於一分開之襯 墊,該標籤/鑲箝可被從其上移除。特別的是,一捲軸129, 其包含一可被拾起捲軸135取起以露出其上黏著物之覆蓋 薄片133 ;可替代地,若襯墊131沒有覆蓋薄片及黏著物, 10 一黏著物可在區域137被施加於該襯塾。在這兩個情形中, 於區域139,該襯墊緊接著會被黏著固定於從捲軸114而來 的線圈/天線薄板條40之底部以形成一標籤/鑲箝及襯墊產 品其被饋給於紙張施加階段123。該製程接著如先前所述之 方式繼續進行。 15 應該被注意的是,該捲軸116僅是舉例說明且該黏著物 uo可被直接施加於完整的標藏/鑲箝122然後一印刷紙118 再被施加於該黏著物12〇之上。 應該被注意的是,在一電容條帶及一晶粒條帶被固定 於一共同的線圈或天線時(見第6圖),顯示於第8圖之製程 2〇會增補第3個薄板條(沒有顯示),接著該薄板條也會索引 至天線薄板條104。應被瞭解的是,在該製程中無論哪一型 之條帶(晶粒條帶或電容條帶)皆可在另一者之前被施加。 另外’第2個拾起捲軸(沒有顯示)也會出現,以從電容條 帶之薄板條將該可釋放開的櫬墊取起。 18 200818561 然而本發明已被詳盡地敘述並參考於其中特有的範 例,這對於熟知此技藝者將是可清楚理解的,而不同的變 化或修改都可被製作而不偏離本發明之精神及範圍。 5 【圖式簡單說明】 第1A圖為一晶粒條帶之放大橫截面圖; 第1B圖為一電容條帶之放大橫截面圖; 第1C圖為一結合的晶粒條帶及電容條帶之放大橫截面 圖, 10 第2圖為一本發明之該晶粒條帶之放大橫截面圖; 第3圖顯示具有數個本發明之晶粒條帶之該薄板條之 部份上平面圖; 第4圖顯示具有數個本發明之晶粒條帶之該薄板條之 放大側面圖; 15 第5圖顯示本發明之一被反轉之晶粒條帶當其被施加 於一線圈或天線; 第6A圖描述一示範性之HF(高頻)保全標籤,其為藉由 使用一晶粒條帶於本發明之製程中所產生; 第6B圖描述一放大圖,其顯示被耦合於第6A圖中之該 20 HF保全標籤之該線圈之該晶粒條帶; 第6C圖描述另一示範性之HF保全標藏,其為藉由使用 一晶粒條帶及一電容帶於本發明之製程中所產生; 第6D圖為第6A-6C圖之一等效電路; 第7A圖描述一示範性之UHF(超高頻)保全標籤,其為 19 200818561 藉由使用一晶粒條帶於本發明之製程中所產生; 第7B圖描述本發明之一等效電路; 第8圖提供一處理過程圖,其用於本發明之該膠帶式轉 移條帶之處理方法。 第9圖提供一示範性之貼紙處理方法圖,其顯示該eas 或RFID標藏或鑲箝如何接著被形成一已可被客戶使用之貼 紙。 【主要元件符號說明】 20條帶 22Α,22Β·傳導元件 23,28,30Α,30Β,42 黏著物 24.基板 26,44襯墊 106A,106B加熱元件 202線圈 302A/302B 天線 200高頻保全標籤 300超高頻保全標籤 40線圈或天線薄板條 20
Claims (1)
- 200818561 十、申請專利範圍: ,種4板條’其包含數個條帶部件,該等條帶部件被可 、睪放開地n㈣板條之襯墊部份但與相鄰之條帶部 5件分開,該等條帶部件之每-個包含-薄的,-般為平 5構件,該平面構件包含_第_電性傳導平面元件, 1 % |±傳^平面元件以及分別電性連接於該傳導元 =端』之-積體電路,該第—電性傳導平面元件及該第 生傳導平面π件被固定於—非傳導層之第—面,且 ίο 、中^非傳$層之第二面被可釋放開地S]定於該襯墊部 份。 _申π專利補第!項之薄板條,其中該非傳導層之該第 面被使用-低黏度並可移除之黏著物可釋放開地固定 於該襯塾。 3. 15 4· 20 5. ▲:明範圍第2項之薄板條,其中該第一傳導平面元件及 命第⑨|±傳導70件包含透過—傳導性黏著物被適用於 笔性連接至-線圈或_天線之表面。 如申請專圍第丨項之薄板條,其中該⑽帶部件之每 〜個透過非傳導層被切斷的方式與相鄰之條帶部件分 開。 : 條,其包含數娜帶部件,該㈣帶部件被可 仪放開地固定於該薄板條之轉部份但與相鄰之條帶部 1分開,該等條帶部件之每—個包含-薄的,-般為平 面_二,該平面構件包含—第_電性傳導平面元件, 弟-電性傳導平面元件以及被配置於該第一及第二個 21 200818561 電性傳導平面元件狀-平面介電層,據麟條帶部件 形成-所欲之電容,該帛-1,_導平^件及該第二 平面電性傳導元件湘定於—非料層之第—面,且其 中該非傳導層之第二面被可釋放開地固定於該概塾部 5 份。 6·如申請專利範圍第5項之薄板條,其中該非傳導層之該第 二面被使用一低黏度之黏著物可釋放開地固定於該襯 墊。 X , 7·如申明專利範圍第6項之薄板條,其中該第一傳導平面元 件及4第_私性傳導元件包含透過一黏著物被適用於電 性耦合至一線圈或一天線之表面。 8·如申請專利範圍第5項之薄板條,其中藉由該非傳導層被 切斷使传該等條帶部件之每一個與相鄰之條帶部件分 開。 15 9·—種用於形成數個EAS或RFID標籤或鑲箝之方法,該方 法包含: 提供—第一薄板條,其包含數個RFID晶粒條帶或電 今條π於_第_襯墊上’該等晶粒條帶或電容條帶之每 -個被可釋放開地固定於該第—襯塾,且其中該等晶粒 2〇 條1電容條帶之每-個與相鄰之條帶分開; 提七、第二薄板條,其具有數個天線或線圈於一第 二襯墊上; '、引"亥第一及第二薄板條使得該等晶粒條帶之一個 或/等電4條帶之—個被對準於該等數個天線之相對應 22 200818561 的個或該等數個線圈之相對應的一個;並且 々施加所選之熱或壓力於該等晶粒條帶之每一個或該 等電容條帶之每一個,以將該晶粒條帶或該等電容 一襯墊釋放開,同時將該晶粒條帶或該電容條帶電 5 11連接於該等數個天線之相對應的一個或該等數個線圈 之相對應的一個,以形成一EAS或RFID標籤或鑲箝。 1〇·如申請專利範圍第9項之方法,其中該等晶粒條帶或該 等私各條帶之每一個使用一低黏度之黏著物黏著地 於該第一櫬墊。 10 η·如申請專利範圍第10項之方法,其中該提供一第一薄板 條之步驟包含施加一黏著物於位在該等晶粒條帶之每一 個傳導性元件或位在該等電容條帶之每一個傳導性元件 上。 U·如申請專利範圍第11項之方法,其中該索引該第一及第 15 二薄板條之步驟包含指向定位該等薄板條,使得在該等 傳V 元件上之該黏著物接觸該數個天線或該數個線圈 之該相對應的一個。 13. 如申請專鄉圍第12項之方法,其巾該施加所選擇之熱 或壓力之步驟包含直接對該第一襯墊上相對於該等傳導 20 元件之一部份之位置直接施加熱或壓力。 14. 如申請專利範圍第13項之方法,更包含取起第一概塾之 一部分的步驟,該第-襯墊之該—部分係相對應於該晶 粒條f或该電容條帶並可由其上釋放開。 15·如申#專利範圍第13項之方法,其中該直接對該第一概 23 200818561 墊施加熱或壓力之步驟,包含將該晶粒條帶或該電容 條帶之該傳導性元件束缚於之該數個天線或該數個線 圈之該相對應的一個。 16. 如申請專利範圍第13項之方法,其中直接對該第一襯墊 5 施加熱或壓力之該步驟包含使用加熱元件及一滾筒。 17. 如申請範圍第10項之方法,其中提供該具有位在第二 襯墊上之數個天線或數個線圈之第二薄板條的步驟,包 含將位在該數個天線或該數個線圈之每一個上的傳導 性黏著物於施加至該等晶粒條帶每一個或該等電容條 10 帶每一個要被連接之處。 18. —種用於形成數個RFID標籤或鑲箝之方法,該方法包 含: 提供一第一薄板條,其包含數個RFID晶粒條帶於一 第一襯墊上,該等晶粒條帶之每一個被可釋放開地固定 15 於該第一襯墊,且其中該等晶粒條帶之每一個與相鄰之 晶粒條帶分開; 提供一第二薄板條,其包含數個電容條帶於一第二 襯墊上,該等電容條帶之每一個被可釋放開地固定於該 第二襯墊,且其中該等電容條帶之每一個與相鄰之電容 20 條帶分開; 提供一具有數個天線或線圈於一第三襯墊上之第三 薄板條; 索引該第一及第三薄板條,使得該等晶粒條帶之一 個被對準於該等數個天線相對應之一個或該等數個線圈 24 200818561 相對應之—個。 =所選之熱或壓力於料晶粒條帶之每—個 ,=帶從該第一概塾釋放開,同時將該晶粒條帶電 之;1於該數個天線相對應之-個或該數個線圈相對應 <一個; 索引該第二及第三薄板條,使得該等電容條帶之一 =被對準於該數個天線相對應之—個或該數個線圈相對 應之一個;且 10 15 20 施加所選之熱及壓力於該等電容條帶之每一個以將 该電容條帶從該第二襯姆相,同時㈣電容條帶電 性連接於魏個天線相對紅—個或贿轉圈相對應 之一個以形成一RFID標籤或鑲箝。 α如申請專利範圍第18項之方法,其中該等晶粒條帶或 该專電容條帶之每-個使用—低黏度可移除之黏著物 分別地黏著固定於該第一及第二櫬墊。 2〇·如申請專利範圍第19項之方法,其中該等提供一第一 薄板條及-第二薄板條之步驟包含施加—傳導性黏著 物於該等晶粒條帶之每一個或該等電容條帶之每一個 之傳導性元件上。 儿如申請專利範圍第20項之方法,其中該索引該第一及 第二薄板條之步驟包含指向定位該等薄板條,使得在該 等傳導性元件上之該傳導性黏著物接觸該相對應之該 Λ 數個天線之一個或該數個線圈之一個。 过如申請專利範圍第21項之方法,其中該施加所選擇之 25 200818561 熱及壓力之步驟,包含直接對該第一襯墊上相對於該晶 粒條帶之該等傳導元件之一部份之位置,及對該第二襯 塾上相對於該電容條帶之該等傳導元件之一部份之位 置直接施加熱及壓力。 5 23·如申請專利範圍第22項之方法,更包含取起相對應於 該晶粒條帶之該第一襯墊之一部份及相對應於該電容 條帶之該第二襯墊之一部份,使得該等部份從其個別襯 墊釋放開之步驟。 24·如申請專利範圍第22項之方法,其中該直接對該第一 10 襯墊施加熱及壓力之步驟包含束缚該晶粒條帶之該等 傳導性元件,及束缚該電容條帶之該等傳導性元件於該 數個天線相對應之一個或該數個線圈相對應之一個。 25·如申請專利範圍第22項之方法,其中該對該第一襯墊 與對4弟一概塾直接施加熱及壓力之步驟包含使用加 15 熱元件及一滾筒。 26·如申請專利範圍第18項之方法,其中該提供一具有數 個天線或線圈於一第三襯墊上之第三薄板條之步驟包 含施加一傳導性黏著物於該等數個天線或線圈之每一 個上’且該等晶粒條帶之每一個或該等電容條帶之每一 2〇 個被連接於此處。 26
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-
2006
- 2006-04-10 US US11/400,932 patent/US7646304B2/en not_active Expired - Fee Related
-
2007
- 2007-04-05 CA CA002649039A patent/CA2649039A1/en not_active Abandoned
- 2007-04-05 EP EP07760213A patent/EP2005370A2/en not_active Withdrawn
- 2007-04-05 AU AU2007238242A patent/AU2007238242B2/en not_active Ceased
- 2007-04-05 WO PCT/US2007/066094 patent/WO2007121114A2/en active Application Filing
- 2007-04-05 JP JP2009505546A patent/JP4659904B2/ja not_active Expired - Fee Related
- 2007-04-05 MX MX2008013016A patent/MX2008013016A/es active IP Right Grant
- 2007-04-05 CN CN2007800213523A patent/CN101467163B/zh not_active Expired - Fee Related
- 2007-04-09 TW TW096112302A patent/TW200818561A/zh unknown
-
2009
- 2009-11-25 US US12/626,170 patent/US7884726B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP4659904B2 (ja) | 2011-03-30 |
US7884726B2 (en) | 2011-02-08 |
AU2007238242A1 (en) | 2007-10-25 |
MX2008013016A (es) | 2008-11-18 |
EP2005370A2 (en) | 2008-12-24 |
US20070238245A1 (en) | 2007-10-11 |
US7646304B2 (en) | 2010-01-12 |
WO2007121114A3 (en) | 2007-12-13 |
US20100083493A1 (en) | 2010-04-08 |
JP2009533769A (ja) | 2009-09-17 |
WO2007121114A2 (en) | 2007-10-25 |
AU2007238242B2 (en) | 2011-06-09 |
CA2649039A1 (en) | 2007-10-25 |
CN101467163A (zh) | 2009-06-24 |
CN101467163B (zh) | 2013-04-03 |
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