MX2008013016A - Proceso de banda de cinta de transferencia. - Google Patents
Proceso de banda de cinta de transferencia.Info
- Publication number
- MX2008013016A MX2008013016A MX2008013016A MX2008013016A MX2008013016A MX 2008013016 A MX2008013016 A MX 2008013016A MX 2008013016 A MX2008013016 A MX 2008013016A MX 2008013016 A MX2008013016 A MX 2008013016A MX 2008013016 A MX2008013016 A MX 2008013016A
- Authority
- MX
- Mexico
- Prior art keywords
- straps
- web
- capacitor
- liner
- transfer tape
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 4
- 239000003990 capacitor Substances 0.000 abstract 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B13/00—Burglar, theft or intruder alarms
- G08B13/22—Electrical actuation
- G08B13/24—Electrical actuation by interference with electromagnetic field distribution
- G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
- G08B13/2405—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used
- G08B13/2414—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags
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- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B13/00—Burglar, theft or intruder alarms
- G08B13/22—Electrical actuation
- G08B13/24—Electrical actuation by interference with electromagnetic field distribution
- G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
- G08B13/2405—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used
- G08B13/2414—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags
- G08B13/2417—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags having a radio frequency identification chip
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- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B13/00—Burglar, theft or intruder alarms
- G08B13/22—Electrical actuation
- G08B13/24—Electrical actuation by interference with electromagnetic field distribution
- G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
- G08B13/2428—Tag details
- G08B13/2437—Tag layered structure, processes for making layered tags
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68345—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self supporting substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
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- H01L2924/01004—Beryllium [Be]
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- H01L2924/078—Adhesive characteristics other than chemical
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- H01L2924/14—Integrated circuits
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Electromagnetism (AREA)
- Computer Security & Cryptography (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Details Of Aerials (AREA)
- Burglar Alarm Systems (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Un método para producir en forma eficaz una pluralidad de etiquetas de EAS o de RFID o incrustaciones que forman un rótulo listo para su uso. El proceso utiliza una primera red de bandas de chip o bandas de condensador que se aseguran en forma liberable a un revestimiento que utiliza sólo un adhesivo de baja pegajosidad y utiliza un segunda red de bobinas o antenas que se aseguran a un segundo revestimiento. Después de indexar estas dos redes ser aplica calor y presión selectivos a las bandas de chips o a las bandas de condensador para transferirlas y acoplarlas en forma eléctrica a una bobina o antena correspondiente. En los casos en los que tanto las bandas de chip como las bandas de condensador se aplican a una antena común, una tercera red de la banda adicional se utiliza en el proceso.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/400,932 US7646304B2 (en) | 2006-04-10 | 2006-04-10 | Transfer tape strap process |
PCT/US2007/066094 WO2007121114A2 (en) | 2006-04-10 | 2007-04-05 | Transfer tape strap process |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2008013016A true MX2008013016A (es) | 2008-11-18 |
Family
ID=38474277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2008013016A MX2008013016A (es) | 2006-04-10 | 2007-04-05 | Proceso de banda de cinta de transferencia. |
Country Status (9)
Country | Link |
---|---|
US (2) | US7646304B2 (es) |
EP (1) | EP2005370A2 (es) |
JP (1) | JP4659904B2 (es) |
CN (1) | CN101467163B (es) |
AU (1) | AU2007238242B2 (es) |
CA (1) | CA2649039A1 (es) |
MX (1) | MX2008013016A (es) |
TW (1) | TW200818561A (es) |
WO (1) | WO2007121114A2 (es) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2901041B1 (fr) * | 2006-05-12 | 2008-10-10 | Eric Heurtier | Etiquette integrant une antenne anti-vol rf et un transporteur rfid uhf |
US20080079587A1 (en) * | 2006-09-29 | 2008-04-03 | Ahmadreza Rofougaran | Method And System For Utilizing Magnetic On-Chip Coil For Ultra High Frequency (UHF) |
US8026818B2 (en) * | 2006-12-20 | 2011-09-27 | Checkpoint Systems, Inc. | EAS and UHF combination tag |
EP2328900B1 (en) | 2008-08-11 | 2013-08-28 | Tasmanian Alkaloids Pty. Ltd. | PROCESS FOR MAKING MORPHINAN-6 alpha-OLS |
US8128000B2 (en) * | 2009-09-25 | 2012-03-06 | Avery Dennison Corporation | Method, system and apparatus for manufacturing a radio frequency identification device |
GB2491447B (en) * | 2010-03-24 | 2014-10-22 | Murata Manufacturing Co | RFID system |
US8701271B2 (en) | 2010-04-14 | 2014-04-22 | Avery Dennison Corporation | Method of assembly of articles |
CN102237323B (zh) * | 2010-04-27 | 2016-04-06 | 上海仪电智能电子有限公司 | 一种带负载电容的微型射频模块封装用pcb载带 |
CN101937523A (zh) * | 2010-09-30 | 2011-01-05 | 潘泽民 | 可读写防盗磁条及可读写防盗标签 |
US9299021B2 (en) * | 2010-11-11 | 2016-03-29 | Avery Dennison Corporation | RFID devices and methods for manufacturing |
US20130092739A1 (en) * | 2011-10-13 | 2013-04-18 | Supreme Technic Package Co., Ltd. | Simple multifuncational identification labels and their manufacturing method |
US10311351B1 (en) * | 2012-04-11 | 2019-06-04 | Impinj, Inc. | RFID integrated circuits with antenna contacts on multiple surfaces |
US20160148086A1 (en) * | 2013-06-19 | 2016-05-26 | Ross Robert Clarke | Radio Frequency Identification Tag |
RU2705509C2 (ru) | 2014-09-29 | 2019-11-07 | Авери Деннисон Корпорейшн | Метка радиочастотной идентификации для отслеживания шины |
KR101892689B1 (ko) * | 2014-10-14 | 2018-08-28 | 삼성전기주식회사 | 칩 전자부품 및 칩 전자부품의 실장 기판 |
US10049319B2 (en) | 2014-12-16 | 2018-08-14 | Avery Dennison Retail Information Services, Llc | Method of assembly using moving substrates, including creating RFID inlays |
US10198677B2 (en) * | 2016-05-26 | 2019-02-05 | Avery Dennison Retail Information Services, Llc | RFID tag for printed fabric label and method of making |
EP3563299B1 (en) | 2016-12-29 | 2021-01-20 | Avery Dennison Retail Information Services, LLC | Rfid tags with shielding structure for incorporation into microwavable food packaging |
US10763588B2 (en) * | 2017-01-31 | 2020-09-01 | TenX Healthcare, Inc. | Patient tracking system for monitoring patient data |
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-
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- 2007-04-05 EP EP07760213A patent/EP2005370A2/en not_active Withdrawn
- 2007-04-05 AU AU2007238242A patent/AU2007238242B2/en not_active Ceased
- 2007-04-05 WO PCT/US2007/066094 patent/WO2007121114A2/en active Application Filing
- 2007-04-05 JP JP2009505546A patent/JP4659904B2/ja not_active Expired - Fee Related
- 2007-04-05 MX MX2008013016A patent/MX2008013016A/es active IP Right Grant
- 2007-04-05 CN CN2007800213523A patent/CN101467163B/zh not_active Expired - Fee Related
- 2007-04-09 TW TW096112302A patent/TW200818561A/zh unknown
-
2009
- 2009-11-25 US US12/626,170 patent/US7884726B2/en not_active Expired - Fee Related
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JP4659904B2 (ja) | 2011-03-30 |
US7884726B2 (en) | 2011-02-08 |
AU2007238242A1 (en) | 2007-10-25 |
TW200818561A (en) | 2008-04-16 |
EP2005370A2 (en) | 2008-12-24 |
US20070238245A1 (en) | 2007-10-11 |
US7646304B2 (en) | 2010-01-12 |
WO2007121114A3 (en) | 2007-12-13 |
US20100083493A1 (en) | 2010-04-08 |
JP2009533769A (ja) | 2009-09-17 |
WO2007121114A2 (en) | 2007-10-25 |
AU2007238242B2 (en) | 2011-06-09 |
CA2649039A1 (en) | 2007-10-25 |
CN101467163A (zh) | 2009-06-24 |
CN101467163B (zh) | 2013-04-03 |
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