TW200801527A - Probe, testing head having a plurality of probes, and circuit board tester having the testing head - Google Patents
Probe, testing head having a plurality of probes, and circuit board tester having the testing headInfo
- Publication number
- TW200801527A TW200801527A TW096112727A TW96112727A TW200801527A TW 200801527 A TW200801527 A TW 200801527A TW 096112727 A TW096112727 A TW 096112727A TW 96112727 A TW96112727 A TW 96112727A TW 200801527 A TW200801527 A TW 200801527A
- Authority
- TW
- Taiwan
- Prior art keywords
- hole
- pin body
- probe
- testing head
- circuit board
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006134202A JP2007304008A (ja) | 2006-05-12 | 2006-05-12 | 基板検査用接触子、基板検査用治具及び基板検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200801527A true TW200801527A (en) | 2008-01-01 |
TWI327222B TWI327222B (zh) | 2010-07-11 |
Family
ID=38685701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096112727A TW200801527A (en) | 2006-05-12 | 2007-04-11 | Probe, testing head having a plurality of probes, and circuit board tester having the testing head |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070264878A1 (zh) |
JP (1) | JP2007304008A (zh) |
KR (1) | KR100864435B1 (zh) |
CN (1) | CN101071140A (zh) |
TW (1) | TW200801527A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI422831B (zh) * | 2009-05-29 | 2014-01-11 | Nidec Read Corp | 檢查用治具 |
TWI814198B (zh) * | 2022-01-04 | 2023-09-01 | 美商全球連接器科技有限公司 | 電性測試裝置 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010025665A (ja) * | 2008-07-17 | 2010-02-04 | Nidec-Read Corp | 基板検査治具及び接触子 |
DE102009004555A1 (de) * | 2009-01-14 | 2010-09-30 | Atg Luther & Maelzer Gmbh | Verfahren zum Prüfen von Leiterplatten |
JP2011089891A (ja) * | 2009-10-22 | 2011-05-06 | Micronics Japan Co Ltd | 電気的接続装置及びこれを用いる試験装置 |
JP5629545B2 (ja) * | 2009-12-18 | 2014-11-19 | 株式会社日本マイクロニクス | プローブカード及び検査装置 |
JP2013100994A (ja) * | 2011-11-07 | 2013-05-23 | Nidec-Read Corp | 基板検査治具、治具ベースユニット及び基板検査装置 |
JP5966688B2 (ja) * | 2012-07-04 | 2016-08-10 | 日本電産リード株式会社 | 配線構造及び基板検査装置 |
JP2014235119A (ja) * | 2013-06-04 | 2014-12-15 | 日本電産リード株式会社 | 基板検査装置、基板検査方法および基板検査用治具 |
US9274166B2 (en) | 2013-08-26 | 2016-03-01 | Fujitsu Limited | Pin verification device and method |
CN104714059A (zh) * | 2015-03-19 | 2015-06-17 | 东莞鸿爱斯通信科技有限公司 | 测试接头 |
CN105388412A (zh) * | 2015-10-23 | 2016-03-09 | 京东方科技集团股份有限公司 | 用于pcba的测试装置 |
JP6872943B2 (ja) * | 2017-03-24 | 2021-05-19 | 株式会社日本マイクロニクス | 電気的接続装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0242542A1 (de) * | 1986-03-26 | 1987-10-28 | Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung | Prüfadapter |
JP2532331B2 (ja) * | 1992-11-09 | 1996-09-11 | 日本発条株式会社 | 導電性接触子 |
US5442299A (en) * | 1994-01-06 | 1995-08-15 | International Business Machines Corporation | Printed circuit board test fixture and method |
US5506510A (en) * | 1994-05-18 | 1996-04-09 | Genrad, Inc. | Adaptive alignment probe fixture for circuit board tester |
JP3326095B2 (ja) * | 1996-12-27 | 2002-09-17 | 日本発条株式会社 | 導電性接触子 |
JP3634074B2 (ja) * | 1996-06-28 | 2005-03-30 | 日本発条株式会社 | 導電性接触子 |
JPH10214649A (ja) * | 1997-01-30 | 1998-08-11 | Yokowo Co Ltd | スプリングコネクタおよび該スプリングコネクタを用いた装置 |
AU8747798A (en) * | 1997-08-21 | 1999-03-16 | Ibiden Co. Ltd. | Checker head |
US6429672B2 (en) * | 1998-06-30 | 2002-08-06 | International Business Machines Corporation | Contamination-tolerant electrical test probe |
JP3538036B2 (ja) * | 1998-09-10 | 2004-06-14 | イビデン株式会社 | チェッカーヘッドおよびその製造方法 |
DE19907727A1 (de) * | 1999-02-23 | 2000-08-24 | Test Plus Electronic Gmbh | Testadapter zur Kontaktierung von bestückten Leiterplatinen |
US6330744B1 (en) * | 1999-07-12 | 2001-12-18 | Pjc Technologies, Inc. | Customized electrical test probe head using uniform probe assemblies |
US6191595B1 (en) * | 1999-07-30 | 2001-02-20 | Credence Systems Corporation | Adhesive attaching, thermal releasing flat pack probe assembly |
JP2001041977A (ja) * | 1999-08-02 | 2001-02-16 | Takashi Nansai | チューブレスプリント基板検査機用治具 |
JP3794608B2 (ja) * | 1999-12-01 | 2006-07-05 | 矢崎総業株式会社 | コネクタ導通検査具 |
US6570399B2 (en) * | 2000-05-18 | 2003-05-27 | Qa Technology Company, Inc. | Test probe and separable mating connector assembly |
WO2003076957A1 (en) * | 2002-03-05 | 2003-09-18 | Rika Denshi America, Inc. | Apparatus for interfacing electronic packages and test equipment |
JP2004039729A (ja) * | 2002-07-01 | 2004-02-05 | Totsuka Densi Kk | プリント配線基板の検査治具 |
US6773938B2 (en) * | 2002-08-29 | 2004-08-10 | Micron Technology, Inc. | Probe card, e.g., for testing microelectronic components, and methods for making same |
KR100405037B1 (en) | 2003-07-21 | 2003-11-10 | From 30 Co Ltd | Probe card for inspecting semiconductor device |
JP4405358B2 (ja) * | 2004-09-30 | 2010-01-27 | 株式会社ヨコオ | 検査ユニット |
US7154286B1 (en) * | 2005-06-30 | 2006-12-26 | Interconnect Devices, Inc. | Dual tapered spring probe |
KR200421209Y1 (ko) * | 2006-04-14 | 2006-07-10 | 캐롤라인 예 | 회로 기판의 검사를 위한 시험용 탐침 장치 |
-
2006
- 2006-05-12 JP JP2006134202A patent/JP2007304008A/ja active Pending
-
2007
- 2007-04-11 TW TW096112727A patent/TW200801527A/zh not_active IP Right Cessation
- 2007-04-24 KR KR1020070039822A patent/KR100864435B1/ko not_active IP Right Cessation
- 2007-05-10 US US11/746,809 patent/US20070264878A1/en not_active Abandoned
- 2007-05-11 CN CNA2007101029153A patent/CN101071140A/zh active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI422831B (zh) * | 2009-05-29 | 2014-01-11 | Nidec Read Corp | 檢查用治具 |
TWI814198B (zh) * | 2022-01-04 | 2023-09-01 | 美商全球連接器科技有限公司 | 電性測試裝置 |
Also Published As
Publication number | Publication date |
---|---|
KR100864435B1 (ko) | 2008-10-20 |
JP2007304008A (ja) | 2007-11-22 |
US20070264878A1 (en) | 2007-11-15 |
CN101071140A (zh) | 2007-11-14 |
KR20070109831A (ko) | 2007-11-15 |
TWI327222B (zh) | 2010-07-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |