TW200732898A - Thermal module - Google Patents

Thermal module

Info

Publication number
TW200732898A
TW200732898A TW095106290A TW95106290A TW200732898A TW 200732898 A TW200732898 A TW 200732898A TW 095106290 A TW095106290 A TW 095106290A TW 95106290 A TW95106290 A TW 95106290A TW 200732898 A TW200732898 A TW 200732898A
Authority
TW
Taiwan
Prior art keywords
heat
conducting plate
groove
thermal module
heat conducting
Prior art date
Application number
TW095106290A
Other languages
Chinese (zh)
Other versions
TWI309761B (en
Inventor
Cheng-Tien Lai
Zhi-Yong Zhou
Yi-San Liu
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW95106290A priority Critical patent/TWI309761B/en
Publication of TW200732898A publication Critical patent/TW200732898A/en
Application granted granted Critical
Publication of TWI309761B publication Critical patent/TWI309761B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A thermal module includes a heat conducting plate for contacting with an electronic component, a heat sink mounted on the heat conducting plate and a heat pipe. The heat conducting plate defines a groove therein. The heat pipe includes a first heat-conducting portion sandwiched between the heat conducting plate and the heat sink, and a second heat-conducting portion thermally connecting with the heat sink but remote from the heat conducting plate. The first heat-conducting portion includes a middle part having a circular cross section and accommodated in the groove of the heat conducting plate, and a flattened part extending out of the groove and having a flattened surface.
TW95106290A 2006-02-24 2006-02-24 Thermal module TWI309761B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95106290A TWI309761B (en) 2006-02-24 2006-02-24 Thermal module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95106290A TWI309761B (en) 2006-02-24 2006-02-24 Thermal module

Publications (2)

Publication Number Publication Date
TW200732898A true TW200732898A (en) 2007-09-01
TWI309761B TWI309761B (en) 2009-05-11

Family

ID=45072096

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95106290A TWI309761B (en) 2006-02-24 2006-02-24 Thermal module

Country Status (1)

Country Link
TW (1) TWI309761B (en)

Also Published As

Publication number Publication date
TWI309761B (en) 2009-05-11

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