TW200735690A - Ceramic heater and manufacturing method thereof - Google Patents

Ceramic heater and manufacturing method thereof

Info

Publication number
TW200735690A
TW200735690A TW095139238A TW95139238A TW200735690A TW 200735690 A TW200735690 A TW 200735690A TW 095139238 A TW095139238 A TW 095139238A TW 95139238 A TW95139238 A TW 95139238A TW 200735690 A TW200735690 A TW 200735690A
Authority
TW
Taiwan
Prior art keywords
plate member
ceramic heater
bar
heater
conduction layer
Prior art date
Application number
TW095139238A
Other languages
English (en)
Other versions
TWI350122B (en
Inventor
Takuma Kushihashi
Noboru Kimura
Masaki Seki
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200735690A publication Critical patent/TW200735690A/zh
Application granted granted Critical
Publication of TWI350122B publication Critical patent/TWI350122B/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/10Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/10Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67103Apparatus for thermal treatment mainly by conduction
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/02Details
    • H05B3/06Heater elements structurally combined with coupling elements or holders
TW095139238A 2005-11-08 2006-10-24 Ceramic heater and manufacturing method thereof TWI350122B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005323967A JP2007134088A (ja) 2005-11-08 2005-11-08 セラミックスヒーターおよびセラミックスヒーターの製造方法

Publications (2)

Publication Number Publication Date
TW200735690A true TW200735690A (en) 2007-09-16
TWI350122B TWI350122B (en) 2011-10-01

Family

ID=37547500

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139238A TWI350122B (en) 2005-11-08 2006-10-24 Ceramic heater and manufacturing method thereof

Country Status (5)

Country Link
US (1) US7329842B2 (zh)
EP (1) EP1784050B1 (zh)
JP (1) JP2007134088A (zh)
KR (1) KR101299496B1 (zh)
TW (1) TWI350122B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113271692A (zh) * 2021-04-29 2021-08-17 苏州极限深灰光电科技有限公司 陶瓷发热体、方法、红外加热管及设备

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101299495B1 (ko) * 2005-12-08 2013-08-29 신에쓰 가가꾸 고교 가부시끼가이샤 세라믹스 히터, 히터 급전 부품 및 세라믹스 히터의제조방법
JP2009123577A (ja) * 2007-11-16 2009-06-04 Ulvac Japan Ltd 基板加熱装置
JP2009301796A (ja) * 2008-06-11 2009-12-24 Shin-Etsu Chemical Co Ltd セラミックスヒーター及びその製造方法
US20110259869A1 (en) * 2008-11-14 2011-10-27 Penny Hlavaty Cooking apparatus with non-metal plates
JP5894401B2 (ja) * 2011-09-12 2016-03-30 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 ポスト型セラミックスヒータおよびその製造方法
JP5996519B2 (ja) * 2013-03-13 2016-09-21 信越化学工業株式会社 セラミックヒーター
JP5911179B2 (ja) * 2013-08-21 2016-04-27 信越化学工業株式会社 立体形状のセラミックスヒーター
US10154542B2 (en) * 2015-10-19 2018-12-11 Watlow Electric Manufacturing Company Composite device with cylindrical anisotropic thermal conductivity
CN107059112B (zh) * 2017-04-14 2023-12-08 南京晶能半导体科技有限公司 半导体级硅单晶炉底部加热器
KR101989855B1 (ko) * 2017-04-18 2019-06-17 주식회사 아모센스 궐련형 전자담배장치용 발열히터
JP2019060819A (ja) * 2017-09-28 2019-04-18 日本特殊陶業株式会社 電子部品検査装置用配線基板
US10681778B2 (en) * 2017-11-21 2020-06-09 Watlow Electric Manufacturing Company Integrated heater and method of manufacture
US11083050B2 (en) 2017-11-21 2021-08-03 Watlow Electric Manufacturing Company Integrated heater and method of manufacture
TWI724951B (zh) * 2018-05-22 2021-04-11 美商瓦特洛威電子製造公司 一體式加熱器及製造方法
WO2020067357A1 (ja) * 2018-09-28 2020-04-02 京セラ株式会社 セラミック構造体及びウェハ用システム
JP7170745B2 (ja) * 2018-10-30 2022-11-14 京セラ株式会社 基板状構造体及びヒータシステム
US20210037613A1 (en) * 2018-11-19 2021-02-04 Ngk Spark Plug Co., Ltd. Holding device and method of manufacturing holding device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5343022A (en) * 1992-09-29 1994-08-30 Advanced Ceramics Corporation Pyrolytic boron nitride heating unit
JP2984164B2 (ja) * 1993-03-26 1999-11-29 日本碍子株式会社 半導体製造用サセプター
JPH10189227A (ja) * 1996-12-27 1998-07-21 Shin Etsu Chem Co Ltd 加熱ユニットおよびその接続方法
JP3560456B2 (ja) * 1997-12-11 2004-09-02 信越化学工業株式会社 複層セラミックスヒータ
JP3477062B2 (ja) * 1997-12-26 2003-12-10 京セラ株式会社 ウエハ加熱装置
JP3914377B2 (ja) * 2000-07-17 2007-05-16 信越化学工業株式会社 静電吸着機能を有するウエーハ加熱装置
JP4521107B2 (ja) * 2000-10-17 2010-08-11 株式会社ブリヂストン ヒータ及び半導体製造装置
JP2002313539A (ja) * 2001-04-17 2002-10-25 Toshiba Ceramics Co Ltd 面状セラミックスヒーター及びその製造方法
JP2002313531A (ja) * 2001-04-17 2002-10-25 Toshiba Ceramics Co Ltd 面状セラミックスヒーター及び製造方法
US20040074898A1 (en) * 2002-10-21 2004-04-22 Mariner John T. Encapsulated graphite heater and process
JP2004220966A (ja) 2003-01-16 2004-08-05 Ngk Insulators Ltd ヒーターおよびその製造方法
JP4602662B2 (ja) * 2003-12-01 2010-12-22 株式会社ブリヂストン セラミックヒータユニット
JP2004253799A (ja) 2004-02-16 2004-09-09 Ibiden Co Ltd 半導体製造・検査装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113271692A (zh) * 2021-04-29 2021-08-17 苏州极限深灰光电科技有限公司 陶瓷发热体、方法、红外加热管及设备

Also Published As

Publication number Publication date
KR20070049543A (ko) 2007-05-11
US20070102419A1 (en) 2007-05-10
US7329842B2 (en) 2008-02-12
JP2007134088A (ja) 2007-05-31
KR101299496B1 (ko) 2013-08-29
EP1784050A3 (en) 2008-09-24
EP1784050A2 (en) 2007-05-09
EP1784050B1 (en) 2015-09-02
TWI350122B (en) 2011-10-01

Similar Documents

Publication Publication Date Title
TW200735690A (en) Ceramic heater and manufacturing method thereof
TW200735691A (en) Ceramic heater, method for manufacturing ceramic heater, and power supplying components for heater
CN108208938A (zh) 一种发热体及制备方法
RU2017134811A (ru) Модуль нагревательного элемента для образующего аэрозоль устройства
MX2017012644A (es) Bolsa de sustrato formador de aerosol, metodo para fabricar la misma y dispositivo generador de aerosol para usar con la bolsa.
ATE554631T1 (de) Elektrische heizvorrichtung und wärmeerzeugendes element einer elektrischen heizvorrichtung
EP1261028A3 (en) Cooling arrangement for an electronic apparatus
ATE358566T1 (de) Dickschicht heizvorrichtung
EA201290240A1 (ru) Электронагреваемая курительная система с улучшенным нагревателем
ATE256961T1 (de) Elektrische heizvorrichtung
BR0107834A (pt) Envidraçamento provido com um circuito elétrico e método para sua produção
CN112390629B (zh) 一种快速烧结陶瓷装置及方法
WO2009069335A1 (ja) 電子放出源及び電子放出源の製造方法
ATE265023T1 (de) Keramische glühstiftkerze
WO2009075310A1 (ja) 発熱体装置及びその製造方法
ATE280928T1 (de) Keramische glühstiftkerze
AR036817A1 (es) Dispositivo de calentamiento para electrodifusores
CN108966381B (zh) 陶瓷加热片结构
DE60209243D1 (de) Elektrischer strahlungsheizkörper
US11828490B2 (en) Ceramic heater for heating water in an appliance
TW200733485A (en) Anisotropic conductive sheet, manufacturing method, connecting method, and examinating method
TW200719364A (en) Surface mount device having a cushioning layer therein and the method of making the same
ATE318064T1 (de) Flexibles flächenheizelement
CN201328474Y (zh) 一种直发器发热板
JPH0410376A (ja) 遠赤外線ヒータ

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees