TW200733485A - Anisotropic conductive sheet, manufacturing method, connecting method, and examinating method - Google Patents

Anisotropic conductive sheet, manufacturing method, connecting method, and examinating method

Info

Publication number
TW200733485A
TW200733485A TW095142744A TW95142744A TW200733485A TW 200733485 A TW200733485 A TW 200733485A TW 095142744 A TW095142744 A TW 095142744A TW 95142744 A TW95142744 A TW 95142744A TW 200733485 A TW200733485 A TW 200733485A
Authority
TW
Taiwan
Prior art keywords
anisotropic conductive
conductive sheet
main surface
electrode
hole
Prior art date
Application number
TW095142744A
Other languages
Chinese (zh)
Other versions
TWI374579B (en
Inventor
Yasuhiro Okuda
Akihisa Hosoe
Taro Fujita
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of TW200733485A publication Critical patent/TW200733485A/en
Application granted granted Critical
Publication of TWI374579B publication Critical patent/TWI374579B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0249—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for simultaneous welding or soldering of a plurality of wires to contact elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H05K2201/09527—Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Abstract

This invention provides an anisotropic conductive sheet (8) that has heatproof and the low temperature resistance, and is suitable for the connection of the electrode. Therefore, regarding the anisotropic conductive sheet of this invention, an insulating film having electro-conductivity in the direction of thickness and constituted of synthetic resin is used as a base film (1). The base film has a plurality of hole (3) formed in the direction of thickness. The hole is opened in direction of one main surface of the base film and closed in direction of another main surface. Metal is adhered to the closed portion (2a) and inner wall (2b) of the hole and an electrode (7) is contacted to the closed portion (2a) of the holes outside, thereby the main surface with the opened holes and contacted electrode (7) are electrically connected through the adhered metal.
TW095142744A 2005-11-21 2006-11-20 Anisotropic conductive sheet, manufacturing method, connecting method, and examinating method TWI374579B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005336053A JP4715464B2 (en) 2005-11-21 2005-11-21 Anisotropic conductive sheet, manufacturing method thereof, connection method and inspection method

Publications (2)

Publication Number Publication Date
TW200733485A true TW200733485A (en) 2007-09-01
TWI374579B TWI374579B (en) 2012-10-11

Family

ID=38048488

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095142744A TWI374579B (en) 2005-11-21 2006-11-20 Anisotropic conductive sheet, manufacturing method, connecting method, and examinating method

Country Status (8)

Country Link
US (1) US7667480B2 (en)
EP (1) EP1953870A4 (en)
JP (1) JP4715464B2 (en)
KR (1) KR20080077087A (en)
CN (1) CN101313438B (en)
CA (1) CA2628772A1 (en)
TW (1) TWI374579B (en)
WO (1) WO2007058101A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
US9442133B1 (en) * 2011-08-21 2016-09-13 Bruker Nano Inc. Edge electrode for characterization of semiconductor wafers
JP5575348B1 (en) * 2014-01-20 2014-08-20 株式会社Ｌｅａｐ Connector manufacturing method
JP2016076299A (en) * 2014-10-02 2016-05-12 ポリマテック・ジャパン株式会社 Anisotropic conductor
JP6459739B2 (en) * 2015-04-13 2019-01-30 オムロン株式会社 Terminal connection structure and electromagnetic relay using the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
JPH0817498A (en) * 1994-06-30 1996-01-19 Ind Technol Res Inst Composite bump junction
JP3233867B2 (en) 1997-01-31 2001-12-04 富士通株式会社 Test substrate and test method using the same
JP3194708B2 (en) * 1997-03-03 2001-08-06 東邦化成株式会社 Socket for IC
US5926029A (en) * 1997-05-27 1999-07-20 International Business Machines Corporation Ultra fine probe contacts
JP2001077495A (en) * 1999-09-02 2001-03-23 Fujitsu Ltd Contactor for electronic component and method for testing electronic component
JP2003533863A (en) * 2000-05-15 2003-11-11 モレックス インコーポレーテッド Elastomer electrical connector
JP3505650B2 (en) * 2000-08-30 2004-03-08 日本航空電子工業株式会社 Anisotropic conductive sheet and method for producing the same
JP2005142111A (en) 2003-11-10 2005-06-02 Sumitomo Electric Ind Ltd Anisotropic conduction sheet
JP2005294131A (en) * 2004-04-02 2005-10-20 Sumitomo Electric Ind Ltd Anisotropic conductive sheet
JP2006209400A (en) 2005-01-27 2006-08-10 Techno System Kk Medical information providing system
JP2006269400A (en) * 2005-02-28 2006-10-05 Sumitomo Electric Ind Ltd Anisotropic conductive sheet, its manufacturing method, connection method, and inspection method

Also Published As

Publication number Publication date
WO2007058101A1 (en) 2007-05-24
US7667480B2 (en) 2010-02-23
US20090115444A1 (en) 2009-05-07
TWI374579B (en) 2012-10-11
KR20080077087A (en) 2008-08-21
CN101313438B (en) 2010-12-08
JP2007141731A (en) 2007-06-07
CN101313438A (en) 2008-11-26
CA2628772A1 (en) 2007-05-24
EP1953870A1 (en) 2008-08-06
EP1953870A4 (en) 2012-07-11
JP4715464B2 (en) 2011-07-06

Similar Documents

Publication Publication Date Title
TW200709509A (en) Anisotropic conductive sheet and manufacturing method, connection method and inspection method of the same
ATE531100T1 (en) SINGLE CLAMP
WO2008126738A1 (en) Interposer
WO2007089599A3 (en) Led illumination assembly with compliant foil construction
WO2008070836A8 (en) Connector assembly with internal seals and manufacturing method
TW200513650A (en) Micro-electromechanical probe circuit film, method for making the same and applications thereof
WO2003075408A1 (en) Anisotropic conductive connector and its production method, and circuit device test instrument
MY166609A (en) Connector assembly and method of manufacture
TW200614285A (en) Magnetic element
TW200729250A (en) Multilayer electronic component and the manufacturing method thereof
WO2009031251A1 (en) Wiring substrate and method for manufacturing the same
TW200737550A (en) Semiconductor device and its manufacturing method, and display device and electronic appliance
DE502006001588D1 (en) Power semiconductor module with insulation layer and method for its production
TW200618233A (en) Connecting substrate, connecting structure, connection method and electronic apparatus
TW200616023A (en) Semiconductor device and method of manufacturing the same
TW200629998A (en) Printed circuit board and forming method thereof
EP1887629A3 (en) Display device and manufacturing method thereof
EP2003707A4 (en) Piezoelectric actuator
TW200733485A (en) Anisotropic conductive sheet, manufacturing method, connecting method, and examinating method
TW200644007A (en) Electronic component and electronic apparatus
WO2007096463A3 (en) Element
JP2005129274A5 (en)
EP1566831A3 (en) Semiconductor device and method for manufacturing it
TWI267173B (en) Circuit device and method for manufacturing thereof
TW200739428A (en) Method for interconnecting tracks present on opposite sides of a substrate

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees