TW200708894A - Photosensitive resin composition comprising organic and inorganic compounds - Google Patents

Photosensitive resin composition comprising organic and inorganic compounds

Info

Publication number
TW200708894A
TW200708894A TW095126177A TW95126177A TW200708894A TW 200708894 A TW200708894 A TW 200708894A TW 095126177 A TW095126177 A TW 095126177A TW 95126177 A TW95126177 A TW 95126177A TW 200708894 A TW200708894 A TW 200708894A
Authority
TW
Taiwan
Prior art keywords
film
resin
organic
compounds
resin composition
Prior art date
Application number
TW095126177A
Other languages
English (en)
Inventor
Joo-Pyo Yun
Byung-Uk Kim
Hyoc-Min Youn
Ki-Hyuk Koo
Tae-Hoon Yeo
Ui-Cheol Jeong
Dong-Myung Kim
Sang-Gak Choi
Ho-Jin Lee
Hong-Dae Shin
Dong-Hyuk Lee
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200708894A publication Critical patent/TW200708894A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0044—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists involving an interaction between the metallic and non-metallic component, e.g. photodope systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Liquid Crystal (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Optical Filters (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Formation Of Insulating Films (AREA)
TW095126177A 2005-07-19 2006-07-18 Photosensitive resin composition comprising organic and inorganic compounds TW200708894A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050065510A KR101221450B1 (ko) 2005-07-19 2005-07-19 유무기 복합 감광성 수지 조성물

Publications (1)

Publication Number Publication Date
TW200708894A true TW200708894A (en) 2007-03-01

Family

ID=37656735

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095126177A TW200708894A (en) 2005-07-19 2006-07-18 Photosensitive resin composition comprising organic and inorganic compounds

Country Status (4)

Country Link
JP (1) JP5194224B2 (zh)
KR (1) KR101221450B1 (zh)
CN (1) CN1900821B (zh)
TW (1) TW200708894A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI392909B (zh) * 2007-07-16 2013-04-11 Korea Electrotech Res Inst 有機-無機混成感光性樹脂組成物及含其硬化體的液晶顯示器

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101305528B1 (ko) * 2006-02-03 2013-09-05 주식회사 동진쎄미켐 유무기 복합 감광성 수지 조성물, 그 경화물을 갖는 액정표시장치, 그를 사용한 액정표시장치의 패턴형성방법
KR101482552B1 (ko) * 2008-04-30 2015-01-21 주식회사 동진쎄미켐 네가티브 감광성 수지 조성물
KR101316397B1 (ko) 2008-09-30 2013-10-10 코오롱인더스트리 주식회사 유기 절연막용 감광성 수지 조성물
WO2011030580A1 (ja) * 2009-09-10 2011-03-17 積水化学工業株式会社 感光性組成物及びプリント配線板
JP5540689B2 (ja) * 2009-12-18 2014-07-02 Ｊｓｒ株式会社 感放射線性組成物、硬化膜及びこの形成方法
CN103038705B (zh) * 2010-05-03 2016-04-20 巴斯夫欧洲公司 用于低温应用的滤色片
TW201213420A (en) * 2010-06-02 2012-04-01 Sumitomo Chemical Co Curable resin composition
JP4924776B2 (ja) * 2010-06-07 2012-04-25 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、画像表示装置の隔壁の形成方法、画像表示装置の製造方法及び画像表示装置
KR20120021488A (ko) * 2010-08-03 2012-03-09 주식회사 동진쎄미켐 네가티브 감광성 수지 조성물
KR20120118600A (ko) * 2011-04-19 2012-10-29 삼성디스플레이 주식회사 감광성 조성물 및 이를 이용한 표시장치용 기판의 제조 방법
JP5699096B2 (ja) * 2012-01-26 2015-04-08 東京応化工業株式会社 感光性組成物、パターンおよびパターンを有する表示装置
JP6171677B2 (ja) * 2013-07-26 2017-08-02 東洋インキＳｃホールディングス株式会社 光硬化性樹脂組成物
JP6255806B2 (ja) * 2013-09-04 2018-01-10 Jsr株式会社 ゲート絶縁膜、感放射線性樹脂組成物、硬化膜、ゲート絶縁膜の形成方法、半導体素子および表示装置
KR102142648B1 (ko) * 2013-12-16 2020-08-10 삼성디스플레이 주식회사 감광성 수지 조성물, 이를 이용한 유기막 형성방법 및 유기막을 포함하는 표시장치
JP6764636B2 (ja) * 2014-10-08 2020-10-07 東京応化工業株式会社 感放射線性樹脂組成物、パターン製造方法、透明絶縁膜、及び表示装置
JPWO2017169440A1 (ja) * 2016-03-28 2019-02-14 Jsr株式会社 感放射線性組成物及びパターン形成方法
CN107586387B (zh) * 2017-08-25 2021-01-26 无锡龙驰氟硅新材料有限公司 一种氟硅树脂用uv光引发剂化合物及其制备方法
CN110894367A (zh) * 2019-11-28 2020-03-20 江苏胜帆电子科技有限公司 一种高强度lcp复合材料的制备方法
CN117210141B (zh) * 2023-11-07 2024-01-26 明士(北京)新材料开发有限公司 一种耐显影的光敏胶膜及其制备与应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3870463B2 (ja) * 1996-12-11 2007-01-17 東レ株式会社 感光性グリーンシートおよびプラズマディスプレイの製造方法
JP4175591B2 (ja) 1999-11-26 2008-11-05 日本化薬株式会社 感光性樹脂組成物及びこれを用いた感光性フイルム
JP3962781B2 (ja) * 2000-06-12 2007-08-22 エルジー・ケミカル・カンパニー・リミテッド 機能性アルキルチオ基を含むトリアジン系化合物及び光重合開始剤（ｔｒｉａｚｉｎｅ−ｂａｓｅｄｃｏｍｐｏｕｎｄｃｏｍｐｒｉｓｉｎｇｆｕｎｃｔｉｏｎａｌｉｚｅｄａｌｋｙｌｔｈｉｏｇｒｏｕｐｓ、ａｎｄｐｈｏｔｐｏｌｙｍｅｒｉｚａｔｉｏｎｉｎｉｔｉａｔｏｒ）
KR100528950B1 (ko) 2001-01-29 2005-11-16 제이에스알 가부시끼가이샤 유전체용 복합 입자, 초미립자 복합 수지 입자, 유전체형성용 조성물 및 그의 용도
JP2003316000A (ja) * 2002-04-24 2003-11-06 Toray Ind Inc 感光性セラミックス組成物
KR100995451B1 (ko) 2003-07-03 2010-11-18 삼성전자주식회사 다층 구조의 게이트 절연막을 포함하는 유기 박막 트랜지스터
JP4292985B2 (ja) * 2003-12-25 2009-07-08 Ｊｓｒ株式会社 感放射線性組成物、マイクロレンズとその形成方法および液晶表示素子

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI392909B (zh) * 2007-07-16 2013-04-11 Korea Electrotech Res Inst 有機-無機混成感光性樹脂組成物及含其硬化體的液晶顯示器

Also Published As

Publication number Publication date
KR20070010712A (ko) 2007-01-24
KR101221450B1 (ko) 2013-01-11
JP2007025678A (ja) 2007-02-01
CN1900821B (zh) 2011-08-31
JP5194224B2 (ja) 2013-05-08
CN1900821A (zh) 2007-01-24

Similar Documents

Publication Publication Date Title
TW200708894A (en) Photosensitive resin composition comprising organic and inorganic compounds
KR102382380B1 (ko) 수지 필름, 적층 필름, 광학 부재, 표시 부재, 전면판 및 적층 필름의 제조방법
TW200613907A (en) Photosensitive resin composition
TW200741344A (en) Photosensitive composition comprising triazine-based photoactive compound containing oxime ester
CN106465508B (zh) 拒墨剂、负型感光性树脂组合物、分隔壁和光学元件
KR20180124013A (ko) 착색 수지 조성물, 컬러 필터 기판, 및 액정 표시 장치
KR20140097354A (ko) 터치패널용 전극의 보호막의 형성 방법, 감광성 수지 조성물, 감광성 엘리먼트, 터치패널의 제조 방법 및 터치패널용 전극의 보호막
KR20170104644A (ko) 수지 경화막 패턴의 형성 방법, 감광성 수지 조성물, 감광성 엘리먼트, 터치패널의 제조 방법 및 수지 경화막
TW200708895A (en) Negative photosensitive resin composition
KR20170026142A (ko) 감광성 조성물, 경화막의 제조 방법, 액정 표시 장치의 제조 방법, 유기 일렉트로루미네선스 표시 장치의 제조 방법, 및 터치패널의 제조 방법
CN103781821A (zh) 聚合物和含有该聚合物的组合物以及粘合剂用组合物
KR101953367B1 (ko) 광경화성 수지 조성물 및 이를 이용한 윈도우 부재의 제조 방법
CN105551582B (zh) 一种透明导电薄膜及具有该透明导电薄膜的触摸屏
TWI730037B (zh) 光硬化方法，及用於該光硬化方法之化合物和組成物
KR101864976B1 (ko) 시일재 및 그의 경화물
WO2005077032A3 (en) Uv radiation blocking protective layers compatible with thick film pastes
US9784965B2 (en) Display element, photosensitive composition and electrowetting display
CN107209410A (zh) 图像显示装置的制造方法、用于该方法的固化性树脂组合物、触控面板和图像显示装置
TW201529617A (zh) 熱硬化性樹脂組合物、其硬化膜、熱硬化型硬塗劑及顯示元件
TW201715298A (zh) 光硬化性樹脂組成物
JP6342645B2 (ja) 積層用樹脂組成物及びその用途
KR102577499B1 (ko) 감광성 조성물, 경화막의 제조 방법, 액정 표시 장치의 제조 방법, 유기 일렉트로 루미네선스 표시 장치의 제조 방법, 및 터치 패널의 제조 방법
WO2018021310A1 (ja) 走査アンテナ
CN109960110B (zh) 光固化性组合物以及由其形成的光固化膜
JP2015007687A (ja) カラーフィルター保護膜用熱硬化性樹脂組成物、及びその硬化膜を備えるカラーフィルター