TW200643639A - Coating and developing system and coating and developing method - Google Patents
Coating and developing system and coating and developing methodInfo
- Publication number
- TW200643639A TW200643639A TW095102330A TW95102330A TW200643639A TW 200643639 A TW200643639 A TW 200643639A TW 095102330 A TW095102330 A TW 095102330A TW 95102330 A TW95102330 A TW 95102330A TW 200643639 A TW200643639 A TW 200643639A
- Authority
- TW
- Taiwan
- Prior art keywords
- coating
- layer
- case
- antireflection
- developing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
- E06B3/70—Door leaves
- E06B3/7003—Door leaves consisting of several adjacent similar elements, e.g. planks, without outer covering panels
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
- E06B3/70—Door leaves
- E06B3/7001—Coverings therefor; Door leaves imitating traditional raised panel doors, e.g. engraved or embossed surfaces, with trim strips applied to the surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005014716 | 2005-01-21 | ||
JP2005294579A JP4955977B2 (ja) | 2005-01-21 | 2005-10-07 | 塗布、現像装置及びその方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200643639A true TW200643639A (en) | 2006-12-16 |
TWI367397B TWI367397B (zh) | 2012-07-01 |
Family
ID=35708755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095102330A TW200643639A (en) | 2005-01-21 | 2006-01-20 | Coating and developing system and coating and developing method |
Country Status (6)
Country | Link |
---|---|
US (1) | US7281869B2 (zh) |
EP (1) | EP1684333B1 (zh) |
JP (1) | JP4955977B2 (zh) |
KR (1) | KR101121794B1 (zh) |
SG (1) | SG124420A1 (zh) |
TW (1) | TW200643639A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117019567A (zh) * | 2023-10-10 | 2023-11-10 | 常州捷佳创智能装备有限公司 | 一种硅片上料涂覆机构、涂布平台、硅片涂布机 |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4955976B2 (ja) * | 2005-01-21 | 2012-06-20 | 東京エレクトロン株式会社 | 塗布、現像装置及びその方法 |
JP4459831B2 (ja) * | 2005-02-01 | 2010-04-28 | 東京エレクトロン株式会社 | 塗布、現像装置 |
JP4685584B2 (ja) * | 2005-03-11 | 2011-05-18 | 東京エレクトロン株式会社 | 塗布、現像装置 |
JP4566035B2 (ja) * | 2005-03-11 | 2010-10-20 | 東京エレクトロン株式会社 | 塗布、現像装置及びその方法 |
JP4514657B2 (ja) * | 2005-06-24 | 2010-07-28 | 株式会社Sokudo | 基板処理装置 |
JP4519037B2 (ja) * | 2005-08-31 | 2010-08-04 | 東京エレクトロン株式会社 | 加熱装置及び塗布、現像装置 |
JP4654120B2 (ja) * | 2005-12-08 | 2011-03-16 | 東京エレクトロン株式会社 | 塗布、現像装置及び塗布、現像方法並びにコンピュータプログラム |
JP4816217B2 (ja) * | 2006-04-14 | 2011-11-16 | 東京エレクトロン株式会社 | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
JP2008072016A (ja) | 2006-09-15 | 2008-03-27 | Tokyo Electron Ltd | 液処理装置、液処理方法及び記憶媒体 |
JP5132920B2 (ja) * | 2006-11-22 | 2013-01-30 | 東京エレクトロン株式会社 | 塗布・現像装置および基板搬送方法、ならびにコンピュータプログラム |
JP5149513B2 (ja) * | 2007-02-15 | 2013-02-20 | 株式会社Sokudo | 基板処理装置 |
JP2009004478A (ja) * | 2007-06-20 | 2009-01-08 | Toshiba Corp | パターン形成方法及び半導体装置の製造方法 |
JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Sokudo | 基板処理装置 |
JP5128918B2 (ja) | 2007-11-30 | 2013-01-23 | 株式会社Sokudo | 基板処理装置 |
JP5179170B2 (ja) | 2007-12-28 | 2013-04-10 | 株式会社Sokudo | 基板処理装置 |
JP5001828B2 (ja) | 2007-12-28 | 2012-08-15 | 株式会社Sokudo | 基板処理装置 |
JP2010118557A (ja) * | 2008-11-13 | 2010-05-27 | Canon Inc | 露光装置、基板処理装置、リソグラフィーシステムおよびデバイス製造方法 |
JP4760919B2 (ja) * | 2009-01-23 | 2011-08-31 | 東京エレクトロン株式会社 | 塗布、現像装置 |
JP2010177673A (ja) * | 2009-01-30 | 2010-08-12 | Semes Co Ltd | 基板処理設備及び基板処理方法 |
JP2010192623A (ja) * | 2009-02-17 | 2010-09-02 | Renesas Electronics Corp | 半導体装置の製造装置、その制御方法、及びその制御プログラム |
JP4973675B2 (ja) * | 2009-02-26 | 2012-07-11 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
JP5562759B2 (ja) * | 2009-11-04 | 2014-07-30 | 東京エレクトロン株式会社 | 基板処理装置 |
JP5490741B2 (ja) * | 2011-03-02 | 2014-05-14 | 東京エレクトロン株式会社 | 基板搬送装置の位置調整方法、及び基板処理装置 |
JP2014038929A (ja) * | 2012-08-15 | 2014-02-27 | Disco Abrasive Syst Ltd | インラインシステム |
JP5779168B2 (ja) * | 2012-12-04 | 2015-09-16 | 東京エレクトロン株式会社 | 周縁部塗布装置、周縁部塗布方法及び周縁部塗布用記録媒体 |
JP5664701B2 (ja) * | 2013-06-05 | 2015-02-04 | 東京エレクトロン株式会社 | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
JP5590201B2 (ja) * | 2013-08-13 | 2014-09-17 | 東京エレクトロン株式会社 | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
JP2013243406A (ja) * | 2013-08-13 | 2013-12-05 | Tokyo Electron Ltd | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
JP5644916B2 (ja) * | 2013-08-13 | 2014-12-24 | 東京エレクトロン株式会社 | 塗布、現像装置 |
JP5926752B2 (ja) * | 2014-02-20 | 2016-05-25 | 東京エレクトロン株式会社 | 半導体装置の製造方法及び半導体製造装置 |
JP6262634B2 (ja) * | 2014-10-31 | 2018-01-17 | 東京エレクトロン株式会社 | 基板処理装置 |
JP6426223B2 (ja) * | 2017-03-31 | 2018-11-21 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP7251673B2 (ja) * | 2017-06-16 | 2023-04-04 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
CN111650813B (zh) * | 2019-03-04 | 2024-04-16 | 东京毅力科创株式会社 | 基板处理装置、基板检查装置及方法、以及记录介质 |
JP7363591B2 (ja) * | 2020-03-05 | 2023-10-18 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3032999B2 (ja) * | 1992-11-09 | 2000-04-17 | 東京エレクトロン株式会社 | 処理装置 |
JP3445937B2 (ja) * | 1998-06-24 | 2003-09-16 | 東京エレクトロン株式会社 | 多段スピン型基板処理システム |
JP3416078B2 (ja) * | 1999-06-09 | 2003-06-16 | 東京エレクトロン株式会社 | 基板処理装置 |
US6402401B1 (en) * | 1999-10-19 | 2002-06-11 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
KR100348938B1 (ko) * | 1999-12-06 | 2002-08-14 | 한국디엔에스 주식회사 | 포토리소그라피 공정을 위한 반도체 제조장치 |
TW594835B (en) | 2000-05-09 | 2004-06-21 | Tokyo Electron Ltd | System for coating and developing |
JP3801849B2 (ja) | 2000-08-07 | 2006-07-26 | 東京エレクトロン株式会社 | 基板処理装置及びその方法 |
KR100811964B1 (ko) * | 2000-09-28 | 2008-03-10 | 동경 엘렉트론 주식회사 | 레지스트 패턴 형성장치 및 그 방법 |
JP2002198289A (ja) * | 2000-12-26 | 2002-07-12 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
JP3916468B2 (ja) * | 2002-01-11 | 2007-05-16 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
US6869234B2 (en) * | 2002-03-28 | 2005-03-22 | Dainippon Screen Mfg. Co., Ltd. | Developing apparatus and developing method |
JP2004015023A (ja) * | 2002-06-11 | 2004-01-15 | Dainippon Screen Mfg Co Ltd | 基板処理装置およびその方法 |
JP4298238B2 (ja) * | 2002-08-27 | 2009-07-15 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理システム |
KR100974141B1 (ko) * | 2002-11-28 | 2010-08-04 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 |
JP4087328B2 (ja) * | 2002-11-28 | 2008-05-21 | 東京エレクトロン株式会社 | 塗布、現像装置及び塗布、現像装置の運転方法 |
JP4170864B2 (ja) * | 2003-02-03 | 2008-10-22 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理装置における基板搬送方法および基板処理方法 |
TW200424767A (en) * | 2003-02-20 | 2004-11-16 | Tokyo Ohka Kogyo Co Ltd | Immersion exposure process-use resist protection film forming material, composite film, and resist pattern forming method |
JP4307132B2 (ja) * | 2003-04-16 | 2009-08-05 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US7070915B2 (en) * | 2003-08-29 | 2006-07-04 | Tokyo Electron Limited | Method and system for drying a substrate |
JP4129215B2 (ja) * | 2003-09-17 | 2008-08-06 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4079861B2 (ja) * | 2003-09-22 | 2008-04-23 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP3993549B2 (ja) * | 2003-09-30 | 2007-10-17 | 株式会社東芝 | レジストパターン形成方法 |
JP4401879B2 (ja) * | 2004-07-07 | 2010-01-20 | 東京エレクトロン株式会社 | 基板の回収方法及び基板処理装置 |
US7371022B2 (en) * | 2004-12-22 | 2008-05-13 | Sokudo Co., Ltd. | Developer endpoint detection in a track lithography system |
-
2005
- 2005-10-07 JP JP2005294579A patent/JP4955977B2/ja active Active
-
2006
- 2006-01-19 KR KR1020060005978A patent/KR101121794B1/ko active IP Right Grant
- 2006-01-20 TW TW095102330A patent/TW200643639A/zh unknown
- 2006-01-20 EP EP06001219A patent/EP1684333B1/en active Active
- 2006-01-20 SG SG200600834A patent/SG124420A1/en unknown
- 2006-01-20 US US11/335,635 patent/US7281869B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117019567A (zh) * | 2023-10-10 | 2023-11-10 | 常州捷佳创智能装备有限公司 | 一种硅片上料涂覆机构、涂布平台、硅片涂布机 |
Also Published As
Publication number | Publication date |
---|---|
US7281869B2 (en) | 2007-10-16 |
EP1684333B1 (en) | 2012-09-12 |
TWI367397B (zh) | 2012-07-01 |
EP1684333A2 (en) | 2006-07-26 |
JP2006229184A (ja) | 2006-08-31 |
KR101121794B1 (ko) | 2012-03-20 |
KR20060085190A (ko) | 2006-07-26 |
EP1684333A3 (en) | 2011-06-15 |
US20060165409A1 (en) | 2006-07-27 |
SG124420A1 (en) | 2006-08-30 |
JP4955977B2 (ja) | 2012-06-20 |
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