TW200510854A - Method for forming film, method for forming wiring pattern, method for manufacturing semiconductor device, electro-optical device, and electronic devic - Google Patents
Method for forming film, method for forming wiring pattern, method for manufacturing semiconductor device, electro-optical device, and electronic devicInfo
- Publication number
- TW200510854A TW200510854A TW093126768A TW93126768A TW200510854A TW 200510854 A TW200510854 A TW 200510854A TW 093126768 A TW093126768 A TW 093126768A TW 93126768 A TW93126768 A TW 93126768A TW 200510854 A TW200510854 A TW 200510854A
- Authority
- TW
- Taiwan
- Prior art keywords
- forming
- electro
- wiring pattern
- manufacturing semiconductor
- semiconductor device
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 230000003993 interaction Effects 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/14—Corona, ionisation, electrical discharge, plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
- B32B37/025—Transfer laminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electrodes Of Semiconductors (AREA)
- Electroluminescent Light Sources (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Thin Film Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003312770A JP2005085799A (ja) | 2003-09-04 | 2003-09-04 | 成膜方法、配線パターンの形成方法、半導体装置の製造方法、電気光学装置、及び電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200510854A true TW200510854A (en) | 2005-03-16 |
Family
ID=34413931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093126768A TW200510854A (en) | 2003-09-04 | 2004-09-03 | Method for forming film, method for forming wiring pattern, method for manufacturing semiconductor device, electro-optical device, and electronic devic |
Country Status (5)
Country | Link |
---|---|
US (1) | US7217334B2 (zh) |
JP (1) | JP2005085799A (zh) |
KR (1) | KR100613160B1 (zh) |
CN (1) | CN100429563C (zh) |
TW (1) | TW200510854A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI560303B (zh) * | 2012-02-01 | 2016-12-01 | Sumitomo Chemical Co |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006116584A2 (en) * | 2005-04-27 | 2006-11-02 | Dynamic Organic Light, Inc. | Light emitting polymer devices using self-assembled monolayer structures |
JP2006332592A (ja) | 2005-04-28 | 2006-12-07 | Ricoh Co Ltd | 電気部品、導電パターンの形成方法、およびインクジェットヘッド |
KR100645534B1 (ko) | 2005-08-12 | 2006-11-14 | 삼성에스디아이 주식회사 | 레이저 열전사용 마스크 및 그를 이용한 유기 전계 발광소자의 제조방법 |
US8268657B2 (en) | 2005-08-30 | 2012-09-18 | Samsung Mobile Display Co., Ltd. | Laser induced thermal imaging apparatus |
KR100700841B1 (ko) * | 2005-11-16 | 2007-03-28 | 삼성에스디아이 주식회사 | 레이저 열 전사 장치 및 이를 이용한 레이저 열 전사법 |
JP4615473B2 (ja) * | 2005-08-30 | 2011-01-19 | 三星モバイルディスプレイ株式會社 | レーザ熱転写装置及びこれを利用したレーザ熱転写法 |
KR100711878B1 (ko) | 2005-08-30 | 2007-04-25 | 삼성에스디아이 주식회사 | 레이저 열 전사 장치 및 레이저 열 전사 방법 |
JP2007062354A (ja) | 2005-08-30 | 2007-03-15 | Samsung Sdi Co Ltd | レーザ熱転写ドナーフィルム、レーザ熱転写装置、レーザ熱転写法及び有機発光素子の製造方法 |
US7817175B2 (en) | 2005-08-30 | 2010-10-19 | Samsung Mobile Display Co., Ltd. | Laser induced thermal imaging apparatus and fabricating method of organic light emitting diode using the same |
JP5008849B2 (ja) * | 2005-09-08 | 2012-08-22 | ソニーモバイルディスプレイ株式会社 | レーザ加工方法及び透明樹脂層を有する表示装置の製造方法 |
JP2007128845A (ja) | 2005-11-04 | 2007-05-24 | Samsung Sdi Co Ltd | レーザ熱転写装置及びレーザ熱転写方法 |
JP2007128844A (ja) | 2005-11-04 | 2007-05-24 | Samsung Sdi Co Ltd | レーザ熱転写装置及びレーザ熱転写方法そしてこれを利用した有機発光表示素子 |
KR100700836B1 (ko) * | 2005-11-16 | 2007-03-28 | 삼성에스디아이 주식회사 | 레이저 열 전사 장치 및 레이저 열 전사법 그리고 이를이용한 유기 발광소자의 제조방법 |
KR100700831B1 (ko) * | 2005-11-16 | 2007-03-28 | 삼성에스디아이 주식회사 | 레이저 열 전사법 및 이를 이용한 유기 발광소자의제조방법 |
JP4642684B2 (ja) * | 2005-11-16 | 2011-03-02 | 三星モバイルディスプレイ株式會社 | レーザ熱転写装置及びその装置を利用したレーザ熱転写法 |
JP4745038B2 (ja) * | 2005-11-30 | 2011-08-10 | 株式会社東芝 | 周縁部処理方法及び半導体装置の製造方法 |
JP2007286600A (ja) * | 2006-03-22 | 2007-11-01 | Nippon Denki Kagaku Co Ltd | 薄膜素子の転写方法、転写体、転写生成物、回路基板及び表示装置 |
KR100721959B1 (ko) * | 2006-05-15 | 2007-05-25 | 삼성에스디아이 주식회사 | 포토레지스트의 패턴형성방법 |
JP5264016B2 (ja) * | 2006-06-30 | 2013-08-14 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US7582403B2 (en) * | 2006-07-17 | 2009-09-01 | E. I. Du Pont De Nemours And Company | Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom |
JP5041903B2 (ja) * | 2006-07-28 | 2012-10-03 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
KR100800263B1 (ko) * | 2006-08-24 | 2008-02-04 | 제일모직주식회사 | 오프셋 인쇄용 전극 조성물 및 그에 의한 전극의 제조방법,이를 이용한 플라즈마 디스플레이 패널 |
JP5358879B2 (ja) * | 2006-11-30 | 2013-12-04 | ぺんてる株式会社 | 塗装物の製造方法 |
JP2008243840A (ja) * | 2007-03-23 | 2008-10-09 | Nippon Denki Kagaku Co Ltd | 薄膜素子の転写方法 |
JP5039249B2 (ja) * | 2007-04-02 | 2012-10-03 | 石原薬品株式会社 | 回路形成方法 |
KR101475467B1 (ko) * | 2007-06-28 | 2014-12-22 | 샌디스크 테크놀로지스, 인코포레이티드 | 재배선 층을 갖는 반도체 다이 |
KR20090017014A (ko) * | 2007-08-13 | 2009-02-18 | 삼성전자주식회사 | 가요성 표시 장치의 제조 방법 |
KR20090052656A (ko) * | 2007-11-21 | 2009-05-26 | 삼성전자주식회사 | 도너 기판 및 이를 이용한 표시 장치의 제조방법 |
US8182633B2 (en) * | 2008-04-29 | 2012-05-22 | Samsung Electronics Co., Ltd. | Method of fabricating a flexible display device |
CN102131950B (zh) * | 2008-06-19 | 2014-05-28 | 实用光有限公司 | 光感应图案 |
US8652872B2 (en) * | 2008-10-12 | 2014-02-18 | Utilight Ltd. | Solar cells and method of manufacturing thereof |
JP5196489B2 (ja) * | 2009-02-09 | 2013-05-15 | 日油株式会社 | 金属パターンを有する基板の製造方法、およびその基板 |
IT1394814B1 (it) * | 2009-07-13 | 2012-07-13 | St Microelectronics Srl | Trattamento superficiale di un substrato organico o inorganico per migliorare la stabilità di uno strato metallico depositato e definito litograficamente |
JP5330527B2 (ja) | 2009-09-29 | 2013-10-30 | 株式会社東芝 | 構造体 |
US8211782B2 (en) | 2009-10-23 | 2012-07-03 | Palo Alto Research Center Incorporated | Printed material constrained by well structures |
KR101207056B1 (ko) * | 2010-07-22 | 2012-11-30 | 주식회사 엘지화학 | 불소계 고분자 박막 및 이의 제조방법 |
JP5977532B2 (ja) * | 2012-02-20 | 2016-08-24 | 東京応化工業株式会社 | 支持体分離方法及び支持体分離装置 |
JP5685567B2 (ja) * | 2012-09-28 | 2015-03-18 | 株式会社東芝 | 表示装置の製造方法 |
US20140097003A1 (en) * | 2012-10-05 | 2014-04-10 | Tyco Electronics Amp Gmbh | Electrical components and methods and systems of manufacturing electrical components |
JP6221243B2 (ja) * | 2013-01-28 | 2017-11-01 | 凸版印刷株式会社 | 薄膜トランジスタアレイ及び画像表示装置 |
JP6357730B2 (ja) * | 2013-02-05 | 2018-07-18 | 株式会社リコー | 加熱方法、圧電膜及び圧電素子の製造方法 |
KR101508824B1 (ko) * | 2013-02-06 | 2015-04-07 | 경희대학교 산학협력단 | 전자빔을 이용한 유기물 패턴 형성 방법 |
KR101617534B1 (ko) * | 2013-08-01 | 2016-05-02 | 주식회사 엘지화학 | 3차원 구조의 금속 패턴 제조 방법 |
JP6346161B2 (ja) * | 2015-12-15 | 2018-06-20 | 株式会社東芝 | パターン形成方法 |
KR101877452B1 (ko) * | 2016-05-19 | 2018-08-09 | 한국기계연구원 | 도전 물질의 패터닝 장치 및 방법 |
CN106113895A (zh) * | 2016-07-28 | 2016-11-16 | 京东方科技集团股份有限公司 | 一种基板贴合方法、基板贴合装置、显示面板及制造方法 |
CN108075040A (zh) * | 2016-11-07 | 2018-05-25 | 中国科学院苏州纳米技术与纳米仿生研究所 | 柔性oled基材及其制备方法 |
KR20180057814A (ko) * | 2016-11-22 | 2018-05-31 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치에 포함되는 윈도우 부재의 제조 방법 |
CN106992116B (zh) * | 2017-04-20 | 2019-10-11 | 京东方科技集团股份有限公司 | 制造半导体器件的方法、阵列基板和显示装置 |
WO2018213210A1 (en) * | 2017-05-17 | 2018-11-22 | Corning Incorporated | Process for forming curved glass laminate article formed using separation material |
CN111092171B (zh) * | 2018-10-23 | 2022-08-16 | 宸鸿光电科技股份有限公司 | 有机发光二极管结构的形成方法 |
CN114261228B (zh) * | 2021-12-23 | 2022-07-15 | 湖南鼎一致远科技发展有限公司 | 一种热转印软标打印方法、图案接收碳带及辅助碳带 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2297691A (en) * | 1939-04-04 | 1942-10-06 | Chester F Carlson | Electrophotography |
US4411735A (en) * | 1982-05-06 | 1983-10-25 | National Semiconductor Corporation | Polymeric insulation layer etching process and composition |
DE3524196C3 (de) * | 1984-07-06 | 1994-08-04 | Canon Kk | Lithografiemaske |
US4942110A (en) * | 1988-08-29 | 1990-07-17 | Xerox Corporation | High resolution conductor patterning |
US5171650A (en) * | 1990-10-04 | 1992-12-15 | Graphics Technology International, Inc. | Ablation-transfer imaging/recording |
DK0455849T3 (da) * | 1990-05-08 | 1993-03-22 | Polytrend Ges Fuer Polymere We | Fremgangsmåde og apparat til påføring af en farvedekoration på et plastsubstrat samt et dekoreret plastsubstrat |
US5147397A (en) * | 1990-07-03 | 1992-09-15 | Allergan, Inc. | Intraocular lens and method for making same |
ES2159567T3 (es) | 1993-08-13 | 2001-10-16 | Pgi Graphics Imaging Llc | Transferencia por ablacion sobre receptores intermedios. |
US5685939A (en) * | 1995-03-10 | 1997-11-11 | Minnesota Mining And Manufacturing Company | Process for making a Z-axis adhesive and establishing electrical interconnection therewith |
KR100195175B1 (ko) * | 1996-12-23 | 1999-06-15 | 손욱 | 유기전자발광소자 유기박막용 도너필름, 이를 이용한 유기전자발광소자의 제조방법 및 그 방법에 따라 제조된 유기전자발광소자 |
DE60003281T2 (de) * | 1999-01-15 | 2004-05-06 | 3M Innovative Properties Co., Saint Paul | Thermisches Übertragungsverfahren. |
US6274508B1 (en) * | 1999-02-05 | 2001-08-14 | Alien Technology Corporation | Apparatuses and methods used in forming assemblies |
US6284391B1 (en) * | 1999-07-12 | 2001-09-04 | Corning Incorporated | Mercaptofunctional silanes to deposit sol-gel coatings on metals |
JP2001168061A (ja) * | 1999-09-27 | 2001-06-22 | Toshiba Corp | レーザ照射により半導体基板上に成膜を形成するためのターゲット及びその製造方法 |
TW476108B (en) * | 1999-09-27 | 2002-02-11 | Toshiba Corp | Target for providing film on semiconductor substrate using laser emission and method of making the same |
JP2001249342A (ja) | 2000-03-07 | 2001-09-14 | Sakae Tanaka | スペーサービーズの位置ぎめ方法と液晶表示装置 |
US6696363B2 (en) * | 2000-06-06 | 2004-02-24 | Ekc Technology, Inc. | Method of and apparatus for substrate pre-treatment |
US20030146019A1 (en) * | 2001-11-22 | 2003-08-07 | Hiroyuki Hirai | Board and ink used for forming conductive pattern, and method using thereof |
-
2003
- 2003-09-04 JP JP2003312770A patent/JP2005085799A/ja not_active Withdrawn
-
2004
- 2004-09-01 CN CNB2004100749365A patent/CN100429563C/zh active Active
- 2004-09-02 KR KR1020040069899A patent/KR100613160B1/ko not_active IP Right Cessation
- 2004-09-03 TW TW093126768A patent/TW200510854A/zh unknown
- 2004-09-03 US US10/933,438 patent/US7217334B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI560303B (zh) * | 2012-02-01 | 2016-12-01 | Sumitomo Chemical Co |
Also Published As
Publication number | Publication date |
---|---|
JP2005085799A (ja) | 2005-03-31 |
KR20050024261A (ko) | 2005-03-10 |
US7217334B2 (en) | 2007-05-15 |
CN1591108A (zh) | 2005-03-09 |
KR100613160B1 (ko) | 2006-08-17 |
US20050087289A1 (en) | 2005-04-28 |
CN100429563C (zh) | 2008-10-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200510854A (en) | Method for forming film, method for forming wiring pattern, method for manufacturing semiconductor device, electro-optical device, and electronic devic | |
DE69820662T2 (de) | Planarisierungsverfahren für halbleitende substrate | |
TW200605169A (en) | Circuit device and process for manufacture thereof | |
TWI261486B (en) | Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same | |
TW200618304A (en) | Thin film semiconductor device and method of manufacturing the same, electro-optical device, and electronic apparatus | |
TW200512857A (en) | Semiconductor device and method for fabricating the same | |
SG126711A1 (en) | Manufacturing method of semiconductor device | |
WO2003092041A3 (en) | Method for fabricating a soi substrate a high resistivity support substrate | |
EP1261021A3 (en) | Method of production of circuit board, semiconductor device, and plating system | |
TW200501199A (en) | Methods of forming semiconductor mesa structures including self-aligned contact layers and related devices | |
TW200644297A (en) | Semiconductor apparatus and manufacturing method thereof | |
TW200603705A (en) | Wiring board and method for producing the same | |
TW200725760A (en) | Thermally enhanced coreless thin substrate with an embedded chip and method for manufacturing the same | |
DE60235906D1 (de) | Erfahren | |
TW200601599A (en) | Semiconductor chip and circuit board, manufacturing method of same, and electronic equipment | |
TWI256719B (en) | Semiconductor device package module and manufacturing method thereof | |
DE60205358D1 (de) | Verfahren zum selektiven transferieren von halbleiter-chips von einem träger zu einem empfangssubstrat | |
TW200506555A (en) | Method for forming photoresist pattern, method for forming wiring pattern, method for making semiconductor devices, electro-optical device and electronic apparatus | |
EP1655777A4 (en) | METHOD AND DEVICE FOR IMPLEMENTING THE FOOTPRINT | |
TW200635013A (en) | Stacked semiconductor package | |
TW200420210A (en) | Method and device to form pattern, manufacturing method of device, conductive film wiring, electro-optic device, and electronic apparatus | |
TW200625476A (en) | Semiconductor device and manufacturing method thereof | |
MX2007003615A (es) | Circuito integrado y metodo de fabricacion. | |
TW200629432A (en) | Method of manufacturing a wiring substrate and an electronic instrument | |
FR2842943B1 (fr) | Procede de fabrication de film polymere conducteur anisotrope sur tranche de semi-conducteur |