200428510 玖、發明說明： 【發明所屬之技術領域】 本發明係關於藉由將處理液吐出在基板進行藥液處理之 基板處理裝置。進一步詳述，其係一供給處理液之技術。 【先前技術】 於基板之製造步驟，如塗布裝置或顯像裝置等，使用對 基板實行藥液處理之基板處理裝置。 例如’塗布裝置係藉由從噴嘴對基板吐出從液體槽等液 體供給機構供-給之抗姓液（處自液），而將抗钮液塗布在該基 1於塗布裝置，由於進行如此之處理，抗姓液附著在喷 嘴，其於其後之基板處理成為微粒子之原因。且，待機十 有，S内之抗姓液變質等問題。因此，有適當洗淨喷嘴或 -e内。卩之必要，例如，於特許文獻丨，揭示有具備洗 能之塗布裝置。 风 、於特許文獻1，揭示有—技術，其係將供給洗淨液陶 或鹼水等)之機構進-步裝設在塗布裝置之液體供給楨 構經由特定之配管將洗淨液從噴嘴吐出。即，揭示有一 技術，其係於塗布裝置不進行對基板之處理期間，從嗔嘴 2洗淨液，進行嘴嘴或配管内部之洗淨。㈣，於塗布 衣置進行-般之基板處理時，_洗淨液之流路，且於不 供給洗淨液到喷嘴之狀態下，將抗㈣供給到喷嘴。此外， :閉液體流路之手&，—般使用開閉閥或止回閥等開閉機 構0 [特許文獻1] 93017.doc 200428510 曰本特開200(M 5 03 45公報 述之開閉機構’係藉由將隔斷構件在打開位置和關 1二置之間私動而關閉液體流路之機構。目而，於關閉流 路^ I生介*隔斷構件而存在有2種液體之狀態（以下稱 :、、、接液狀L」）。於如此之接液狀態，根據隔斷構件之密 封效果(P同斷液體之機能之效果)之程度，而有必須與供給到 ㈣之液體混人之問題。尤其，於隔斷構件之 乂效果口為長年變化等而劣化時，或必須隔斷之液體黏 度較，而易產生毛細管現象時等，該混入現象較顯著。 、：由&、貞像液將基板顯像處理之情形為例，檢驗混入現 象之弊端°於顯像裝置’顯像液係從噴嘴以數L/min程度之 流量吐出。此日吝，戈! . ^ 右1 CC/mi11程度之洗淨液（純水）藉由接液 狀悲混入時，吐屮夕月s /各、+ 出之-像液之濃度變化變成〇 · 1〇/〇，而充分 地顯像不佳之原因。 本^明係鏗於上述問題而研發者，其目的在於於對基板 处 防止2種以上之液體混入所造成之處理精確度降 低。 【發明内容】 為了解决上述問題，申請專利範圍第】項之發明，係對基 板至少供給i種處理液之液體供給裝置，其具備：吐出手 段’其係將包含前述至少1種處理液之多數種液體吐出；供 、’’S手"k 係七、給别述多數種液體；供給流路，其係將前 ^多數種液體引導至前述吐出手段；多數之流路，其係將 月）述夕數種液體從月;j述供給手段引導至前述供給流路；連 93017.doc 200428510 接手段，其係將前述供給流路和前述錄流料接連通； 及排液手段’其係從前述多數流路中之至少]個流路將液體 排液。 且’申請專利範圍第1 2項之發明，係關於申請專利範圍第 !項發明之液體供給裝置，其係具備_前述多數流路之開 閉手段，前述排液手段係就前述至少丨個流路，於從前述開 閉手段到前述供給手段之間進行液體之排液。 且，申請專利範圍第3 4項之發明，係關於申請專利範圍第 2項發明之液體供給裝置，前述開閉手段係三通間。 且，申請專利範圍第4項之發明，係關於申請專利範圍第 2項發明之液體供給裝置，前述開閉手段係止回闕。 且，申請專利範圍第5項之發明，係關於申請專利範圍第 1項發明之㈣供給裝置，前述多數種《包含有純水，前 述排液手段係前述多數流路中，從使用於用於引導純水之 流路將液體排液。 且，申請專利範圍第6項之發明，係關於申請專利範圍第 1項發明之液體供給裝置，前述至少!種處理液含有顯像液。 且，申請專利範圍第7項之發明，係關於申請專利範圍第 1項發明之液體供給裝置’前述至少1種處理液含有抗敍液。 且’申請專利範圍第8項之發明，係關於申請專利範圍第 93017.doc 1 項發明之液體供給裝置，前述排液手段係裝設在比前述吐 2 出手段低之位置。 3 且，申請專利範圍第9項之發明，係對基板進行處理液之 4 藥液處理之液體供給裝置，其具備：保料段，其係保持 200428510 基板；及申請專利範圍第1至8項之任一項液體供給裝置， 其係對保持在前述保持手段之前述基板供給處理液。 【實施方式】 以下，參照附圖並詳細地說明關於本發明適當之實施型 態。 < 1 ·第1實施型態> 圖1係關於本發明之基板處理裝置1之概略圖。此外，於 圖1，為了圖示及說明之方便，以Z軸方向表示垂直方向， XY平面表示水平面者為定義，但該等係為了把握位置關係 而權宜上定義者，並非限定以下說明之各方向者。關於以 下之圖式夺相同。 基板處理裝置1係包含進行對基板處理裝置丨之基板9〇之 運出入之引導件10、11、運送基板9〇之運送機構2〇、液體 供給裝置30及控制裝置40。基板處理裝置丨係將用於製造液 晶顯示裝置之晝面面板之方形玻璃基板當作被處理基板 90，於將形成在基板9〇表面之電極層等選擇性地蝕刻之步 驟，將已進行曝光處理之基板90當作顯像之裝置而構成。 因而，於該實施型態，細縫喷嘴31係吐出顯像液當作處理 液。 然後，基板處理裝置1不僅液晶顯示裝置用之玻璃基板， 亦可藉由將顯像液吐出在各種基板當作進行顯像處理之裝 置而、交形利用。且，對基板90進行藥液處理之液體不限定 於顯像液者，例如，與顯像液同樣地，於藥液處理關於濃 度管理要求有高精確度之抗蝕液等亦可。於該情形，基板 93017.doc 200428510 处理衣置1係當作對基板9 〇塗布抗餘液之塗布裝置機能。 引V件1 0係從不圖示之裝置外之運送機構接受基板％， 於特定之位置保持特定之時間後，將基板90傳送到運送機 構20。且，引導件11係將從運送機構20運出之基板90交付 到不圖示之裝置外之運送機構。此外，引導件1〇、u係具 備用於I載FOUP卡匣等之裝載台，或於與運送機構2〇之間 進行基板90傳送之運送機械人等亦可。 運送機構20係具有於將基板9〇保持在特定位置之狀態， 從引導件10朝向引導件u運送之機能。詳細内容將後述， 但於基板處理裝置卜在運送機構2〇保持基板9〇之狀態，進 行對基板90之各種處理。 圖2係表示第1實施型態中之液體供給裝置30之結構之概 略圖。液體供給裝置30係具備細縫喷嘴3丨、喷嘴配管32、 一通閥3 3、藥液供給部3 4、藥液配管3 5、洗淨液供給部3 6、 洗 >尹液配管37及排液機構38，藉由將從藥液供給部34供給 之顯像液從細縫喷嘴3丨吐出，而將顯像液供給到保持在運 送機構20之基板9〇。詳細情形將後述，但藉此，基板處理 裝置1係當作實行對基板9〇之顯像處理之裝置機能。 細缝喷嘴3 1係以主要在γ軸方向延伸之直線形構件構 成，於相對於保持在運送機構2〇之基板9〇之位置，裝設用 於吐出液體之細缝（不圖示）。細縫喷嘴3丨安裝有噴嘴配管 32。細縫噴嘴31係將從藥液供給部34供給之顯像液從前述 細縫對基板90吐出。且，細縫噴嘴31係亦可吐出關於從洗 淨液供給部3 6供給之洗淨液。 93017.doc -10- 200428510 如圖2所示，於本實施型態中之細縫噴嘴”，沿著γ軸方 向之3處’連通連接有喷嘴配管32。藉此，由於在細縫喷嘴 3」從3處供給顯像液等液體，因此丫轴方向之吐出精確度均 ^化此夕卜，細縫喷嘴31之液體供給處之數並非限定於3處 ^通閥33係具有於喷嘴配管32連接藥液配管”及洗淨液 配管37之機能。即，三通閥33係主要相當於本發明中之連 接手&。且，對喷嘴配管32，具有將藥液配管Μ及洗淨液 配管37之任意—方選擇性地連通，且_另—方之機能， 亦相當於本發明中之開閉手段。 再者，三通閥33係連接在控制裝置4〇，對應從控制裝置 4〇傳來的控制信號決定開閉動作（流路選擇動作）。例如，藉 由控制裝置40選擇顯像液當作供給到細縫噴嘴3丨之液體 時，將藥液配管35連通連接到噴嘴配管32。藉此，關閉洗 淨液配管3 7。 藥液供給部34係具備藥液槽340、送液幫浦341及開閉閥 3 42。藥液槽340係具有儲存顯像液之儲存槽之機能，介設 送液幫浦341及開閉閥342連通連接在藥液配管35。藥液供 給部34係藉由使開閉閥342變成打開狀態，並驅動送液幫浦 341，而將儲存在藥液槽34〇之顯像液朝向三通閥33送出。 此時，若三通閥33變成連通噴嘴配管32和藥液配管35之狀 態’則將顯像液供給到細縫噴嘴31。即，藥液供給部34係 具有將顯像液供給到細縫噴嘴3 1之機能。 洗淨液供給部36係藉由打開開閉閥360，而藉由特定之厚 93017.doc -11 - 200428510 力將料液從不圖示之裝置外的洗淨液槽朝向三通闕33送 出。此時，若三通閥33為連通喷嘴配管32和洗淨液配管37 之狀態，則洗淨液係供給到細縫喷嘴31。即，洗淨液供給 部36係具有將洗淨液供給到細縫喷嘴3丨之機能。此外，由 於本實施型態中之基板處理裝置1係使用純水當作洗淨 液，因此採用從裝置外之洗淨液槽供給洗淨液之結構，但 供給洗乎液之機構並非限定於此者。例如，於洗淨液供給 部36裝設送液幫浦或洗淨液槽，如藉由該送液幫浦之驅動 力將洗淨液供給到細縫喷嘴31般地構成亦可。且，洗淨液 並非限定於純水者，選擇驗水等，進一步具有洗淨力之液 體亦可。 本實施型態中之基板處理裝置丨係藉由具備藥液供給部 34及洗淨液供給部36，而可將多數種液體（於本實施型態為 顯像液和洗淨液）供給到細縫喷嘴31。即，藥液供給部34及 洗淨液供給部36係主要相當於本發明中之供給手段。 排液機構38係如圖2所示，具備開閉閥38〇，其係配置在 比細缝喷嘴3 1之咼度位置低之位置，對應從控制裝置⑽傳 來之控制信號，藉由打開開閉閥38〇將洗淨液配管37内之液 體（主要為洗淨液）排液。 於基板處理裝置1，噴嘴配管32、藥液配管35及洗淨液配 官37係形成將液體引導至細縫喷嘴3丨之流路。喷嘴配管 係具有引導供給至細縫噴嘴3丨之液體之機能，且相當於本 &明中之供給流路。且，藥液配管3 5及洗淨液配管3 7係相 當於本發明中之多數流路。此外，於該等流路，適當裝設 93017.doc • 12 - 200428510 调整流量用之閥、除去微粒子用之㈣器及手㈣等亦可。 控制裝置40係具有一般性電腦機能之裝置，主要包含進 行計算處理之cpu及記憶f料之記憶部（任—項均不圖 :)二控制裝置40和基板處理裝置工之各構成係以信號之收 考“。為可能之狀態連接’根據前述cpu產生之控制信號， ^有控制各構成之機能。尤其，控制裝置係液體控制裝 〇選擇供給到細縫喷嘴31之液體（顯像液或洗淨液）且藉 由控制三通閥33，而關閉已選擇之液體以外之流路。藉由3 =此之控制，基板處理裝L係可從細縫噴仙吐出對應處 理之液體（已選擇之液體）。 广係本實施型態中之基板處理裝置i之結構之說明。接 Γ說明關於基板處理裝置1之動作。基板處理裝D中之 處理係大致區分為顯像處理和洗淨處理。此外，以下之其 板處理裝置1之動作係不特 土 J不止之下，對應從控制裝置40 專來之控制信號，藉由控制各結構而實現者。 說明關於洗淨處理之動作。於基板處理裝置!，如 :4因為進行顯像處理而在細縫喷嘴及喷嘴配管^内 殘留顯像液。該殘留之強 ”、、員像液由於長時變化而變質，因此 受成污染物而成為微粒子 ^ ^ 卞之原因，或於其後之處理成為在 颂像液浪度造成影像之原 ? u因而，基板處理裝置1係於實 订顯像處理前，實行為了 ”去主要夂邊在細縫噴管3 1及喷 麵配管32之顯像液之洗淨處理。 首先’於基板處理裝詈〗一， 34^ 〇/- ^ - ▲ 碣σ冼淨處理之前，藥液供給部 、H ’341交成停止狀態，並將開閉閥⑷變成關閉 93017.doc -13· 200428510 狀悲。藉此，停止對細缝噴嘴3丨之顯像液之供給。此外， 顯像液之停止供給處理實際上係與後述之顯像處理之結束 同牯地貝行。且，排液機構38將開閉閥38〇變成關閉狀態。 接著，控制装置40係由於於洗淨處理必須供給到細缝噴 嘴3 1之液體為洗淨液，因此對三通閥33，如連通連接噴嘴 配管32和洗淨液配管37般控制。對應該控制，三通閥^係 將喷嘴配管32和洗淨液配管37選擇性地連通連接，而關閉 藥液配管35。 接著，洗淨液供給部36係藉由將開閉閥36〇變成打開狀 態，而將洗淨液供給到細縫喷嘴3丨。將洗淨液供給到細縫 喷3 1日守，從細縫噴嘴3丨吐出洗淨液。此時，由於洗淨液 通過細縫喷嘴31及喷嘴配管32，因此將殘留在該等之内部 之顯像液等沖出，洗淨細縫噴嘴3丨及喷嘴配管32。 經過特疋之時間，且充分地進行細縫喷嘴3 1及喷嘴配管 32之洗淨和控制裝置40判斷時，控制裝置4〇如關閉洗淨液 供給部36之開閉閥360般，將控制信號輸出到洗淨液供給部 36。對應該控制信號，洗淨液供給部36係藉由將開閉閥36〇 變成關閉狀態，停止對細縫噴嘴3 1之洗淨液之供給，停止 從細缝噴嘴3 1之洗淨液之吐出。 接著，排液機構38係對應從控制裝置4〇傳來的控制信號 而將開閉閥380變成打開狀態。開閉閥38〇係裝設在比細縫 喷噶3 1低之位置。因而，開閉閥3 8〇變成打開狀態時，細縫 f嚿3 1、喷嘴配管3 2、三通閥3 3及洗淨液配管3 7内之洗淨 液’主要藉由重力之作用，朝向圖2以箭頭所示之方向流 93017.doc -14- 200428510 出即不須另外吸引機構等，洗淨液係藉由排液機構38 排液到袭置外。藉此，防止洗淨液殘留在洗淨液配管P 内洗淨液配管3 7變成大致空的狀態。 如本實施型態中之基板處理裝置丨，使用純水當作洗淨液 時，純水長時間滯留時，純水中產生細菌，且有變成微粒 子之原因之問題。但是，於基板處理裝置1，即使較長時間 如止I置時，亦由於藉由排液機構38防止純水之滯留，因 此可防止細菌之產生。 排液機構38之排液結束時，基板處理裝置1中之洗淨處理 結束，且基板處理裝置丨變成待機狀態。 接著，說明關於基板處理裝置丨中之顯像處理之動作。顯 像處理係於基板90之製造步驟，對基板90實行之液體之處 理之一步驟。具體而言，係為了將基板9〇上已曝光處理之 感光材料（抗蝕劑）顯像之處理。 顯像處理係於待機狀態之基板處理裝置1，藉由以裝置外 之運送1置將已曝光處理之基板90運入而開始。裝置外之 運送裝置係對引導件1〇進行基板9〇之運入。 引導件10係將運入之基板9〇保持在特定之位置，並進行 守周正後傳送到運送機構2〇。此時，引導件J 〇係藉由旋 轉基板90調整基板9〇之方向亦可。 運送機構20係將接受之基板9〇保持在大致水平方向，並 、' J ( X)方向。藉由不圖示之感應器，檢測出將基板9〇 運运到特定之位置時，由於在顯像處理必須供給到細縫喷 嘴31之液體為顯像液，因此控制裝置4〇係控制三通閥33將 93017.doc -15- 200428510 喷嘴配管32㈣液配管35連料接。藉此，三通㈣係將 嗔嘴配管32和藥液配管35性料通連接，而關閉洗淨 液配管37。 *接著，藥液供給部34係藉由打開開閉閥342，並驅動送液 幫浦34卜而將顯像液供給到細缝噴嘴31，對基板9〇開始從 細縫喷嘴31之顯像液之吐出。 此日守，藉由排液機構38使洗淨液配管37内 在有液體之狀態(空狀態)。因而，於本實施型態中之基= 理裝置卜顯像處理中於三通閥33,並無顯像液和洗淨液變 成接液狀態之情形。因而，關於對基板9〇吐出之顯像液防 止洗淨液之混人。藉此，由於可防止顯像液稀釋化等，而 可提高顯像液之濃度管理精確度，且防止顯像不良。 基板90係藉由運送機構2G朝向（+χ)方向運送，並接受從 細縫㈣31之顯像液之吐出。即，基板9〇係藉由細縫喷嘴 31沿著X軸方向掃描，進行基板9〇上之已曝光之感光材料之 顯像處理。 細缝喷嘴31之基板90之掃描結束時，藥液供給部％係將 開閉閥342變成關閉狀態，並停止送液幫浦34ι。藉此，停 止從藥液供給部34之顯像液之供給，而停止從細縫噴嘴31 之顯像液之吐出。 接著，控制裝置4G係控制三通閥33將喷嘴配管32和洗淨 液配管37連通連接。藉此，三通_係將噴嘴配管Μ和洗 料配㈣㈣性地連料接，顧藥液”35變成關閉 狀態。再者，排液機構38將開閉閥38〇變成打開狀態，經由 93017.doc -16- 200428510 先/爭液配官37將細縫噴嘴3 1及喷嘴配管32内之顯像液排 液。 藉此’顯像處理結束。然後，再度實行前述之洗淨處理， 進订細缝噴嘴31及噴嘴配管32内之洗淨。此外，洗淨處理 亚無每次進行顯像處理時進行之必要，例如，於反覆特定 -人數之顯像處理後，進行洗淨處理亦可。 妓士以上，本貫施型態中之基板處理裝置1係於對基板90 /、、$處理液别，排液機構3 8對處理液之流路藉由將變成接 液狀態之流路、(洗淨液配管37)内之液體預先排液，而可防止 液體接液到處理液。因❿，即使因為三通閥％長時變 化等:降低隔斷機能時，或當作洗淨液使狀液體之黏度 ^ 仍可如先别之裝置般，防止供給到細縫喷嘴3 1之 處理液混入其他之液體。 將绞邊在洗淨液配管37内之洗淨液 排液’可防止洗淨液配管37内之洗淨液之滯留。因而， t即使使賴水當作洗淨液，基域理裝置Η亭止較長時丨 才仍可防止產生成為微粒子原因之細菌。藉此，亦可； 南基板處理裝置1之處理精確度。 此外’為了防止顯像液和洗淨液變成接液狀態，於在乡 縫喷嘴31供給顯像液之狀g，洗淨〉夜之液面不接觸三㈣ 33即可。因而，排液機構％不須將洗淨液配管π内之洗、、, 液全部排液。但是’洗淨液為純水時等，為了防止咖 之滯留，如本實施型態中之基板處理裝置i，將洗淨液配售 37内之洗淨液全部排液般構成為較佳。 93017.doc -17- 200428510 <2.第2實施型態> 於第1實施型態，以三通閥33將噴嘴配管32、藥液配管Μ 及洗淨液f 3 7連通連接般構成，但連通連接該等配管之 結構，並非限定於三通閥33者。即，具有開閉流路之機能 之構件亦可。 圖3係表示根據如此之原理所構成的第2實施型態中之基 板處理裝置1之液體供給裝置3〇a之概略圖。液體供給裝置 3(^係具有第1實施型態中之液體供給裝置30之三通閥33替 換成結合部33a之結構。此外，由於液體供給裝置3〇a係結 合部33a以外之結構和液體供給裝置3〇相同，因此適當省略 圖示及說明。 說明具有如以上之結構之第2實施型態中之基板處理裝 置1之洗淨處理及顯像處理的動作。 首先，說明關於洗淨處理。於本實施型態中之基板處理 裂置1 ’在開始洗淨處理前，藉由藥液供給部3 4停止送液幫 浦341之驅動，將開閉閥342變成關閉狀態。且，排液機構 38係將開閉閥380變成關閉狀態。 接著，對應從控制裝置40傳來的控制信號，洗淨液供給 部3 6係將開閉閥3 6 0變成打開狀態。藉此，從裝置外之洗淨 液槽將洗淨液供給到洗淨液配管37，通過結合部33a及喷嘴 配管32，供給到細縫噴嘴3 1。藉此，從細縫喷嘴3 1吐出洗 淨液。 經過特定之時間，細缝喷嘴3 1及喷嘴配管32之洗淨結束 時，洗淨液供給部36係將開閉閥360變成關閉狀態。且，排 93017.doc -18- 200428510 液機構38藉由打開開閉閥谓，而將殘留在細縫喷_、喷 嘴配管32、結合部33a及洗淨液配管_之洗淨液排液。此 時’由於結合部3域内部構造等比三通㈣單純，因此脫 液良好，有效地防止顯像液之殘留。 _夜栈構3 8之洗淨液之排液結束時，排液機構μ將開閉 閥_變成關閉狀態。藉此，本實施型態中之基板處理裝置 之洗淨處理結束知，基板處理裝置j變成待機狀態。即， 於本實施型態中之基板處理裝置卜亦於待機中防止洗淨液 配管37内產生、純水之滞留。 、、接著’說明關於顯像處理。藉由運送機構肩基板9〇運 达到特定之位置時，控制裝置4G係選擇顯像液當作使用之 液體’且將控制信號輸㈣藥液供給部對應該控制信 號’藥液供給部3,始送液幫浦341之驅動並將開閉間342 變成打開狀態。 藉此，將顯像液供給到藥液配管35，從藥液配管％供給 到結合部33a之顯像液亦流入洗淨液配管37。但是，由於洗 淨液供給部36之開閉閥360及排液機構38之開閉閥38〇係關 閉狀態，因此顯像液之朝向洗淨液配管37之流入，係於一 疋虿停止，且以後從藥液配管35供給之顯像液係經由結合 部33a及喷嘴配官32供給到細縫噴嘴3丨。藉此，從細縫喷嘴 3 1開始顯像液之吐出。 此牯，由於洗淨液配管37内之顯像液係於開閉閥36〇，與 洗淨液成為接液狀態，因此洗淨液配管3 7内混入有洗淨 液。但是，由於洗淨液配管37和顯像液之流路係於空間上 93017.doc -19- 200428510 連接者，並不直接地成為顯像液之流路，因此洗淨液配管 37内之液體大致不流動。因而，於位於從結合部(顯像 液之貫質流路）較偏離之位置之開閉閥36〇，顯像液和洗淨 液變成接液狀態，即使稀釋一部分洗淨液配管37内之顯像 液，亦幾乎對顯像處理沒有影響。 細缝喷嘴3 1之基板90之掃描結束時，藥液供給部34係將 開閉閥3 42變成關閉狀態，並停止送液幫浦3 }。藉此，停 止從藥液供給部34之顯像液之供給，而停止從細縫噴嘴= 之顯像液之吐出。 接著，排液機構38係將開閉閥380變成打開狀態，將細縫 喷嘴31、喷嘴配管32、結合部33a及洗淨液配管37内之顯像 液排液，且結束顯像處理。 如以上，第2實施型態中之基板處理裝置丨，係藉由將產 生使用於對基板90之藥液處理之處理液和其他液體之接液 狀態之位置，如位於從該處理液之流路充分地偏離之位置 般構成，並裝設藉由接液狀態將稀釋之處理液適當排液之 排液機構38，而可控制從細缝喷嘴3丨吐出之處理液混入其 他液體。因而，本實施型態中之基板處理裝置1，由於可提 高對基板90供給之處理液之濃度管理精確度，因此可提高 對基板90之藥液處理之處理精確度。 <3β第3實施型態> 使用使液體僅通過一方向之一般性止回閥而實現當作開 閉液體流路之手段般構成亦可。 圖4係表示根據如此之原理所構成之第3實施型態中之基 93017.doc -20- 200428510 板處理裝置1之液體供給裝置30b之概略圖。液體供給裝置 30b係當作開閉藥液配管35及洗淨液配管37之機構，具備止 回閥39a、39b之點與上述實施型態相異。 止回閥3 9a係於驅動藥液供給部3 4之送液幫浦34丨時，使 顯像液從藥液配管35朝向噴嘴配管32通過。且，止回閥）％ 係具有防止液體（顯像液及洗淨液）從喷嘴配管32逆流到藥 液配管3 5之機能。 止回閥39b係於打開洗淨液供給部36之開閉閥36〇時，使 洗淨液從洗淨液配管37朝向噴嘴配管32通過。且，止回閥 39b係防止液體（顯像液及洗淨液）從喷嘴配管32逆流到洗淨 液配管37。 即，控制裝置40係藉由控制止回閥39a、39b之藥液配管 35及洗淨液配管37側之液體壓力之增減，而可控制止回閱 39a、39b之開閉。 說明關於具備如此之結構的第3實施型態中之基板處理 瓜置1之洗淨處理及顯像處理之動作。 首先，於開始洗淨處理前，藥液供給部34係將送液幫浦 341之驅動變成停止狀態，並將開閉閥342變成關閉狀態。 且’排液機構3 8係將開閉閥380變成關閉狀態。 接著’對應從控制裝置40傳來的控制信號，洗淨液供給 部36係將開閉閥360變成打開狀態。藉此，將洗淨液從裝置 外之洗淨液槽供給到洗淨液配管37，洗淨液配管37内之洗 淨液壓力上升。因而’止回閥39b變成打開狀態，洗淨液通 過止回閥39b及喷嘴配管32，供給到細缝喷嘴3 1，從細縫喷 93017.doc -21 - 200428510 嘴3 1吐出洗淨液。 經過特定之時間，細缝喷嘴31及喷嘴配管32之洗淨結束 時，洗淨液供給部36係將開閉閥36〇變成關閉狀態。且，排 液機構38係藉由打開開閉閥38〇，而將殘留在洗淨液配管37 内之洗淨液排液。此外，排液機構38係藉由將洗淨液配管 37内之洗淨液排液，雖然洗淨液配管37内之壓力降低，但 喷嘴配官32内之液體藉由止回閥39b而不逆流到洗淨液配 管37内。 根據以上，本實施型態中之基板處理裝置丨之洗淨處理結 束’且基板處理裝置1變成待機狀態。 接著，說明關於顯像處理。藉由運送機構2〇將基板9〇運 送到特定之位置時，選擇顯像液當作控制裝置仙使用之液 體，且將控制信號輸出到藥液供給部34。對應該控制信號， 樂液供給部34開始送液幫浦341之驅動，並將開閉閥342變 成打開狀態。 糟此，將顯像液供給到藥液配管35，由於藥液配管35内 之顯像液壓力增加，止回閥39a變成開放狀態。因而，顯像 液係通過止回閥39a及喷嘴配管32供給到細縫喷嘴31，從細 缝噴嘴3 1開始顯像液之吐出。 此時，由於洗淨液配管37内之洗淨液係藉由排液基構％ 預先排液，因此於止回閥39b，顯像液和洗淨液不變成接液 狀態。 如以上，於第3實施型態中之基板處理裝置i，藉由使用 止回閥3 9 a、3 9 b之液體供給裝置3 〇 b當作開閉液體流路之機 93017.doc -22- 200428510 構。可獲得與第）實施型態中之基板處理裝置丨相同之效果。 且，藉由使用止回閥39a、39b，控制裝置40不直接控制 亥等而以僅控制藥液供給部34及洗淨液供給部36，即可 進行所要之動作。因而，可簡化控制裝置4〇之控制。 此外為了防止顯像液或洗淨液殘留在細縫配管3 1及喷 嘴配管32内’將細縫喷嘴31之2軸方向之高度位置，配置成 比止回閥39a、39biZ軸方向之高度位置低為較佳。 <4·第4實施型態〉 ;第2只軛型恶中之液體供給裝置3 ，藥液配管％係以 大致水平狀態連通連接在結合部3 3 a。藉由如此之配置連接 喷嘴配管32和藥液配管35時，即使藉由㈣機構％進行排 液，仍有藥液配管35内顯像液殘留之虞。 如第1貝鉍型恶中之三通閥33，於流路連接機構組入流路 開閉機構時’洗淨處理中可關閉藥液配管Μ。目而，較少 有藥液配管35内顯像液之殘留成為問題。其係洗淨處理並 非對基板90進行之處理，不要求很高的精確度，和洗淨處 理中從細缝噴嘴3丨+ ψ 心 、出之冼淨液，於三通閥33藉由和顯像 液變成接液狀態而混入顯像液，但若是該程度之混入則洗 >尹液之洗淨力不會顯著喪失所致。 t疋^ 2貝^型態中之結合部33a係洗淨處理中無法關 閉藥液配& 35。因而，藥液配管35内殘留顯像液時，第2實 :型態中之基板處理裝比第丄實施型態中之基板處理 衣置1力洗淨處理中之洗淨液混入較多顯像液。即，藉 此於洗淨液之洗淨效果降低時，開始洗淨處理前，儘可月; 93017.doc -23· 200428510 減少殘留在藥液配管35内之顯像液較佳。 圖5係表示根據如此之原理所構成之第4實施型態中之基 板處理裝置丨之液體供給裝置30〇之概略圖。於液體供給^ 置3〇c，依照如圖5所示之傾斜將藥液配管”連接在結合部 33a。即，藥液配管35係朝向結合部33&傾斜到下方並連接。 藉此，排液機構38打開開閉閥380進行洗淨液配管37内之 排液時，藥液配管35内之液體亦順利地排液，殘留在藥液 配管35内之液體量減少。此外，除此以外之液體供給裝置 3 0c之結構、動作，由於和第2實施型態中之液體供給裝置 3 0a相同，因此省略說明。 如以上，即使使用如第4實施型態中之基板處理裝置 結構’仍可獲得和第2實施型態相同之效果。 且，於液體供給裝置30c，藥液配管35係藉由朝向結合部 33a傾斜到下方，並連接在結合部33a之結構，而提高從藥 液配官35之脫液。因而，由於殘留在藥液配管35内之液體 量減少，例如，可減少混入在洗淨處理中之洗淨液之顯像 液之量。 < 5·第5實施型態> 已說明關於上述實施型態中之基板處理裝置1，使用1種 液體（顯像液）當作對基板9 〇進行處理之處理液的情形，但處 理液並非限定於1種者，2種以上亦可。 圖ό係表示根據如此之原理所構成之第5實施型態中之基 板處理裝置1之液體供給裝置30d之概略圖。 液體供給裝置30d係如圖6所示，具備3個藥液供給部 93017.doc -24- 200428510 34a 34b、34e ’各連通連接在結合部现。各藥液供給部 34a，b、係各具有和上述實施型態中之藥液供給部μ 相同之結構，在各藥液槽34〇儲存互相相異之處理液。 結合部33b係可連通連接多數之藥液配㈣以外，呈有和 結合部33a相同之機能、結構之構件。此外，於本實施型離， 如圖6所示，各藥液配管35係沿著2軸方向安裝在社人 33b ’例如，安裝在環繞結合部33b周圍之位置亦可。。° 控制裝置4〇係基板處理裝置1配合實行之處理，選擇從細 縫喷嘴31吐出之處理液，且從藥液供給部^、糾、％中， 特定儲存選擇之處理液者，供給到細縫噴嘴31。此外，於 替換使用之處理液時，藉由排液機構38進行細縫噴嘴31、 嘴嘴配管32及結合部33b内之液體之排液。再者，洗淨液供 給部36係供給洗淨液，進行洗淨處理亦可。 如以上，於第5實施型態中之基板處理裝置i，亦可獲得 和上述實施型態相同之效果。 且，液體供給裝置30d係藉由具備多數之藥液供給 34&、34b、34C，而可增加藉由基板處理裝置〖實行之^理 多樣化。 <6.變形例> 以上已說明關於本發明之實施型態，但本發明並非限定 於上述實施型態者，可做各種變形。 例如，基板處理裝置丨不須對運入之基板9〇經常進行顯像 处、即基板處理叙置1係於組入進行多重曝光步驟之線 時等，於反覆多數次曝光處理間，使基板9〇通過基板處理 93017.doc -25 - 200428510 ^置1上亦可。上述實施型態中之基板處理褒置！係由於藉 由洗乎處理除去附著在細縫喷嘴31之顯像液，因此不如此 地進行顯像處理而對通過基板處理m之基㈣，不會從 細縫喷嘴3!掉落顯像液，可防止處理不良。 …且’於上述實施型態’排液機構38係僅從洗淨液配管η ’夜仁關於藥液配官3 5 ,仍裝設與排液機構3 8相同 之機構而進行排液般構成亦可。 於上述只％型悲，排液機構38不裝設吸引機構，而 進行排液’但另外裳設吸引機構，吸引洗淨液配管37内之 液體並排液般構成亦可。 一且’ P汗1閉流路之機構’或裝設該機構之位置等，並非限 疋於上述Λ靶型態所示者。例如，將第3實施型態中之液體 供給裝置30b之止回閥39a、39bt換成開閉閥而藉由控制裝 置40控制該開閉閥亦可。 且，於第2、第4、第5實施型態中之液體供給裝置30a、 3〇c、3 0d，顯像液和洗淨液之接液狀態係以不產生在接近 於顯像液之流路之位置般構成。但是，在洗淨液配管37之 結合部33a(33b)側裝設開閉閥之結構亦可。圖7係根據如此 之原理所構成之變形例中之液體供給裝置3〇e之示意圖。液 體供給裝置30e係於第2實施型態中之液體供給裝置3〇&具 有追加開閉閥33 c之結構。該變形例中之排液機構38係於關 閉開閉閥33c之狀態，進行洗淨液配管37内之液體之排液。 藉此’即使使用構造單純之結合部33a、33b連通連接藥液 配ί 3 5和洗淨液配管3 7時，仍可防止顯像液和洗淨液之接 93017.doc -26- 200428510 液狀態。此外，關於圖5所示之第4實施型態中之液體供給 裝置30c，及圖6所示之第5實施型態中之液體供給裝置3叫 亦相同。 於申請專利範圍第1至8項之發明，藉由具備排液手段， 其係從多數流路中之至少丨個流路將液體排液，而可控制從 吐出手段吐出之液體混入其他液體。 於申請專利範圍第2項之發明，排液手段係就至少丨個流 路，藉心_手段到供給手段之間進行液體之排液，^ 可防止處理液和其他液體之接液狀態，因此可防止從吐出 手段吐出之處理液混入其他液體。 於申請專利範圍第4項之發明，藉由開閉手段為止回閥， 可簡化控制。 ;I销專利範圍第5項之發明’排液手段係於多數流承 中’精由從使用用於引導純水之流路將液體排液，而藉d 防止純水之滯留，可防止微粒子原因之細菌之產生。曰 於申請專利範圍第6項之發明，藉由於至少傻處理液2 有顯像液，可提高供給之顯像液之濃度管理精確度，而^ 成顯像處理精確度之提高。 於申請專利範圍第7項之發明，藉由至少】種處理液含$ ::液，可提高供給之抗姓液之濃度管理精確度，而達力 塗布處理精確度之提高。 於申請專利範圍第8項之發明，排液手段係藉由裝設在^ 吐出手段低之位置，而不裝設吸引機構等，即可排液。 於申請專利範圍第9項之發明，藉由具備申請專利範圍〗 93017.doc -27- 200428510 1至8項之任—項液體供給裝置，而藉由提高供給到基板之 處理液之濃度管理精確度，可達成藥液處理精_度之提高。 【圖式簡單說明】 圖1係關於本發明之基板處理裝置之概略俯視圖。 圖2係表示P實施型態中之基板處理裝置之液體供給裝 置之概略圖。 t 圖3係表示第2實施型態中之基板處理裂置之液體供給裝 置之概略圖。 t 圖4係表示第3實施型態中之基板處理裳置之液體供 置之概略圖。 ^ 圖5係表不第4實施型態中之其紅老 之基板處理裝置之液體供給雙 置之概略圖。 圖6係表示第5實施型態中之基柘卢 扳處理裝置之液體供給裝 置之概略圖。 圖7係表示變形例中之基板處 之 汉免理I置之液體供給裝置 概略圖。 【圖式代表符號說明】 1 10、11 20 30、30a、30b、 3〇c、30d、30e 31 32 基板處理裝置 引導件 運送機構（保持手段） 液體供給裝置 細σ背 噴嘴配管 93017.doc -28- 200428510 33 三通閥 33a 、33b 結合部 33c 開閉閥 34、 34a 、 34b 、 34c 藥液供給部 35 藥液配管 36 洗淨液供給部 37 洗淨液配管 38 排液機構 39a 、3 9b 止回閥 40 控制裝置 90 基板 340 藥液槽 341 送液幫浦 342 、360 、 380 開閉閥 93017.doc -29-200428510 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a substrate processing apparatus for processing a chemical solution by discharging a processing solution onto a substrate. To further elaborate, it is a technology for supplying a treatment liquid. [Prior art] In the manufacturing steps of the substrate, such as a coating device or a developing device, a substrate processing device that performs chemical liquid processing on the substrate is used. For example, the “coating device” is to spray the anti-button liquid from the liquid supply mechanism such as a liquid tank to the substrate from the nozzle, and apply the anti-button liquid to the coating device. In the processing, the anti-liquid adheres to the nozzle, and the subsequent substrate processing becomes the cause of the particles. In addition, there are many problems in standby, such as the deterioration of anti-surname fluid in S. Therefore, there are proper cleaning nozzles or -e inside. For example, in Patent Document 丨, a coating device having washing power is disclosed. Wind, in Patent Document 1, it is disclosed that there is a technology that further advances a mechanism for supplying a cleaning liquid (ceramics, alkaline water, etc.) to a liquid supply structure installed in a coating device, and sends the cleaning liquid from a nozzle through a specific pipe. Spit it out. That is, a technique is disclosed in which the cleaning liquid is removed from the nozzle 2 while the substrate is not being processed by the coating device, and the inside of the nozzle or the pipe is cleaned. Alas, when the substrate is treated in the same manner as the conventional substrate processing, the cleaning liquid flow path, and the anti-aqueous solution is supplied to the nozzle without supplying the cleaning liquid to the nozzle. In addition, the hand that closes the liquid flow path & generally uses an opening and closing mechanism such as an on-off valve or a check valve. 0 [Patent Document 1] 93017.doc 200428510 The opening and closing mechanism described in JP 200 (M 5 03 45) It is a mechanism that closes the liquid flow path by privately moving the partition member between the open position and the closed position. For the purpose of closing the flow path ^ I 生 介 * partition member, there are two types of liquid (below Weighing: ",", "wet liquid state L"). In such a wet state, depending on the degree of the sealing effect of the partition member (the effect of the function of shutting off the liquid), it must be mixed with the liquid supplied to the puppet. Problem. Especially, when the effect of the barrier member is degraded due to long-term changes, etc., or the viscosity of the liquid that must be partitioned is relatively high, and the capillary phenomenon is prone to occur, the mixing phenomenon is more significant. Take the case of substrate development processing as an example to check the disadvantages of the mixing phenomenon. ° In the imaging device, the imaging liquid is ejected from the nozzle at a flow rate of several L / min. This day, Ge!! ^ Right 1 CC / mi11 When the degree of cleaning solution (pure water) is mixed into the wet state, spit The change in the concentration of the -image solution of 屮 / 月, +, and 变成 is changed to 0.1 · 0 / 〇, and the cause of poor imaging is fully developed. The purpose of this research is to solve the above problems and the developer, whose purpose is to The processing accuracy of the substrate is prevented from being lowered due to the mixing of two or more liquids. [Summary of the Invention] In order to solve the above-mentioned problem, the invention of the scope of application for a patent] is a liquid supply device that supplies at least i types of processing liquid to a substrate. Equipped with: "discharging means", which is to spit out most liquids containing at least one of the aforementioned treatment liquids; supply, "S hand", "k", seven, to other kinds of liquids; supply flow path, which This kind of liquid is guided to the above-mentioned spitting means; most of the flow paths are for the month) and several kinds of liquids are from the month; the above-mentioned supply means are guided to the above-mentioned supply flow path; The flow path is in communication with the aforementioned recording material; and the liquid discharging means is used to discharge liquid from at least one of the plurality of flow paths. And the invention of item 12 in the scope of patent application is a liquid supply device for the invention in the scope of patent application! It is provided with the opening and closing means of most of the aforementioned flow paths, and the above-mentioned drainage means is based on at least one of the aforementioned flow paths. Discharging liquid between the opening and closing means and the supplying means. In addition, the invention in the 34th scope of the patent application relates to the liquid supply device for the second invention in the scope of the patent application, and the aforementioned means for opening and closing are three-way. In addition, the invention of the fourth scope of the patent application relates to the liquid supply device of the second scope of the patent application, and the aforementioned opening and closing means are non-returning. In addition, the invention in the fifth scope of the patent application relates to the ㈣ supply device for the first invention in the scope of the patent application. Most of the above-mentioned "contains pure water, and the above-mentioned drainage means are in most of the above-mentioned flow paths. Guide the flow path of pure water to drain liquid. In addition, the invention in the sixth scope of the patent application relates to the liquid supply device for the first invention in the scope of the patent application. At least one of the aforementioned treatment liquids contains a developing solution. In addition, the invention in the seventh scope of the patent application relates to the liquid supply device of the first invention in the scope of the patent application. In addition, the invention of the eighth aspect of the patent application is a liquid supply device for the first invention of the first ninety-three patent application scope. The above-mentioned drainage means is installed at a position lower than the above-mentioned two ejection means. 3 And, the invention of item 9 in the scope of patent application is a liquid supply device for treating liquids on the substrate. 4 The liquid supply device for chemical liquid treatment includes: a holding section, which holds the 200428510 substrate; and items 1 to 8 in the scope of patent application. In any one of the liquid supply devices, the processing liquid is supplied to the substrate held by the holding means. [Embodiments] Hereinafter, suitable embodiments of the present invention will be described in detail with reference to the drawings. < 1. First Embodiment > Fig. 1 is a schematic view of a substrate processing apparatus 1 according to the present invention. In addition, in FIG. 1, for the convenience of illustration and explanation, the Z-axis direction represents the vertical direction and the XY plane represents the horizontal plane. However, these are defined for the sake of grasping the positional relationship and are not limited to the following descriptions. Direction. The same applies to the following diagrams. The substrate processing apparatus 1 includes guides 10 and 11 for carrying in and out of the substrate 90 of the substrate processing apparatus 丨, a transport mechanism 20 for transporting the substrate 90, a liquid supply apparatus 30, and a control apparatus 40. The substrate processing device 丨 is a step in which a square glass substrate used for manufacturing a daytime panel of a liquid crystal display device is regarded as a substrate 90 to be processed, and an electrode layer formed on the surface of the substrate 90 is selectively etched to expose the substrate. The processed substrate 90 is configured as a developing device. Therefore, in this embodiment, the slit nozzle 31 ejects the developing liquid as the processing liquid. Then, the substrate processing apparatus 1 can be used not only as a glass substrate for a liquid crystal display device, but also as a device for performing development processing by ejecting a developing solution onto various substrates. In addition, the liquid to be used for the chemical solution treatment of the substrate 90 is not limited to a developer solution. For example, as with the developer solution, a resist solution or the like that requires high accuracy in the concentration management of the chemical solution may be used. In this case, the substrate 93017.doc 200428510 treatment set 1 functions as a coating device for coating the substrate 90 with an anti-residue solution. The V-guide 10 receives the substrate% from a transport mechanism outside the device (not shown), and after holding it at a specific position for a specific time, the substrate 90 is transferred to the transport mechanism 20. In addition, the guide 11 is a substrate 90 delivered from the conveyance mechanism 20 to a conveyance mechanism outside the apparatus (not shown). In addition, the guides 10 and u may be provided with a loading table for a FOUP cassette or the like, or a transport robot that transfers the substrate 90 to and from the transport mechanism 20. The transport mechanism 20 has a function of transporting the substrate 90 from the guide 10 toward the guide u while holding the substrate 90 at a specific position. The details will be described later, but in the substrate processing apparatus, the substrate 90 is held in the transport mechanism 20 to perform various processes on the substrate 90. Fig. 2 is a schematic diagram showing the structure of the liquid supply device 30 in the first embodiment. The liquid supply device 30 includes a slit nozzle 3 丨, a nozzle pipe 32, a one-way valve 3 3, a chemical liquid supply section 3 4, a chemical liquid pipe 3 5, a cleaning liquid supply section 36, a washing > Yin liquid pipe 37 and The liquid discharging mechanism 38 supplies the developing liquid to the substrate 90 held in the transporting mechanism 20 by ejecting the developing liquid supplied from the chemical liquid supply unit 34 from the slit nozzle 3 丨. The details will be described later, but by this means, the substrate processing apparatus 1 functions as a device for performing development processing on the substrate 90. The slit nozzle 31 is formed by a linear member extending mainly in the γ-axis direction. A slit (not shown) for ejecting liquid is installed at a position corresponding to the substrate 90 held by the transport mechanism 20. A nozzle pipe 32 is attached to the narrow nozzle 3 丨. The slit nozzle 31 discharges the developing liquid supplied from the chemical liquid supply unit 34 from the slit to the substrate 90. In addition, the slit nozzle 31 can discharge the cleaning liquid supplied from the cleaning liquid supply unit 36. 93017.doc -10- 200428510 As shown in FIG. 2, in the present embodiment, the “slit nozzle” is connected to the nozzle pipe 32 in three places along the γ-axis direction. As a result, the nozzle 3 ”Liquids such as developing liquid are supplied from 3 places, so the discharge accuracy in the Y-axis direction is equalized. The number of liquid supply places of the fine slit nozzle 31 is not limited to 3 places. The on-off valve 33 is provided in the nozzle piping. The function of 32 connecting the chemical liquid pipe "and the cleaning liquid pipe 37. That is, the three-way valve 33 mainly corresponds to the connecting hand & in the present invention. Furthermore, the nozzle pipe 32 includes a chemical liquid pipe M and a cleaning solution. Any one of the liquid pipes 37 is selectively connected, and the function of the other is equivalent to the opening and closing means in the present invention. Moreover, the three-way valve 33 is connected to the control device 40, corresponding to the slave control device 4. 〇 The control signal transmitted determines the opening and closing operation (flow path selection operation). For example, when the developing device is selected as the liquid to be supplied to the slit nozzle 3 by the control device 40, the chemical liquid pipe 35 is connected to the nozzle pipe 32. With this, the cleaning liquid piping 3 7 is closed. The liquid medicine tank 340, the liquid delivery pump 341, and the on-off valve 3 42 are provided. The liquid medicine tank 340 has the function of a storage tank for storing imaging liquid, and the liquid delivery pump 341 and the on-off valve 342 are connected to the liquid medicine pipeline. 35. The medicinal solution supply unit 34 sends the developing solution stored in the medicinal solution tank 34 to the three-way valve 33 by turning the on-off valve 342 into an open state and driving the liquid feeding pump 341. At this time, if The three-way valve 33 is in a state where the nozzle pipe 32 and the chemical liquid pipe 35 are communicated with each other. Then, the developing liquid is supplied to the fine slit nozzle 31. That is, the chemical liquid supply unit 34 has a function of supplying the developing liquid to the fine slit nozzle 31. The cleaning liquid supply unit 36 opens and closes the on-off valve 360, and forces the material liquid from the cleaning liquid tank outside the device (not shown) toward the tee 33 by a specific thickness 93017.doc -11-200428510. At this time, if the three-way valve 33 communicates with the nozzle pipe 32 and the washing liquid pipe 37, the washing liquid is supplied to the slit nozzle 31. That is, the washing liquid supply unit 36 includes a washing liquid The function of supplying to the slit nozzle 3 丨 In addition, since the substrate processing apparatus 1 in this embodiment uses pure water As the cleaning liquid, a structure for supplying the cleaning liquid from a cleaning liquid tank outside the device is adopted, but the mechanism for supplying the cleaning liquid is not limited to this. For example, a liquid feeding pump is installed in the cleaning liquid supply section 36 Or, the cleaning liquid tank may be constituted such that the cleaning liquid is supplied to the fine slit nozzle 31 by the driving force of the liquid sending pump. The cleaning liquid is not limited to pure water. It is also possible to have a liquid with further detergency. The substrate processing apparatus in this embodiment is provided with a chemical liquid supply section 34 and a cleaning liquid supply section 36, and can be used for a large number of liquids (in this embodiment: The developing liquid and the cleaning liquid) are supplied to the slit nozzle 31. That is, the chemical liquid supply section 34 and the cleaning liquid supply section 36 mainly correspond to the supply means in the present invention. As shown in FIG. 2, the liquid discharge mechanism 38 is provided with an on-off valve 38 °, which is disposed at a position lower than the position of the narrow nozzle 31, and responds to a control signal transmitted from the control device by opening and closing. The valve 38o drains the liquid (mainly the washing liquid) in the washing liquid pipe 37. In the substrate processing apparatus 1, the nozzle piping 32, the chemical liquid piping 35, and the cleaning liquid piping 37 form a flow path for guiding the liquid to the slit nozzle 3 丨. The nozzle piping has a function of guiding the liquid supplied to the slit nozzle 3, and corresponds to the supply flow path of this & Ming. The chemical solution piping 35 and the cleaning solution piping 37 are equivalent to most flow paths in the present invention. In addition, in these flow paths, 93017.doc • 12-200428510 can be installed appropriately to adjust the flow rate of the valve, to remove the particles of the device and the hand, etc. The control device 40 is a device with a general computer function, and mainly includes a CPU for performing calculation processing and a memory section for storing data (any item is not shown in the figure). The two components of the control device 40 and the substrate processing device are signaled. "Received". It is connected in a possible state 'according to the control signal generated by the aforementioned cpu, and has the function of controlling each component. In particular, the control device is a liquid control device. The liquid (development liquid or imaging liquid) supplied to the slit nozzle 31 is selected. Cleaning liquid) and closed the flow path other than the selected liquid by controlling the three-way valve 33. By 3 = this control, the substrate processing device L can spit out the corresponding processed liquid from the fine slit (already The selected liquid). This is a description of the structure of the substrate processing apparatus i in this embodiment. Then, the operation of the substrate processing apparatus 1 will be described. The processing in the substrate processing apparatus D is roughly divided into development processing and cleaning. In addition, the following operation of the plate processing device 1 is not limited to the specific J, and it is realized by controlling the respective structures in response to the control signals exclusively from the control device 40. The cleaning processing will be explained. In the substrate processing device !, such as: 4 because of the development process, the imaging liquid remains in the slit nozzle and the nozzle pipe ^. This residual strength is strong, and the imaging liquid is deteriorated due to long-term changes, so Caused by pollutants and becoming fine particles ^ ^ 卞, or subsequent processing becomes the source of the image caused by the wave length of the imaging liquid? U Therefore, the substrate processing device 1 is implemented before the actual development processing. " Go to the main edge and clean the developing solution in the fine-slit nozzle 31 and the nozzle surface piping 32. First, before the substrate processing installation, first, 34 ^ 〇 /-^-▲ 碣 σ 冼 before the clean processing, The chemical liquid supply unit and H '341 are put into a stopped state, and the on-off valve ⑷ is closed 93017.doc -13 · 200428510. This stops the supply of the developing liquid to the slit nozzle 3 丨. In addition, the developing liquid The process of stopping the supply of the image liquid is actually the same as that of the end of the development process described later. The liquid discharge mechanism 38 turns the on-off valve 38 ° to the closed state. Next, the control device 40 is required for the cleaning process. The liquid supplied to the slit nozzle 31 is a cleaning liquid, so The three-way valve 33 is controlled as if the nozzle pipe 32 and the washing liquid pipe 37 are connected. In response to the control, the three-way valve ^ selectively connects the nozzle pipe 32 and the washing liquid pipe 37 and closes the liquid medicine pipe 35. Next, the cleaning liquid supply unit 36 supplies the cleaning liquid to the slit nozzle 3 by changing the on-off valve 360 to an open state. The cleaning liquid supply portion 36 supplies the cleaning liquid to the slit nozzle 31, and The narrow nozzle 3 丨 discharges the cleaning liquid. At this time, the cleaning liquid passes through the narrow nozzle 31 and the nozzle pipe 32, so the developing liquid and the like remaining in these are flushed out, and the narrow nozzle 3 is cleaned. And the nozzle piping 32. When the cleaning and control device 40 of the fine-slit nozzle 31 and the nozzle piping 32 are sufficiently judged after a special time, the control device 40 closes the on-off valve 360 of the cleaning liquid supply unit 36 In general, a control signal is output to the cleaning liquid supply unit 36. In response to the control signal, the cleaning liquid supply unit 36 stops the supply of the cleaning liquid to the slit nozzle 31 and stops the discharge of the cleaning liquid from the slit nozzle 31 by turning the on-off valve 36 ° to the closed state. . Next, the liquid discharge mechanism 38 changes the on-off valve 380 to the open state in response to a control signal transmitted from the control device 40. The on-off valve 38 ° is installed at a position lower than that of the sparge 31. Therefore, when the on-off valve 3 80 is opened, the fine slit f 嚿 3 1, the nozzle pipe 3 2, the three-way valve 3 3, and the cleaning liquid in the cleaning liquid pipe 37 are mainly directed by the action of gravity. Figure 2 flows in the direction indicated by the arrow 93017.doc -14- 200428510. No additional suction mechanism is required at the time of exit. The cleaning liquid is discharged to the outside by the drainage mechanism 38. Thereby, the washing liquid is prevented from remaining in the washing liquid pipe P, and the washing liquid pipe 37 becomes substantially empty. For example, in the substrate processing apparatus of this embodiment mode, when pure water is used as a cleaning liquid, when the pure water stays for a long time, bacteria are generated in the pure water, and there are problems that they become particles. However, in the substrate processing apparatus 1, even if it is left for a long period of time, the retention of pure water is prevented by the liquid discharge mechanism 38, so the generation of bacteria can be prevented. When the liquid discharge from the liquid discharge mechanism 38 is completed, the cleaning process in the substrate processing apparatus 1 is completed, and the substrate processing apparatus 丨 becomes a standby state. Next, the operation of the development processing in the substrate processing apparatus will be described. The development processing is a step of manufacturing the substrate 90, and is a step of liquid processing performed on the substrate 90. Specifically, it is a process for developing a photosensitive material (resist) which has been exposed on the substrate 90. The development processing is performed on the substrate processing apparatus 1 in a standby state, and is started by carrying in the exposed processing substrate 90 by the transport 1 outside the apparatus. The transport device outside the device carries the substrate 90 into the guide 10. The guide 10 keeps the carried substrate 90 at a specific position, and then transfers it to the transport mechanism 20 after carrying out maintenance. At this time, the guide J 0 may also be used to adjust the direction of the substrate 90 by rotating the substrate 90. The transport mechanism 20 keeps the received substrate 90 in a substantially horizontal direction, and in a direction of 'J (X). The sensor (not shown) detects that the substrate 90 is transported to a specific position. Since the liquid that must be supplied to the slit nozzle 31 during the development process is the development liquid, the control device 40 is the third control unit. The valve 33 connects 93017.doc -15- 200428510 nozzle pipe 32 and liquid pipe 35 to the material. With this, the three-way system connects the nozzle pipe 32 and the chemical liquid pipe 35 to each other, and closes the cleaning liquid pipe 37. * Next, the chemical liquid supply unit 34 supplies the developing liquid to the fine slit nozzle 31 by opening the on-off valve 342 and drives the liquid feeding pump 34, and starts the developing liquid from the fine slit nozzle 31 on the substrate 90. Spit it out. On this day, the liquid discharge mechanism 38 keeps the inside of the cleaning liquid pipe 37 in a liquid state (empty state). Therefore, in this embodiment mode, the three-way valve 33 is used in the development process of the physical device and the developing solution, and there is no case where the developing solution and the cleaning solution are changed into a wet state. Therefore, the developing solution discharged from the substrate 90 prevents the cleaning solution from being mixed. This prevents the development solution from being diluted, etc., thereby improving the accuracy of the concentration management of the development solution and preventing the development failure. The substrate 90 is transported in the (+ χ) direction by the transport mechanism 2G, and receives the ejection of the developing solution from the slit ㈣31. That is, the substrate 90 is scanned by the slit nozzle 31 in the X-axis direction to perform the development processing of the exposed photosensitive material on the substrate 90. When the scanning of the substrate 90 of the slit nozzle 31 is completed, the chemical liquid supply section% turns the on-off valve 342 to a closed state and stops the liquid feeding pump 34m. Thereby, the supply of the developing solution from the chemical solution supply unit 34 is stopped, and the discharge of the developing solution from the slit nozzle 31 is stopped. Next, the control device 4G controls the three-way valve 33 to connect the nozzle pipe 32 and the washing liquid pipe 37 in communication. With this, the three-way system is connected to the nozzle pipe M and the washing material, and the Gu liquid "35 becomes closed. Furthermore, the liquid discharge mechanism 38 turns the on-off valve 380 to the open state, via 93017. doc -16- 200428510 First / liquid-dispensing officer 37 drains the developing solution in the fine slit nozzle 31 and the nozzle pipe 32. This' ends the developing process. Then, the aforementioned washing process is performed again, and the order is made. Washing in the narrow slit nozzle 31 and the nozzle pipe 32. In addition, the washing process is not necessary to be carried out each time the developing process is performed, for example, after repeating the developing process of a specific number of persons, the washing process may be performed. Above the prostitute, the substrate processing device 1 in the conventional application type is for processing substrates 90 ,, and $, and the liquid discharge mechanism 38. The flow path of the processing liquid will be changed to the wetted flow path. The liquid in (cleaning liquid pipe 37) is drained in advance to prevent the liquid from getting wet with the processing liquid. Because of this, even if the three-way valve% changes for a long time, etc .: When the blocking function is reduced, or as a cleaning liquid The viscosity of the liquid ^ can still be the same as that of other devices, preventing the supply to the slit nozzle 3 1 The treatment liquid is mixed with other liquids. The "draining of the cleaning liquid in the cleaning liquid piping 37" can prevent the retention of the cleaning liquid in the cleaning liquid piping 37. Therefore, even if the lye is used as cleaning, It is still possible to prevent the generation of microbes as a cause of microparticles when the liquid crystal and base device is longer. This can also be used; the processing accuracy of the south substrate processing device 1 is also used. In addition, 'in order to prevent the developing solution and cleaning The liquid becomes in a liquid-contact state, and the developing liquid is supplied to the sewing nozzle 31, and the liquid surface of the cleaning> night does not contact the ㈣33. Therefore, the liquid discharge mechanism does not need to place the cleaning liquid in the pipe π. The washing, washing, and washing liquids are all drained. However, when the washing liquid is pure water, etc., in order to prevent the retention of coffee, as in the substrate processing apparatus i in this embodiment, the washing liquid is distributed with the washing liquid in 37 It is better to make a complete drainage. 93017.doc -17- 200428510 < 2. Second embodiment > In the first embodiment, the three-way valve 33 is used to connect the nozzle pipe 32, the chemical liquid pipe M, and the cleaning liquid f 3 7 to each other, but these pipes are connected and connected. The structure is not limited to the three-way valve 33. That is, a member having a function of opening and closing a flow path may be used. Fig. 3 is a schematic view showing the liquid supply device 30a of the substrate processing apparatus 1 in the second embodiment constructed based on such a principle. The liquid supply device 3 has a structure in which the three-way valve 33 of the liquid supply device 30 in the first embodiment is replaced with a joint portion 33a. In addition, the liquid supply device 30a is a structure other than the joint portion 33a and a liquid Since the supply device 30 is the same, illustration and description are appropriately omitted. The operation of cleaning processing and developing processing of the substrate processing apparatus 1 in the second embodiment having the above configuration will be described. First, the cleaning processing will be described. In the present embodiment, the substrate processing split 1 ′ before the cleaning process is started, the chemical liquid supply unit 34 stops the driving of the liquid feeding pump 341, and the on-off valve 342 is closed. Furthermore, the liquid is discharged. The mechanism 38 turns the on-off valve 380 into a closed state. Then, in response to a control signal transmitted from the control device 40, the cleaning liquid supply section 36 turns the on-off valve 3 60 into an open state. Thus, washing from outside the device is performed. The cleaning tank supplies the cleaning liquid to the cleaning liquid pipe 37, and supplies the cleaning liquid to the slit nozzle 31 through the joint portion 33a and the nozzle pipe 32. As a result, the cleaning liquid is discharged from the slit nozzle 31. A specific time elapses , Fine slit nozzle 3 1 and When the cleaning of the nozzle pipe 32 is completed, the cleaning liquid supply part 36 turns the on-off valve 360 into a closed state. Moreover, the liquid mechanism 38 discharges the opening-closing valve so that it remains in the slit Drain the cleaning liquid from the nozzle _, nozzle piping 32, joint 33a, and cleaning liquid piping _. At this time, 'the internal structure of the 3 domain of the joint is simpler than that of the tee, so the liquid is drained well, which effectively prevents development. Residue of liquid. _When the discharge of the cleaning liquid of the night stack structure 3 8 is completed, the liquid discharging mechanism μ turns the on-off valve _ to a closed state. With this, the end of the cleaning processing of the substrate processing apparatus in this embodiment is known. The substrate processing apparatus j is in a standby state. That is, the substrate processing apparatus in this embodiment also prevents the generation of pure water in the cleaning liquid pipe 37 during standby. Next, the description is directed to the development process. When the shoulder substrate 90 is transported to a specific position by the transport mechanism, the control device 4G selects a developing liquid as the liquid to be used, and inputs the control signal to the medicinal liquid supply unit corresponding to the control signal. The medicinal liquid supply unit 3, The drive of the liquid pump 341 will start The booth 342 is opened. As a result, the developing solution is supplied to the chemical solution pipe 35, and the developing solution supplied from the chemical solution pipe to the coupling portion 33a also flows into the cleaning solution pipe 37. However, the cleaning solution supply section The on-off valve 360 of 36 and the on-off valve 38 of the liquid discharging mechanism 38 are in a closed state. Therefore, the inflow of the developing liquid toward the cleaning liquid pipe 37 is stopped at a moment, and the imaging supplied from the chemical liquid pipe 35 afterwards The liquid system is supplied to the slit nozzle 3 through the joint portion 33a and the nozzle dispensing unit 32. As a result, the development liquid is started to be discharged from the slit nozzle 31. Therefore, the development liquid system in the cleaning liquid pipe 37 is used. Since the on-off valve 36o is in a liquid state with the cleaning solution, the cleaning solution is mixed in the cleaning solution pipe 37. However, since the flow path of the cleaning liquid pipe 37 and the developing liquid is connected to the space 93017.doc -19- 200428510, it does not directly become the flow path of the developing liquid, so the liquid in the cleaning liquid pipe 37 Roughly does not flow. Therefore, at the opening / closing valve 36 located at a position relatively deviated from the joint portion (the mass flow path of the developing solution), the developing solution and the cleaning solution are in a liquid-contact state, even if a part of the developing solution in the cleaning solution pipe 37 is diluted. The image liquid has almost no effect on the development processing. When the scanning of the substrate 90 of the fine slit nozzle 31 is completed, the chemical liquid supply unit 34 turns the on-off valve 3 42 to a closed state and stops the liquid feeding pump 3}. Thereby, the supply of the developing solution from the chemical solution supply section 34 is stopped, and the discharge of the developing solution from the slit nozzle = is stopped. Next, the liquid discharge mechanism 38 opens the on-off valve 380, discharges the developing liquid in the slit nozzle 31, the nozzle pipe 32, the joint portion 33a, and the washing liquid pipe 37, and ends the developing process. As described above, the substrate processing apparatus in the second embodiment mode is based on the position in which the processing liquid and other liquids in the liquid state used for processing the chemical liquid for the substrate 90 are generated, such as being located from the flow of the processing liquid. The path is configured as a fully deviated position, and a liquid discharge mechanism 38 is provided to properly drain the diluted processing liquid in a liquid-receiving state, and the processing liquid discharged from the slit nozzle 3 can be controlled to mix with other liquids. Therefore, the substrate processing apparatus 1 in this embodiment can improve the accuracy of the concentration management of the processing liquid supplied to the substrate 90, and therefore can improve the processing accuracy of the chemical liquid processing of the substrate 90. < 3β Third Embodiment > It is also possible to use a general check valve that passes the liquid only in one direction to realize the configuration as a means for opening and closing the liquid flow path. FIG. 4 is a schematic diagram showing a base 93017.doc -20-200428510 of the third embodiment constructed based on such a principle, and a liquid supply device 30b of the plate processing device 1 is shown. The liquid supply device 30b serves as a mechanism for opening and closing the chemical liquid piping 35 and the cleaning liquid piping 37, and is different from the above-mentioned embodiment in that it includes check valves 39a and 39b. The check valve 39a is used to drive the liquid supply pump 34 of the chemical liquid supply unit 34 to pass the developing liquid from the chemical liquid pipe 35 toward the nozzle pipe 32. In addition, the check valve)% has a function of preventing liquid (developing liquid and cleaning liquid) from flowing backward from the nozzle pipe 32 to the chemical liquid pipe 35. The check valve 39b is configured to pass the washing liquid from the washing liquid pipe 37 toward the nozzle pipe 32 when the on-off valve 36 of the washing liquid supply unit 36 is opened. The check valve 39b prevents the liquid (developing liquid and washing liquid) from flowing backward from the nozzle pipe 32 to the washing liquid pipe 37. That is, the control device 40 can control the opening and closing of the non-return check 39a and 39b by controlling the increase and decrease of the liquid pressure on the side of the liquid medicine pipe 35 and the washing liquid pipe 37 of the check valves 39a and 39b. The operation of the substrate processing in the third embodiment having such a structure and the cleaning processing and development processing of the watermelon 1 will be described. First, before the cleaning process is started, the medicinal solution supply unit 34 turns the driving of the liquid feeding pump 341 into a stopped state, and turns the on-off valve 342 into a closed state. The 'drainage mechanism 38' turns the on-off valve 380 into a closed state. Next, in response to a control signal transmitted from the control device 40, the cleaning liquid supply unit 36 turns the on-off valve 360 into an open state. Thereby, the washing liquid is supplied from a washing liquid tank outside the apparatus to the washing liquid pipe 37, and the pressure of the washing liquid in the washing liquid pipe 37 rises. Therefore, the check valve 39b is opened, and the cleaning liquid is supplied to the slit nozzle 31 through the check valve 39b and the nozzle pipe 32, and the cleaning liquid is discharged from the slit nozzle 93017.doc -21-200428510. When the cleaning of the fine-slit nozzle 31 and the nozzle pipe 32 is completed in a predetermined time, the cleaning liquid supply unit 36 turns the on-off valve 36o to the closed state. The liquid discharge mechanism 38 discharges the cleaning liquid remaining in the cleaning liquid pipe 37 by opening the on-off valve 38o. In addition, the liquid discharge mechanism 38 discharges the cleaning liquid in the cleaning liquid pipe 37. Although the pressure in the cleaning liquid pipe 37 is reduced, the liquid in the nozzle dispensing unit 32 is prevented by the check valve 39b. Backflowed into the washing liquid pipe 37. According to the above, the cleaning processing of the substrate processing apparatus 丨 in this embodiment mode is completed 'and the substrate processing apparatus 1 is brought into a standby state. Next, development processing will be described. When the substrate 90 is transported to a specific position by the transport mechanism 20, the developing liquid is selected as the liquid used by the control device, and the control signal is output to the chemical liquid supply unit 34. In response to the control signal, the music liquid supply unit 34 starts driving the liquid supply pump 341, and changes the on-off valve 342 to an open state. After that, the developing solution is supplied to the chemical solution pipe 35, and the pressure of the developing solution in the chemical solution pipe 35 increases, and the check valve 39a is opened. Therefore, the developing liquid is supplied to the slit nozzle 31 through the check valve 39a and the nozzle pipe 32, and the developing liquid is discharged from the slit nozzle 31. At this time, since the cleaning liquid in the cleaning liquid pipe 37 is drained in advance by the drainage structure%, the developing liquid and the cleaning liquid are not brought into a wet state at the check valve 39b. As described above, in the third embodiment, the substrate processing device i uses the liquid supply device 3 0b using the check valves 3 9 a and 3 9 b as a mechanism for opening and closing the liquid flow path. 93017.doc -22- 200428510 Structure. The same effect as that of the substrate processing apparatus in the embodiment can be obtained. In addition, by using the check valves 39a and 39b, the control device 40 can directly perform the desired operation by controlling only the chemical liquid supply portion 34 and the cleaning liquid supply portion 36 without directly controlling the seal and the like. Therefore, the control of the control device 40 can be simplified. In addition, in order to prevent the development liquid or the cleaning liquid from remaining in the slit pipe 31 and the nozzle pipe 32, the height position of the two-axis direction of the slit nozzle 31 is arranged to be higher than the position of the check valve 39a and 39biZ axis direction. Low is better. < 4. 4th implementation mode >; The second yoke-type liquid supply device 3 in the yoke type is connected to the joint portion 3 3a in a substantially horizontal state in communication. When the nozzle pipe 32 and the chemical liquid pipe 35 are connected in this configuration, even if the liquid is drained by the cymbal mechanism%, the developing liquid in the chemical liquid pipe 35 may remain. For example, the three-way valve 33 in the first bismuth-type evil can close the chemical liquid pipe M during the cleaning process when the flow path connecting mechanism group enters the flow path opening and closing mechanism. Therefore, there is less problem that the developer remains in the chemical solution pipe 35. The cleaning process is not a process for the substrate 90, and does not require high accuracy. In the cleaning process, the cleaning solution from the narrow slit nozzle 3 丨 + ψ center and the cleaning solution is sent to the three-way valve 33 through and The developing solution is mixed with the developing solution in a wet state, but if it is mixed to this extent, the washing power of the Yin solution will not be significantly lost. The joint 33a in the t 疋 ^ 2 shell type is that the medicine solution cannot be closed during the cleaning process & 35. Therefore, when the developing solution remains in the chemical solution piping 35, the substrate processing equipment in the second embodiment: the substrate processing equipment in the second embodiment mode is more mixed than the cleaning solution in the one-stage cleaning processing. Like liquid. That is, when the cleaning effect of the cleaning solution is reduced, it can be as long as possible before starting the cleaning process; 93017.doc -23 · 200428510 It is better to reduce the developing solution remaining in the chemical solution pipe 35. Fig. 5 is a schematic view showing a liquid supply device 30o of a substrate processing apparatus in a fourth embodiment constructed based on such a principle. At the liquid supply position 30c, the medicinal liquid pipe is connected to the joint portion 33a according to the inclination shown in FIG. 5. That is, the medicinal liquid pipe 35 is inclined toward the joint portion 33 and connected downward. When the liquid mechanism 38 opens the on-off valve 380 to discharge the liquid in the cleaning liquid pipe 37, the liquid in the chemical liquid pipe 35 is also smoothly drained, and the amount of liquid remaining in the chemical liquid pipe 35 is reduced. The structure and operation of the liquid supply device 3 0c are the same as those of the liquid supply device 3 0a in the second embodiment, so the description is omitted. As described above, even if the substrate processing device structure in the fourth embodiment is used, it is still possible. The same effect as that of the second embodiment is obtained. In addition, in the liquid supply device 30c, the medicinal solution pipe 35 is inclined downward to the joint portion 33a and connected to the joint portion 33a, thereby improving the medicinal solution dispensing function. 35. Therefore, since the amount of liquid remaining in the medicinal solution pipe 35 is reduced, for example, the amount of the developing solution mixed in the cleaning solution in the cleaning process can be reduced. < 5. 5th embodiment > The case where the substrate processing apparatus 1 in the above embodiment uses one liquid (developing liquid) as the processing liquid for processing the substrate 90 has been described, but the processing liquid It is not limited to one type, and two or more types may be used. Fig. 6 is a schematic diagram showing a liquid supply device 30d of the substrate processing apparatus 1 in the fifth embodiment constructed based on such a principle. The liquid supply device 30d is provided with three chemical liquid supply sections 93017.doc -24-200428510 34a 34b, 34e 'as shown in FIG. 6, and each is connected to the joint section. Each of the chemical liquid supply sections 34a, b has the same structure as the chemical liquid supply section μ in the above embodiment, and stores different processing liquids in each of the chemical liquid tanks 34o. The coupling portion 33b is a member having the same function and structure as the coupling portion 33a except that it can connect and connect a large number of chemical liquid preparations. In addition, in this embodiment, as shown in FIG. 6, each chemical liquid pipe 35 is attached to the company 33b 'along the two-axis direction. For example, it may be installed at a position around the joint portion 33b. . ° Control device 40 is the processing performed by the substrate processing device 1 and selects the processing liquid to be discharged from the slit nozzle 31, and stores the selected processing liquid from the chemical liquid supply unit ^, rectification, and%, and supplies it to the Slit Nozzle 31. In addition, when the used treatment liquid is replaced, the liquid in the slit nozzle 31, the nozzle pipe 32, and the joint portion 33b is discharged by the liquid discharge mechanism 38. In addition, the washing liquid supply unit 36 may supply a washing liquid and perform a washing process. As described above, the substrate processing apparatus i in the fifth embodiment can also obtain the same effect as the above embodiment. In addition, the liquid supply device 30d is provided with a plurality of chemical liquid supplies 34 &, 34b, and 34C, so that the substrate processing device can be diversified. < 6. Modifications > Although the embodiments of the present invention have been described above, the present invention is not limited to those described above, and various modifications can be made. For example, the substrate processing device 丨 does not need to carry out the development of the substrate 90 frequently, that is, when the substrate processing is placed in the line for multiple exposure steps, etc., in the multiple exposure processing room, the substrate 90 through substrate processing 93017.doc -25-200428510 ^ 1 can also be placed. The substrate processing setup in the above implementation form! Because the developing liquid adhering to the slit nozzle 31 is removed by the washing process, the development process is not performed in this way, and the substrate m processed by the substrate is not removed from the slit nozzle 3! To prevent poor handling. … And in the above-mentioned embodiment, the liquid discharging mechanism 38 is constituted only from the washing liquid pipe η ′ Yeren about the drug liquid dispensing officer 3 5, and the same mechanism as the liquid discharging mechanism 38 is used for liquid discharging. Yes. In the above-mentioned example, the liquid discharge mechanism 38 is not provided with a suction mechanism, but performs liquid discharge '. In addition, a suction mechanism is also provided to suction the liquid in the cleaning liquid pipe 37 and discharge the liquid. The "Phan 1 closed-flow mechanism" or the position where the mechanism is installed is not limited to the above-mentioned Λ target type. For example, the check valves 39a, 39bt of the liquid supply device 30b in the third embodiment may be replaced with an on-off valve, and the on-off valve may be controlled by the control device 40. Moreover, in the liquid supply devices 30a, 30c, and 30d of the second, fourth, and fifth embodiments, the liquid-contacting state of the developing solution and the cleaning solution is not generated close to the developing solution. The position of the flow path is constituted. However, a configuration may be adopted in which an on-off valve is provided on the joint portion 33a (33b) side of the cleaning liquid pipe 37. Fig. 7 is a schematic diagram of a liquid supply device 30e in a modified example constructed based on such a principle. The liquid supply device 30e is a liquid supply device 30 in the second embodiment, and has a structure in which an on-off valve 33c is added. The liquid discharge mechanism 38 in this modification is a state in which the on-off valve 33c is closed, and the liquid in the cleaning liquid pipe 37 is discharged. With this, even when the connection of the chemical solution ί 3 5 and the cleaning solution piping 37 is made by using the connection portions 33 a and 33 b having a simple structure, the connection of the developing solution and the cleaning solution can be prevented. 93017.doc -26- 200428510 status. The same applies to the liquid supply device 30c in the fourth embodiment shown in FIG. 5 and the liquid supply device 3 in the fifth embodiment shown in FIG. The inventions in items 1 to 8 of the scope of patent application, by having a liquid discharge means, discharge liquid from at least one of the plurality of flow paths, and can control the liquid discharged from the discharge means to mix into other liquids. For the invention in the second scope of the patent application, the drainage means is at least one flow path, and the liquid is drained from the means to the supply means. ^ It can prevent the liquid from being in contact with the processing liquid and other liquids, so It can prevent the treatment liquid discharged from the discharge means from mixing into other liquids. The invention in item 4 of the scope of patent application can simplify the control by closing and closing the valve. The invention of item 5 of the I-pin patent scope is that the drainage means is in most flow channels. The essence is to drain the liquid from the flow path used to guide pure water, and d prevents the retention of pure water and prevents particles. Cause of bacteria. The invention of the sixth item in the scope of patent application, because at least the processing solution 2 has a developing solution, can improve the accuracy of the concentration management of the supplied developing solution, and improve the developing processing accuracy. The invention in item 7 of the scope of patent application, by at least one kind of treatment liquid containing $ :: solution, can improve the accuracy of the concentration management of the supplied anti-name solution, and improve the accuracy of Duli coating treatment. In the invention in the eighth aspect of the patent application, the liquid discharge means can be discharged by installing at a position where the discharge means is low, without installing a suction mechanism or the like. The invention in item 9 of the scope of patent application has a liquid supply device of any of the items 1 to 8 provided with the scope of patent application 93017.doc -27- 200428510, and the concentration management of the processing liquid supplied to the substrate is accurately controlled Degree, it can achieve the improvement of the precision of the liquid treatment. [Brief description of the drawings] FIG. 1 is a schematic plan view of a substrate processing apparatus according to the present invention. Fig. 2 is a schematic diagram showing a liquid supply device of a substrate processing device in a P implementation type. t Fig. 3 is a schematic view showing a liquid supply device for substrate processing split in a second embodiment. t FIG. 4 is a schematic diagram showing a liquid supply device for a substrate processing apparatus in a third embodiment. ^ Fig. 5 is a schematic diagram showing the liquid supply dual set of the red-old substrate processing apparatus in the fourth embodiment. Fig. 6 is a schematic view showing a liquid supply device of a Kibaru handle device in a fifth embodiment. Fig. 7 is a schematic diagram showing a liquid supply device of the Han Lili I at the substrate in the modification. [Illustration of Symbols] 1 10, 11 20 30, 30a, 30b, 30c, 30d, 30e 31 32 Substrate processing device guide transport mechanism (holding means) Liquid supply device fine σ back nozzle piping 93017.doc- 28- 200428510 33 Three-way valve 33a, 33b Combined part 33c On-off valve 34, 34a, 34b, 34c Chemical solution supply part 35 Chemical solution piping 36 Cleaning solution supply part 37 Cleaning solution piping 38 Discharge mechanism 39a, 3 9b Stop Check valve 40 Control device 90 Base plate 340 Chemical tank 341 Feed pump 342, 360, 380 On-off valve 93017.doc -29-