200428411 玫、發明說明： 技術領域 本發明係關於一種聚合物厚膜電阻（p〇lymer thick mm resistor)膠體組成物，具有良好的搖變特性（thix〇tr〇py)，且 不含有機或無機溶劑。由於該膠體組成物在烘烤硬化的過 程中，不會改變其電阻的尺寸及形狀，且表面也不會產生 %陷的現象，因·此可降低電阻阻值的變異性。 先前技術 隨著科技發|的曰新月#，各項電子產品無不朝向輕薄 短小及高功能化的趨勢發展。為因應此一需求，主動元件 已由低階產品逐漸轉換成高階產品，且被動元件的需求數 畺也相對地大巾田增力”然而在電路基板面積日益縮小的情 況下，如何縮小被動元件的尺寸，已成為業界研發的目標。 、電阻器、為廣泛使用的被動元件之―，其主要功能是所來 調整電器及電子產品内之電路電流或電壓大小，並限制電 流的流動。一般而言。電阻器可分為薄膜電阻及厚膜電阻 兩種薄膜兒阻主要生產方式以人工插件為主，例如碳膜 電阻、金屬膜電阻、繞線電阻及金屬氧化膜電阻等。而厚 膜包阻夕已朝向晶片化發展，包括晶片電阻、晶片排阻 及罔路兒阻等，其主要利用表面黏著技術（surface mount techn_gy，SMT)，以將多個厚膜電阻分別安裝在電路基板 士 ’由於採自動化生產，因此可有效降低人工成本，然而 卻具有製程耗費時間較久，且尺寸料财限等缺點。 因此近年來業界大多使用聚合物厚膜電阻技術來製作埋200428411 Rose, description of the invention: TECHNICAL FIELD The present invention relates to a polymer thick film resistor colloidal composition, which has good thixotropy and does not contain organic or inorganic Solvent. Since the colloidal composition does not change the size and shape of its resistance during the baking and hardening process, and the surface does not have the phenomenon of sinking, the variability of the resistance value can be reduced. Previous technology With the development of the technology of the new moon #, all electronic products have been trending towards the trend of thinness, shortness and high functionality. In response to this demand, active components have gradually been transformed from low-level products to high-level products, and the demand for passive components has increased relatively. ”However, in the case of the circuit substrate area is shrinking, how to reduce the size of passive components , Has become the goal of industry research and development. Resistors, which are widely used passive components, its main function is to adjust the current or voltage of circuits in electrical and electronic products, and limit the flow of current. Generally speaking. Resistors can be divided into two types: thin film resistors and thick film resistors. The main production methods of film resistors are artificial plug-ins, such as carbon film resistors, metal film resistors, wire wound resistors, and metal oxide film resistors. Thick film resistors It has developed towards chip-based development, including chip resistance, chip exclusion, and circuit resistance. It mainly uses surface mount technology (SMT) to mount multiple thick film resistors on circuit substrates. Automated production, so it can effectively reduce labor costs, but it has a long process, and the size and financial constraints Point. Thus the industry in recent years is often used to produce a polymer thick film resistor technology Buried
O:\84\84447.DOC 200428411 入式被動元件（embedded passives)，以達到縮小被動元件之 目的，其最大的優點在於可以利用網印方式，一次將大量 的電阻膠體印在電路基板上，然後經由烘 里 相較於傳統以表面黏著技術將獨立式被動元件m P咖Wes)安裝在電路基板丨，制聚合物厚膜電阻可以節 省更多空間，且製程更為簡單。 習知製作聚合.物厚膜電阻膠體的方法，大多是使用兼具 紫外光及熱交聯性能之環氧樹脂為基材，結合導電顆粒及 其他添加劑，以製作出電阻值約為10至10000歐姆⑼之 間的電阻膠體。然後經網版印刷或點膠製程將此電阻膠體 植入在電路基板上的電極之間，使之形成各自獨立的電阻 元件，再經過疊壓法（或增層法）的製程及導通孔的製程將線 料貝起來’如此可將電路板的表面積縮小，同時增加產 降低成本。例如中華民國專利公告案第撕奶 號:揭示-種聚合物厚膜電阻體組成物，其包含有導電金 屬銀，子）碳粒子及溶解於有機溶劑之熱塑性樹脂 奉乳土树脂）’當該組成物經由網印印於一基板上，再經過 能有效地除去溶劑，以將該組成物轉變成固 月豆狀悲。然而利用μ 、 处万法所形成之厚膜電阻，在去除有 機；谷劑之後，备作& 、、s坆成笔阻的尺寸大幅地縮小，而導致電阻 尺寸典法固定，甘兩^ /、黾阻阻值約會有10至30〇/〇的誤差產生。 在習知作法中，#、丄p ^ 解決厚膜電阻尺寸安定性問題的方法不 外乎兩種，一杲枓料 文I程，例如中華民國專利公告案第 503681 5虎中揭示 、无在一印刷電路基板上蝕刻形成預設O: \ 84 \ 84447.DOC 200428411 Embedded passives are used to achieve the purpose of reducing passive components. The biggest advantage is that screen printing can be used to print a large amount of resistive gel on the circuit board at one time, and then Compared with the traditional method of mounting the self-contained passive components (MPW, Wes) on the circuit substrate through baking, the production of polymer thick film resistors can save more space and the manufacturing process is simpler. Conventional methods for making polymer thick film resistive colloids are mostly epoxy resins with both ultraviolet light and thermal cross-linking properties as substrates, combined with conductive particles and other additives to produce resistance values of about 10 to 10,000. Resistive colloid between ohms. Then, this resistive gel is implanted between the electrodes on the circuit board through screen printing or dispensing process to form each independent resistive element, and then the process of lamination (or build-up method) and the via hole are processed. The process will wire up the material 'so that the surface area of the circuit board can be reduced, while increasing production and reducing costs. For example, the Republic of China Patent Bulletin No. Tear Milk: Revealed-a polymer thick film resistor composition, which contains conductive metal silver, carbon particles and thermoplastic resins dissolved in organic solvents. The composition is printed on a substrate via screen printing, and then the solvent can be effectively removed to transform the composition into a solid moon bean shape. However, the thickness of the thick film resistor formed by μ and Chu Wanfa was used to remove the organic; after the cereal was prepared, the size of the prepared & s was reduced significantly, resulting in the fixed resistance of the resistors. /, The resistance value dating has an error of 10 to 30/0. In the conventional practice, #, 丄 p ^ are no more than two methods to solve the problem of dimensional stability of thick film resistors. One document is described in the process, for example, disclosed in the Republic of China Patent Publication No. 503681 5 Etching on a printed circuit board to form a preset
O:\84\84447.DOC 200428411 電阻器圖樣的電阻六 二曰】及其他線路’再將電阻膠體均勻塗 佈於該基板之電卩且办 a 二4以形成一電阻層，該電阻層具有預 疋厚度及電阻值，缺^^ ^ 1 ' …、後烘烤硬化該電阻層。另一種方式為 严:料，，如美國專利第M3M53號中提出一種聚合物 網印成形後’需先使用紫外線曝光， 將該電阻的外部硬仆佘 、 化疋型後，再經過加熱固化該電阻的内 部結構，進而得.到尺寸 μ - 女疋的；月旲电阻。然而無論是改變 製程步驟或是更換兩阳^ 制… 換一材料，均會增加製程步驟，而造成 、、 業界仍止寻求一種具有良好的尺寸 安足性與穩定的雷卩且，卩 . 值’且不&增加製程複雜性之電阻 膠體組成物。 發明内宠 本發明〈目的係提供—種聚合物厚膜電阻膠體組成物， 由於其不'含有機或無機溶劑，且因有良好的搖變特性，因 此具有艮好的尺寸安定性與穩定的電阻阻值。 本1Λ月〈另一目的在於提供—種在電路基板上植入聚合 物厚膜電阻膠體的方法，可減少製程步驟，降低成本。 實施方式 本發明之聚合物厚膜電阻膠體組成物，其特徵為該組成 物不含有機或無機溶劑’其搖變指數（thixotropic index) 介於4至9之間，較佳為5 ? 7、口日 為至間，且黏度範圍介於 400,000 至 2,〇〇〇 〇〇〇 厘泊（ /里/EUcps^間，較佳為6〇〇,〇〇〇至 1，000,000 厘泊（cps)之間。 本發明之聚合物電阻膠體組成物包含⑽重量份數之環O: \ 84 \ 84447.DOC 200428411 resistance of the resistor pattern, and other circuits' and then evenly apply the resistive gel to the substrate of the substrate and do a 2 to 4 to form a resistive layer, the resistive layer has The thickness and resistance value are pre-determined, and the resistance layer is absent ^^ ^ 1 ', and is post-bake hardened. Another method is strict: material, as proposed in US Patent No. M3M53, after polymer screen printing is formed, it is necessary to use UV exposure first, and then harden the external hard resistor of the resistor, and then heat-curing the The internal structure of the resistor, which in turn has a size of μ-son-in-law; However, whether it is changing the process steps or replacing the two anodes ^ system ... Changing one material will increase the process steps, and the industry still does not seek a thunder with good dimensional safety and stability. And, 卩. Value 'Without & a resistive colloidal composition that increases process complexity. The present invention <the purpose of the present invention is to provide a polymer thick film resistive colloidal composition, because it does not contain organic or inorganic solvents, and because it has good shake properties, it has good dimensional stability and stability. Resistance value. This January, another purpose is to provide a method for implanting a polymer thick film resistor colloid on a circuit substrate, which can reduce the process steps and reduce the cost. Embodiments The polymer thick film resistive colloidal composition of the present invention is characterized in that the composition does not contain organic or inorganic solvents, and its thixotropic index is between 4 and 9, preferably 5-7. Oral days are between and between, and the viscosity ranges from 400,000 to 2,000,000 centipoise (/ mile / EUcps ^, preferably from 60,000 to 1,000,000 centipoise (cps) The polymer resistive colloidal composition of the present invention contains a ring of parts by weight.
O:\84\84447.DOC -8- 200428411 氧樹脂；0.1至20重量份數之熱硬化促進劑；5至30重量 份數之導電碳黑；及1 〇至95重量份數之導電石墨。 可用於本發明電阻膠體組成物中之環氧樹脂並無特殊限 制，其例如但非限於雙酚A型環氧樹脂（bisphenol A epoxy)，如EPON 828(殼牌石油化學）、EPON1001(殼牌石 油化學）及DER 33 1(陶氏化學）等；四溴雙酚A型環氧樹脂 (tetrabromobisphenol A epoxy)，如 DIC 1 53(大日本油墨）及 DIC 152(大日本油墨）等；雙酚F型環氧樹脂（bisphenol F epoxy)，如EPON 862(殼牌石油化學）等；環脂族環氧樹脂 (cycloaliphatic epoxy，），如：ERL-4221(美國聯合碳化）及 VCMX(美國聯合碳化）等；二環戊二晞型環氧樹脂，如 XD-1000 2L(日本化藥）及HP-7200L(大日本油墨）等；多官 能基環氧樹脂（multi-functional epoxy)，如 EPPN 501(曰本 化藥）、E?PN 502H(曰本化藥）及TFIC(安原化學）等；或含 環多官能基環氧樹脂（naphthalene-containing epoxy)，如 HP-4032(大日本油墨）及HP-4032D(大日本油墨）等，該等環 氧樹脂可單獨或混合使用。 可用於本發明電阻膠體組成物中之熱硬化促進劑例如但 非限於三氟化硼單乙胺複合物（BF3 · MEA)、咪唑 (imidazole)，例如2P4MZ-CNS(六和化學）、亞磷酸三苯酯 (triphenyl phosphite，TPP)、1，8-二氮雜雙環-(5,4,0)·Η---7- 烯（l，8-diazabicyclo-(5,4,0)-undec-7-ene，DBU)和其鹽類， 或乙驗醋酸銅（II)(copper(II) acetylactate)等，該等促進劑可 單獨或混合使用。 O:\84\84447.DOC -9 - 200428411 應用於本發明電阻膠體組成物中之導電碳黑，其例如但 非限於高吸油量導電碳黑，如BP2000(台灣卡博特），或低 吸油量導電碳黑，如ΒΡ32〇0(台灣卡博特）。 可用於本發明電阻膠體組成物中之導電石墨，其粒徑小 於200蒒目（mesh)，可商業購得之產品，例如但非限於45095 (台灣德固）。 此外，本發明.電阻膠體組成物可視需要添加70至95重 量份數的液態酸酐來作為硬化劑，例如六氫苯二甲酸酐 (Hexahydrophthalic anhydride，HHPA)、甲基六氫苯二甲酸 酐'(Methyl Hexahydrophthalic anhydride，MHHPA)或甲基四 氳苯二甲酸 if (Methyl tetrahydrophthalic anhydride， ΜΤΉΡΑ)，此等液態酸酐可單獨使用或混合使用，例如但非 限於 700G (清泰）【ΗΗΡΑ:ΜΗΗΡΑ=3:7】。 再者，本發明電阻膠體組成物可視需要包含熟悉此項技 術者已知可用於電阻膠體組成物之添加劑，該等添加劑之 非限制性實例例如為分散劑、流平劑、搖變劑、金屬密著 劑或消泡劑。本發明亦提供一種在電路基板上植入聚合物 厚膜電阻膠體之方法，其係包含在該電路基板上蝕刻形成 所需的線路，接著覆蓋一模板，再利用一網版印刷製程， 將該電阻膠體組成物附著在該電路基板上，然後利用烘箱 或紅外線加熱使該電阻膠體組成物固化。在本發明中，電 路基板可為任何適合電子元件應用之基板，例如印刷電路 板（printed circuit board)或導線架（lead frame)等，而模板可 為鋼板、鋼絲板或尼龍板等。 O:\84\84447.DOC -10- 200428411 :於本發明之電阻膠體具有良好的搖變特 =著於電路基板上時，電阻的尺寸基本上不會發: 又“鴂塌陷的現象，因此可直接完全加熱固化， 而不需先將外部固化定型。 本=曰下實！?例將對本發明作進一步之說明，唯非用以限制 〜又明<範圍，任何熟悉本發明技術領域者，在不達背本 =月<精神下所得以達成之修飾及變化，均屬本發明之範 實施例 等只施例中，主要目的在於比較導電碳里盘里 的添加對於電阻膠體組成物之黏度與搖變指二影響力： 在本發明之實施例中’係同時添加導電碳黑與導電石墨； =比李乂例1中僅添加導電碳黑；而在比較例2中僅添加導 ^石墨。、亦即’本發明之製程條件的固定參數為：相同劑 :之環氧樹脂、液態酸酐、添加劑，及熱硬化促進劑，'變 ：不同種類與劑量之導電碳黑’及不同劑量之導 t-ir 々、董、0 [貫驗步驟] 1·先，汁K環氧樹脂、液態酸奸，及添加劑加入附有攪 拌器之容器中’然後在室溫下攪拌使其均勻混合，之後 緩緩加入熱硬化促進劑、導電碳黑，及導電石墨授摔均 2，最後經過三滾輪混練（three r〇11 miu)，以製成電阻 高分子厚膜膠體（其組成見下表丨）。 在本發明之最佳實施例中，電阻膠體的黏度測量方式主O: \ 84 \ 84447.DOC -8- 200428411 Oxygen resin; 0.1 to 20 parts by weight of thermal curing accelerator; 5 to 30 parts by weight of conductive carbon black; and 10 to 95 parts by weight of conductive graphite. The epoxy resin that can be used in the resistance colloid composition of the present invention is not particularly limited, such as but not limited to bisphenol A epoxy, such as EPON 828 (Shell Petrochemical), EPON1001 (Shell Petrochemical) ) And DER 33 1 (The Dow Chemical), etc .; tetrabromobisphenol A epoxy, such as DIC 1 53 (Dai Ni ink) and DIC 152 (Dai Ni ink), etc .; Bisphenol F type Epoxy resin (bisphenol F epoxy), such as EPON 862 (Shell Petrochemical), etc .; cycloaliphatic epoxy resin (cycloaliphatic epoxy,), such as: ERL-4221 (United States United Carbonation) and VCMX (United States United Carbonation), etc .; Dicyclopentadiene-type epoxy resin, such as XD-1000 2L (Nippon Kayaku) and HP-7200L (Da Nihon Ink), etc .; multi-functional epoxy resin, such as EPPN 501 (Japanese Chemical drugs), E? PN 502H (the original chemical) and TFIC (Anyuan Chemical), etc .; or cyclic polyfunctional epoxy resin (naphthalene-containing epoxy), such as HP-4032 (Danippon Ink) and HP- 4032D (Dai Ni ink), etc., these epoxy resins can be used alone or in combination . Thermal hardening accelerators that can be used in the resistive colloid composition of the present invention such as, but not limited to, boron trifluoride monoethylamine complex (BF3 · MEA), imidazole, such as 2P4MZ-CNS (Liuhe Chemical), phosphorous acid Triphenyl phosphite (TPP), 1,8-diazabicyclo- (5,4,0) · Η --- 7-ene (l, 8-diazabicyclo- (5,4,0) -undec -7-ene, DBU) and its salts, or copper (II) acetate (copper (II) acetylactate), etc. These accelerators can be used alone or in combination. O: \ 84 \ 84447.DOC -9-200428411 The conductive carbon black used in the resistive colloid composition of the present invention, such as but not limited to a high oil absorption conductive carbon black, such as BP2000 (Cabot, Taiwan), or low oil absorption Amount of conductive carbon black, such as PB3200 (Cabot, Taiwan). The conductive graphite, which can be used in the resistive colloid composition of the present invention, has a particle size of less than 200 mesh, and is a commercially available product such as, but not limited to, 45095 (Degu, Taiwan). In addition, according to the present invention, the resistive colloidal composition may be added with 70 to 95 parts by weight of a liquid acid anhydride as a hardener, such as hexahydrophthalic anhydride (HHPA), methyl hexahydrophthalic anhydride, ( Methyl Hexahydrophthalic anhydride (MHHPA) or methyl tetrahydrophthalic anhydride (MTHPA). These liquid anhydrides can be used alone or in combination, such as but not limited to 700G (清泰) [ΗΗΡΑ: ΜΗΗΡΑ = 3: 7 】. Furthermore, the resistive colloidal composition of the present invention may optionally include additives known to those skilled in the art to be useful in resistive colloidal compositions. Non-limiting examples of such additives are, for example, dispersants, leveling agents, shakers, metals Adhesive or defoamer. The invention also provides a method for implanting a polymer thick film resistor colloid on a circuit substrate, which comprises etching the circuit substrate to form a required circuit, then covering a template, and then using a screen printing process to apply the The resistive colloid composition is attached to the circuit substrate, and then the resistive colloid composition is cured by an oven or infrared heating. In the present invention, the circuit substrate may be any substrate suitable for the application of electronic components, such as a printed circuit board or a lead frame, and the template may be a steel plate, a steel wire plate, or a nylon plate. O: \ 84 \ 84447.DOC -10- 200428411: The resistive colloid in the present invention has good shaking characteristics = when it is attached to the circuit substrate, the size of the resistor will not be substantially changed: "the phenomenon of collapse, so It can be completely cured by heating directly, without the need to shape the external curing first. This example will explain the present invention further, but it is not intended to limit the scope of the invention. Anyone familiar with the technical field of the invention The modifications and changes achieved in the spirit of not reaching the book = month < are all exemplary embodiments of the present invention and the like. The main purpose is to compare the addition of conductive carbon to the resistive colloid composition. Viscosity and shake refers to two influences: In the embodiment of the present invention, 'the conductive carbon black and the conductive graphite are added at the same time; = compared to the case where only conductive carbon black is added in Example 1; and only the conductive graphite is added in Comparative Example 2. . That is, the fixed parameters of the process conditions of the present invention are: the same agent: epoxy resin, liquid acid anhydride, additives, and thermosetting accelerators, 'change: different types and doses of conductive carbon black' and different doses of引 t-ir 々, ， 0 [Performance steps] 1. First, juice K epoxy resin, liquid acid, and additives are added to a container with a stirrer, and then stirred at room temperature to evenly mix, and then slowly added to promote heat hardening to promote Agent, conductive carbon black, and conductive graphite are all 2 and finally mixed with three rollers (three r011 miu) to make a resistive polymer thick film colloid (the composition is shown in the table below). In the preferred embodiment, the viscosity measurement method of the resistive colloid is mainly
O:\84\84447.DOC -11 - 200428411 要是利用黏度計機台（Brookfield DV-I+ Visc〇meier)來測 量黏度。機台之操作參數如下··測暈轉針編號為七號（高 黏度用），黏度測量轉速使用低轉速（2 rpm)和高轉速（2〇 rpm)兩種。此外，搖變指數的計算方式為低轉速測量時 知到的黏度和高轉速測量得到的黏度之比值。茲將實施 例、比較例1，及比較例2測得之結果進一步說明如表j 中0 2·再將電阻膠體利用網印的方式（網印的條件如表2所 不），印刷在含有線路的電路基板上，然後利用烘箱加熱 _ 方式，以溫度約為· 15〇t烘烤該電阻膠體約九十分鐘， 使其完全固化。 3.最後利用光學顯微鏡，例如〇lympus ΒΗ-2，以倍數hx 來觀察已固化的厚膜電阻之外觀，觀察的結果如圖丨及 圖2所示。O: \ 84 \ 84447.DOC -11-200428411 If you use a viscometer machine (Brookfield DV-I + Viscomeier) to measure the viscosity. The operating parameters of the machine are as follows: The number of halo measuring needles is No. 7 (for high viscosity). The speed of viscosity measurement is low (2 rpm) and high (20 rpm). In addition, the shake index is calculated as the ratio of the viscosity known at low speed measurement to the viscosity obtained at high speed measurement. The results measured in Example, Comparative Example 1, and Comparative Example 2 are further explained as 0 2 in Table j. The method of screen printing using resistive colloids (screen printing conditions are not shown in Table 2) is printed on On the circuit substrate of the circuit, then the oven-heating method is used to bake the resistive colloid at a temperature of about · 150t for about ninety minutes to completely cure it. 3. Finally, use an optical microscope, such as Olympus BΗ-2, to observe the appearance of the cured thick film resistor at multiples of hx. The results of the observation are shown in Figures 丨 and 2.
O:\84\84447.DOC 12- 200428411 表1 聚合物厚膜電阻膠體組成（單位:phr.)及其性質 組成物種類 實施例 比較例1 比較例2 每氧樹脂 ERL4221 100 100 100 液態酸纤 700G 90 90 90 促進劑 2P4MZ-CNS 0.5 0.5 0.5 導電碳黑 BP2000 0 5 0 BP3200 30 20 0 導電石墨: 45095 62.5 0 95 黏度(2 rpm)單位：Cps. 630000 240000 500000 搖變指數(Ti) ’ 5.1 5.0 4.2 表2 網印條件 項目 單位 鋼板印刷 鋼絲網板印刷 鋼板/乳劑厚渡 Mm 0.04 0.015 張力 NT 55 30 網目 Mesh 325 刮刀材質 不銹鋼刮刀 膠刮刀 刮刀角度 60 60 刮刀速度 cm/sec 4.2 2.1 刮刀壓力 Kg 0.6 0.6 網印機機型 大敏精密DM2000A改良型 參照表1與圖1，表1為本發明之聚合物厚膜電阻膠體 O:\84\84447.DOC -13- 200428411 組成及其彳Φ哲 、丨王貝，圖1為本發明使用鋼板印刷所得之電阻膠 =的表面觀察結果，其中（A)、（Β)及（C)分別為本發明之實 她例、比較例1及比較例2之觀察結果。由表！中可知， 本發明貫施例中所製得的電阻膠體具有較高的黏度與搖變 才曰奏L。々In，. 、 卜如圖UA)所示，由於電阻膠體具有較高的黏 度入較佳的搖變特性，因此電阻膠體在完全硬化後的尺寸 外觀均几整，如，圖UB)所示，因電阻膠體的黏度太低，因 此在邊緣處會有暈開的現象發生；而如圖1(C)所示，因電 阻膠體的黏度稍低，因此在邊緣處會有齒狀現象發生。由 上述可知，本發明之词時添加導電碳黑與導電石墨的電阻 膠把組成物，具有良好的黏度和搖變指數，因此在使用網 版印刷與加熱固化之後，電阻的尺寸不變，具有良好的尺 寸安定性。 接著參〜照圖2，圖2為本發明之實施例使用鋼絲板印刷 所得之電阻膠體的表面觀察結果。如圖2所示，本發明實 施例所製得之電阻膠體組成物，在使用鋼絲網版印刷時， 不論是圓形、方形或轉角等處均具有良好的解析度，且線 支最細約可以印刷至6哩（mil)，約為〇· 15釐米（mm)寬，因 此本發明之組成物不論使用鋼板網版或鋼絲網版來形成電 阻膠體’均具有良好的解析度。 以下申請專利範圍係用以界定本發明之合理保護範圍。 $應明瞭者’技藝人士基於本發明之揭示所可達成之種種 顯而易見之改良，亦應歸屬本發明合理之保護範圍。 週^簡單說明 O:\84\84447.DOC -14- 200428411 圖1為本發明之實施例、比較例1及比較例2使用鋼板 印刷所得之電阻膠體，利用光學顯微錄觀察表面的結果。 圖2 ’為本發明之實施例使用鋼絲板印刷所得之電阻膠 體，利用光學顯微鏡觀察表面的結果。 O:\84\84447.DOC 15-O: \ 84 \ 84447.DOC 12- 200428411 Table 1 Polymer thick film resistor colloid composition (unit: phr.) And its properties Composition type Examples Comparative example 1 Comparative example 2 Per oxygen resin ERL4221 100 100 100 Liquid acid fiber 700G 90 90 90 Accelerator 2P4MZ-CNS 0.5 0.5 0.5 Conductive carbon black BP2000 0 5 0 BP3200 30 20 0 Conductive graphite: 45095 62.5 0 95 Viscosity (2 rpm) Unit: Cps. 630000 240000 500000 Shaking index (Ti) '5.1 5.0 4.2 Table 2 Screen printing conditions Project unit Stencil printing Wire mesh screen printing plate / emulsion thickness Mm 0.04 0.015 Tension NT 55 30 Mesh Mesh 325 Scraper material Stainless steel scraper Squeegee blade angle 60 60 Scraper speed cm / sec 4.2 2.1 Squeegee pressure Kg 0.6 0.6 Screen printing machine type Damin Precision DM2000A modified Table 1 and Figure 1, Table 1 is the polymer thick film resistor colloid O: \ 84 \ 84447.DOC -13- 200428411 composition and its 彳 Φ 哲, Wang Bei, Figure 1 is the surface observation result of the resist gel = obtained by using the steel plate printing of the present invention, in which (A), (B) and (C) are actual examples, comparative examples 1 and comparative examples of the present invention, respectively. Observation of 2 fruit. By the table! It can be seen that the resistive colloids prepared in the examples of the present invention have a high viscosity and shake before they are used. 々In,., As shown in Figure UA), because the resistive colloid has a higher viscosity and better shake characteristics, the size and appearance of the resistive colloid after curing is almost complete, as shown in Figure UB) Because the viscosity of the resistive colloid is too low, the phenomenon of halo will occur at the edges; as shown in Figure 1 (C), because the viscosity of the resistive colloid is slightly lower, toothing will occur at the edges. From the above, it can be known that the composition of the resistive rubber with conductive carbon black and conductive graphite added to the wording of the present invention has good viscosity and shake index. Therefore, after screen printing and heat curing, the size of the resistor does not change. Good dimensional stability. Then refer to FIG. 2, which is a surface observation result of the resistive colloid obtained by printing with a steel plate according to an embodiment of the present invention. As shown in FIG. 2, when the resistive colloidal composition obtained in the embodiment of the present invention is used in screen printing, it has a good resolution regardless of whether it is round, square, or corner, and the wire support is the finest. Can be printed to 6 miles (mil), about 0.15 cm (mm) wide, so the composition of the present invention has good resolution regardless of the use of steel screen or steel screen to form the resistive colloid '. The following patent application scope is used to define the reasonable protection scope of the present invention. The obvious improvements that an artisan can achieve based on the disclosure of the present invention should also belong to the reasonable protection scope of the present invention. Zhou ^ Brief explanation O: \ 84 \ 84447.DOC -14- 200428411 Figure 1 shows the results of observing the surface of a resistive colloid obtained by printing with a steel plate in Examples, Comparative Examples 1 and 2 of the present invention, using optical microscopy. Fig. 2 'is a result of observing the surface of a resistive gel obtained by printing with a steel plate according to an embodiment of the present invention using an optical microscope. O: \ 84 \ 84447.DOC 15-