1230949 玖、發明說明： 技術領域 本發明係關於一種聚合物厚膜電阻（p〇lymeii如以mm resistor)膠體組成物，具有良好的搖變特性（化丨如^叩力，且 不含有機或無機溶劑。由於該膠體組成物在烘烤硬化的過 程中，不會改變其電阻的尺寸及形狀，且表面也不會產生 %陷的現象，因.此可降低電阻阻值的變異性。 先前技術 隨著科技發展的日新月異，各項電子產品無不朝向輕薄 短小及高功能化的趨勢發展。為因應此一需求，主動元件 已由低階產品逐漸轉換成高階產品，且被動元件的需求數 量也相對地大幅增加。然而在電路基板面積日益縮小的情 況下’如何縮小被動元件的尺寸，已成為業界研發的目標。 電阻器、為廣泛使用的被動元件之_，其主要功能是用來 調整電器及電子產品内之電路電流或電壓大小，並限制電 流的流動。-般而言。電阻器可分為薄膜電阻及厚膜電阻 兩種。薄膜電阻主要生產方式以人工插件為主，例如碳膜 電阻'金屬膜電阻、繞線電阻及金屬氧化膜電阻等。而厚 膜電阻則多已朝向晶片化發展，包括晶片電阻、晶片排阻 及，.祠路包阻寺，其主要利用表面黏著技術（似⑹咖贈 technology，SMT)，以將多個厚膜電阻分別安裝在電路基板 上’由於採自動化生產，因此可有效降低人工成本，然而 Ί、有I&耗費時間較久，且尺寸縮小仍有限等缺點。 因此近年來業界大多使用聚合物厚膜電阻技術來製作埋1230949 发明, Description of the invention: TECHNICAL FIELD The present invention relates to a polymer thick film resistor (such as mm resistor) colloidal composition, which has good shake properties (such as chemical resistance, and does not contain organic or Inorganic solvent. Because the colloidal composition does not change the size and shape of its resistance during the baking and hardening process, and the surface does not have the phenomenon of sag, so it can reduce the variability of the resistance value. Previously With the rapid development of technology, all electronic products are trending toward lightness, thinness, shortness, and high functionality. In response to this demand, active components have gradually changed from low-level products to high-level products, and the number of passive components is required. It has also increased relatively. However, under the situation of the circuit substrate area becoming smaller, 'how to reduce the size of passive components has become the goal of industry research and development. Resistors, which are widely used passive components, are mainly used to adjust The current or voltage of circuits in electrical and electronic products, and restrict the flow of current.-Generally speaking, resistors can be divided into thin film electrical Resistance and thick film resistance. The main production methods of thin film resistors are mainly manual plug-ins, such as carbon film resistors, metal film resistors, wire wound resistors, and metal oxide film resistors. Thick film resistors have mostly developed into wafers. Including chip resistance, chip exclusion, and cilu package resistance temple, which mainly uses surface adhesion technology (similar to the technology), to install multiple thick film resistors on the circuit substrate respectively. Therefore, it can effectively reduce labor costs. However, there are disadvantages such as I & it takes a long time and the size reduction is still limited. Therefore, in recent years, the industry has mostly used polymer thick film resistor technology to make buried layers.
O:\84\84447.DOC 1230949 入式被動元件（embedded passives) 達到縮小被動元件之 目的，其最大的優點在於可以利用網印方式，—次將大量 的電阻膠體印在電路基板上、然後經由烘烤硬化=製成T 相較於傳統以表面黏著技術將獨立式被動元件⑷s⑽ passives)安裝在電路基板上，利用聚合物厚膜電心以節 省更多空間，且製程更為簡單。 習知製作聚合.物厚膜電阻膠體的方法，大多是使用兼具 紫外光及熱交聯性能之環氧樹脂為基材，結合導電顆粒及 其他添加劑’以製作出電阻值約為1G至⑽⑽歐姆⑼之 間的電阻膠體。然後經網版印刷或點膠製程將此電阻膠體 植入在電路基板上的電極之間，使之形成各自獨立的電阻 元件’再經過疊壓法（或增層法）的製程及導通孔的製程將線 路連貫起I，如此可將電路板的表面積縮小，@時增加產 品的性能―並降低成本。例如中華民國專利公告案第Μ”” 號即揭示一種聚合物厚膜電阻體組成物，其包含有導電金 屬粒子（銀粒子）、碳粒子及溶解於有機溶劑之熱塑性:脂 (苯氧基樹脂）’當孩組成物經由網印印於一基板上，再經過 加熱過程後，能有效地除去溶劑，以將該組成物轉變^固 體狀態。然而利用上述方法所形成之厚膜電阻，在去除有 機溶劑之後，會造成電阻的尺寸大幅地縮小，而導致電阻 尺寸無法固定，且其電阻阻值約會有1〇至3〇%的誤差產生。 在習知作法中，解決厚膜電阻尺寸安定性問題的方法不 外乎兩種，一是改變製程，例如中華民國專利公告案第 503681號中揭示，預先在一印刷電路基板上蝕刻形成預設O: \ 84 \ 84447.DOC 1230949 Embedded passives achieve the purpose of reducing passive components. The biggest advantage is that screen printing can be used to print a large amount of resistive colloid on the circuit board, and then pass Baking and hardening = making T. Compared with the traditional method of surface mount technology, the independent passive components (⑷s⑷ passives) are mounted on the circuit substrate. The polymer thick film core is used to save more space and the process is simpler. Known methods for making polymer thick film resistive colloids are mostly using epoxy resin with UV light and thermal cross-linking properties as the base material, combined with conductive particles and other additives to produce a resistance value of about 1G to ⑽⑽ Resistive colloid between ohms. Then, this resistive gel is implanted between the electrodes on the circuit substrate through screen printing or dispensing process, so as to form each independent resistive element, and then through the process of lamination (or build-up method) and the via hole. The manufacturing process continuously connects the lines to I, so that the surface area of the circuit board can be reduced, and the performance of the product can be increased @@, and the cost can be reduced. For example, the Republic of China Patent Bulletin No. "M" "discloses a polymer thick film resistor composition that includes conductive metal particles (silver particles), carbon particles, and a thermoplastic: lipid (phenoxy resin) dissolved in an organic solvent. ) 'When the composition is printed on a substrate via screen printing, and after a heating process, the solvent can be effectively removed to transform the composition into a solid state. However, the thickness of the thick film resistor formed by the above method, after removing the organic solvent, will cause the size of the resistor to be greatly reduced, resulting in that the size of the resistor cannot be fixed, and an error of 10 to 30% in its resistance value will occur. In the conventional practice, there are only two methods to solve the problem of dimensional stability of thick film resistors. One is to change the process. For example, it is disclosed in the Republic of China Patent Publication No. 503681 that a preset is etched on a printed circuit board to form a preset
O:\84\84447.DOC 1230949 電阻器圖樣的電阻空間及其他線路，再將電阻膠體均勻塗 亥基板之包阻空間以形成一電阻層，該電阻層具有預 定厚度及電阻值’然後烘烤硬化該電阻層。另一種方式為 ，變：料’例如美國專利第6,030,553號中提出一種聚合物 旱膜％阻，该電阻經網印成形後，需先使用紫外線曝光， :該電阻的外部硬化定型後’再經過加熱固化該電阻的内 ，結構，進而得·到尺寸安定的厚膜電阻。然而無論是改變 製程步驟或是更換電阻材料，均會增加製程步驟，而造成 製程成本的提高。因此業界仍企尋求—種具有良好的尺寸 安定性與較的電隊值，製程複雜性之電阻 膠體組成物。 發明内交 本！明之目的係提供一種聚合物厚膜電阻膠體組成物， 由於其不、含有機或無機溶劑，且因有良好的搖變特性，、因 此具有良好的尺寸安定性與穩定的電阻阻值。 本發明《另-目的在於提供—種在電路基板上植入聚合 物厚膜電阻膠體的方法，可減少製程步驟，降低成本。 f施方式 本發月之水合物厚膜電阻膠體組成物，其特徵為該組成 物不含有機或無機溶劑’其i變㈣（thix_pie index) I、； 4至9之間’較佳為5至7之間，且黏度範園介於 ，〇〇〇至2,000,000厘泊（cps)之間，較佳為6〇〇，_至 1，000,000 厘泊（CpS)之間。 本發明之聚合物電阻膠體組成物包含⑽重量份數之環O: \ 84 \ 84447.DOC 1230949 resistor space and other circuits of the resistor pattern, and then the resistive gel is evenly coated on the enclosing space of the substrate to form a resistive layer having a predetermined thickness and resistance value, and then baked The resistance layer is hardened. Another way is to change the material: for example, a polymer dry film% resistance is proposed in US Patent No. 6,030,553. After the resistance is formed by screen printing, it needs to be exposed by ultraviolet rays first: after the resistance of the resistance is hardened and shaped, then The internal structure of the resistor is cured by heating to obtain a thick-film resistor with stable dimensions. However, whether the process steps are changed or the resistance material is changed, the process steps will be increased, resulting in an increase in process costs. Therefore, the industry is still looking for a resistive colloidal composition with good dimensional stability, relatively low battery value, and complex process. Invented intercourse this! The purpose of the present invention is to provide a polymer thick film resistive colloidal composition, which, because it does not contain organic or inorganic solvents, and has good shake characteristics, therefore has good dimensional stability and stable resistance value. Another object of the present invention is to provide a method for implanting a polymer thick film resistor colloid on a circuit substrate, which can reduce manufacturing steps and reduce costs. f Application method The hydrate thick film resistive colloid composition of the present invention is characterized in that the composition does not contain organic or inorganic solvents 'its i becomes ㈣ (thix_pie index) I ,; between 4 and 9' is preferably 5 It is between 7 and 7, and the viscosity range is between 0.00 and 2,000,000 centipoise (cps), preferably between 600 and 1,000,000 centipoise (CpS). The polymer resistive colloidal composition of the present invention contains a ring of parts by weight.
O:\84\84447.DOC -8 - 1230949 氧樹脂；0.1至20重量份數之熱硬化促進劑；5至30重量 份數之導電碳黑；及1 0至95重量份數之導電石墨。 可用於本發明電阻膠體組成物中之環氧樹脂並無特殊限 制，其例如但非限於雙S分A型環氧樹脂（bisphenol A epoxy)，如EPON 828(殼牌石油化學）、EPON1001(殼牌石 油化學）及DER 331(陶氏化學）等；四溴雙酚A型環氧樹脂 (tetrabromobisph-enol A epoxy)，如 DIC 1 53(大曰本油墨）及 DIC 152(大曰本油墨）等；雙酚F型環氧樹脂（bisphenol F epoxy)，如EPON 862(殼牌石油化學）等；環脂族環氧樹脂 (cycloaliphatic epoxy)，如：ERL-4221(美國聯合碳化）及 VCMX(美國聯合碳化）等；二環戊二稀型環氧樹脂，如 XD-1000 2L(日本化藥）及HP-7200L(大日本油墨）等；多官 能基環氧樹脂（multi-functional epoxy)，如 EPPN 501(曰本 化藥）、E?PN 502H(日本化藥）及TFIC(安原化學）等；或含 環多官能基環氧樹脂（naphthalene-containing epoxy)，如 HP-4032(大日本油墨）及HP-4032D(大日本油墨）等，該等環 氧樹脂可單獨或混合使用。 可用於本發明電阻膠體組成物中之熱硬化促進劑例如但 非限於三氟化硼單乙胺複合物（BF3 · MEA)、咪唑 (imidazole)，例如2P4MZ-CNS(六和化學）、亞磷酸三苯酯 (triphenyl phosphite，TPP)、1，8-二氮雜雙環-(5，4,0)-十一-7-晞（1，8-(1132&131。>^(：1〇-(5,4,0)-1111(16(：-7-61^，〇811)和其鹽類’ 或乙酿醋酸銅（II)(copper(II) acetylactate)等，該等促進劑可 單獨或混合使用。 O:\84\84447.DOC -9- 1230949 應用於本發明電阻膠體組成物中之導電碳黑，其例如但 非限於高吸油量導電碳黑，如BP2000(台灣卡博特），或低 吸油量導電碳黑，如BP3200(台灣卡博特）。 可用於本發明電阻膠體組成物中之導電石墨，其粒徑小 於200篩目（mesh)，可商業購得之產品，例如但非限於45095 (台灣德固）。 此外，本發明.電阻膠體組成物可視需要添加70至95重 量份數的液態酸肝來作為硬化劑，例如六氫苯二甲酸 (Hexahydrophthalic anhydride，HHPA)、甲基六氫苯二甲酸 if (Methyl Hexahydrophthalic anhydride，MHHPA)或甲基四 氫苯二甲酸 gf (Methyl tetrahydrophthalic anhydride， ΜΤΉΡΑ)，此等液態酸if可單獨使用或混合使用，例如但非 限於 700G (清泰）【ΗΗΡΑ··ΜΗΗΡΑ=3··7】。 再者，丰發明電阻膠體組成物可視需要包含熟悉此，技 術者已知可用於電阻膠體組成物之添加劑，該等添加劑之 非限制性實例例如為分散劑、流平劑、搖變劑、金屬密著 劑或消泡劑。本發明亦提供一種在電路基板上植入聚合物 厚膜電阻膠體之方法，其係包含在該電路基板上蝕刻形成 所需的線路，接著覆蓋一模板，再利用一網版印刷製程， 將該電阻膠體組成物附著在該電路基板上，然後利用烘箱 或紅外線加熱使該電阻膠體組成物固化。在本發明中，電 路基板可為任何適合電子元件應用之基板，例如印刷電路 板（printed circuit board)或導線架（lead frame)等，而模板可 為鋼板、鋼絲板或尼龍板等。 O:\84\84447.DOC -10- 1230949 , 毛明之電阻膠體具有良好的搖變特性及黏度，因 政匕^其附著於雷久A ^ 改織，矣基板上時，電阻的尽寸基本上不會發生 欠 面5F無塌陷的現象，因此可直接完全加熱固化， 不需先將外部固化定型。 本於例將對本發明作進—步之說明"隹非用以限制 菸曰、、範園，任何熱悉本發明技術領域者，在不達背本 二月<精神下所得以達成之修飾及變化，均屬本發明之範 固0 例— 、，匕等只她例中，主要目的在於比較導電碳黑與導電石墨 的添加對於電阻《組絲之黏度與搖變指數之影響力Γ 在本發明之實施例中，係同時添加導電碳黑與導電石墨； •車乂例1中僅添加導電碳黑；而在比較例2中僅添加導 ^石墨。、亦即’本發明之製程條件的固定參數為：相同劑 量之環氧樹脂、液態酸酐、添加劑，及熱硬化促進劑，'變 異參數為··不同種類與劑量之導電碳黑，及不同劑量之導 田 电々墨° [實驗步驟] 1 ·先將叶Κ稼氧樹脂、液態酸肝，及添加劑加人附有攪 拌器之容器中，，然後在室溫下揽拌使其均勻混合，之後 、k緩加入熱硬化促進劑、導電碳黑，及導電石墨攪拌均 勻取後k過二/袞輪混練（three roll miii)，以製成電阻 高分子厚膜膠體（其組成見下表丨）。 在本發明之最佳實施例中，電阻膠體的黏度測量方式主O: \ 84 \ 84447.DOC -8-1230949 oxygen resin; 0.1 to 20 parts by weight of thermal curing accelerator; 5 to 30 parts by weight of conductive carbon black; and 10 to 95 parts by weight of conductive graphite. The epoxy resin that can be used in the resistive colloid composition of the present invention is not particularly limited, such as, but not limited to, double S-type A epoxy resin (bisphenol A epoxy), such as EPON 828 (Shell Petrochemical), EPON1001 (Shell Petroleum Chemistry) and DER 331 (Dow Chemical), etc .; tetrabromobisph-enol A epoxy, such as DIC 1 53 (Japanese ink) and DIC 152 (Japanese ink); Bisphenol F epoxy, such as EPON 862 (Shell Petrochemical), etc .; cycloaliphatic epoxy, such as: ERL-4221 (United States Carbonization) and VCMX (United States Carbonization) ), Etc .; Dicyclopentadiene epoxy resin, such as XD-1000 2L (Japanese Chemicals) and HP-7200L (Da Nihon Ink), etc .; multi-functional epoxy resin (such as EPPN 501) (Japanese chemical), E? PN 502H (Japanese chemical) and TFIC (Anyuan Chemical), etc .; or cyclic polyfunctional epoxy resin (naphthalene-containing epoxy), such as HP-4032 (Danippon Ink) and HP-4032D (Da Nihon Ink), etc. These epoxy resins can be used alone or in combination. Thermal hardening accelerators that can be used in the resistive colloid composition of the present invention such as, but not limited to, boron trifluoride monoethylamine complex (BF3 · MEA), imidazole, such as 2P4MZ-CNS (Liuhe Chemical), phosphorous acid Triphenyl phosphite (TPP), 1,8-diazabicyclo- (5,4,0) -undec-7-fluorene (1,8- (1132 & 131.) ^ (: 1〇 -(5,4,0) -1111 (16 (:-7-61 ^, 〇811) and its salts' or copper (II) acetate (copper (II) acetylactate), etc. Used alone or in mixture. O: \ 84 \ 84447.DOC -9-1230949 The conductive carbon black used in the resistive colloid composition of the present invention, such as but not limited to high oil absorption conductive carbon black, such as BP2000 (Taiwan Cabot) ), Or low carbon oil-absorbing conductive carbon black, such as BP3200 (Cabot, Taiwan). The conductive graphite that can be used in the resistive colloid composition of the present invention has a particle size of less than 200 mesh, a commercially available product, For example, but not limited to 45095 (Degu, Taiwan). In addition, according to the present invention, the resistive colloid composition may be added with 70 to 95 parts by weight of liquid acid liver as a sclerosing agent, such as hexahydroxylylene. (Hexahydrophthalic anhydride, HHPA), Methyl Hexahydrophthalic anhydride (MHHPA), or methyl tetrahydrophthalic acid gf (Methyl tetrahydrophthalic anhydride, MTHPA). These liquid acids if can be used alone or in combination. For example, but not limited to 700G (Qingtai) [ΗΗΡΑ ·· ΜΗΗΡΑ = 3 ·· 7]. Furthermore, Feng Feng's resistive colloid composition may optionally include additives familiar to the person skilled in the art. Non-limiting examples of additives such as dispersants, leveling agents, shakers, metal adhesives or defoamers. The invention also provides a method for implanting a polymer thick film resistor colloid on a circuit substrate, which The method includes etching and forming a desired circuit on the circuit substrate, then covering a template, and then using a screen printing process to attach the resistive colloid composition to the circuit substrate, and then using an oven or infrared heating to make the resistive colloid. The composition is cured. In the present invention, the circuit substrate may be any substrate suitable for electronic component applications, such as printing Printed circuit board or lead frame, etc., and the template can be steel plate, steel wire plate or nylon plate, etc. O: \ 84 \ 84447.DOC -10- 1230949, Mao Ming's resistive gel has good shaking Variation characteristics and viscosity, due to its attachment to Lei Jiu A ^ re-textured, when the substrate is placed on the substrate, the resistance of the substrate will not occur under the 5F without collapse, so it can be directly cured by heating. First set the external curing. This example will make a further description of the present invention-"It is not used to restrict the smoke, fan garden, anyone who knows the technical field of the present invention well, without reaching the spirit of this February". Modifications and changes are all examples of the present invention. In the case of 、, 匕, 匕, and other examples, the main purpose is to compare the influence of the addition of conductive carbon black and conductive graphite on the resistance of the "viscosity of the filament and the shake index Γ" In the embodiment of the present invention, conductive carbon black and conductive graphite are added at the same time; • Only conductive carbon black is added in Car Example 1; and only conductive graphite is added in Comparative Example 2. That is, the fixed parameters of the process conditions of the present invention are: epoxy resin, liquid acid anhydride, additives, and thermal hardening accelerators of the same dosage, and the variation parameters are: conductive carbon black of different types and dosages, and different dosages Zhi Da Tian Dian Mo ° [Experimental Procedures] 1 · First add leaf ketamine oxygen resin, liquid acid liver, and additives to a container with a stirrer, and then mix at room temperature to make it evenly mixed. After that, k is slowly added to the heat hardening accelerator, conductive carbon black, and conductive graphite, and the conductive graphite is stirred evenly. After k is mixed for three roll miii, it is made into a resistive polymer thick film colloid (the composition is shown in the table below 丨). In the preferred embodiment of the present invention, the viscosity measuring method of the resistive colloid is mainly
O:\84\84447.DOC -11 - 1230949 要是利用黏度計機台（Bro〇kfield DV-I+ Viscometer)來測 量黏度。機台之操作參數如下：測暈轉針編號為七號（高 黏度用）’黏度測量轉速使用低轉速（2 rpm)和高轉速（2〇 r*pm)兩種。此外，搖變指數的計算方式為低轉速測量時 得到的黏度和高轉速測量得到的黏度之比值。茲將實施 例、比較例1，及比較例2測得之結果進一步說明如表1 中。 2·再將電阻膠體利用網印的方式（網印的條件如表2所 不）’印刷在含有線路的電路基板上，然後利用烘箱加熱 万式，以溫度約為·工⑼它烘烤該電阻膠體約九十分鐘， 使其完全固化。 3·取後利用光學顯微鏡，例如〇卜叫^3 ΒΗ_2 ,以倍數 來觀察已固化的厚膜電阻之外觀，觀察的結果 圖2所示。O: \ 84 \ 84447.DOC -11-1230949 If you use a viscometer machine (Brokfield DV-I + Viscometer) to measure the viscosity. The operating parameters of the machine are as follows: The number of the halo rotating needle is No. 7 (for high viscosity). The viscosity measurement speed uses low speed (2 rpm) and high speed (20 r * pm). In addition, the shake index is calculated as the ratio of the viscosity obtained during low-speed measurement to the viscosity obtained during high-speed measurement. The results measured in Examples, Comparative Examples 1, and 2 are further described in Table 1. 2. Then use the screen printing method (screen printing conditions are not shown in Table 2) on the circuit substrate containing the circuit, and then use an oven to heat the Wan type, and bake it at a temperature of about The resistive colloid is about ninety minutes to fully cure. 3. After taking it, use an optical microscope, such as 〇 ^^ 3 ΒΗ_2, to observe the appearance of the cured thick film resistor in multiples. The results are shown in Figure 2.
O:\84\84447.DOC 12- 1230949 表1 聚合物厚膜電阻膠體組成（單位：phr.)及其性質 組成物種類 實施例 比較例1 比較例2 環氧樹脂’ ERL4221 100 100 100 液態酸酐 700G 90 90 90 促進劑 2P4MZ-CNS 0.5 0.5 0.5 導電碳黑 BP2000 0 5 0 BP3200 30 20 0 導電石墨 45095 62.5 0 95 黏度(2rpm)單位：Cps. 630000 240000 500000 搖變指數(Ti) ’ 5.1 5.0 4.2 表2 網印條件 項目 單位 鋼板印刷 鋼絲網板印刷 鋼板/乳劑厚痩 Mm 0.04 0.015 張力 NT 55 30 網目 Mesh 325 刮刀材質 不銹鋼刮刀 膠刮刀 刮刀角度 60 60 刮刀速度 cm/sec 4.2 2.1 刮刀壓力 Kg 0.6 0.6 網印機機型 大敏精密DM2000A改良型 參照表1與圖1，表1為本發明之聚合物厚膜電阻膠體 O:\84\84447.DOC -13- 1230949 ’成及"丨生貝，圖1為本發明使用鋼板印刷所得之電阻膠 體的表面觀察結果’其中⑷、⑻及（C)分別為本發明之實 她例比車义例1及比較例2之觀察結果。由表！中可知， ^發明實施財㈣得的電阻膠體具有較高的黏度與搖變 “數n如圖1(A)所示’由於電阻膠體具有較高的黏 度與較佳的搖變4性，因此電阻膠體在完全硬化後的尺寸 外觀均完整’·如.圖1(B)所示，因電阻膠體的黏度太低，因 此在邊緣處會有暈開的現象發生；而如圖2⑹所示，因電 阻膠to的黏度稍低，因此在邊緣處會有齒狀現象發生。由 上述可知，本發明之，同時添加導電碳黑與導電石墨的電阻 膠體組成物’具有良好的黏度和搖變指數，因此在使用網 版印刷與加熱固化之後，電阻的尺寸不t，具彳良好的尺 寸安定性。 接著參Μ圖2，圖2為本發明之實施例使用鋼絲板即刷 所得之電阻膠體的表面觀察結果。如圖2所示，本發明實 施例所製得之電阻膠體組成物，在使用鋼絲網版印刷時， 不論是圓形、方形或轉角等處均具有良好的解析度，且線 寬最細約可以印刷至6哩（mil)，約為〇.15釐米（mm)寬，因 此本發明之組成物不論使用鋼板網版或鋼絲網版來形成電 阻膠體’均具有良好的解析度。 以下申。目專利範圍係用以界定本發明之合理保護範圍。 然應明瞭者，技藝人士基於本發明之揭示所可達成之種種 顯而易見之改良，亦應歸屬本發明合理之保護範圍。 圖式簡單說明 O:\84\84447.DOC -14 - 1230949 圖1為本發明之實施例、比較例1及比較例2使用鋼板 印刷所得之電阻膠體，利用光學顯微錄觀察表面的結果。 圖2 ’為本發明之實施例使用鋼絲板印刷所得之電阻膠 體，利用光學顯微鏡觀察表面的結果。 O:\84\84447.DOC 15-O: \ 84 \ 84447.DOC 12- 1230949 Table 1 Polymer thick film resistor colloid composition (unit: phr.) And its properties Composition type Examples Comparative example 1 Comparative example 2 Epoxy resin 'ERL4221 100 100 100 Liquid acid anhydride 700G 90 90 90 Accelerator 2P4MZ-CNS 0.5 0.5 0.5 Conductive carbon black BP2000 0 5 0 BP3200 30 20 0 Conductive graphite 45095 62.5 0 95 Viscosity (2rpm) Unit: Cps. 630000 240000 500000 Shake index (Ti) '5.1 5.0 4.2 Table 2 Screen printing conditions Project unit Stencil printing Steel screen printing plate / emulsion thickness 痩 Mm 0.04 0.015 Tension NT 55 30 Mesh Mesh 325 Scraper material Stainless steel scraper Squeegee blade angle 60 60 Scraper speed cm / sec 4.2 2.1 Squeegee pressure Kg 0.6 0.6 Screen printing machine model Damin Precision DM2000A improved refer to Table 1 and Figure 1. Table 1 is the polymer thick film resistor colloid of the present invention O: \ 84 \ 84447.DOC -13-1230949 '成 和 " 丨 Sheng Bei, FIG. 1 is the surface observation result of the resistive colloid obtained by using the steel plate printing of the present invention, where ⑷, ⑻, and (C) are the observation results of the actual example of the present invention, the car example 1, and the comparative example 2, respectively. By the table! It can be seen that the resistive colloid obtained by the invention has a higher viscosity and shake. "The number n is shown in Figure 1 (A)." Because the resistive colloid has a higher viscosity and better shake resistance, so The size and appearance of the resistive gel after it is completely hardened are complete. As shown in Figure 1 (B), because the viscosity of the resistive gel is too low, halo will occur at the edges; as shown in Figure 2⑹, Because the viscosity of the resistive gel to is slightly lower, toothing will occur at the edges. From the above, it can be known that the resistive colloid composition 'with the addition of conductive carbon black and conductive graphite in the present invention has good viscosity and shake index. Therefore, after using screen printing and heating and curing, the size of the resistor is not t, and has good dimensional stability. Then refer to FIG. 2, which is an example of the resistive gel obtained by using a steel plate and brush in the embodiment of the present invention. Surface observation results. As shown in FIG. 2, when the resistive colloidal composition obtained in the embodiment of the present invention is used in screen printing, it has a good resolution, regardless of whether it is round, square, or corner. The narrowest width is about Printed to 6 miles (mil), approximately 0.15 centimeters (mm) wide, so the composition of the present invention has a good resolution regardless of whether it uses a steel screen or steel screen to form a resistive colloid. The patent scope is used to define the reasonable protection scope of the present invention. However, it should be clear that the obvious improvements that can be achieved by the skilled artisan based on the disclosure of the present invention should also belong to the reasonable protection scope of the present invention. The diagram briefly explains O: \ 84 \ 84447.DOC -14-1230949 Figure 1 shows the results of observing the surface with optical microscopy using resistive colloids obtained by using steel plate printing in Examples, Comparative Examples 1 and 2 of the present invention. Figure 2 'This invention In the example, the result is a resistive colloid obtained by printing on a steel plate, and the surface is observed with an optical microscope. O: \ 84 \ 84447.DOC 15-