SI2143139T1 - Hladilna doza za komponente ali vezja - Google Patents
Hladilna doza za komponente ali vezjaInfo
- Publication number
- SI2143139T1 SI2143139T1 SI200832089T SI200832089T SI2143139T1 SI 2143139 T1 SI2143139 T1 SI 2143139T1 SI 200832089 T SI200832089 T SI 200832089T SI 200832089 T SI200832089 T SI 200832089T SI 2143139 T1 SI2143139 T1 SI 2143139T1
- Authority
- SI
- Slovenia
- Prior art keywords
- circuits
- components
- cooling box
- cooling
- box
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D27/00—Lighting arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007020170 | 2007-04-26 | ||
EP08736309.9A EP2143139B1 (de) | 2007-04-26 | 2008-04-17 | Kühldose für bauelemente oder schaltungen |
PCT/EP2008/054641 WO2008132056A1 (de) | 2007-04-26 | 2008-04-17 | Kühldose für bauelemente oder schaltungen |
Publications (1)
Publication Number | Publication Date |
---|---|
SI2143139T1 true SI2143139T1 (sl) | 2019-11-29 |
Family
ID=39590489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SI200832089T SI2143139T1 (sl) | 2007-04-26 | 2008-04-17 | Hladilna doza za komponente ali vezja |
Country Status (11)
Country | Link |
---|---|
US (2) | US8630092B2 (sl) |
EP (2) | EP2535928A3 (sl) |
JP (2) | JP2010526427A (sl) |
KR (2) | KR20100017414A (sl) |
CN (1) | CN101689537B (sl) |
AU (1) | AU2008244383B2 (sl) |
DE (1) | DE102008001230A1 (sl) |
DK (1) | DK2143139T3 (sl) |
HU (1) | HUE046347T2 (sl) |
SI (1) | SI2143139T1 (sl) |
WO (1) | WO2008132056A1 (sl) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008001228A1 (de) * | 2007-04-24 | 2008-10-30 | Ceramtec Ag | Verfahren zum Herstellen eines Verbundes mit zumindest einem nicht plattenförmigen Bauteil |
EP2535928A3 (de) * | 2007-04-26 | 2014-08-20 | CeramTec GmbH | Kühldose für Bauelemente oder Schaltungen |
DE102009036122B4 (de) * | 2009-08-05 | 2011-07-21 | BJB GmbH & Co. KG, 59755 | Lampensockel und Lampenfassung |
CN103547850A (zh) * | 2011-03-29 | 2014-01-29 | 陶瓷技术有限责任公司 | 具有陶瓷冷却器和led的浇注灯体 |
JP5447433B2 (ja) * | 2011-05-13 | 2014-03-19 | 株式会社安川電機 | 電子機器および電子機器が設けられた電力変換装置 |
CN102270679A (zh) * | 2011-07-28 | 2011-12-07 | 容云 | 支撑件、支撑组件及太阳能光伏集光器与led发光装置 |
CN102270690A (zh) * | 2011-07-28 | 2011-12-07 | 容云 | 太阳能利用装置 |
WO2013061409A1 (ja) | 2011-10-25 | 2013-05-02 | 富士通株式会社 | 水冷装置、水冷装置を有する電子機器、及び水冷方法 |
EP2772717B1 (en) * | 2011-10-28 | 2019-02-27 | Kyocera Corporation | Channel member, heat exchanger, and semiconductor unit including the same |
US9255741B2 (en) * | 2012-01-26 | 2016-02-09 | Lear Corporation | Cooled electric assembly |
CN102748624A (zh) * | 2012-06-28 | 2012-10-24 | 王干 | 一种长度可调拔插式led灯管装置 |
KR101375956B1 (ko) * | 2012-07-05 | 2014-03-18 | 엘에스산전 주식회사 | 자동차용 전장부품 박스 |
DE102012106244B4 (de) * | 2012-07-11 | 2020-02-20 | Rogers Germany Gmbh | Metall-Keramik-Substrat |
JP6094015B2 (ja) * | 2013-04-12 | 2017-03-15 | ホシデン株式会社 | 端子ボックス |
CN105164873A (zh) * | 2013-05-02 | 2015-12-16 | 皇家飞利浦有限公司 | 用于冷却激光装置的冷却设备和包括冷却设备的激光*** |
CN105308742B (zh) * | 2013-11-28 | 2018-04-03 | 富士电机株式会社 | 半导体组件用冷却器的制造方法、半导体组件用冷却器、半导体组件和电驱动车辆 |
CN103672515B (zh) * | 2013-12-10 | 2016-02-03 | 林英强 | 一种高效散热的led灯泡 |
CN103672516B (zh) * | 2013-12-11 | 2016-08-17 | 佛山市大明照明电器有限公司 | 一种led灯及控制*** |
FR3015178B1 (fr) * | 2013-12-13 | 2016-01-01 | Sagemcom Broadband Sas | Equipement electronique a double refroidissement |
CN103672520B (zh) * | 2013-12-18 | 2016-01-13 | 宁波市柯玛士电器实业有限公司 | 一种led感应灯 |
CN103672521B (zh) * | 2013-12-20 | 2016-09-14 | 陈琦 | 一种双向调配光模组 |
CN103672522B (zh) * | 2013-12-23 | 2015-11-25 | 天津中环电子照明科技有限公司 | 智能镜面led平板灯 |
CN103672523B (zh) * | 2013-12-23 | 2015-12-30 | 天津中环电子照明科技有限公司 | 带应急功能的led面包灯 |
CN203827682U (zh) * | 2014-04-24 | 2014-09-10 | 中兴通讯股份有限公司 | 一种移动通信终端 |
CN107004921B (zh) * | 2014-11-24 | 2020-07-07 | 陶瓷技术有限责任公司 | 在电动交通领域中的热管理 |
DE102015106552B4 (de) * | 2015-04-28 | 2022-06-30 | Infineon Technologies Ag | Elektronisches Modul mit Fluid-Kühlkanal und Verfahren zum Herstellen desselben |
DE102015107489B4 (de) * | 2015-05-12 | 2020-07-02 | Infineon Technologies Ag | Verfahren zur Reduzierung des Schichtwiderstands in einer elektronischen Vorrichtung |
FR3046022B1 (fr) * | 2015-12-17 | 2019-06-28 | Valeo Siemens Eautomotive France Sas | Circuit de refroidissement et dispositif electrique comprenant le circuit de refroidissement |
EP3206468B1 (de) * | 2016-02-15 | 2018-12-26 | Siemens Aktiengesellschaft | Umrichter mit gleichspannungszwischenkreis |
DE102017003854A1 (de) * | 2017-04-20 | 2018-10-25 | Leopold Kostal Gmbh & Co. Kg | Gehäuse für ein elektrisches oder elektronisches Gerät |
CN109413932A (zh) * | 2017-08-18 | 2019-03-01 | 鹏鼎控股(深圳)股份有限公司 | 散热结构及其制作方法 |
EP3929976A4 (en) * | 2019-03-22 | 2022-04-20 | Showa Denko Materials Co., Ltd. | COOLING STRUCTURE |
CN112444098A (zh) * | 2020-10-08 | 2021-03-05 | 中山市光大光学仪器有限公司 | 一种冷却台及其急速冷却方法 |
CN114699874B (zh) * | 2020-12-16 | 2023-04-07 | 上海协微环境科技有限公司 | 一种反应副产品收集***及方法 |
DE102021109617A1 (de) | 2021-04-16 | 2022-10-20 | Bayerische Motoren Werke Aktiengesellschaft | Kühlvorrichtung und Verfahren zum Herstellen einer Kühlvorrichtung |
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DE3604074A1 (de) * | 1986-02-08 | 1987-08-13 | Bosch Gmbh Robert | Zuendschaltgeraet |
DE3709200A1 (de) * | 1987-03-20 | 1988-09-29 | Heraeus Gmbh W C | Elektronisches bauteil |
US5001299A (en) * | 1989-04-17 | 1991-03-19 | Explosive Fabricators, Inc. | Explosively formed electronic packages |
DE9110268U1 (de) | 1991-02-23 | 1991-11-07 | ABB Patent GmbH, 6800 Mannheim | Anordnung mit flüssigkeitsgekühltem, elektrischem Leistungswiderstand |
DE9201158U1 (de) * | 1992-01-31 | 1992-03-26 | ABB Patent GmbH, 6800 Mannheim | Flüssigkeitskühldose aus zwei Keramikdosenhälften |
DE29514012U1 (de) | 1994-08-03 | 1995-11-02 | ANCeram GmbH & Co KG, 95463 Bindlach | Halbzeug aus einer Aluminiumnitridkeramik als Träger mit einer auf mindestens einer seiner Flächen aufgebrachten Leitschicht |
JPH08139480A (ja) * | 1994-11-08 | 1996-05-31 | Mitsubishi Materials Corp | ヒートパイプ構造を有する放熱性セラミック基板 |
US5566055A (en) * | 1995-03-03 | 1996-10-15 | Parker-Hannifin Corporation | Shieled enclosure for electronics |
DE19527674C2 (de) | 1995-07-31 | 2000-11-02 | Anceram Gmbh & Co Kg | Kühleinrichtung |
DE19643717A1 (de) * | 1996-10-23 | 1998-04-30 | Asea Brown Boveri | Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul |
US6136128A (en) * | 1998-06-23 | 2000-10-24 | Amerasia International Technology, Inc. | Method of making an adhesive preform lid for electronic devices |
WO2001059544A2 (en) * | 2000-02-14 | 2001-08-16 | Rainbow Technologies B.V., Netherlands | Security module system, apparatus and process |
EP1225633A1 (de) * | 2001-01-22 | 2002-07-24 | ABB Schweiz AG | Heat sink for cooling a power semiconductor device and method of manufacturing such a heat sink |
JP3773797B2 (ja) * | 2001-03-02 | 2006-05-10 | 三洋電機株式会社 | コールドプレートの連結構造及び連結方法 |
JP3556175B2 (ja) * | 2001-03-09 | 2004-08-18 | 株式会社日立製作所 | 半導体モジュール及び電力変換装置 |
JP2002329938A (ja) * | 2001-04-27 | 2002-11-15 | Kyocera Corp | セラミック回路基板 |
DE10334354B4 (de) | 2002-07-25 | 2016-12-22 | Gva Leistungselektronik Gmbh | Anordnung, enthaltend einen Flüssigkeitskühler und ein Leistungshalbleiter-Element |
JP2004116871A (ja) * | 2002-09-25 | 2004-04-15 | Sony Corp | 熱輸送体および熱輸送体を有する電子機器 |
JP4325263B2 (ja) * | 2003-04-21 | 2009-09-02 | ソニー株式会社 | 回路装置及び電子機器 |
US7129422B2 (en) * | 2003-06-19 | 2006-10-31 | Wavezero, Inc. | EMI absorbing shielding for a printed circuit board |
JP4543279B2 (ja) * | 2004-03-31 | 2010-09-15 | Dowaメタルテック株式会社 | アルミニウム接合部材の製造方法 |
US6989991B2 (en) * | 2004-05-18 | 2006-01-24 | Raytheon Company | Thermal management system and method for electronic equipment mounted on coldplates |
JP4549759B2 (ja) * | 2004-07-08 | 2010-09-22 | 富士通株式会社 | 冷却モジュール |
JP2006066464A (ja) * | 2004-08-24 | 2006-03-09 | Toyota Industries Corp | 半導体装置 |
US7168152B1 (en) * | 2004-10-18 | 2007-01-30 | Lockheed Martin Corporation | Method for making an integrated active antenna element |
JP4710460B2 (ja) * | 2005-07-20 | 2011-06-29 | 株式会社村田製作所 | セラミック多層基板、その製造方法、およびパワー半導体モジュール |
US7551439B2 (en) * | 2006-03-28 | 2009-06-23 | Delphi Technologies, Inc. | Fluid cooled electronic assembly |
DE112007000768T5 (de) * | 2006-03-30 | 2009-02-12 | Cooligy, Inc., Mountain View | Integriertes Modul für die Flüssigkeits-Luft-Leitung |
US8004860B2 (en) * | 2006-08-29 | 2011-08-23 | Texas Instruments Incorporated | Radiofrequency and electromagnetic interference shielding |
JP5112101B2 (ja) * | 2007-02-15 | 2013-01-09 | 株式会社東芝 | 半導体パッケージ |
EP2535928A3 (de) * | 2007-04-26 | 2014-08-20 | CeramTec GmbH | Kühldose für Bauelemente oder Schaltungen |
US8031485B2 (en) * | 2007-09-07 | 2011-10-04 | Autosplice, Inc. | Electronic shielding apparatus and methods |
US7916484B2 (en) * | 2007-11-14 | 2011-03-29 | Wen-Long Chyn | Heat sink having enhanced heat dissipation capacity |
US7974099B2 (en) * | 2007-11-19 | 2011-07-05 | Nexxus Lighting, Inc. | Apparatus and methods for thermal management of light emitting diodes |
US8130499B2 (en) * | 2007-11-30 | 2012-03-06 | Panasonic Corporation | Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board |
US7817428B2 (en) * | 2008-06-27 | 2010-10-19 | Greer Jr David Randall | Enclosure with integrated heat wick |
US8081467B2 (en) * | 2008-08-20 | 2011-12-20 | Sri Hermetics Inc. | Electronics package including heat sink in the housing and related methods |
US9196588B2 (en) * | 2011-11-04 | 2015-11-24 | Invensas Corporation | EMI shield |
-
2008
- 2008-04-17 EP EP12184416.1A patent/EP2535928A3/de not_active Withdrawn
- 2008-04-17 US US12/596,849 patent/US8630092B2/en not_active Expired - Fee Related
- 2008-04-17 DE DE102008001230A patent/DE102008001230A1/de not_active Ceased
- 2008-04-17 WO PCT/EP2008/054641 patent/WO2008132056A1/de active Application Filing
- 2008-04-17 JP JP2010504636A patent/JP2010526427A/ja active Pending
- 2008-04-17 HU HUE08736309A patent/HUE046347T2/hu unknown
- 2008-04-17 AU AU2008244383A patent/AU2008244383B2/en not_active Ceased
- 2008-04-17 CN CN2008800219187A patent/CN101689537B/zh active Active
- 2008-04-17 EP EP08736309.9A patent/EP2143139B1/de active Active
- 2008-04-17 SI SI200832089T patent/SI2143139T1/sl unknown
- 2008-04-17 DK DK08736309.9T patent/DK2143139T3/da active
- 2008-04-17 KR KR1020097024729A patent/KR20100017414A/ko not_active Application Discontinuation
- 2008-04-17 KR KR1020157005361A patent/KR20150036793A/ko not_active Application Discontinuation
-
2013
- 2013-12-06 US US14/098,850 patent/US20140104811A1/en not_active Abandoned
-
2014
- 2014-05-26 JP JP2014108235A patent/JP2014160873A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20100017414A (ko) | 2010-02-16 |
US8630092B2 (en) | 2014-01-14 |
EP2143139B1 (de) | 2019-06-19 |
CN101689537B (zh) | 2013-08-21 |
HUE046347T2 (hu) | 2020-02-28 |
DK2143139T3 (da) | 2019-09-23 |
CN101689537A (zh) | 2010-03-31 |
US20100163210A1 (en) | 2010-07-01 |
JP2010526427A (ja) | 2010-07-29 |
AU2008244383A1 (en) | 2008-11-06 |
EP2143139A1 (de) | 2010-01-13 |
US20140104811A1 (en) | 2014-04-17 |
EP2535928A2 (de) | 2012-12-19 |
AU2008244383B2 (en) | 2013-05-30 |
KR20150036793A (ko) | 2015-04-07 |
DE102008001230A1 (de) | 2008-10-30 |
WO2008132056A1 (de) | 2008-11-06 |
JP2014160873A (ja) | 2014-09-04 |
EP2535928A3 (de) | 2014-08-20 |
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