SG93233A1 - Electrolytic copper plating solutions - Google Patents

Electrolytic copper plating solutions

Info

Publication number
SG93233A1
SG93233A1 SG200001790A SG200001790A SG93233A1 SG 93233 A1 SG93233 A1 SG 93233A1 SG 200001790 A SG200001790 A SG 200001790A SG 200001790 A SG200001790 A SG 200001790A SG 93233 A1 SG93233 A1 SG 93233A1
Authority
SG
Singapore
Prior art keywords
copper plating
electrolytic copper
plating solutions
solutions
electrolytic
Prior art date
Application number
SG200001790A
Other languages
English (en)
Inventor
R Barstad Leon
E Rychwalski James
Lefebvre Mark
Menard Stephane
L Martin James
A Schetty Robert Iii
Toben Michael
Original Assignee
Shipley Co Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Llc filed Critical Shipley Co Llc
Publication of SG93233A1 publication Critical patent/SG93233A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
SG200001790A 1999-05-17 2000-03-30 Electrolytic copper plating solutions SG93233A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/313,045 US6444110B2 (en) 1999-05-17 1999-05-17 Electrolytic copper plating method

Publications (1)

Publication Number Publication Date
SG93233A1 true SG93233A1 (en) 2002-12-17

Family

ID=23214138

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200001790A SG93233A1 (en) 1999-05-17 2000-03-30 Electrolytic copper plating solutions

Country Status (7)

Country Link
US (3) US6444110B2 (de)
EP (1) EP1054080B1 (de)
JP (1) JP2001003191A (de)
KR (1) KR100514251B1 (de)
CN (1) CN1260398C (de)
SG (1) SG93233A1 (de)
TW (1) TWI245816B (de)

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WO2020006761A1 (zh) * 2018-07-06 2020-01-09 力汉科技有限公司 电解液、使用该电解液以电沉积制备单晶铜的方法以及电沉积设备
CN110306214A (zh) * 2019-07-05 2019-10-08 东莞市斯坦得电子材料有限公司 一种用于高纵横比孔径印制线路板通孔电镀的反向脉冲镀铜工艺
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CN110983389B (zh) * 2019-12-31 2020-11-13 广州三孚新材料科技股份有限公司 一种钢铁件无氰碱性电镀铜液及其制备方法
CN111962109A (zh) * 2020-08-20 2020-11-20 苏州大学 一种酸铜添加剂及其制备方法
CN114003009B (zh) * 2021-10-29 2024-01-12 中国联合网络通信集团有限公司 沉铜控制方法、沉铜控制模型的训练方法及装置

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Also Published As

Publication number Publication date
KR20000077270A (ko) 2000-12-26
JP2001003191A (ja) 2001-01-09
EP1054080B1 (de) 2017-04-12
US20060065537A1 (en) 2006-03-30
TWI245816B (en) 2005-12-21
EP1054080A2 (de) 2000-11-22
US6444110B2 (en) 2002-09-03
CN1260398C (zh) 2006-06-21
US20030010646A1 (en) 2003-01-16
CN1274021A (zh) 2000-11-22
US20010047943A1 (en) 2001-12-06
EP1054080A3 (de) 2004-03-03
KR100514251B1 (ko) 2005-09-13

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