SG155825A1 - Machining quality judging method for wafer grinding machine and wafer grinding machine - Google Patents

Machining quality judging method for wafer grinding machine and wafer grinding machine

Info

Publication number
SG155825A1
SG155825A1 SG200808159-8A SG2008081598A SG155825A1 SG 155825 A1 SG155825 A1 SG 155825A1 SG 2008081598 A SG2008081598 A SG 2008081598A SG 155825 A1 SG155825 A1 SG 155825A1
Authority
SG
Singapore
Prior art keywords
wafer
grinding machine
wafer grinding
machining quality
quality judging
Prior art date
Application number
SG200808159-8A
Other languages
English (en)
Inventor
Motoi Nedu
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of SG155825A1 publication Critical patent/SG155825A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
SG200808159-8A 2008-03-21 2008-10-31 Machining quality judging method for wafer grinding machine and wafer grinding machine SG155825A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008074009A JP5219569B2 (ja) 2008-03-21 2008-03-21 ウェーハ研削装置における加工良否判定方法およびウェーハ研削装置

Publications (1)

Publication Number Publication Date
SG155825A1 true SG155825A1 (en) 2009-10-29

Family

ID=41060731

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200808159-8A SG155825A1 (en) 2008-03-21 2008-10-31 Machining quality judging method for wafer grinding machine and wafer grinding machine

Country Status (6)

Country Link
US (1) US8055374B2 (zh)
JP (1) JP5219569B2 (zh)
KR (1) KR101038548B1 (zh)
DE (1) DE102008060199A1 (zh)
SG (1) SG155825A1 (zh)
TW (1) TWI411030B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5311858B2 (ja) * 2008-03-27 2013-10-09 株式会社東京精密 ウェーハの研削方法並びにウェーハ研削装置
JP5761943B2 (ja) * 2010-03-25 2015-08-12 株式会社東京精密 仕上研削装置および仕上研削方法
JP6388545B2 (ja) * 2015-01-16 2018-09-12 株式会社ディスコ 被加工物の研削方法
JP6719825B2 (ja) * 2016-10-12 2020-07-08 株式会社ディスコ 研削装置及びウェーハの加工方法
JP7242141B2 (ja) * 2019-06-24 2023-03-20 株式会社ディスコ 被加工物の加工方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4316313C1 (de) * 1993-05-15 1994-12-08 Alexander Bromme Verfahren und Anordnung zur Qualitätsüberwachung des Schleifprozesses
JP2005021997A (ja) * 2003-06-30 2005-01-27 Komatsu Machinery Corp 研削加工装置及び研削加工方法
JP2006035406A (ja) * 2004-07-30 2006-02-09 Nachi Fujikoshi Corp 平面研削装置
EP1738871A1 (en) * 1999-03-05 2007-01-03 Ebara Corporation Polishing apparatus

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH074460U (ja) * 1993-06-22 1995-01-24 鐘紡株式会社 封凾機のテープ貼り不良検出装置
WO1998014306A1 (en) * 1996-10-04 1998-04-09 Obsidian, Inc. A method and system for controlling chemical mechanical polishing thickness removal
US6159075A (en) * 1999-10-13 2000-12-12 Vlsi Technology, Inc. Method and system for in-situ optimization for semiconductor wafers in a chemical mechanical polishing process
JP2001198794A (ja) * 2000-01-21 2001-07-24 Ebara Corp 研磨装置
JP4687838B2 (ja) 2000-04-04 2011-05-25 株式会社ディスコ 半導体チップの製造方法
JP4721574B2 (ja) 2001-08-29 2011-07-13 株式会社ディスコ 研削装置の原点位置設定機構
US7037184B2 (en) * 2003-01-22 2006-05-02 Raytech Innovation Solutions, Llc Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
JP2003338479A (ja) * 2002-05-20 2003-11-28 Tokyo Seimitsu Co Ltd 半導体ウェーハの加工装置
KR20030071712A (ko) * 2003-08-16 2003-09-06 이민웅 이차원 기반의 오프라인 매장식 삼차원 온라인 쇼핑몰운영 방법 및 그 시스템
JP2005342841A (ja) 2004-06-03 2005-12-15 Renesas Technology Corp 研磨装置
US7150673B2 (en) * 2004-07-09 2006-12-19 Ebara Corporation Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
JP4712555B2 (ja) 2005-12-28 2011-06-29 株式会社ディスコ 研磨装置
JP2007301665A (ja) 2006-05-10 2007-11-22 Disco Abrasive Syst Ltd 研削ホイールおよびその製造方法
JP4913481B2 (ja) 2006-06-12 2012-04-11 株式会社ディスコ ウエーハ研削装置
DE102007015503B4 (de) * 2007-03-30 2013-03-21 Globalfoundries Inc. Verfahren und System zum Steuern des chemisch-mechanischen Polierens durch Berücksichtigung zonenspezifischer Substratdaten

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4316313C1 (de) * 1993-05-15 1994-12-08 Alexander Bromme Verfahren und Anordnung zur Qualitätsüberwachung des Schleifprozesses
EP1738871A1 (en) * 1999-03-05 2007-01-03 Ebara Corporation Polishing apparatus
JP2005021997A (ja) * 2003-06-30 2005-01-27 Komatsu Machinery Corp 研削加工装置及び研削加工方法
JP2006035406A (ja) * 2004-07-30 2006-02-09 Nachi Fujikoshi Corp 平面研削装置

Also Published As

Publication number Publication date
KR101038548B1 (ko) 2011-06-02
JP2009231475A (ja) 2009-10-08
JP5219569B2 (ja) 2013-06-26
TW200941569A (en) 2009-10-01
US8055374B2 (en) 2011-11-08
KR20090101058A (ko) 2009-09-24
TWI411030B (zh) 2013-10-01
US20090239448A1 (en) 2009-09-24
DE102008060199A1 (de) 2009-10-15

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