SG155830A1 - Grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same - Google Patents
Grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in sameInfo
- Publication number
- SG155830A1 SG155830A1 SG200900722-0A SG2009007220A SG155830A1 SG 155830 A1 SG155830 A1 SG 155830A1 SG 2009007220 A SG2009007220 A SG 2009007220A SG 155830 A1 SG155830 A1 SG 155830A1
- Authority
- SG
- Singapore
- Prior art keywords
- grinding
- semiconductor wafer
- thickness
- same
- back surface
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 230000002093 peripheral effect Effects 0.000 abstract 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
Abstract
A grinding method for grinding a back surface of a semiconductor wafer that performs in feed grinding of a back surface of a wafer laminated body, the method, during the grinding of the back surface of the wafer laminated body, having: measuring respectively a thickness of an outer peripheral portion and an inner peripheral portion of the wafer laminated body; calculating a thickness difference between the thickness of the outer portion and the thickness the inner portion; and tilting an axis of a grinding wheel by a predetermined angle in an arbitrary direction so as to reduce the calculated thickness difference.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008092932A JP2009246240A (en) | 2008-03-31 | 2008-03-31 | Grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG155830A1 true SG155830A1 (en) | 2009-10-29 |
Family
ID=41011365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200900722-0A SG155830A1 (en) | 2008-03-31 | 2009-02-02 | Grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090247050A1 (en) |
JP (1) | JP2009246240A (en) |
DE (1) | DE102009011491A1 (en) |
SG (1) | SG155830A1 (en) |
TW (1) | TW200949921A (en) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5149020B2 (en) * | 2008-01-23 | 2013-02-20 | 株式会社ディスコ | Wafer grinding method |
JP2011245610A (en) * | 2010-05-31 | 2011-12-08 | Mitsubishi Electric Corp | Method of manufacturing semiconductor device |
JP5658586B2 (en) * | 2011-02-03 | 2015-01-28 | 株式会社ディスコ | Grinding equipment |
JP2013004726A (en) * | 2011-06-16 | 2013-01-07 | Disco Abrasive Syst Ltd | Processing method of plate-like object |
US9120194B2 (en) * | 2011-07-21 | 2015-09-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus for wafer grinding |
JP5788304B2 (en) * | 2011-12-06 | 2015-09-30 | 株式会社ディスコ | Grinding equipment |
JP2014172131A (en) * | 2013-03-11 | 2014-09-22 | Disco Abrasive Syst Ltd | Grinding device |
JP6179021B2 (en) * | 2013-07-18 | 2017-08-16 | 株式会社岡本工作機械製作所 | Semiconductor substrate flattening grinding method |
JP6377433B2 (en) * | 2014-07-04 | 2018-08-22 | 株式会社ディスコ | Grinding method |
JP6399873B2 (en) * | 2014-09-17 | 2018-10-03 | 株式会社荏原製作所 | Film thickness signal processing apparatus, polishing apparatus, film thickness signal processing method, and polishing method |
JP6348856B2 (en) * | 2015-02-26 | 2018-06-27 | 株式会社東京精密 | Grinding equipment |
TWI651163B (en) * | 2015-08-26 | 2019-02-21 | 日商迪思科股份有限公司 | Grinding method |
CN105215840B (en) * | 2015-08-31 | 2018-04-17 | 上海华虹宏力半导体制造有限公司 | A kind of thining method of silicon hole |
JP6632356B2 (en) * | 2015-12-10 | 2020-01-22 | 株式会社東京精密 | Grinding equipment |
JP6081005B2 (en) * | 2016-04-21 | 2017-02-15 | 株式会社東京精密 | Grinding / polishing apparatus and grinding / polishing method |
JP6791579B2 (en) * | 2016-09-09 | 2020-11-25 | 株式会社ディスコ | Wafers and wafer processing methods |
CN108214282B (en) * | 2016-12-14 | 2020-12-15 | 邱瑛杰 | Plane grinder |
TWI602645B (en) * | 2016-12-26 | 2017-10-21 | 台灣積體電路製造股份有限公司 | Thickness reducing apparatus and thickness reducing method |
CN108237468B (en) * | 2016-12-26 | 2021-08-03 | 台湾积体电路制造股份有限公司 | Thickness reduction device and thickness reduction method |
JP6884015B2 (en) * | 2017-03-22 | 2021-06-09 | 株式会社荏原製作所 | Substrate polishing equipment and polishing method |
JP6917233B2 (en) * | 2017-07-25 | 2021-08-11 | 株式会社ディスコ | Wafer processing method |
JP6974133B2 (en) * | 2017-11-22 | 2021-12-01 | 株式会社ディスコ | How to mold a SiC ingot |
CN107984375A (en) * | 2017-11-27 | 2018-05-04 | 德淮半导体有限公司 | Wafer processing apparatus and its processing method |
JP7012538B2 (en) * | 2018-01-11 | 2022-01-28 | 株式会社ディスコ | Wafer evaluation method |
JP7331198B2 (en) * | 2018-02-19 | 2023-08-22 | 株式会社東京精密 | Grinding equipment |
JP7068849B2 (en) * | 2018-02-19 | 2022-05-17 | 株式会社東京精密 | Grinding device |
JP7121573B2 (en) * | 2018-07-24 | 2022-08-18 | 株式会社ディスコ | Creep feed grinding method |
JP7391470B2 (en) | 2019-12-20 | 2023-12-05 | 株式会社ディスコ | Workpiece grinding method |
CN111730431B (en) * | 2020-05-20 | 2021-10-15 | 清华大学 | Wafer grinding method and wafer grinding system |
JP2022040984A (en) * | 2020-08-31 | 2022-03-11 | 株式会社ディスコ | Grinding apparatus |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5816895A (en) * | 1997-01-17 | 1998-10-06 | Tokyo Seimitsu Co., Ltd. | Surface grinding method and apparatus |
JP2000260738A (en) * | 1999-03-10 | 2000-09-22 | Hitachi Ltd | Grinding of semiconductor substrate and semiconductor device and its manufacture |
US6656818B1 (en) * | 1999-09-20 | 2003-12-02 | Shin-Etsu Handotai Co., Ltd. | Manufacturing process for semiconductor wafer comprising surface grinding and planarization or polishing |
US6368881B1 (en) * | 2000-02-29 | 2002-04-09 | International Business Machines Corporation | Wafer thickness control during backside grind |
KR100954534B1 (en) * | 2002-10-09 | 2010-04-23 | 고요 기카이 고교 가부시키가이샤 | Both side grinding method and both side grinder of thin disc-like work |
JP4103808B2 (en) | 2004-01-22 | 2008-06-18 | 信越半導体株式会社 | Wafer grinding method and wafer |
JP4913517B2 (en) * | 2006-09-26 | 2012-04-11 | 株式会社ディスコ | Wafer grinding method |
JP5064102B2 (en) * | 2007-04-27 | 2012-10-31 | 株式会社ディスコ | Substrate grinding method and grinding apparatus |
-
2008
- 2008-03-31 JP JP2008092932A patent/JP2009246240A/en active Pending
-
2009
- 2009-02-02 SG SG200900722-0A patent/SG155830A1/en unknown
- 2009-02-05 TW TW098103723A patent/TW200949921A/en unknown
- 2009-03-04 US US12/398,087 patent/US20090247050A1/en not_active Abandoned
- 2009-03-06 DE DE102009011491A patent/DE102009011491A1/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
DE102009011491A1 (en) | 2009-10-01 |
TW200949921A (en) | 2009-12-01 |
JP2009246240A (en) | 2009-10-22 |
US20090247050A1 (en) | 2009-10-01 |
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