SG11202111470XA - Wafer loading support, wafer loading system, and wafer mounting method for cmp process - Google Patents

Wafer loading support, wafer loading system, and wafer mounting method for cmp process

Info

Publication number
SG11202111470XA
SG11202111470XA SG11202111470XA SG11202111470XA SG11202111470XA SG 11202111470X A SG11202111470X A SG 11202111470XA SG 11202111470X A SG11202111470X A SG 11202111470XA SG 11202111470X A SG11202111470X A SG 11202111470XA SG 11202111470X A SG11202111470X A SG 11202111470XA
Authority
SG
Singapore
Prior art keywords
wafer
wafer loading
mounting method
cmp process
support
Prior art date
Application number
SG11202111470XA
Other languages
English (en)
Inventor
Hui Xu
Linghan Shen
Original Assignee
Hangzhou Zhonggui Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hangzhou Zhonggui Electronic Technology Co Ltd filed Critical Hangzhou Zhonggui Electronic Technology Co Ltd
Publication of SG11202111470XA publication Critical patent/SG11202111470XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B24B49/165—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load for grinding tyres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11202111470XA 2019-04-17 2019-09-04 Wafer loading support, wafer loading system, and wafer mounting method for cmp process SG11202111470XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910309589 2019-04-17
PCT/CN2019/104291 WO2020211260A1 (zh) 2019-04-17 2019-09-04 Cmp工艺的晶圆装载支架、晶圆装载***及晶圆装片方法

Publications (1)

Publication Number Publication Date
SG11202111470XA true SG11202111470XA (en) 2021-11-29

Family

ID=67593144

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202111470XA SG11202111470XA (en) 2019-04-17 2019-09-04 Wafer loading support, wafer loading system, and wafer mounting method for cmp process

Country Status (6)

Country Link
US (1) US20220152777A1 (zh)
KR (1) KR102605197B1 (zh)
CN (1) CN110142689B (zh)
SG (1) SG11202111470XA (zh)
TW (1) TWI713141B (zh)
WO (1) WO2020211260A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110142689B (zh) * 2019-04-17 2021-09-14 杭州众硅电子科技有限公司 一种晶圆装载支架、晶圆装载***及晶圆装片方法
CN111469046B (zh) * 2020-04-22 2020-12-29 华海清科股份有限公司 一种晶圆装载杯
CN113400195B (zh) * 2021-07-21 2022-08-19 北京烁科精微电子装备有限公司 一种在线分区调整抛光头装卸片压力的方法及***
CN113649945B (zh) * 2021-10-20 2022-04-15 杭州众硅电子科技有限公司 一种晶圆抛光装置
CN114279380B (zh) * 2021-12-27 2024-02-02 华海清科股份有限公司 一种弹片式晶圆在位检测装置及检测方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5957751A (en) * 1997-05-23 1999-09-28 Applied Materials, Inc. Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
KR20010030213A (ko) * 1999-09-02 2001-04-16 아끼모토 유미 연마 헤드, 이것을 이용한 연마 장치, 및 연마 상태 검출방법
CN100433269C (zh) * 2000-05-12 2008-11-12 多平面技术公司 抛光装置以及与其一起使用的基片托架
JP2002346918A (ja) * 2001-05-29 2002-12-04 Speedfam Co Ltd 両面研磨装置
KR100437456B1 (ko) * 2001-05-31 2004-06-23 삼성전자주식회사 화학적 기계적 평탄화 기계의 폴리싱 헤드 및 그것을이용한 폴리싱방법
KR100470227B1 (ko) * 2001-06-07 2005-02-05 두산디앤디 주식회사 화학기계적 연마장치의 캐리어 헤드
JP3892703B2 (ja) * 2001-10-19 2007-03-14 富士通株式会社 半導体基板用治具及びこれを用いた半導体装置の製造方法
KR20060023735A (ko) * 2004-09-10 2006-03-15 삼성전자주식회사 웨이퍼 이송 아암
TWI354347B (en) * 2006-06-02 2011-12-11 Applied Materials Inc Fast substrate loading on polishing head without m
KR100989432B1 (ko) * 2008-07-23 2010-10-26 주식회사 아토 기판로딩장치
CN102049730B (zh) * 2010-12-29 2012-02-15 清华大学 一种用于化学机械抛光设备的晶圆交换装置
JP5875950B2 (ja) * 2012-06-29 2016-03-02 株式会社荏原製作所 基板保持装置および研磨装置
CN104625941B (zh) * 2013-11-14 2018-09-04 盛美半导体设备（上海）有限公司 晶圆加工装置
JP6225088B2 (ja) * 2014-09-12 2017-11-01 株式会社荏原製作所 研磨方法および研磨装置
KR102412773B1 (ko) * 2015-11-27 2022-06-24 주식회사 케이씨텍 화학 기계적 연마 시스템의 웨이퍼 로딩 장치
KR101946786B1 (ko) * 2017-02-15 2019-02-12 주식회사 케이씨텍 기판 처리 장치
CN109500716A (zh) * 2017-09-14 2019-03-22 上海新昇半导体科技有限公司 一种抛光盘基座、抛光盘、抛光机以及最终抛光方法
CN110142689B (zh) * 2019-04-17 2021-09-14 杭州众硅电子科技有限公司 一种晶圆装载支架、晶圆装载***及晶圆装片方法

Also Published As

Publication number Publication date
WO2020211260A1 (zh) 2020-10-22
TWI713141B (zh) 2020-12-11
KR102605197B1 (ko) 2023-11-22
KR20210126104A (ko) 2021-10-19
CN110142689B (zh) 2021-09-14
CN110142689A (zh) 2019-08-20
US20220152777A1 (en) 2022-05-19
TW202040743A (zh) 2020-11-01

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