SG10202006736YA - Wafer processing method - Google Patents
Wafer processing methodInfo
- Publication number
- SG10202006736YA SG10202006736YA SG10202006736YA SG10202006736YA SG10202006736YA SG 10202006736Y A SG10202006736Y A SG 10202006736YA SG 10202006736Y A SG10202006736Y A SG 10202006736YA SG 10202006736Y A SG10202006736Y A SG 10202006736YA SG 10202006736Y A SG10202006736Y A SG 10202006736YA
- Authority
- SG
- Singapore
- Prior art keywords
- processing method
- wafer processing
- wafer
- processing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/388—Trepanning, i.e. boring by moving the beam spot about an axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/6839—Separation by peeling using peeling wedge or knife or bar
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Dicing (AREA)
- Laser Beam Processing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019145060A JP7345973B2 (en) | 2019-08-07 | 2019-08-07 | Wafer processing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202006736YA true SG10202006736YA (en) | 2021-03-30 |
Family
ID=74188730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202006736YA SG10202006736YA (en) | 2019-08-07 | 2020-07-15 | Wafer processing method |
Country Status (7)
Country | Link |
---|---|
US (1) | US11594454B2 (en) |
JP (1) | JP7345973B2 (en) |
KR (1) | KR20210018072A (en) |
CN (1) | CN112435964A (en) |
DE (1) | DE102020209874B4 (en) |
SG (1) | SG10202006736YA (en) |
TW (1) | TW202107548A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7341606B2 (en) * | 2019-09-11 | 2023-09-11 | 株式会社ディスコ | Wafer processing method |
JP2021064627A (en) * | 2019-10-10 | 2021-04-22 | 株式会社ディスコ | Wafer processing method |
JP7301480B2 (en) * | 2019-10-17 | 2023-07-03 | 株式会社ディスコ | Wafer processing method |
JP2021077720A (en) * | 2019-11-07 | 2021-05-20 | 株式会社ディスコ | Wafer processing method |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS539710B2 (en) * | 1972-08-07 | 1978-04-07 | ||
US4197346A (en) | 1978-10-10 | 1980-04-08 | Appleton Papers Inc. | Self-contained pressure-sensitive record material and process of preparation |
JP3076179B2 (en) | 1993-07-26 | 2000-08-14 | 株式会社ディスコ | Dicing equipment |
JP3076179U (en) | 2000-09-07 | 2001-03-30 | 和雄 落合 | Cup type bottle cap |
JP2003152056A (en) | 2001-11-08 | 2003-05-23 | Sony Corp | Semiconductor element holder and method of manufacturing the same |
JP2005191297A (en) * | 2003-12-25 | 2005-07-14 | Jsr Corp | Dicing film and cutting method of semiconductor wafer |
JP4930679B2 (en) * | 2005-12-14 | 2012-05-16 | 日本ゼオン株式会社 | Manufacturing method of semiconductor device |
JP2008117943A (en) * | 2006-11-06 | 2008-05-22 | Nitto Denko Corp | Adhesive sheet for water jet laser dicing |
JP5047838B2 (en) * | 2008-02-26 | 2012-10-10 | 株式会社ディスコ | Tape applicator |
JP5801046B2 (en) * | 2010-12-06 | 2015-10-28 | 株式会社ディスコ | Processing method of plate |
WO2013021644A1 (en) * | 2011-08-09 | 2013-02-14 | 三井化学株式会社 | Semiconductor device manufacturing method and film used therein for protecting surface of semiconductor |
CN103797567B (en) | 2011-09-30 | 2018-05-11 | 琳得科株式会社 | Manufacture method with the cambial cutting diaphragm of protective film and chip |
JP6151557B2 (en) * | 2013-05-13 | 2017-06-21 | 株式会社ディスコ | Laser processing method |
JP6121281B2 (en) * | 2013-08-06 | 2017-04-26 | 株式会社ディスコ | Wafer processing method |
JP6425435B2 (en) | 2014-07-01 | 2018-11-21 | 株式会社ディスコ | Tip spacing maintenance device |
JP6703485B2 (en) * | 2014-09-29 | 2020-06-03 | リンテック株式会社 | Base material for semiconductor wafer processing sheet, semiconductor wafer processing sheet, and method for manufacturing semiconductor device |
JP2017147361A (en) * | 2016-02-18 | 2017-08-24 | 株式会社ディスコ | Wafer processing method |
JP2017152569A (en) | 2016-02-25 | 2017-08-31 | 株式会社ディスコ | Processing method of wafer |
JP2018029126A (en) * | 2016-08-18 | 2018-02-22 | 株式会社ディスコ | Wafer processing method |
JP7154809B2 (en) | 2018-04-20 | 2022-10-18 | 株式会社ディスコ | Wafer processing method |
JP2019192717A (en) | 2018-04-20 | 2019-10-31 | 株式会社ディスコ | Method of processing wafer |
JP7181020B2 (en) * | 2018-07-26 | 2022-11-30 | 株式会社ディスコ | Wafer processing method |
JP7341606B2 (en) * | 2019-09-11 | 2023-09-11 | 株式会社ディスコ | Wafer processing method |
-
2019
- 2019-08-07 JP JP2019145060A patent/JP7345973B2/en active Active
-
2020
- 2020-07-14 TW TW109123779A patent/TW202107548A/en unknown
- 2020-07-15 SG SG10202006736YA patent/SG10202006736YA/en unknown
- 2020-07-28 KR KR1020200093863A patent/KR20210018072A/en unknown
- 2020-07-31 US US16/944,347 patent/US11594454B2/en active Active
- 2020-08-03 CN CN202010766592.3A patent/CN112435964A/en active Pending
- 2020-08-05 DE DE102020209874.3A patent/DE102020209874B4/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2021027213A (en) | 2021-02-22 |
US11594454B2 (en) | 2023-02-28 |
TW202107548A (en) | 2021-02-16 |
CN112435964A (en) | 2021-03-02 |
KR20210018072A (en) | 2021-02-17 |
US20210043513A1 (en) | 2021-02-11 |
DE102020209874A1 (en) | 2021-02-11 |
DE102020209874B4 (en) | 2024-07-04 |
JP7345973B2 (en) | 2023-09-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201905294RA (en) | Wafer processing method | |
SG10201904699RA (en) | Wafer processing method | |
SG10202006736YA (en) | Wafer processing method | |
SG10202000576QA (en) | Wafer processing method | |
SG10201905935VA (en) | Wafer processing method | |
SG10202004876YA (en) | Wafer processing method | |
SG10201912832SA (en) | Wafer processing method | |
SG10201911116YA (en) | Wafer processing method | |
SG10201909522RA (en) | Wafer processing method | |
SG10201906678TA (en) | Wafer processing method | |
SG10201905936RA (en) | Wafer processing method | |
SG10201904719TA (en) | Wafer processing method | |
SG10202009952SA (en) | Wafer processing method | |
SG10202003482RA (en) | Wafer processing method | |
SG10202002647RA (en) | Wafer processing method | |
SG10202000574XA (en) | Wafer processing method | |
SG10201910165QA (en) | Wafer processing method | |
SG10201910032WA (en) | Wafer processing method | |
SG10201906896QA (en) | Wafer processing method | |
SG10201906897SA (en) | Wafer processing method | |
SG10201904710UA (en) | Wafer processing method | |
SG10202010592VA (en) | Wafer processing method | |
SG10202009948YA (en) | Wafer processing method | |
SG10202009949PA (en) | Wafer processing method | |
SG10202009268SA (en) | Wafer processing method |