SG11202111470XA - Wafer loading support, wafer loading system, and wafer mounting method for cmp process - Google Patents
Wafer loading support, wafer loading system, and wafer mounting method for cmp processInfo
- Publication number
- SG11202111470XA SG11202111470XA SG11202111470XA SG11202111470XA SG11202111470XA SG 11202111470X A SG11202111470X A SG 11202111470XA SG 11202111470X A SG11202111470X A SG 11202111470XA SG 11202111470X A SG11202111470X A SG 11202111470XA SG 11202111470X A SG11202111470X A SG 11202111470XA
- Authority
- SG
- Singapore
- Prior art keywords
- wafer
- wafer loading
- mounting method
- cmp process
- support
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
- B24B49/165—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load for grinding tyres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910309589 | 2019-04-17 | ||
PCT/CN2019/104291 WO2020211260A1 (en) | 2019-04-17 | 2019-09-04 | Wafer loading support, wafer loading system, and wafer mounting method for cmp process |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202111470XA true SG11202111470XA (en) | 2021-11-29 |
Family
ID=67593144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202111470XA SG11202111470XA (en) | 2019-04-17 | 2019-09-04 | Wafer loading support, wafer loading system, and wafer mounting method for cmp process |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220152777A1 (en) |
KR (1) | KR102605197B1 (en) |
CN (1) | CN110142689B (en) |
SG (1) | SG11202111470XA (en) |
TW (1) | TWI713141B (en) |
WO (1) | WO2020211260A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110142689B (en) * | 2019-04-17 | 2021-09-14 | 杭州众硅电子科技有限公司 | Wafer loading support, wafer loading system and wafer loading method |
CN111469046B (en) * | 2020-04-22 | 2020-12-29 | 华海清科股份有限公司 | Wafer loading cup |
CN113400195B (en) * | 2021-07-21 | 2022-08-19 | 北京烁科精微电子装备有限公司 | Method and system for online partition adjustment of loading and unloading pressure of polishing head |
CN113649945B (en) * | 2021-10-20 | 2022-04-15 | 杭州众硅电子科技有限公司 | Wafer polishing device |
CN114279380B (en) * | 2021-12-27 | 2024-02-02 | 华海清科股份有限公司 | Spring piece type wafer in-situ detection device and detection method |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5957751A (en) * | 1997-05-23 | 1999-09-28 | Applied Materials, Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
KR20010030213A (en) * | 1999-09-02 | 2001-04-16 | 아끼모토 유미 | Polishing head, polishing apparatus using polishing head, and method for sensing polished surface state |
CN100433269C (en) * | 2000-05-12 | 2008-11-12 | 多平面技术公司 | Pneumatic diaphragm head having independent retaining ring and multi-region pressure control, and method to use the same |
JP2002346918A (en) * | 2001-05-29 | 2002-12-04 | Speedfam Co Ltd | Both surface polishing device |
KR100437456B1 (en) * | 2001-05-31 | 2004-06-23 | 삼성전자주식회사 | Polishing head of a chemical mechanical polishing machine and polishing method using the polishing head |
KR100470227B1 (en) * | 2001-06-07 | 2005-02-05 | 두산디앤디 주식회사 | Carrier Head for Chemical Mechanical Polishing |
JP3892703B2 (en) * | 2001-10-19 | 2007-03-14 | 富士通株式会社 | Semiconductor substrate jig and semiconductor device manufacturing method using the same |
KR20060023735A (en) * | 2004-09-10 | 2006-03-15 | 삼성전자주식회사 | Arm for transferring a wafer |
TWI354347B (en) * | 2006-06-02 | 2011-12-11 | Applied Materials Inc | Fast substrate loading on polishing head without m |
KR100989432B1 (en) * | 2008-07-23 | 2010-10-26 | 주식회사 아토 | Apparatus for loading wafer on susceptor |
CN102049730B (en) * | 2010-12-29 | 2012-02-15 | 清华大学 | Wafer replacing device used in chemical mechanical polishing equipment |
JP5875950B2 (en) * | 2012-06-29 | 2016-03-02 | 株式会社荏原製作所 | Substrate holding device and polishing device |
CN104625941B (en) * | 2013-11-14 | 2018-09-04 | 盛美半导体设备(上海)有限公司 | Wafer processing apparatus |
JP6225088B2 (en) * | 2014-09-12 | 2017-11-01 | 株式会社荏原製作所 | Polishing method and polishing apparatus |
KR102412773B1 (en) * | 2015-11-27 | 2022-06-24 | 주식회사 케이씨텍 | Apparatus of loading wafeer in chemical mechanical polishing system |
KR101946786B1 (en) * | 2017-02-15 | 2019-02-12 | 주식회사 케이씨텍 | Substrate procesing apparatus |
CN109500716A (en) * | 2017-09-14 | 2019-03-22 | 上海新昇半导体科技有限公司 | A kind of polishing disk pedestal, polishing disk, polishing machine and final polishing method |
CN110142689B (en) * | 2019-04-17 | 2021-09-14 | 杭州众硅电子科技有限公司 | Wafer loading support, wafer loading system and wafer loading method |
-
2019
- 2019-05-24 CN CN201910440334.3A patent/CN110142689B/en active Active
- 2019-09-04 KR KR1020217029530A patent/KR102605197B1/en active IP Right Grant
- 2019-09-04 WO PCT/CN2019/104291 patent/WO2020211260A1/en active Application Filing
- 2019-09-04 US US17/440,191 patent/US20220152777A1/en active Pending
- 2019-09-04 SG SG11202111470XA patent/SG11202111470XA/en unknown
- 2019-11-25 TW TW108142763A patent/TWI713141B/en active
Also Published As
Publication number | Publication date |
---|---|
WO2020211260A1 (en) | 2020-10-22 |
TWI713141B (en) | 2020-12-11 |
KR102605197B1 (en) | 2023-11-22 |
KR20210126104A (en) | 2021-10-19 |
CN110142689B (en) | 2021-09-14 |
CN110142689A (en) | 2019-08-20 |
US20220152777A1 (en) | 2022-05-19 |
TW202040743A (en) | 2020-11-01 |
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