SG11201811626TA - Method and sample holder for the controlled bonding of substrates - Google Patents

Method and sample holder for the controlled bonding of substrates

Info

Publication number
SG11201811626TA
SG11201811626TA SG11201811626TA SG11201811626TA SG11201811626TA SG 11201811626T A SG11201811626T A SG 11201811626TA SG 11201811626T A SG11201811626T A SG 11201811626TA SG 11201811626T A SG11201811626T A SG 11201811626TA SG 11201811626T A SG11201811626T A SG 11201811626TA
Authority
SG
Singapore
Prior art keywords
substrates
sample holder
controlled bonding
bonding
substrate
Prior art date
Application number
SG11201811626TA
Other languages
English (en)
Inventor
Dominik Zinner
Thomas Wagenleitner
Jürgen Markus Süss
Jürgen Mallinger
Dr Thomas Plach
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG11201811626TA publication Critical patent/SG11201811626TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Combinations Of Printed Boards (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG11201811626TA 2016-08-12 2016-08-12 Method and sample holder for the controlled bonding of substrates SG11201811626TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2016/069307 WO2018028801A1 (de) 2016-08-12 2016-08-12 Verfahren und probenhalter zum gesteuerten bonden von substraten

Publications (1)

Publication Number Publication Date
SG11201811626TA true SG11201811626TA (en) 2019-03-28

Family

ID=56852227

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201811626TA SG11201811626TA (en) 2016-08-12 2016-08-12 Method and sample holder for the controlled bonding of substrates

Country Status (8)

Country Link
US (1) US10991609B2 (zh)
EP (1) EP3497712B1 (zh)
JP (1) JP6899891B2 (zh)
KR (2) KR102347321B1 (zh)
CN (1) CN109496345B (zh)
SG (1) SG11201811626TA (zh)
TW (2) TWI649826B (zh)
WO (1) WO2018028801A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201906510PA (en) 2017-03-02 2019-08-27 Ev Group E Thallner Gmbh Method and device for bonding chips
AT525844A1 (de) * 2019-05-13 2023-07-15 Suss Microtec Lithography Gmbh Bondvorrichtung sowie Verfahren zum Bonden von Substraten
KR20220007687A (ko) 2019-05-13 2022-01-18 수스 마이크로텍 리소그라피 게엠바하 본딩 장치 및 기판을 본딩하기 위한 방법
SG11201911798UA (en) 2019-08-23 2021-04-29 Ev Group E Thallner Gmbh Method and device for the alignment of substrates
CN115605987A (zh) 2020-06-29 2023-01-13 Ev 集团 E·索尔纳有限责任公司（At） 基底保持器以及用于固定和键合基底的方法
KR20220167376A (ko) 2020-06-29 2022-12-20 에베 그룹 에. 탈너 게엠베하 기판 접합 방법 및 장치
US20230369095A1 (en) 2021-02-01 2023-11-16 Ev Group E. Thallner Gmbh Substrate holder and method for producing a substrate holder for bonding
WO2024002494A1 (de) * 2022-07-01 2024-01-04 Ev Group E. Thallner Gmbh Verfahren zum bonden eines ersten substrats mit einem zweiten substrat, vorrichtung zum bonden und anordnung aus erstem und zweitem substrat
WO2024046577A1 (de) 2022-09-02 2024-03-07 Ev Group E. Thallner Gmbh Verfahren und vorrichtung zum beeinflussen einer bondwelle beim bonden

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4752180A (en) * 1985-02-14 1988-06-21 Kabushiki Kaisha Toshiba Method and apparatus for handling semiconductor wafers
JPH0766092B2 (ja) 1988-09-30 1995-07-19 富士通株式会社 モード変換コード
JPH0744135B2 (ja) * 1989-08-28 1995-05-15 株式会社東芝 半導体基板の接着方法及び接着装置
US5149827A (en) * 1990-01-10 1992-09-22 Nippon Shokubai Kagaku Kogyo Co., Ltd. Method for handling maleimides
JPH0766092A (ja) * 1993-08-23 1995-03-10 Sumitomo Sitix Corp 半導体ウエーハの接着方法および接着治具
JPH0766093A (ja) * 1993-08-23 1995-03-10 Sumitomo Sitix Corp 半導体ウエーハの貼り合わせ方法およびその装置
JPH1174164A (ja) * 1997-08-27 1999-03-16 Canon Inc 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法
AT405775B (de) 1998-01-13 1999-11-25 Thallner Erich Verfahren und vorrichtung zum ausgerichteten zusammenführen von scheibenförmigen halbleitersubstraten
KR100744183B1 (ko) * 2006-02-16 2007-08-01 삼성전자주식회사 디스플레이장치의 제조장치 및 제조방법
US7682933B1 (en) * 2007-09-26 2010-03-23 The United States Of America As Represented By The Secretary Of The Air Force Wafer alignment and bonding
SG187694A1 (en) 2010-12-20 2013-03-28 Ev Group E Thallner Gmbh Receiving means for mounting of wafers
DE102010055288A1 (de) 2010-12-21 2012-06-21 Ev Group Gmbh Vorrichtung zum spanenden Bearbeiten eines Werkstücks
JP2012186245A (ja) * 2011-03-04 2012-09-27 Tokyo Electron Ltd 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
EP3005407B1 (de) * 2013-05-29 2018-08-15 EV Group E. Thallner GmbH Verfahren zum bonden von substraten
WO2014202106A1 (de) 2013-06-17 2014-12-24 Ev Group E. Thallner Gmbh Vorrichtung und verfahren zum ausrichten von substraten
JP6120749B2 (ja) * 2013-10-25 2017-04-26 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム
US9851645B2 (en) 2013-12-06 2017-12-26 Ev Group E. Thallner Gmbh Device and method for aligning substrates
KR101521971B1 (ko) * 2013-12-11 2015-05-20 주식회사 휴템 플라즈마 활성화 처리를 이용한 웨이퍼 본더, 웨이퍼 접합 장치, 및 웨이퍼 접합 방법
JP2014150266A (ja) * 2014-03-13 2014-08-21 Tokyo Electron Ltd 接合装置及び接合システム
JP6177739B2 (ja) * 2014-08-07 2017-08-09 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP6271404B2 (ja) * 2014-11-27 2018-01-31 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム
KR20230009995A (ko) 2014-12-10 2023-01-17 가부시키가이샤 니콘 기판 겹침 장치 및 기판 겹침 방법
CN118098939A (zh) 2016-03-22 2024-05-28 Ev 集团 E·索尔纳有限责任公司 用于衬底的接合的装置和方法

Also Published As

Publication number Publication date
EP3497712A1 (de) 2019-06-19
KR102300481B1 (ko) 2021-09-10
TWI681488B (zh) 2020-01-01
JP2019533897A (ja) 2019-11-21
TW201903940A (zh) 2019-01-16
KR20190037231A (ko) 2019-04-05
EP3497712B1 (de) 2020-04-29
TW201826425A (zh) 2018-07-16
KR102347321B1 (ko) 2022-01-04
US20200027768A1 (en) 2020-01-23
WO2018028801A1 (de) 2018-02-15
CN109496345B (zh) 2023-07-18
TWI649826B (zh) 2019-02-01
KR20210113693A (ko) 2021-09-16
JP6899891B2 (ja) 2021-07-07
US10991609B2 (en) 2021-04-27
CN109496345A (zh) 2019-03-19

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